WO2017140091A1

WO2017140091A1 - Module and assembling method therefor

Info

Publication number: WO2017140091A1
Application number: PCT/CN2016/091980
Authority: WO
Inventors: 肖鹏; 何毅
Original assignee: 深圳市汇顶科技股份有限公司
Priority date: 2016-02-18
Filing date: 2016-07-28
Publication date: 2017-08-24
Also published as: CN107094365B; CN107094365A

Abstract

Disclosed are a module (1) and an assembling method therefor. The module (1) comprises a first component (11) and a second component (12). The assembling method comprises the following steps: pre-positioning the first component (11) and the second component (12) to obtain a pre-positioning module; detecting whether the pre-positioning module qualifies, and if so, using first reworkable materials (21, 22) to fix the first component (11) and the second component (12); and if not, separating the first component (11) and the second component (12), pre-positioning the first component (11) and the second component (12) again and detecting same until a pre-positioning module (1) that qualifies is detected, and using the first reworkable materials (21, 22) to fix the first component (11) and the second component (12). In the assembling method in the present invention, first reworkable materials (21, 22) are used to fix the first component (11) and the second component (12), so that the module (1) is reworkable during the manufacturing process and is repairable during the usage process.

Description

Module and assembly method thereof

The present application claims priority to Chinese Patent Application No. 20161009221, filed on Feb. 18,,,,,,,,,,,,,,,,,,,,,

Technical field

The present application relates to the field of high value module technology, and in particular to a module and an assembly method thereof.

Background technique

It has been pointed out in the related art that if a high-value device or device is defective in production or use, it is necessary to remove the defective component from the device or device for rework or rework, however, in the process of disassembling the defective component, it is often damaged. The remaining components cause the device or device to be scrapped. For example, in the process of assembling a screen module of a smart phone by a pasting process, a glue is attached to the back of the screen by a glue. However, the glue used in the standard bonding process requires strong adhesion to the ink layer on the back of the screen. After completion and curing, the glue cannot be separated from the ink layer by high temperature or solvent immersion within a safe range, and the sensor surface may also have residual glue that cannot be cleaned, resulting in the screen module being completely scrapped, resulting in a high failure rate of rework and repair. Increase input costs.

In addition, the glue required for the standard bonding process usually takes a long time to complete the curing. If the curing is to be accelerated, it is often necessary to heat the glue to a curing temperature that is significantly better than the optimum range, which brings a technical challenge that is difficult to overcome. For example, whether the uniformity of heating can ensure whether the escape medium in the curing process can be sufficiently volatilized, and the large stress caused by the thermal expansion factor after cooling. As a result, the production efficiency of the module is difficult to increase.

All in all, the modules in the related art are difficult to implement rework and rework, and the production efficiency is low and the online waiting time is long.

Summary of the invention

The present application is intended to address at least one of the technical problems existing in the prior art. To this end, the present application proposes a method of assembling a module, which can perform non-destructive rework and rework without high yield.

The present application also proposes a module assembled by the above assembly method.

According to a method of assembling a module according to an embodiment of the present application, the module includes a first component and a second component, and the assembling method includes the steps of: pre-positioning the first component and the second component Obtaining a pre-positioning module; detecting whether the pre-positioning module is qualified; if qualified, fixing the first component and the second component with a first reworkable material; if not, separating the Determining the first component and the second component, and re-predetermining and detecting the first component and the second component until a qualified pre-positioning module is obtained and fixed by the first reworkable material The first component and the second component.

According to the assembly method of the module of the present application, the first component and the second component are fixed by using the first reworkable material, so that the production process of the module can be reworked and the process can be repaired.

In some embodiments, if the first component and the second component are damaged by the first reworkable material, the following rework steps are performed: separating the first component and the second component; replacing Or repairing the first component and/or the second component; reassembling.

In some embodiments, after separating the first component and the second component, the method further includes the step of removing a first reworkable material on the first component and/or the second component with a solvent.

In some embodiments, the second component has a mounting portion for mounting the first component, the first reworkable material being sandwiched between the first component and the mounting portion.

In some embodiments, when the first reworkable material is a reheatable meltable reworkable material, the pre-positioning of the first component and the second component to obtain a pre-positioned module is specifically : A1, the first reworkable material is sandwiched between the first component and the mounting portion; A2, the mounting portion is heated and then cooled to obtain a pre-position module, and the first reworkable The material fixing the first component and the second component is specifically: B1, after the detection result of the predetermined position module is passed, pressing the first component and the mounting portion; B2, facing the mounting portion Heat first and then cool to room temperature.

In some embodiments, the step of securing the first component and the second component with the first reworkable material further comprises the steps of: filling a second reworkable material within the mounting portion and surrounding the first component .

In some embodiments, the first reworkable material is paraffin wax and the second reworkable material is room temperature vulcanized silicone rubber.

In some embodiments, when the first reworkable material is a reworkable material that can be removed by shearing, the first component and the second component are pre-positioned to obtain a pre-position module. Specifically: C1, filling a third reworkable material in the mounting portion and surrounding the first component; C2, heating the third reworkable material to instantaneously cure the third reworkable material to obtain a predetermined The first module and the second component are fixed by using the first reworkable material: D1, before the step C1, the first reworkable material is sandwiched between the first component with Between the mounting portions; D2, after the detection result of the pre-positioning module is passed, the first component and the mounting portion are pressed, and the first reworkable material is naturally cured.

In some embodiments, the first reworkable material is room temperature vulcanized silicone rubber and the third reworkable material is paraffin wax.

In some embodiments, the third reworkable material is heated using a spot heating device.

In some embodiments, the pointing heating device is a resistance wire or a laser.

In some embodiments, the mounting portion is heated using a fixed heating device.

In some embodiments, the fixed heating device includes: a mounting platform having a heating region and a normal temperature region, the second component being disposed on the mounting platform and the mounting portion and the heating region Up and down; and a heater for heating the heating zone.

A module according to another embodiment of the present application is assembled using an assembly method of a module according to the first aspect of the present application.

According to the module of the present application, the assembly method of the first aspect is used for assembly, thereby improving the yield of the module and reducing the production cost of the module.

In some embodiments, the module is a fingerprint identification module of the mobile terminal, the first component is a fingerprint sensor, and the second component is a screen.

Additional aspects and advantages of the present invention will be set forth in part in the description which follows.

DRAWINGS

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings to be used in the embodiments or the prior art description will be briefly described below. Obviously, the drawings in the following description are only It is a certain embodiment of the present application, and other drawings can be obtained according to the drawings without any creative labor for those skilled in the art.

1 is a schematic assembly view of a module according to an embodiment of the present application;

2 is an assembled view of a module in accordance with another embodiment of the present application.

Reference mark:

Module 1, 1a; first member 11; second member 12; mounting portion 121;

First

reworkable material

21, 22; third reworkable material 23;

Mounting platform 3; heating zone 31; normal temperature zone 32; pressurizing device 4; fixed point heating device 5.

detailed description

In order to make the object, the features and the advantages of the present invention more obvious and easy to understand, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the drawings in the embodiments of the present application. The embodiments are only a part of the embodiments of the present application, and not all of them. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments of the present application without departing from the inventive scope are the scope of the present application.

The following disclosure provides many different embodiments or examples for implementing different structures of the present application. In order to simplify the disclosure of the present application, the components and settings of the specific examples are described below. Of course, they are merely examples and are not intended to limit the application. In addition, the present application may repeat reference numerals and/or letters in different examples. This repetition is for the purpose of simplicity and clarity, and is not in the nature of the description of the various embodiments and/or arrangements discussed. Moreover, the present application provides examples of various specific processes and materials, but one of ordinary skill in the art will recognize the applicability of other processes and/or the use of other materials.

A module 1 and an assembly method thereof according to an embodiment of the present application are described below with reference to FIG. 1 and FIG. 2, wherein the module 1 can be a high-value module, such as a module of a mobile terminal (such as a smart phone, a tablet, etc.). In the following, the module 1 is used as a fingerprint recognition module of a smart phone as an example. After reading the following technical solutions, those skilled in the art can clearly understand that the module 1 is a technical solution of other types of modules.

As shown in FIGS. 1 and 2, a module 1 according to an embodiment of the present application includes a first component 11 and a second component 12, and the second component 12 may have a mounting portion 121 for mounting the first component 11, for example The mounting portion 121 may be a groove (or blind hole) formed on the second member 12 to facilitate the mounting of the first member 11. For example, when the module 1 is a fingerprint recognition module, the first component 11 can be a fingerprint sensor, and the second component 12 can be a screen, such as a glass cover or a touch screen.

As shown in FIG. 1 and FIG. 2, the assembling method of the module 1 according to the embodiment of the present application includes the following steps: pre-positioning the first component 11 and the second component 12 to obtain a pre-positioning module, and detecting the pre-positioning module. Qualified, if qualified, the first component 11 and the second component 12 are secured with a first reworkable material (such as the first

reworkable material

21 or 22 described below); if not, the first component 11 is separated and The second component 12 re-predetermines and detects the first component 11 and the second component 12 until a qualified pre-positioning module is obtained and the first reworkable material is used (eg, the first reworkable material described below) 21 or 22) fixes the first component 11 and the second component 12.

Wherein, "pre-positioning the first component 11 and the second component 12" may be: using a returnable The bonding material of the worker pastes the first member 11 and the second member 12, for example, by reworking the adhesive material to pre-position the first member 11 on the mounting portion 121 of the second member 12, so that the first member 11 and the second member 12 pre-position.

Wherein, "detecting whether the pre-positioning module is qualified" may be: detecting whether the relative position of the first component 11 and the second component 12 meets the process requirement, and if it meets the process requirement, it is qualified, and if it does not meet the process requirement, it is unqualified. .

Among them, "reworkable material" refers to: having adhesive performance, using its adhesive performance to achieve a fixed connection with the component, and there is a corresponding removal scheme, the removal scheme is easy to implement; when the removal scheme is used, the reworkable material can be Completely separated from the part. For example, when the first reworkable material is pasted on the glass cover plate and the first reworkable material on the surface of the cover glass plate needs to be removed, the first reworkable material can be completely separated from the surface of the cover glass by using a corresponding removal scheme. That is, the first reworkable material does not stick to the ink layer on the surface of the glass cover, so that the surface of the cover glass is intact. In addition, it should be noted that although the reworkable materials described in the embodiments of the present application have adhesive properties, these materials are not used in the prior art for the standard pasting process. For example, paraffin wax is used to fix the wafer when cutting the wafer to avoid flying chips when cutting; room temperature vulcanized silicone rubber is used for sealing.

In fact, there are many "reworkable materials", for example, reflowable materials that can be repeatedly heated and melted, such as paraffin, etc., can be removed by heating that is easily achieved; for example, some soluble reworkable materials The removal of the material can be achieved by a dissolution method that is easily accomplished; for example, some reworkable materials that can be removed by shearing forces, such as room temperature vulcanized silicone rubber, etc., the resilience of such reworkable materials is usually The conditions of use (impact, vibration, temperature, humidity, electromagnetic interference, corrosive environment, etc.) are strong, but can be removed under the conditions of easy to apply torque (ie, shear force). In short, the reworkable material can be hot melt, reactive, dissolved, shear, etc., as long as there is an easy to implement removal scheme, here is no longer detailed .

Thus, since the reworkable material has a corresponding, easily implementable removal scheme, after the first component 11 and the second component 12 are fixed by the first reworkable material, it is easily realized by using the first reworkable material. The removal scheme can achieve the perfect separation of the first component 11 and the second component 12, thereby realizing the reworkability in the production process of the module 1 and the reworkability in the use of the module 1. Thus, the module 1 and the assembly method thereof according to the embodiments of the present application have non-invasive production reworkability and use reworkability, thereby reducing scrap rate and input cost, improving yield and Repair success rate.

Since the production process of the module 1 has reworkability, when the inspection fails in the production process, the rework can be safely performed, and the rework will not cause damage to the components, thereby improving the yield of the module 1 and reducing the waste. Rate and input costs. Next, the reworking step of the module 1 will be briefly described as follows: First, the first member 11 and the second member 12 are separated, and then the first member 11 and the second member 12 are reassembled, and the reassembly process is carried out by the above assembling method.

Since the use of the module 1 has reworkability, when a malfunction occurs in the use of the product, the repair can be safely performed, and the repair will not cause damage to the component, thereby reducing the difficulty of repairing the module 1 and reducing the maintenance. Scrap rate and maintenance costs. Hereinafter, the reworking step of the module 1 will be briefly described as follows: first, the first component 11 and the second component 12 are separated, and then the failed component (such as the first component 11 and the second component 12) is replaced or repaired, and finally reassembled. The first component 11 and the second component 12, which are not problematic, are reassembled using the assembly method described above.

In some embodiments of the present application, separating the first component 11 and the second component 12 further includes the step of removing the first reworkable material on the first component 11 and/or the second component 12 with a solvent. Thereby, product quality can be guaranteed.

Hereinafter, a module according to two specific embodiments of the present application and an assembly method thereof will be briefly described. Specifically, in the following two embodiments, the first reworkable material is interposed between the first member 11 and the mounting portion 121, whereby the connection reliability of the first member 11 and the second member 12 can be ensured.

In order to assemble the module 1, the assembly method of the module 1 can be implemented by using an assembly device. Specifically, the assembly device can include: a mounting platform 3, a heater (not shown), and a pressing device 4, the mounting platform 3 There is a heating region 31 and a normal temperature region 32, wherein the upper end surface of the mounting platform 3 can be formed as a plane, the heating region 31 can be the same as the structure (shape, size) of the mounting portion 121, and the heater is disposed at the bottom of the mounting platform 3 or Inside the mounting platform 3 and for heating the heating zone 31, the pressurizing device 4 is arranged above the mounting platform 3 so as to be movable up and down. Among them, the mounting platform 3 and the heater may constitute a fixed heating device as described below.

As shown in FIG. 1 , the specific assembly method of the module 1 includes the following steps:

First, the first reworkable material 21 is sandwiched between the first component 11 and the mounting portion 121; then, the mounting portion 121 is first heated and then cooled to obtain a pre-positioning module; and then, whether the pre-positioning module is qualified, If it is acceptable, the first member 11 and the mounting portion 121 are pressed, and then the mounting portion 121 is first heated and then cooled to a normal temperature to fix the first member 11 and the second member 12 together.

Thus, it can be seen that in the above process, the first reworkable material 21 serves the dual purpose of pre-positioning and final fixing of the first component 11 and the second component 12, thereby realizing the first component 11 and the second component. The production of 12 can be reworked and used for repairability, and the overall assembly efficiency of the module 1 is effectively improved.

The specific assembly method of the module 1 further includes the following steps:

A second reworkable material (not shown) is filled in the mounting portion 121 and surrounds the first member 11, thereby achieving a fixing reinforcement effect on the first member 11 and the second member 12. Specifically, the adhesion of the second reworkable material is greater than the adhesion of the first reworkable material 21, so that the connection reliability of the first member 11 and the second member 12 can be specifically improved. The curing time or the surface curing time of the first reworkable material 21 and the second reworkable material are both much shorter than the curing time of the ordinary glue, so that the overall assembly efficiency of the module 1 can be effectively improved.

Specifically, the first reworkable material 21 is a reworkable adhesive material having a high melting point and being soluble in a corresponding solvent, such as a paraffin sheet or the like. Thus, during the rework, the separation of the paraffin sheet from the first member 11 and the second member 12 can be achieved by heating the paraffin sheet. Specifically, the thickness of the paraffin sheet may be 50 μm or less, thereby ensuring smooth progress of the rework process and ensuring assembly precision and connection reliability of the first member 11 and the second member 12. Specifically, the shape of the paraffin sheet may be the same as the shape of the mounting portion 121, so that the paraffin sheet can be just attached to the mounting portion 121 to specifically improve the assembly accuracy of the first member 11 and the second member 12.

Specifically, the second reworkable material may be a room temperature vulcanized silicone rubber having a fast surface curing property. Since the room temperature vulcanized silicone rubber is only surface-cured, the fixing of the first member 11 and the second member 12 can be achieved, and the subsequent process can be continued, so that the overall assembly efficiency of the module 1 can be specifically improved. In short, the second reworkable material is usually a reworkable material that can be naturally cured only at normal temperature without heating, such as room temperature vulcanized silicone rubber, etc., to effectively improve the overall assembly efficiency of the module 1.

An assembly method and a rework method of the module 1 of the first embodiment are fully described:

(1) First, the first member 11 and the second member 12 are cleaned, and then the second member 12 is laid flat on the mounting platform 3 and the mounting portion 121 is ensured to face up and down with the heating region 31, and then the first reworkable material is 21 (for example, a paraffin sheet having a thickness of 50 μm or less and having the same cross-sectional shape and size as the mounting portion 121) is placed on the mounting portion 121 of the second member 12. Thereafter, the heater region 31 may be heated by a heater to heat the mounting portion 121 to melt the first reworkable material 21 to be bonded to the mounting portion 121 (of course, this step may be omitted), and then the first member 11 may be Placed in the first Rework material 21 on.

(2) Next, the heating region 31 is heated by the heater to heat the mounting portion 121 to melt the first reworkable material 21, and then to the ambient temperature, after the first reworkable material 21 is cooled, the first member 11 It can be well positioned in the mounting portion 121 to obtain a pre-positioning module. Specifically, before this step, the mounting portion 121 and the first member 11 may be pre-compressed, for example, by pressing the pressing device 4 downward to press the second member 12 and the first member 11 to thereby increase the first member. The positioning reliability of the 11 and the second component 12.

(3) Then, the pre-positioning module is tested, and if the detection result is acceptable, the second reworkable material (for example, room temperature vulcanized silicone rubber) may be filled in the mounting portion 121 and surround the first member 11 to be the first The member 11 is securely fixed to the second member 12 to reinforce and protect the adhesion of the first member 11 and the second member 12. However, if the detection result indicates a failure, that is, the detection result indicates failure, rework can be performed.

The method of rework is as follows:

(1) The first member 11 and the second member 12 are separated. For example, the module 1 to be reworked can be placed on the mounting platform 3, and then the heating zone 31 is heated by the heater, so that the first reworkable material 21 is melted, and then the first component 11 can be taken from the mounting portion 121. Come down. Thereafter, the first reworkable material 21 remaining on the mounting portion 121 and the first reworkable material 21 on the first member 11 may be removed using a solvent (this step may be omitted). Thus, since the adhesion of the first reworkable material 21 is not very strong, the second member 12 is not damaged during the rework of the first member 11, for example, the ink layer on the surface of the glass panel is not affected. Damage, and, since the first reworkable material 21 is soluble in the corresponding solvent, the cleanliness of the first member 11 and the second member 12 can be ensured, thereby facilitating repositioning.

(2) the first component 11 and the second component 12 are repositioned and detected using the first reworkable material 21 until the qualified pre-positioning module is obtained and the first component 11 is fixed by the first reworkable material 21 and Second component 12.

In summary, the assembly method of the above module 1 is simple, the operation of production and rework is simple, the production efficiency is high, and the scrap rate is low. In addition, the assembly method can be used for reworkable assembly of high-value components, such as assembly for assembling fingerprint module keys.

Referring to FIG. 2, the specific assembly method of the module 1a includes the following steps:

First, the first reworkable material 22 is interposed between the first component 11 and the mounting portion 121; Thereafter, the third reworkable material 23 is filled in the mounting portion 121 and surrounds the first component 11; then, the third reworkable material 23 is heated by a pointing heating device (such as a resistance wire or a laser) to make the third reworkable material 23 instantaneous curing, at the same time, it is also possible to use a fixed heating device, that is, heating the heating region 31 with a heater to heat the mounting portion 121, so that the third reworkable material 23 is instantaneously cured; finally, detecting whether the pre-positioning module 1a is Qualified, if acceptable, the first component 11 and the second component 12 are compressed and cured naturally by the first reworkable material 22.

Thus, it can be seen that in the above process, the first component 11 and the second component 12 are pre-positioned by the instantaneous curing of the third reworkable material 23, by the natural curing of the first reworkable material 22 A component 11 and a second component 12 serve as a final fixing function, thereby realizing the reworkability and reworkability of the first component 11 and the second component 12, thereby effectively improving the overall assembly efficiency of the module 1a.

Specifically, the first reworkable material 22 is a room temperature vulcanized silicone rubber, and the third reworkable material 23 is a paraffin wax. Therefore, in the process of production, if the detection is unsatisfactory, the separation of the first component 11 and the second component 12 can be achieved by heating the third reworkable material 23 to ensure smooth rework process; when the module 1a is used In the event of a malfunction or malfunction, the third reworkable material 23 may be heated to remove the third reworkable material 23, and then the first reworkable material 22 is removed by shearing force to separate the first component 11 and the second component 12 to ensure The repair process went smoothly. Since the first reworkable material 22 is a room temperature vulcanized silicone rubber which can be naturally cured at normal temperature, the curing of the first reworkable material 22 can be naturally completed in the subsequent process of product production, thereby greatly improving the overall assembly efficiency of the module 1a. .

An assembly method and a rework method for the module 1a of the second embodiment are fully described:

(1) The first reworkable material 22 is disposed between the mounting portion 121 and the first member 11, and the third reworkable material 23 is disposed in the mounting portion 121 and surrounds the first member 11. For example, in a specific example of the embodiment, the second component 12, such as a glass panel, may first be placed on the mounting platform 3, and then the first reworkable material 22 may be disposed within the mounting portion 121, for example, may be in a viscous liquid state. The room temperature vulcanized silicone rubber, and then the first component 11 is dropped onto the first reworkable material 22 in the mounting portion 121, and then the third reworkable reworkable and fast curing is adhered to the outer peripheral edge of the first component 11. Material 23, such as paraffin (of course, this step can also be performed in advance).

(2) The third reworkable material 23 is heated by the fixed point heating device 5 and then cooled to obtain a pre-positioning module. For example, it can be wrapped around the mounting platform 3 by a resistance wire or a laser. The third reworkable material 23 on the outer periphery of a part 11 is fixed-point heating, and the instantaneous high-temperature heating rapidly melts the third reworkable material 23, and then the heating can be stopped, so that the third reworkable material 23 is rapidly cooled and solidified, and the first part is at this time. 11 is temporarily assembled to the second member 12, thereby obtaining the pre-positioning module 1a.

In addition, in this embodiment, while the third reworkable material 23 is heated by the fixed point heating device 5, the mounting portion 121 may be heated simultaneously by the fixed heating device to accelerate the melting of the third reworkable material 23, wherein, The heating device may be the above-mentioned mounting platform 3 and the heater, that is, the heater may simultaneously heat the heating region 31 on the mounting platform 3 to raise the temperature of the mounting portion 121, thereby accelerating the third reworkable material. The melting of 23. Of course, the present application is not limited thereto, and it is also possible to melt the third reworkable material 23 using only a fixed heating device.

(3) Then, the pre-position module 1a is detected. If the detection result is acceptable, the remaining steps can be continued in the lower clamp to fully cure the first reworkable material 22 between the first component 11 and the mounting portion 121, for example. It cures naturally at room temperature. However, if the test result shows that the test result is unsatisfactory, that is, the test result shows failure, rework can be performed, and the rework process is basically the same as that of the previous embodiment, that is, the third reworkable material 23 and the first reworkable material are removed by heating or solvent. 22, and reassembling the separated first component 11 and second component 12.

In summary, when the module is pre-positioned with reworkable materials, the assembly process of the module can be reworked without damage; when the reworkable material is used to fix the module, the assembly process of the module can be performed without loss of rework or use. Non-destructive repair; when using a reworkable material pre-positioning or fixed module with a fast surface curing speed, the assembly efficiency of the module can be greatly improved; when a removable material is used to fix the module, it can be ensured The reliability of the connection of the module under various environmental conditions.

In summary, according to the assembly method of the embodiment of the present application, the assembly production of the high-value module can be reworkable, thereby reducing the scrap rate and reducing the input cost. Moreover, the assembly method is quick and easy, there are many reworkable materials that can be selected, and a fast curing process can be employed to reduce the usual online waiting time from several minutes to the order of 10 seconds. At the same time, the introduction of fixed-point instant curing measures can avoid the high-temperature heating process of the assembled components, greatly reducing the potential danger of the process and avoiding the introduction of large stresses. In short, according to the assembly method of the module of the embodiment of the present application, the assembly efficiency is high, the work can be reworked, the repair can be performed, and the safety is high.

In the description of the present application, it is to be understood that the orientation or positional relationship of the indications of "upper", "lower" and the like is based on the orientation or positional relationship shown in the drawings, for convenience of description of the present application and simplified description. Instead of indicating or implying that the device or component referred to must have a particular orientation, constructed and operated in a particular orientation, it is not to be construed as limiting the invention.

Moreover, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, features defining "first" and "second" may include one or more of the features either explicitly or implicitly. In the description of the present application, the meaning of "a plurality" is two or more unless specifically and specifically defined otherwise.

In the description of the present specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" and the like means a specific feature described in connection with the embodiment or example. A structure, material or feature is included in at least one embodiment or example of the application. In the present specification, the schematic representation of the above terms is not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. In addition, various embodiments or examples described in the specification, as well as features of various embodiments or examples, may be combined and combined.

While the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art The scope of the present application is defined by the claims and their equivalents.

In the various embodiments provided by the present application, it should be understood that the disclosed apparatus and method may be implemented in other manners. For example, the device embodiments described above are merely illustrative. For example, the division of the modules is only a logical function division. In actual implementation, there may be another division manner, for example, multiple modules or components may be combined or Can be integrated into another system, or some features can be ignored or not executed. In addition, the mutual coupling or direct coupling or communication link shown or discussed may be an indirect coupling or communication link through some interface, device or module, and may be electrical, mechanical or otherwise.

The modules described as separate components may or may not be physically separated. The components displayed as modules may or may not be physical modules, that is, may be located in one place, or may be distributed to multiple network modules. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of the embodiment.

In addition, each functional module in each embodiment of the present application may be integrated into one processing module, or each module may exist physically separately, or two or more modules may be integrated into one module. In the block. The above integrated modules can be implemented in the form of hardware or in the form of software functional modules.

The integrated modules, if implemented in the form of software functional modules and sold or used as separate products, may be stored in a computer readable storage medium. Based on such understanding, the technical solution of the present application, in essence or the contribution to the prior art, or all or part of the technical solution may be embodied in the form of a software product stored in a storage medium. A number of instructions are included to cause a computer device (which may be a personal computer, server, or network device, etc.) to perform all or part of the steps of the methods described in various embodiments of the present application. The foregoing storage medium includes: a U disk, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk, or an optical disk, and the like. .

It should be noted that, for the foregoing method embodiments, for the sake of brevity, they are all described as a series of action combinations, but those skilled in the art should understand that the present application is not limited by the described action sequence. Because certain steps may be performed in other sequences or concurrently in accordance with the present application. In the following, those skilled in the art should also understand that the embodiments described in the specification are specific embodiments, and the actions and modules involved are not necessarily required by the present application.

In the above embodiments, the descriptions of the various embodiments are all focused, and the parts that are not detailed in a certain embodiment can be referred to the related descriptions of other embodiments.

Claims

A module assembling method, characterized in that the module comprises a first component and a second component, and the assembling method comprises the following steps:

Pre-positioning the first component and the second component to obtain a pre-positioning module;

Detecting whether the pre-positioning module is qualified, if qualified, fixing the first component and the second component with a first reworkable material; if not, separating the first component and the second component And re-predetermining and detecting the first component and the second component until a qualified pre-positioning module is obtained and fixing the first component and the second by using the first reworkable material component.
The method of assembling a module according to claim 1, wherein if the first component and the second component are damaged by the first reworkable material, the following rework steps are performed:

Separating the first component and the second component;

Replacing or repairing the first component and/or the second component;

reassemble.
The method of assembling a module according to claim 1 or 2, further comprising the steps of: separating the first component and the second component:

A first reworkable material on the first component and/or the second component is removed using a solvent.
The assembling method of the module according to claim 1, wherein the second component has a mounting portion for mounting the first component, and the first reworkable material is sandwiched by the first Between the component and the mounting portion.
The method of assembling a module according to claim 4, wherein when said first reworkable material is a reheatable material that can be repeatedly heated and melted,

The pre-positioning of the first component and the second component to obtain a pre-position module is specifically:

Placing a first reworkable material between the first component and the mounting portion;

Heating and re-cooling the mounting portion to obtain a pre-positioning module;

The fixing the first component and the second component by using the first reworkable material is specifically:

After the detection result of the pre-positioning module is passed, the first component and the mounting portion are pressed;

The mounting portion is heated first and then cooled to normal temperature.
The method of assembling a module according to claim 4 or 5, wherein the step of fixing the first component and the second component by using the first reworkable material further comprises the steps of:

A second reworkable material is filled within the mounting portion and surrounds the first component.
The method of assembling a module according to claim 6, wherein the first reworkable material is paraffin wax, and the second reworkable material is room temperature vulcanized silicone rubber.
The method of assembling a module according to claim 4, wherein when said first reworkable material is a reworkable material that can be removed by shearing force,

The pre-positioning of the first component and the second component to obtain a pre-position module is specifically:

Filling a third reworkable material in the mounting portion and surrounding the first component;

Heating the third reworkable material and/or the mounting portion to instantaneously cure the third reworkable material to obtain a pre-positioning module;

The fixing the first component and the second component by using the first reworkable material is specifically:

Disposing a first reworkable material between the first component and the mounting portion before filling the third reworkable material in the mounting portion and surrounding the first component;

After the detection result of the pre-positioning module is passed, the first component and the mounting portion are pressed, and the first reworkable material is naturally cured.
The method of assembling a module according to claim 8, wherein the first reworkable material is room temperature vulcanized silicone rubber, and the third reworkable material is paraffin wax.
The method of assembling a module according to claim 8, wherein the third reworkable material is heated by a fixed point heating device.
The method of assembling a module according to claim 10, wherein the fixed point heating device is a resistance wire or a laser.
The method of assembling a module according to any one of claims 5 or 8, wherein the mounting portion is heated by a fixed heating device.
The method of assembling a module according to claim 12, wherein the fixed heating device comprises:

a mounting platform having a heating area and a normal temperature area, the second component being disposed on the mounting platform and the mounting portion being vertically opposed to the heating area;

A heater for heating the heating zone.
A module assembled by the assembly method of the module according to any one of claims 1-13.
The module according to claim 14, wherein the module is a fingerprint identification module of the mobile terminal, the first component is a fingerprint sensor, and the second component is a screen.