WO2016042414A3 - Method for producing a deformable printed-circuit substrate, and deformable printed-circuit substrate - Google Patents

Method for producing a deformable printed-circuit substrate, and deformable printed-circuit substrate Download PDF

Info

Publication number
WO2016042414A3
WO2016042414A3 PCT/IB2015/002186 IB2015002186W WO2016042414A3 WO 2016042414 A3 WO2016042414 A3 WO 2016042414A3 IB 2015002186 W IB2015002186 W IB 2015002186W WO 2016042414 A3 WO2016042414 A3 WO 2016042414A3
Authority
WO
WIPO (PCT)
Prior art keywords
printed
circuit
circuit substrate
shaped
deformable
Prior art date
Application number
PCT/IB2015/002186
Other languages
German (de)
French (fr)
Other versions
WO2016042414A2 (en
Inventor
Klaus Schmidegg
Stephan Trassl
Mag. DI Andreas TANDA
Christoph RAMSAUER
Philipp WEISSEL
Original Assignee
Plastic Electronic Gmbh
Hueck Folien Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Plastic Electronic Gmbh, Hueck Folien Gmbh filed Critical Plastic Electronic Gmbh
Priority to EP15816863.3A priority Critical patent/EP3195705A2/en
Publication of WO2016042414A2 publication Critical patent/WO2016042414A2/en
Publication of WO2016042414A3 publication Critical patent/WO2016042414A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0158—Polyalkene or polyolefin, e.g. polyethylene [PE], polypropylene [PP]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09018—Rigid curved substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path

Abstract

The invention relates to a method for producing a deformable printed-circuit substrate in the form of a laminate consisting of an adhesion promoter film (1), optionally an adhesive layer (2), a printed-circuit film substrate (3) and a purely metallic conductor track (4), the latter having a preferred thickness of the order of magnitude of 1000 atomic layers. The invention also relates to a deformable printed-circuit substrate (1-4). In the method according to the invention, the printed-circuit substrate (1-4) is shaped by means of a gaseous pressure medium, at a temperature above the glass transition temperature and below the melting temperature of the printed-circuit film substrate (3) being shaped, under a sudden, high gas pressure. Thanks to the invention, sharply deformed printed-circuit substrates, in particular freely or spherically shaped printed-circuit substrates can be produced, even with purely metallic conductor tracks. Optional back-moulding (9) and application of decorative layers (11) and/or coating layers (10) allow producing multifunctional, seamlessly and freely shaped plastic components with integrated electronic elements.
PCT/IB2015/002186 2014-09-18 2015-09-18 Method for producing a deformable printed-circuit substrate, and deformable printed-circuit substrate WO2016042414A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP15816863.3A EP3195705A2 (en) 2014-09-18 2015-09-18 Method for producing a deformable printed-circuit substrate, and deformable printed-circuit substrate

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102014013564.0 2014-09-18
DE102014013564.0A DE102014013564A1 (en) 2014-09-18 2014-09-18 Method for producing a reshaped circuit carrier, as well as reshaped circuit carrier

Publications (2)

Publication Number Publication Date
WO2016042414A2 WO2016042414A2 (en) 2016-03-24
WO2016042414A3 true WO2016042414A3 (en) 2016-05-12

Family

ID=55025273

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2015/002186 WO2016042414A2 (en) 2014-09-18 2015-09-18 Method for producing a deformable printed-circuit substrate, and deformable printed-circuit substrate

Country Status (3)

Country Link
EP (1) EP3195705A2 (en)
DE (1) DE102014013564A1 (en)
WO (1) WO2016042414A2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017212784A1 (en) * 2017-07-25 2019-01-31 Wiegand Gmbh Trim piece for a vehicle and method of making a trim piece
DE102017125446B4 (en) 2017-10-30 2023-02-23 Bia Kunststoff- Und Galvanotechnik Gmbh & Co. Kg Operating element with a galvanized surface and capacitive sensors and method for its production
DE102018131760A1 (en) * 2018-12-11 2020-06-18 Hueck Folien Gmbh Domed functional film structure and method for producing the same
DE102021103548A1 (en) 2021-02-16 2022-08-18 Bayerische Motoren Werke Aktiengesellschaft Process for manufacturing a component and component
DE102022120646A1 (en) 2022-08-16 2024-02-22 Audi Aktiengesellschaft Method for producing a flexible printed circuit (FPC) by depositing metal conductor tracks, printed circuit and printed circuit battery system

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6785144B1 (en) * 1999-06-10 2004-08-31 Micron Technology, Inc. High density stackable and flexible substrate-based devices and systems and methods of fabricating
US20070257398A1 (en) * 2006-05-04 2007-11-08 Moncrieff Scott E Laminated electronic components for insert molding
US20090002973A1 (en) * 2005-11-18 2009-01-01 Nec Corporation Mount Board and Electronic Device
US20100271281A1 (en) * 2009-04-27 2010-10-28 Shenzhen Futaihong Precision Industry Co., Ltd. Housing with built-in antenna and method for fabricating the same
WO2010123733A1 (en) * 2009-04-21 2010-10-28 Molex Incorporated Three dimensional antenna
EP2378846A1 (en) * 2011-01-25 2011-10-19 Bayer Material Science AG Decorative product surface with circuit board function

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4036592A1 (en) * 1990-11-16 1992-05-21 Bayer Ag INJECTION MOLDED CIRCUITS BY INJECTING FLEXIBLE CIRCUITS WITH THERMOPLASTIC MATERIALS
DE19812880A1 (en) * 1998-03-24 1999-09-30 Bayer Ag Shaped part and flexible film with protected conductor track and process for its production
DE102005017002A1 (en) * 2005-04-07 2006-10-19 Festo Ag & Co Printed circuit board production method, involves applying base plate on form, aligning base plate to form, where base plate is arranged before and after alignment of form with conductor structure

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6785144B1 (en) * 1999-06-10 2004-08-31 Micron Technology, Inc. High density stackable and flexible substrate-based devices and systems and methods of fabricating
US20090002973A1 (en) * 2005-11-18 2009-01-01 Nec Corporation Mount Board and Electronic Device
US20070257398A1 (en) * 2006-05-04 2007-11-08 Moncrieff Scott E Laminated electronic components for insert molding
WO2010123733A1 (en) * 2009-04-21 2010-10-28 Molex Incorporated Three dimensional antenna
US20100271281A1 (en) * 2009-04-27 2010-10-28 Shenzhen Futaihong Precision Industry Co., Ltd. Housing with built-in antenna and method for fabricating the same
EP2378846A1 (en) * 2011-01-25 2011-10-19 Bayer Material Science AG Decorative product surface with circuit board function

Also Published As

Publication number Publication date
WO2016042414A2 (en) 2016-03-24
EP3195705A2 (en) 2017-07-26
DE102014013564A1 (en) 2016-03-24

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