A method of fabricating integrated circuits utilizing dual damascene processing when a soft insulative material, such as a polymer, is used. Vertical and horizontal edges of via and conductive line openings are protected from degradation during a second etching step by, prior to the second etching, depositing...http://www.google.com.au/patents/US6303489?utm_source=gb-gplus-sharePatent US6303489 - Spacer - defined dual damascene process method
