WO2016120068A1 - Coupon having a sintered soldering foil, method and component - Google Patents

Coupon having a sintered soldering foil, method and component Download PDF

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Publication number
WO2016120068A1
WO2016120068A1 PCT/EP2016/050546 EP2016050546W WO2016120068A1 WO 2016120068 A1 WO2016120068 A1 WO 2016120068A1 EP 2016050546 W EP2016050546 W EP 2016050546W WO 2016120068 A1 WO2016120068 A1 WO 2016120068A1
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WO
WIPO (PCT)
Prior art keywords
coupon
substrate
component
sintered
powder
Prior art date
Application number
PCT/EP2016/050546
Other languages
German (de)
French (fr)
Inventor
Britta Laux
Thomas NÄGEL
Ingo Reinkensmeier
Original Assignee
Siemens Aktiengesellschaft
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Filing date
Publication date
Application filed by Siemens Aktiengesellschaft filed Critical Siemens Aktiengesellschaft
Publication of WO2016120068A1 publication Critical patent/WO2016120068A1/en

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/06Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
    • B22F7/062Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F5/00Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product
    • B22F5/04Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product of turbine blades
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/06Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
    • B22F7/08Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools with one or more parts not made from powder
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/0008Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0018Brazing of turbine parts
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0233Sheets, foils
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244Powders, particles or spheres; Preforms made therefrom
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/30Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3033Ni as the principal constituent
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/30Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3046Co as the principal constituent
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23PMETAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P15/00Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
    • B23P15/04Making specific metal objects by operations not covered by a single other subclass or a group in this subclass turbine or like blades from several pieces
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23PMETAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P6/00Restoring or reconditioning objects
    • B23P6/002Repairing turbine components, e.g. moving or stationary blades, rotors
    • B23P6/005Repairing turbine components, e.g. moving or stationary blades, rotors using only replacement pieces of a particular form
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F01MACHINES OR ENGINES IN GENERAL; ENGINE PLANTS IN GENERAL; STEAM ENGINES
    • F01DNON-POSITIVE DISPLACEMENT MACHINES OR ENGINES, e.g. STEAM TURBINES
    • F01D5/00Blades; Blade-carrying members; Heating, heat-insulating, cooling or antivibration means on the blades or the members
    • F01D5/005Repairing methods or devices
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/06Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
    • B22F7/062Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts
    • B22F2007/068Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts repairing articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/001Turbines
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F05INDEXING SCHEMES RELATING TO ENGINES OR PUMPS IN VARIOUS SUBCLASSES OF CLASSES F01-F04
    • F05DINDEXING SCHEME FOR ASPECTS RELATING TO NON-POSITIVE-DISPLACEMENT MACHINES OR ENGINES, GAS-TURBINES OR JET-PROPULSION PLANTS
    • F05D2230/00Manufacture
    • F05D2230/20Manufacture essentially without removing material
    • F05D2230/23Manufacture essentially without removing material by permanently joining parts together
    • F05D2230/232Manufacture essentially without removing material by permanently joining parts together by welding
    • F05D2230/238Soldering
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F05INDEXING SCHEMES RELATING TO ENGINES OR PUMPS IN VARIOUS SUBCLASSES OF CLASSES F01-F04
    • F05DINDEXING SCHEME FOR ASPECTS RELATING TO NON-POSITIVE-DISPLACEMENT MACHINES OR ENGINES, GAS-TURBINES OR JET-PROPULSION PLANTS
    • F05D2230/00Manufacture
    • F05D2230/30Manufacture with deposition of material
    • F05D2230/31Layer deposition

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Materials Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Powder Metallurgy (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)

Abstract

The invention relates to a coupon which has a sintered shape made of two powders as a substrate, wherein the second powder has a lower melting temperature than the first powder by at least 10K, wherein a foil is provided on the sintered substrate (4), which has a lower melting point than the second powder of the substrate (4) by at least 10K. For improved fixing, a coupon according to the invention has a further thin layer made of a soldering foil, which is joined to the pre-sintered shape by means of sintering.

Description

Coupon mit aufgesinterter Lotfolie, Verfahren und Bauteil  Coupon with sintered solder foil, process and component
Die Erfindung betrifft einen Coupon, der eine aufgesinterte Lotfolie aufweist, ein Verfahren und ein Bauteil. The invention relates to a coupon having a sintered solder foil, a method and a component.
Zur Reparatur von geschädigten Turbinenkomponenten kann eine strukturelle Reparatur durchgeführt werden, bei der die ge¬ schädigten Bereiche aus der Turbinenschaufel herausgetrennt werden und durch vorgefertigte Inserts aus dem gleichen Mate- rial ersetzt werden. Diese Inserts, „Coupons" oder PSP, kön¬ nen mittels einer konventionellen Lotfolie in den abgetrennten Bereich eingefügt werden. Bei der Lotfolie besteht aller¬ dings das Problem, dass diese in der Regel nur eine Dicke von 0,05 - 0,1mm aufweist. Sofern der Lötspalt, der sich zwischen der ausgemuldeten Komponente und dem Coupon ergibt, diese Dicke überschreitet, kommt es zu einer unvollständigen Anbin- dung des Coupons. Damit ist eine sehr präzise Vorbereitung der Komponente und des Coupons erforderlich, die mit hohen Kosten verbunden ist. For the repair of damaged turbine components a structural repair can be performed, in which the ge ¬ damaged areas are separated out of the turbine blade and are replaced by preformed inserts of the same Mate rial. These inserts, "coupons" or PSP, Kings ¬ NEN be inserted into the separated area by means of a conventional solder foil In the solder foil consists of all ¬ recently the problem that they generally only have a thickness of 0.05 -. 0.1 mm comprising If the gap between the component and the coupon is more than that, the coupon will be incomplete, which means that the component and the coupon must be prepared very precisely and at a high cost ,
Eine Möglichkeit stellen flexible Tapes dar, die jedoch auf¬ wendig zu applizieren sind. Weiterhin verfügen die flexiblen Tapes über einen Binderanteil, der das Risiko einer Porenbil¬ dung im Lötspalt birgt, sofern der Binder während des Lötens nicht ausgasen kann. One way represent flexible tapes, however, are to apply to ¬ agile. Furthermore, the flexible tapes have a binder content, which carries a risk of Porenbil ¬ dung in the soldering gap, provided that the binder can not outgas during brazing.
Es ist daher Aufgabe der Erfindung, oben genanntes Problem zu lösen . Die Aufgabe wird gelöst durch einen Coupon gemäß Anspruch 1, einem Verfahren gemäß Anspruch 5 und einem Bauteil gemäß Anspruch 8. It is therefore an object of the invention to solve the above-mentioned problem. The object is achieved by a coupon according to claim 1, a method according to claim 5 and a component according to claim 8.
In den Unteransprüchen sind weitere vorteilhafte Maßnahmen aufgelistet, die beliebig miteinander kombiniert werden kön¬ nen, um weitere Vorteile zu erzielen. Die Figuren und die Beschreibung stellen nur Ausführungsbeispiele der Erfindung dar. In the dependent claims further advantageous measures are listed, which are combined with each other Kings ¬ nen to obtain further advantages. The figures and the description represent only embodiments of the invention.
Es zeigen Show it
Figur 1 ein Coupon mit Lotfolie, FIG. 1 shows a coupon with solder foil,
Figur 2 schematisch einen Schritt bei der Durchführung des erfindungsgemäßen Verfahrens und Figure 2 shows schematically a step in the implementation of the method according to the invention and
Figur 3 zeigt eine Liste von nickel- und kobaltbasierten Figure 3 shows a list of nickel- and cobalt-based ones
Legierungen  alloys
Es wird vorgeschlagen, eine Lotfolie direkt auf Substrate von Coupons vorzugsweise aufzusintern . Bei den Folien könnte es sich um flexible Folien mit der gewünschten Lot-/ Grundwerkstoffmischung handeln. Diese könnten in der passenden Geometrie und Dicke hergestellt werden und bei niedrigen Temperatu¬ ren auf die Coupons aufgesintert werden. In diesem Schritt könnte der Binder ausgasen, so dass die Gefahr der Porenbildung deutlich reduziert werden kann. Es wäre auch denkbar, die Coupons vollständig applikationsfertig mitsamt dem aufgesinterten Tape zu beziehen, so dass im Rahmen der Applikation lediglich noch die Komponente vorbereitet werden müss- te . It is proposed to preferably sinter a solder foil directly onto substrates of coupons. The films could be flexible films with the desired solder / base material mixture. These could be made in the appropriate geometry and thickness and are sintered at low tempera ¬ ren on the coupons. In this step, the binder could outgas, so that the risk of pore formation can be significantly reduced. It would also be conceivable to obtain the coupons completely ready for application together with the sintered-on tape so that in the context of the application only the component would have to be prepared.
Dadurch kann die Wirtschaftlichkeit der Coupon-Repair deutlich erhöht werden. Die Coupon-Repair als innovative Repara¬ turtechnologie führt zu einer Erweiterung des Reparaturumfan- ges und einer Reduzierung der Anschlussrate. As a result, the cost-effectiveness of the coupon repair can be significantly increased. The coupon Repair as an innovative Repara ¬ turtechnologie leads to an expansion of Reparaturumfan- ges and a reduction in the connection rate.
Figur 1 zeigt einen erfindungsgemäßen Coupon 1. FIG. 1 shows a coupon 1 according to the invention.
Der Coupon 1 weist ein Substrat 4 auf. The coupon 1 has a substrate 4.
Das Substrat 4 ist in bekannter Weise eine Mischung aus zu¬ mindest zwei verschiedenen Pulver, die zu einer Form gesintert werden. Die zwei verschiedenen Pulver stellen vorzugsweise zum einen ein Material eines Grundwerkstoffs eines Bauteilsubstrats 10 (Figur 2) dar, das repariert werden soll als auch ein zweites Material, insbesondere Pulver, das gegenüber dem ersten Mate- rial eine um mindestens 10K niedrigere Schmelztemperatur auf¬ weist. The substrate 4 is in a known manner a mixture of at least two different ¬ powders which are sintered into a mold. The two different powders is preferably used for a material of a base material of a component substrate 10 (Figure 2) is to be repaired and a second material, in particular powder, which has a lower by at least 10K melting temperature ¬ compared to the first material ,
Vorzugsweise sind das nickel- oder kobaltbasierte Superlegie- rungen, insbesondere gemäß Figur 3 oder Modifikationen davon mit Schmelzpunkterniedrigern . Preferably, these are nickel- or cobalt-based superalloys, in particular according to FIG. 3, or modifications thereof with melting point depressants.
Auf dem Substrat 4 des Coupons 1 ist eine Lotfolie 7 vorhan¬ den, deren Schichtdicke deutlich dünner ist, insbesondere aber mindestens 50%, ganz insbesondere mindestens 70% dünner ausgeführt ist als das Substrat 4 des Coupons 1. Hierfür kön¬ nen bekannte flexible Lotfolien 7 verwendet werden. On the substrate 4 of the coupon 1, a solder foil is 7 EXISTING ¬, whose layer thickness is much thinner, but especially at least 50%, is carried out more in particular at least 70% thinner than the substrate 4 of the coupon 1. For this purpose, Kings ¬ NEN known flexible solder foils 7 are used.
Vorzugsweise sind das nickel- oder kobaltbasierte Superlegie- rungen, insbesondere gemäß Figur 3 oder Modifikationen davon mit Schmelzpunkterniedrigern. Preferably, these are nickel- or cobalt-based superalloys, in particular according to FIG. 3, or modifications thereof with melting point depressants.
Die Lotfolie 7 weist wiederum gegenüber der Schmelztemperatur Ts des Substrats 4 oder des zweiten Materials des Coupons 4, eine wiederum mindestens 10K niedrigere Schmelztemperatur auf. The solder foil 7 again has a melting temperature Ts of the substrate 4 or of the second material of the coupon 4, which in turn is at least 10K lower melting temperature.
Zur Herstellung wird ein bekanntes Substrat 4 eines Coupons 1 aus dem Stand der Technik verwendet, das mit einer Lotfolie 7 aus dem Stand der Technik in einem separaten Herstellungsgang durch Sintern miteinander verbunden wird. For the production, a known substrate 4 of a prior art coupon 1 is used, which is connected to a prior art solder foil 7 in a separate manufacturing process by sintering.
Ein solcher modifizierter Coupon 1 kann zur Reparatur eines Bauteilsubstrats 10 eines Bauteils 11 oder zur Neuherstellung verwendet werden (Fig. 2) . Such a modified coupon 1 can be used to repair a component substrate 10 of a component 11 or to make it new (FIG. 2).
Dabei kommt der Coupon 1 mit der Lotfolie 7 auf eine Auflage¬ fläche 13 des zu reparierenden Bauteilsubstrats 10 in Kontakt und wird erneut versintert, so dass ein repariertes Bauteil 11 oder ein Neubauteil aus mehreren Komponenten entsteht. In this case, the coupon 1 comes with the solder foil 7 on a support ¬ surface 13 of the component to be repaired substrate 10 in contact with and is sintered again so that a repaired component 11, or a new part of a plurality of components is produced.

Claims

Patentansprüche claims
1. Coupon ( 1 ) , 1st coupon (1),
der als Substrat (4) eine gesinterte Form aus zumindest zwei Pulvern aufweist,  which as substrate (4) has a sintered form of at least two powders,
wobei das zweite Pulver des Substrats (4) ein gegenüber dem ersten Pulver eine um mindestens 10K niedrigere Schmelztemperatur aufweist,  wherein the second powder of the substrate (4) has a melting temperature which is at least 10K lower than that of the first powder,
wobei mit dem gesinterten Substrat (4) eine Lotfolie (7) verbunden ist,  wherein a brazing foil (7) is bonded to the sintered substrate (4),
die (7) gegenüber dem Substrat (4) eine um mindestens 10K niedrigere Schmelztemperatur aufweist.  which (7) has a melting point that is at least 10K lower than the substrate (4).
2. Coupon nach Anspruch 1, 2. Coupon according to claim 1,
bei dem die Pulver für das Substrat (4) nickel- oder ko¬ baltbasiert sind. wherein the powder for the substrate (4) nickel- or ko ¬ are baltbasiert.
3. Coupon nach Anspruch 1, 3. Coupon according to claim 1,
bei dem das Material der Lotfolie (7) nickel- oder kobalt¬ basiert ist. in which the material of the solder foil (7) is nickel or cobalt ¬ based.
4. Coupon nach einem oder mehreren der Ansprüche 1, 2 oder 3, 4. coupon according to one or more of claims 1, 2 or 3,
bei dem die Lotfolie (7) mit dem Substrat (4) versintert ist .  in which the solder foil (7) is sintered to the substrate (4).
5. Verfahren zur Reparatur oder Herstellung eines Bauteils (10) , 5. Method for repairing or producing a component (10),
bei dem ein Coupon (1) gemäß einem oder mehreren der Ansprüche 1, 2, 3 oder 4 verwendet wird. in which a coupon (1) according to one or more of claims 1, 2, 3 or 4 is used.
6. Verfahren nach Anspruch 5, 6. The method according to claim 5,
bei dem das Bauteilsubstrat (10) eine nickel- oder kobalt¬ basierte Superlegierung aufweist. wherein the component substrate (10) comprises a nickel- or cobalt-based superalloy ¬.
7. Verfahren nach Anspruch 5 oder 6, 7. The method according to claim 5 or 6,
bei dem die Lotfolie (7) mit dem Coupon (1) zur Auflage auf eine Oberfläche (13) des Bauteilsubstrats (10) gelangt.  in which the solder foil (7) with the coupon (1) comes to rest on a surface (13) of the component substrate (10).
8. Bauteil (11) aus einem Bauteilsubstrat (10) mit einer Auflagefläche (13), 8. component (11) comprising a component substrate (10) having a bearing surface (13),
wobei mit der Auflagefläche (13) ein Coupon (1) nach einem oder mehreren der Ansprüche 1, 2, 3 oder 4 verbunden ist.  wherein with the support surface (13) a coupon (1) according to one or more of claims 1, 2, 3 or 4 is connected.
9. Verfahren oder Bauteil nach einem oder mehreren der Ansprüche 5, 6, 7 oder 8, 9. A method or component according to one or more of claims 5, 6, 7 or 8,
wobei eine Materialkomponente des Substrats (4) oder der Lotfolie (7) dem Material eines Bauteilsubstrats (10) ent¬ spricht . wherein a component material of the substrate (4) or the solder foil (7) speaks ent ¬ the material of a component substrate (10).
PCT/EP2016/050546 2015-01-30 2016-01-13 Coupon having a sintered soldering foil, method and component WO2016120068A1 (en)

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Application Number Priority Date Filing Date Title
DE102015201632.3A DE102015201632A1 (en) 2015-01-30 2015-01-30 Coupon with sintered solder foil, process and component
DE102015201632.3 2015-01-30

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020083493A1 (en) * 2018-10-25 2020-04-30 Siemens Aktiengesellschaft Max phase coupons for high temperature applications and method

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US5952042A (en) * 1992-11-04 1999-09-14 Coating Applications, Inc. Plural layered metal repair tape
US6612480B1 (en) * 2000-11-21 2003-09-02 C.A. Patents, L.L.C. Method of forming preforms for metal repairs
EP1749902A2 (en) * 2005-07-25 2007-02-07 The General Electric Company Wear-resistant coating mixture and article having the wear-resistant coating mixture applied thereto
EP2078579A1 (en) * 2008-01-10 2009-07-15 Siemens Aktiengesellschaft Method for soldering one component and component with soldering and welding points
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