The present invention relates to the use of a laser to remove surface contamination and oxidation from a ball grid array substrate. The laser etching can be configured to cover the entire substrate or pinpointed to the epoxy molding compound/solder resist (EMC/SR) interfaces. Additionally, a laser can...http://www.google.com.au/patents/US20020170897?utm_source=gb-gplus-sharePatent US20020170897 - Methods for preparing ball grid array substrates via use of a laser
