In a multi-level wiring structure wires and vias are formed by an isotropic deposition of a conductive material, such as copper, on a dielectric base, such as a polyimide. In a preferred embodiment of the invention copper is electroplated to a thin seed conducting layer deposited on the surface of the...http://www.google.com.au/patents/US5209817?utm_source=gb-gplus-sharePatent US5209817 - Selective plating method for forming integral via and wiring layers
