WO2017034184A1

WO2017034184A1 - Vision inspection module and element inspection system having same

Info

Publication number: WO2017034184A1
Application number: PCT/KR2016/008769
Authority: WO
Inventors: 유홍준; 이명국; 배수민
Original assignee: (주)제이티
Priority date: 2015-08-26
Filing date: 2016-08-10
Publication date: 2017-03-02
Also published as: KR101784987B1; SG11201801479YA; TW201713939A; TWI637165B; CN108449975A; KR20170024808A

Abstract

The present invention relates to an element inspection system and, more specifically, to a vision inspection module for performing a vision inspection on a semiconductor element, and an element inspection system having the same. Disclosed is a vision inspection module (50) for performing a vision inspection on a semiconductor element (1) having a polygonal planar shape, the vision inspection module (50) comprising: a single image acquisition unit (100) for acquiring a first planar image for a first plane of the semiconductor element (1) and lateral images for lateral surfaces of polygonal sides of the semiconductor element (1); and an optical system for forming a first optical path (L1) through which the first planar image for the first plane of the semiconductor element (1) arrives at the single image acquisition unit (100) and a plurality of second optical paths (L2) through which the lateral images for the lateral surfaces of the polygonal sides of the semiconductor element (1) respectively arrive at the single image acquisition unit (100).

Description

Vision Inspection Module and Device Inspection System Having It

The present invention relates to a device inspection system, and more particularly, to a vision inspection module for performing a vision inspection for a semiconductor device and a device inspection system having the same.

After the packaging process, the semiconductor device device is shipped to the customer tray after inspection such as burn-in test.

In addition, the semiconductor device that is shipped is subjected to a marking process in which a label such as a serial number and a manufacturer's logo is displayed on a surface of the semiconductor device.

In addition, the semiconductor device device finally inspects whether the lead device or ball grid is damaged, cracks, scratches, etc., the appearance of the semiconductor device device and whether the marking formed on the surface is good. It will go through the process.

On the other hand, as the inspection of the appearance state of the semiconductor device device and whether the marking is satisfactory is added, the inspection time and the arrangement of each module affect the time and the size of the device for the entire process execution.

In particular, the size of the device depends on the loading of a tray loaded with a plurality of elements, one or more modules for vision inspection of each element, and the configuration and arrangement of the unloading module according to the inspection result after the inspection.

The size of the device limits the number of device inspection systems that can be installed in the device inspection line, or affects the installation cost for device production according to the installation of a predetermined number of device inspection systems.

A vision inspection module and a device inspection system having the same, which can recognize vision as described above to obtain the image of the surface of the semiconductor device and a plurality of side surfaces adjacent to the surface at one time to perform vision inspection To provide.

The present invention was created in order to achieve the object of the present invention as described above, the present invention is a vision inspection module 50 for performing a vision inspection of the semiconductor device (1) having a planar shape polygon, the semiconductor device ( Single image acquisition unit 100 for obtaining a first plane image of the first plane of 1) and side images of the sides of the polygonal sides of the semiconductor device 1, and a first image of the semiconductor device 1 Each of the first optical path L1 for causing the first planar image of the plane to reach the single image acquisition unit 100 and each of the side images of the sides of the polygonal sides of the semiconductor device 1 Disclosed is a vision inspection module (50) comprising an optical system for forming a plurality of second optical paths (L2) to reach the image acquisition unit (100).

The optical system may further include a focal length correction unit 400 installed in the optical system to correct a focal length difference between the first optical path L1 and the second optical path L2.

The focal length correction unit 400 may include a medium unit 410 installed on the light paths L1 and L2 and having a transparent material capable of light transmission.

The focal length correction unit 400 may include a frame unit 420 detachably coupled to the structure 520 and the media unit 410 is detachably installed.

The frame part 420 may be detachably coupled to the structure 520 by magnetic force.

The optical system may include a main reflection member 211 reflecting a first plane image of the first plane toward the single image acquisition unit 100, and corresponding sides of polygonal sides of the semiconductor device 1. And an auxiliary reflection member 311 reflecting side images of the sides of the polygonal sides of the semiconductor device 1 toward the main reflection member 211.

The main reflection member 211 has a semi-transmissive material through which light can pass, and the angles of the polygonal sides of the first plane and the semiconductor device 1 on the rear surface of the reflective surface reflecting the first plane image. It may include an illumination system 540 for irradiating light to the side.

The focal length correction unit 400 is formed between each side of the polygonal sides of the semiconductor device 1 and the main reflection member 211 of the second optical path L2, and the second optical path L2. ) May be installed in at least one of the main reflection member 211 and the single image acquisition unit 100.

The focal length correction unit 400 is installed between each side of the polygonal sides of the semiconductor element 1 of the second optical path L2 and the main reflection member 211, and the focal length correction unit 400 may be integrally formed with the auxiliary reflection member 311.

The present invention also includes a loading unit 10 for linearly moving a tray (2) containing a plurality of semiconductor elements (1) is loaded; A vision inspection module 50 installed at one side of the loading unit 10 to be perpendicular to the conveying direction of the tray 2 in the loading unit 10 to perform vision inspection on the semiconductor device 1; A first guide rail 68 disposed perpendicular to the moving direction of the tray 2 in the loading unit 10; Coupled with the first guide rail 68 so as to move along the first guide rail 68, and picks up and transports the device from the loading unit 10 to the vision inspection module 50 to perform vision inspection. A first transfer tool 61; The unloading unit 31 receives the trays 2 containing the semiconductor devices 1 that have undergone vision inspection by the loading unit 10 and classifies the semiconductor devices 1 into the trays 2 according to the vision inspection results. 32, 33, and the vision inspection module 50 discloses a device inspection system, characterized in that the vision inspection module having the configuration as described above.

The vision inspection module and the device inspection system having the same according to the present invention are capable of performing a variety of rapid vision inspection by performing a vision inspection by acquiring images of the surface of the semiconductor device and a plurality of side surfaces adjacent to the surface at once. There is an advantage.

In particular, in acquiring images of the surface of a semiconductor device and a plurality of side surfaces adjacent to the surface of the semiconductor device at a time, the difference in focal length according to different optical paths is corrected by using a medium such as transparent glass. Images can be obtained, which simplifies the configuration of modules for performing vision inspection and reduces manufacturing costs.

1 is a plan view showing an example of a device inspection system according to the present invention.

FIG. 2A is a conceptual diagram illustrating a configuration of an example of a vision inspection module of the device inspection system of FIG. 1 in a lateral direction.

FIG. 2B is a bottom view illustrating an arrangement of a semiconductor device and an auxiliary reflection member of the vision inspection module of FIG. 2A.

3 is a plan view illustrating an example of a focal length adjusting unit of the vision inspection module of FIG. 2.

4 is a side view of the focal length adjusting unit of FIG. 3.

FIG. 5 is a conceptual diagram illustrating a configuration of another example of a vision inspection module of the device inspection system of FIG. 1 in a lateral direction.

6 is a conceptual diagram illustrating a concept of an operating distance for obtaining an image in the vision inspection module of FIG. 2 or FIG. 5.

7 is a conceptual diagram schematically illustrating an image obtained by the vision inspection module of FIG. 2 or FIG. 5.

Hereinafter, a vision inspection module and a device inspection system having the same according to the present invention will be described with reference to the accompanying drawings.

Device inspection system according to an embodiment of the present invention, as shown in Figure 1, a loading unit 10 for linearly moving a tray (2) containing a plurality of semiconductor elements (1) is loaded; A vision inspection module 50 installed at one side of the loading unit 10 to be perpendicular to the transfer direction of the tray 2 in the loading unit 10 to perform vision inspection on the semiconductor device 1; A first guide rail 68 disposed perpendicular to the moving direction of the tray 2 in the loading unit 10; A first transfer tool coupled with the first guide rail 68 to move along the first guide rail 68 and picking up and transporting elements from the loading unit 10 to the vision inspection module 50 to perform vision inspection. 61; Unloading

units

31 and 32 that receive the trays 2 containing the semiconductor devices 1 that have undergone vision inspection in the loading unit 10 and classify the semiconductor devices 1 into the trays 2 according to the vision inspection results. , 33).

Here, the semiconductor device 1 may be a target of any semiconductor device that has completed a semiconductor process such as a memory, an SD RAM, a flash RAM, a CPU, and a GPU.

The tray 2 is a structure in which one or more semiconductor devices 1 are stacked and transported in an eight-light matrix, and is generally standardized as a memory device.

The loading unit 10 is a component for loading the semiconductor device 1 to be inspected so as to perform vision inspection, and various configurations are possible.

For example, the loading unit 10 transfers a tray 2 containing a plurality of semiconductor elements 1 in a state of being seated in a seating groove formed in the tray 2.

The loading unit 10 may be configured in various ways, and as shown in FIG. 1 and Korean Patent Application Laid-Open No. 10-2008-0092671, the movement of the tray 2 on which the plurality of semiconductor devices 1 are stacked is performed. A guide unit (not shown) for guiding and a drive unit (not shown) for moving the tray 2 along the guide unit may be configured.

The vision inspection module 50 is installed on one side of the loading unit 10 to be perpendicular to the conveying direction of the tray 2 in the loading unit 10 to perform vision inspection of the semiconductor device 1. Various configurations are possible.

Here, the vision inspection module 50, of course, can be various configurations depending on the configuration of the system.

In particular, the vision inspection module 50 may be configured to acquire an image of the exterior of the bottom surface of the semiconductor device 1 by using a camera, a scanner, or the like.

Here, the image obtained by the vision inspection module 50 is used for non-point inspection, such as whether the defect after analyzing the image using a program.

Meanwhile, the vision inspection module 50 may be configured in various ways according to the type of vision inspection, and may be disposed on any one surface (hereinafter, referred to as a 'first surface') and a side adjacent to the top and bottom surfaces of the semiconductor device 1. It is preferred to be configured to perform all vision tests on the subject.

More specifically, as shown in FIGS. 2A and 7, the vision inspection module 50 may be mounted in the state of being picked up by the first transfer tool 61 with respect to the semiconductor device 1 having a rectangular planar shape. It is preferably configured to perform vision inspection on both the opposite side and the four sides.

To this end, the vision inspection module 50 is, for example, as shown in Figures 2 to 5, as a vision inspection module 50 for performing a vision inspection of the semiconductor device 1 of planar polygonal shape, Single image acquisition unit 100 for acquiring the first plane image of the first plane of the semiconductor device 1 and the side images of the sides of the polygonal sides of the semiconductor device 1, the first image of the semiconductor device 1 Acquire a single image for each of the first optical path L1 for allowing the first plane image for one plane to reach the single image acquisition unit 100 and for the side images of the sides of the polygonal sides of the semiconductor device 1. It may include an optical system for forming a plurality of second optical path (L2) to reach the portion 100.

The single image acquisition unit 100 is configured to acquire a first plane image for the first plane of the semiconductor device 1 and side images for the side surfaces of polygonal sides of the semiconductor device 1. Do.

For example, the single image acquisition unit 100 may be a camera, a scanner, or the like.

In addition, as illustrated in FIG. 7, the single image acquisition unit 100 includes the first plane image of the first plane of the semiconductor device 1 and the polygonal sides of the semiconductor device 1 for analysis of the acquired images. The side images of the sides of the vehicle are transferred to a controller (not shown) and used for a non-point test such as whether or not after analyzing the image using a program.

The optical system includes a first optical path L1 for allowing a first plane image of the first plane of the semiconductor device 1 to reach the single image acquisition unit 100, and side surfaces of polygonal sides of the semiconductor device 1. Various configurations are possible as a configuration of forming a plurality of second optical paths L2 for allowing each of the side images of the light beams to reach the single image acquisition unit 100.

Specifically, in the optical system, the numbers of the lens 110, the reflecting

members

211 and 311, the transflective member, the prism, and the like, according to the installation positions of the semiconductor device 1 and the single image acquisition unit 100, are numbers and installation positions. Can be selected.

In particular, the optical system corresponds to the main reflection member 211 reflecting the first plane image on the first plane toward the single image acquisition unit 100 and corresponding to each side of the polygonal sides of the semiconductor device 1. It may include an auxiliary reflection member 311 is installed to reflect the side image of each side of the polygonal sides of the semiconductor device 1 toward the main reflection member 211.

The main reflecting member 211 is configured to reflect the first plane image on the first plane toward the single image acquisition unit 100, and various members such as a reflective member and a semi-transmissive member may be used.

The auxiliary reflection member 311 is installed to correspond to each side of the polygonal sides of the semiconductor device 1 so that the side image of each side of the polygonal sides of the semiconductor device 1 toward the main reflection member 211. As the configuration for reflecting, various members such as a reflecting member and a transflective member can be used.

Meanwhile, the optical system is provided with an illumination system 540 for irradiating light to the first plane and side surfaces for vision inspection, and the illumination system 540 may be variously installed according to the irradiation method.

The illumination system 540 may be irradiated with a variety of light, such as monochromatic light such as laser light, tricolor light such as R, G, B, white light, depending on the type of vision inspection, various light sources such as LED element can be used.

In addition, the illumination system 540 can be variously arranged according to the configuration of the optical system.

For example, when the optical system includes the main reflection member 211 described above, the main reflection member 211 may have a transflective material through which light can pass, and the illumination system 540 may include a first plane. It may be configured to irradiate light to each side of the polygonal sides of the first plane and the semiconductor device 1 on the back surface of the reflecting surface reflecting the image.

Also, as shown in FIG. 2, the illumination system 540 may be configured to perform irradiation on the first plane and irradiation on each side by a separate light source 545, and the auxiliary reflection described above. The member 311 may be configured to have a transflective material through which light can pass, and to irradiate light onto each side of the polygonal sides of the semiconductor device 1 on the rear surface of the reflective surface reflecting the side image.

On the other hand, since the first planar image and the side images are acquired through different optical paths, that is, the first optical path L1 and the second optical path L2, the focal lengths are different from each other due to the path difference of the optical paths, thereby obtaining a single image. When an image is acquired by a device, that is, a camera, one of the first planar image and the side image is out of focus and blurs.

Thus, the vision inspection module 50, as shown in Figures 2 to 5, is installed in the optical system to correct the focal length difference between the first optical path (L1) and the second optical path (L2) focal length The correction unit 400 may further include.

Since the focal length correction unit 400 is obtained through the first optical path L1 and the second optical path L2, various configurations are possible as a configuration for compensating that the focal lengths are different from each other due to the path difference of the optical paths. .

As an example, the focal length correction unit 400 may include a medium unit 410 installed on the light paths L1 and L2 and having a transparent material capable of light transmission.

The medium part 410 is installed on the optical paths L1 and L2 to correct the focal length, and is installed on the optical paths L1 and L2 such as transparent glass and quartz and has a focal length due to a difference in refractive index. It is a configuration to correct.

In particular, the medium part 410 is preferably installed in the second optical path L2 of the first optical path L1 and the second optical path L2.

Here, the medium part 410 has a column shape such as a cylinder, a polygonal column, etc., having a predetermined thickness and forming a plane perpendicular to the optical path based on the optical path.

At this time, the thickness t of the medium portion 410 in the second optical path L2 direction is calculated by FIG. 6 and the following equation.

t = (1-1 / n) / A ₁ -A ₂ , where t is the thickness of the medium in the optical path direction, n is the refractive index of the medium, A ₁ working distance for image acquisition on the first plane, A ₂ Is the working distance for the image acquisition on the side)

Meanwhile, the medium part 410 may affect the measurement result when there is a minute error. Therefore, precise installation is important. For this purpose, the focal length correction unit 400 may be detachable from the structure 520. It may be coupled to the frame portion 410 may include a frame portion 420 is detachably installed.

The structure 520 is installed in an apparatus, that is, an element inspection system, and can be configured in various ways as a structure for supporting the medium portion 410.

The frame part 420 is detachably coupled to the structure 520 and is configured to be detachably installed with a medium part 410.

For example, as illustrated in FIG. 3, the frame part 420 forms an empty space 429 in the first optical path L1 to enable light transmission, and corresponds to the second optical path L2. It may be configured by a plurality of frame members (421, 422) so that the medium portion 413 can be installed in the portion.

In addition, the frame part 420 may be detachably coupled to the structure 520 by a magnetic force, and for this purpose, at least one of the magnet 424 and the at least one of the frame part 420 and the structure 520 may be used. 524 may be installed.

The focal length correction unit 400 may be arranged in various ways in combination with an optical system.

For example, as illustrated in FIGS. 2 and 5, the focal length compensator 400 may include each side surface of the polygonal sides of the semiconductor device 1 and the main reflection member of the second optical path L2. Between the 211, and between the main reflecting member 211 and the single image acquisition unit 100 of the second optical path (L2).

The focal length correction unit 400 is installed between each side of the polygonal sides of the semiconductor element 1 and the main reflection member 211 in the second optical path L2. 400 may be integrally formed with the auxiliary reflection member 311.

By installing the focal length correction unit 400 as described above, when the image is acquired by a single image acquisition device, that is, a camera, the focal lengths are different from each other due to the path difference of the optical paths. This can solve the problem of blurring because of focusing on either side.

The first transfer tool 61 is coupled to the first guide rail 68 so as to move along the first guide rail 68 and from the loading unit 10 to the vision inspection module 50 to perform vision inspection. Various configurations are possible as the configuration for picking up and transferring the elements.

For example, the first transfer tool 61 may include one or more pickup tools (not shown) for picking up the semiconductor device 1, and the pickup tools may be provided in a plurality, such as a line or a double row, to increase the inspection speed. This is preferable.

The pick-up tool is configured to pick up the semiconductor element 1 by vacuum pressure, and various configurations are possible.

The first guide rail 680 is disposed perpendicular to the moving direction of the tray 2 in the loading unit 10 to support the first transfer tool 61 to be described later, and to guide the movement thereof. Configuration is possible.

The unloading

units

31, 32, and 33 receive trays 2 containing the semiconductor devices 1 that have undergone vision inspection in the loading unit 10, and receive semiconductor trays in the trays 2 according to the vision inspection results. Various configurations are possible as the configuration for classifying (1).

The unloading

parts

31, 32, and 33 have a structure similar to that of the loading part 10, and according to the number of inspection results of the semiconductor device 1, good quality G, bad 1 or abnormal 1 (R1), bad It is preferable that it is comprised so that classification grades, such as 2 or more 2 (R2), may be provided.

The unloading

parts

31, 32, and 33 may include a guide part (not shown) installed in parallel with one side of the loading part 10, and a driving part (not shown) for moving the tray 2 along the guide part. Unloading trays including a plurality may be installed in parallel.

Meanwhile, the tray 2 may be transferred between the loading unit 10 and the unloading

units

31, 32, and 33 by a tray transfer device (not shown), and the unloading

units

31, 32 may be used. , 33 may further include a bin tray 200 for supplying an empty tray 2 in which the semiconductor device 1 is not loaded.

In this case, the bin tray 200 may include a guide unit (not shown) installed in parallel with one side of the loading unit 10, and a drive unit (not shown) for moving the tray 2 along the guide unit. Can be.

In addition, the unloading

parts

31, 32, and 33 may be separately provided with a sorting tool 62 for transferring the semiconductor device 1 according to the classification level of each unloading tray part between the unloading tray parts. .

The sorting tool 62 may have a configuration that is the same as or similar to that of the first transfer tool 61 described above, and may have a double row structure or a single row structure.

Meanwhile, the unloading

units

31, 32, and 33 have been described with reference to an embodiment in which the

unloading unit

31, 32, and 33 are unloaded while being loaded in the tray 2 loaded from the loading unit 10. Any configuration can be used as long as it can be loaded and unloaded, including a so-called tape reel module, which is loaded and unloaded on a carrier tape having a pocket.

On the other hand, the present invention is characterized by the configuration of the vision inspection module, in particular the ultra-compensation distance compensation unit on the optical path, the configuration of the device inspection system presented is an embodiment, the vision inspection module according to the present invention is an embodiment of the present invention Of course, it is not limited to being installed in the device inspection system according to the example.

The exemplary embodiments of the present invention have been described above by way of example, but the scope of the present invention is not limited to these specific embodiments, and may be appropriately changed within the scope of the claims.

Claims

As a vision inspection module 50 for performing a vision inspection of a semiconductor device 1 having a polygonal planar shape,

A single image acquisition unit 100 for acquiring a first plane image of the first plane of the semiconductor device 1 and side images of sides of polygonal sides of the semiconductor device 1;

A first optical path L1 for causing a first plane image of the first plane of the semiconductor device 1 to reach the single image acquisition unit 100 and sides of polygonal sides of the semiconductor device 1 Vision inspection module (50), characterized in that it comprises an optical system for forming a plurality of second optical paths (L2) to reach each of the side images for the single image acquisition unit (100).
The method according to claim 1,

Vision inspection module (50) is installed in the optical system further comprises a focal length correction unit (400) for correcting the focal length difference between the first optical path (L1) and the second optical path (L2).
The method according to claim 2,

The focal length correction unit 400, the vision inspection module 50, characterized in that it comprises a medium portion 410 is installed in the light path (L1, L2) having a transparent material capable of light transmission.
The method according to claim 2,

The focal length correction unit (400) is a vision inspection module (50), characterized in that it comprises a frame portion (420) detachably coupled to the structure (520) and the medium portion (410) is detachably installed.
The method according to claim 4,

The frame part (420), the vision inspection module 50, characterized in that detachably coupled to the structure 520 by a magnetic force.
The method according to any one of claims 1 to 5,

The optical system,

A main reflection member 211 reflecting the first plane image with respect to the first plane toward the single image acquisition unit 100;

An auxiliary reflection member installed to correspond to each side surface of the polygonal sides of the semiconductor device 1 to reflect side images of each side surface of the polygonal sides of the semiconductor device 1 toward the main reflection member 211 ( Vision inspection module 50, characterized in that it comprises a 311).
The method according to claim 6,

The main reflection member 211 has a semi-transmissive material that can transmit light,

A vision inspection module comprising an illumination system 540 for irradiating light to each side of the polygonal sides of the first plane and the semiconductor device 1 from a rear surface of the reflective surface reflecting the first plane image ( 50).
The method according to claim 7,

The focal length correction unit 400 is formed between each side of the polygonal sides of the semiconductor device 1 and the main reflection member 211 of the second optical path L2, and the second optical path L2. Vision inspection module (50), characterized in that installed in at least one of between the main reflecting member (211) and the single image acquisition unit (100).
The method according to claim 7,

The focal length correction unit 400 is provided between each side of the polygonal sides of the semiconductor device 1 and the main reflection member 211 of the second optical path L2,

The focal length correction unit 400, the non-point inspection module (1), characterized in that formed integrally with the auxiliary reflecting member (311).
A loading unit 10 configured to linearly move by loading a tray 2 containing a plurality of semiconductor devices 1;

A vision inspection module 50 installed at one side of the loading unit 10 to be perpendicular to the conveying direction of the tray 2 in the loading unit 10 to perform vision inspection on the semiconductor device 1;

A first guide rail 68 disposed perpendicular to the moving direction of the tray 2 in the loading unit 10;

Coupled with the first guide rail 68 so as to move along the first guide rail 68, and picks up and transports the device from the loading unit 10 to the vision inspection module 50 to perform vision inspection. A first transfer tool 61;

The unloading unit 31 receives the trays 2 containing the semiconductor devices 1 that have undergone vision inspection by the loading unit 10 and classifies the semiconductor devices 1 into the trays 2 according to the vision inspection results. 32, 33),

The vision inspection module 50 is a device inspection system, characterized in that the vision inspection module according to any one of claims 1 to 5.
The method according to claim 10,

The optical system,

A main reflection member 211 reflecting the first plane image with respect to the first plane toward the single image acquisition unit 100;

An auxiliary reflection member installed to correspond to each side surface of the polygonal sides of the semiconductor device 1 to reflect side images of each side surface of the polygonal sides of the semiconductor device 1 toward the main reflection member 211 ( 311) device inspection system comprising a.
The method according to claim 11,

The main reflection member 211 has a semi-transmissive material that can transmit light,

And an illumination system (540) for irradiating light to each side of the polygonal sides of the first plane and the semiconductor device (1) from the back surface of the reflecting surface reflecting the first plane image.
The method according to claim 12,

The focal length correction unit 400 may be formed between the side surfaces of the polygonal sides of the semiconductor device 1 and the main reflection member 211 of the second optical path L2, and the second optical path L2. ) At least one of the main reflecting member (211) and the single image acquisition unit (100).
The method according to claim 12,

The focal length correction unit 400 is provided between each side of the polygonal sides of the semiconductor device 1 and the main reflection member 211 of the second optical path L2,

The focal length correction unit (400) is a device inspection system, characterized in that formed integrally with the auxiliary reflecting member (311).