The present invention provides a resin-encapsulated semiconductor apparatus comprising a semiconductor device having a ferroelectric film and a surface-protective film, and an encapsulant member comprising a resin; the surface-protective film being formed of a polyimide. The present invention also provides...http://www.google.com.au/patents/US7521744?utm_source=gb-gplus-sharePatent US7521744 - Resin-encapsulated semiconductor apparatus and process for its fabrication
