Resin encapsulated electronic devices are provided by encapsulating so-called flat-shaped, plate-like, or angular-shaped electronic devices with a resin composition containing rubber-like particles preferably having an average particle size of 150 .mu.m or less. In the course of production of said resin...http://www.google.com.au/patents/US4933744?utm_source=gb-gplus-sharePatent US4933744 - Resin encapsulated electronic devices
