WO2014104491A1 - Photosensitive resin composition for insulation film for display device, and insulation film and display device using same - Google Patents

Abstract

The present invention relates to a positive type photosensitive resin composition comprising (A) an alkali-soluble resin, (B) a photosensitive diazoquinone compound, (C) particles containing siloxane having a specific surface area of 100 to 400 m²/g, and (D) a solvent. The present invention also relates to an insulation film and to a display device using said composition.

Description

Photosensitive resin composition for display device insulating film, and display device insulating film and display device using same

The present invention relates to a photosensitive resin composition for a display device insulating film, a display device insulating film and a display device using the same.

Conventionally, polyimide resins having excellent heat resistance, electrical properties, mechanical properties, and the like have been used for surface protection films and interlayer insulating films of semiconductor devices. Such polyimide resins have recently been used in the form of photosensitive polyimide precursor compositions, and are easy to apply. After applying the polyimide precursor composition onto a semiconductor device, patterning by ultraviolet rays, development, thermal imidization treatment, and the like are performed. Thus, the surface protective film, the interlayer insulating film and the like can be easily formed. Therefore, compared with the conventional non-photosensitive polyimide precursor composition, it has the characteristic that the process shortening is large.

The photosensitive polyimide precursor composition has a positive type in which the exposed part is dissolved by development and a negative type in which the exposed part is cured. In the positive type, a non-toxic aqueous alkali solution can be used as a developer. The positive photosensitive polyimide precursor composition includes polyamic acid as a polyimide precursor, diazonaphthoquinone as a photosensitive material, and the like. However, the positive photosensitive polyimide precursor composition has a problem in that the carboxylic acid of the polyamic acid used is too soluble in alkali to obtain a desired pattern. In order to solve this problem, a substance in which a phenolic hydroxyl group is introduced instead of carboxylic acid, such as reacting an alcohol compound having at least one hydroxyl group through an ester bond with polyamic acid (see Japanese Patent Application Laid-Open No. 10-307393), has been proposed. This material has insufficient developability and has a problem of reducing the film or peeling the resin from the substrate.

In another way, a material in which a diazonaptoquinone compound is mixed with a polybenzoxazole precursor (Japanese Patent Laid-Open No. 63-96162) has recently been attracting attention, but especially when the polybenzoxazole precursor composition is actually used, Since the film reduction amount of the unexposed part is large, it is difficult to obtain a desired pattern after development. In order to improve this problem, if the molecular weight of the polybenzoxazole precursor is increased, the film reduction amount of the unexposed part becomes small, but developing residue (scum) occurs in the exposed part during development, resulting in poor resolution and longer developing time of the exposed part. there was. In order to solve this problem, it is reported that the amount of film reduction of unexposed portions during development is suppressed by adding a specific phenolic compound to the polybenzoxazole precursor composition (Japanese Patent Laid-Open No. 9-302221 and Japanese Patent Laid-Open No. 2000). -292913). However, in this method, the effect of suppressing the reduction amount of the unexposed portion is insufficient, and there is a continuous demand for research to increase the film reduction suppression effect without generating development residues (scum). In addition, the phenol used to control the solubility causes problems such as decomposition or side reactions at high temperatures during thermal curing, which causes great damage to the mechanical properties of the resulting cured film. Research is also continuing.

On the other hand, also in the field of display apparatus, the positive photosensitive resin composition containing the said polybenzoxazole precursor can be applied as an organic insulating film or a partition material. Liquid crystal display devices, which are one of display devices, have advantages such as light weight, thinness, low cost, low power consumption, and excellent bonding with integrated circuits, and thus their use range is expanding for notebook computers, monitors, and TV images. The liquid crystal display device includes a lower substrate on which a black matrix, a color filter, and an ITO pixel electrode are formed, an active circuit unit consisting of a liquid crystal layer, a thin film transistor, and a capacitor layer, and an upper substrate on which an ITO pixel electrode is formed. The color filter includes a black matrix layer formed in a predetermined pattern on a transparent substrate for shielding boundaries between pixels, and a plurality of colors (typically red (R), green (G), and blue (B) to form each pixel. The three primary colors) are arranged in a stacked order.

In the case of organic light emitting diodes (OLEDs), which are being actively developed recently, in order to construct a pixelated device, each organic EL element may be arranged as a matrix pixel, and these pixels may have the same color. It may be manufactured to emit a monochromatic display device or arranged in three primary colors of red (R), green (G), and blue (B) to emit various colors.

One embodiment of the present invention is to provide a display positive type photosensitive resin composition having excellent residual film ratio, sensitivity, and dielectric constant, and low residue generation rate of an exposed part.

Another embodiment of the present invention is to provide an insulating film using the positive photosensitive resin composition.

Another embodiment of the present invention is to provide a display device including the insulating layer.

One embodiment of the present invention is a positive composition comprising (A) an alkali soluble resin, (B) a photosensitive diazoquinone compound, (C) siloxane-containing particles having a specific surface area of 100 to 400 m ² / g, and (D) a solvent It provides a type photosensitive resin composition.

The siloxane-containing particles (C) may have a specific surface area of 100 to 300 m ² / g.

The alkali-soluble resin (A) may be a polybenzoxazole precursor, polyamic acid, polyimide, or a combination thereof.

The siloxane-containing particles may be represented by the following formula (1).

[Formula 1]

R _m Si (OR ¹ ) _4-m

In Formula 1, R is a hydrogen atom, a hydroxyl group, a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C2 to C30 alkenyl group, a substituted or unsubstituted C2 to C30 alkynyl group, a substituted or unsubstituted C3 To C30 cycloalkyl group, substituted or unsubstituted C3 to C30 cycloalkenyl group, substituted or unsubstituted C3 to C30 cycloalkynyl group, substituted or unsubstituted C6 to C30 aryl group, or a combination thereof, R ¹ Silver substituted or unsubstituted C1 to C30 alkyl group, substituted or unsubstituted C2 to C30 alkenyl group, substituted or unsubstituted C2 to C30 alkynyl group, substituted or unsubstituted C3 to C30 cycloalkyl group, substituted or unsubstituted C3 To C30 cycloalkenyl group, a substituted or unsubstituted C3 to C30 cycloalkynyl group, a substituted or unsubstituted C6 to C30 aryl group, or a combination thereof, m is a tablet of 1 to 3 One can.

The positive photosensitive resin composition may contain 5 to 100 parts by weight of the (B) photosensitive diazoquinone compound, 1 to 10 parts by weight of the (C) siloxane-containing particles, and 100 parts by weight of the (A) alkali-soluble resin. (D) 100 to 400 parts by weight of the solvent may be included.

The positive photosensitive resin composition may further include a phenol compound.

In another embodiment of the present invention, an insulating film manufactured by using the positive photosensitive resin composition is provided.

In another embodiment of the present invention, a display device including the insulating film is provided.

The photosensitive resin composition for an insulating film, the insulating film using the same, and a display device including the same according to an embodiment of the present invention have excellent residual film rate, sensitivity, and dielectric constant, and low residue generation rate of the exposed part.

1 is a schematic view (section) showing a display device according to an embodiment.

2 is a schematic view showing an insulating film pattern after exposure / development of the photosensitive resin composition according to one embodiment.

<Explanation of symbols for the main parts of the drawings>

100: first electrode opening

200: second electrode opening

101: taper angle

102: organic light emitting layer

103: cathode

104: insulation layer

105: anode

106: TFT electrode layer

107: glass

Hereinafter, embodiments of the present invention will be described in detail. However, this is presented as an example, by which the present invention is not limited and the present invention is defined only by the scope of the claims to be described later.

Unless stated otherwise in the specification, "substituted" to "substituted" means that at least one hydrogen atom of the functional group of the present invention is a halogen atom (-F, -Cl, -Br or -I), hydroxy group, nitro group, cya No group, amino group (NH ₂ , NH (R ²⁰⁰ ) or N (R ²⁰¹ ) (R ²⁰² ), wherein R ²⁰⁰ , R ²⁰¹ and R ²⁰² are the same or different from each other, and are each independently C1 to C10 alkyl group, Amidino group, hydrazine group, hydrazone group, carboxyl group, substituted or unsubstituted alkyl group, substituted or unsubstituted alkenyl group, substituted or unsubstituted alkynyl group, substituted or unsubstituted alicyclic organic group, substituted or unsubstituted It means substituted with one or more substituents selected from the group consisting of an aryl group, and a substituted or unsubstituted hetero ring group.

Unless stated otherwise in the present specification, "alkyl group" means a C1 to C30 alkyl group, specifically means a C1 to C15 alkyl group, and "cycloalkyl group" means a C3 to C30 cycloalkyl group, specifically C3 To C18 cycloalkyl group, "alkoxy group" means C1 to C30 alkoxy group, specifically C1 to C18 alkoxy group, "aryl group" means C6 to C30 aryl group, specifically C6 to C18 to aryl group, "alkenyl group" means C2 to C30 alkenyl group, specifically C2 to C18 alkenyl group, "alkylene group" means C1 to C30 alkylene group, specifically C1 To C18 alkylene group, an "arylene group" means a C6 to C30 arylene group, specifically, a C6 to C16 arylene group.

Also, unless stated otherwise in the specification, an "aliphatic organic group" means a C1 to C30 alkyl group, a C2 to C30 alkenyl group, a C2 to C30 alkynyl group, a C1 to C30 alkylene group, a C2 to C30 alkenylene group, or a C2 to C30 group. An alkynylene group, and specifically, a C1 to C15 alkyl group, a C2 to C15 alkenyl group, a C2 to C15 alkynyl group, a C1 to C15 alkylene group, a C2 to C15 alkenylene group, or a C2 to C15 alkynylene group, and Alicyclic organic group "means a C3 to C30 cycloalkyl group, a C3 to C30 cycloalkenyl group, a C3 to C30 cycloalkynyl group, a C3 to C30 cycloalkylene group, a C3 to C30 cycloalkenylene group, or a C3 to C30 cycloalkynylene group Specifically, C3 to C15 cycloalkyl group, C3 to C15 cycloalkenyl group, C3 to C15 cycloalkynyl group, C3 to C15 cycloalkylene group, C3 to C15 cycloalkenylene group, Or a C3 to C15 cycloalkynylene group, "aromatic organic group" means a C6 to C30 aryl group or a C6 to C30 arylene group, and specifically means a C6 to C16 aryl group or a C6 to C16 arylene group, "Hetero ring group" means a C2 to C30 heterocycloalkyl group, C2 to C30 hetero, containing one to three heteroatoms selected from the group consisting of O, S, N, P, Si and combinations thereof in one ring Cycloalkylene group, C2 to C30 heterocycloalkenyl group, C2 to C30 heterocycloalkenylene group, C2 to C30 heterocycloalkynyl group, C2 to C30 heterocycloalkynylene group, C2 to C30 heteroaryl group, or C2 to C30 hetero It means an arylene group, specifically, containing one to three hetero atoms selected from the group consisting of O, S, N, P, Si and combinations thereof in one ring C2 to C15 heterocycloalkyl group, C2 to C15 heterocycloalkylene group, C2 to C15 heterocycloalkenyl group, C2 to C15 heterocycloalkenylene group, C2 to C15 heterocycloalkynyl group, C2 to C15 heterocycloalkynylene group, C2 To C15 heteroaryl group, or C2 to C15 heteroarylene group.

Positive type photosensitive resin composition according to an embodiment of the present invention is (A) alkali-soluble resin, (B) photosensitive diazoquinone compound, (C) siloxane-containing particles having a specific surface area of 100 to 400 m ² / g, and ( D) a solvent.

Hereinafter, each structure of the said positive photosensitive resin composition is demonstrated concretely.

(A) alkali-soluble resin

The alkali-soluble resin (A) can be used without limitation so long as it is an alkali-soluble resin generally used in the art. Specifically, the alkali-soluble resin includes a polybenzoxazole precursor including a repeating unit represented by the following Formula 2, a polyamic acid including the repeating unit represented by the following Formula 3, and a repeating unit represented by the following Formula 4. At least one selected from polyimides can be used.

Polybenzoxazole precursors

[Formula 2]

[Correction under Rule 91 11.07.2013]

In Formula 2, X ¹ is a substituted or unsubstituted C6 to C30 aromatic organic group, Y1 is a substituted or unsubstituted C6 to C30 aromatic organic group, a substituted or unsubstituted divalent to hexavalent C1 to C30 aliphatic oil Or a substituted or unsubstituted divalent to hexavalent C3 to C30 alicyclic organic group.

In Formula 2, X ¹ may be a residue derived from an aromatic diamine as an aromatic organic group.

Examples of the aromatic diamine include 3,3'-diamino-4,4'-dihydroxybiphenyl, 4,4'-diamino-3,3'-dihydroxybiphenyl, bis (3-amino- 4-hydroxyphenyl) propane, bis (4-amino-3-hydroxyphenyl) propane, bis (3-amino-4-hydroxyphenyl) sulfone, bis (4-amino-3-hydroxyphenyl) sulfone, 2,2-bis (3-amino-4-hydroxyphenyl) -1,1,1,3,3,3-hexafluoropropane, 2,2-bis (4-amino-3-hydroxyphenyl) -1,1,1,3,3,3-hexafluoropropane, 2,2-bis (3-amino-4-hydroxy-5-trifluoromethylphenyl) hexafluoropropane, 2,2-bis (3-amino-4-hydroxy-6-trifluoromethylphenyl) hexafluoropropane, 2,2-bis (3-amino-4-hydroxy-2-trifluoromethylphenyl) hexafluoropropane, 2 , 2-bis (4-amino-3-hydroxy-5-trifluoromethylphenyl) hexafluoropropane, 2,2-bis (4-amino-3-hydroxy-6-trifluoromethylphenyl) hexafluoro rope Ropan, 2,2-bis (4-amino-3-hydroxy-2-trifluoromethylphenyl) hexafluoropropane, 2,2-bis (3-amino-4-hydroxy-5-pentafluoroethyl Phenyl) hexafluoropropane, 2- (3-amino-4-hydroxy-5-trifluoromethylphenyl) -2- (3-amino-4-hydroxy-5-pentafluoroethylphenyl) hexafluoro Propane, 2- (3-amino-4-hydroxy-5-trifluoromethylphenyl) -2- (3-hydroxy-4-amino-5-trifluoromethylphenyl) hexafluoropropane, 2- (3 -Amino-4-hydroxy-5-trifluoromethylphenyl) -2- (3-hydroxy-4-amino-6-trifluoromethylphenyl) hexafluoropropane, 2- (3-amino-4-hydroxy Hydroxy-5-trifluoromethylphenyl) -2- (3-hydroxy-4-amino-2-trifluoromethylphenyl) hexafluoropropane, 2- (3-amino-4-hydroxy-2-trifluoro Rhomethylphenyl) -2- (3-hydroxy-4-amino-5-trifluoromethylphenyl) hexafluoropropane and 2- (3-a No-4-hydroxy-6-trifluoromethylphenyl) -2- (3-hydroxy-4-amino-5-trifluoromethylphenyl) hexafluoropropane can be used, but is not limited thereto It doesn't happen.

In Formula 2, Y ¹ is an aromatic organic group, a divalent to hexavalent aliphatic organic group, or a divalent to hexavalent alicyclic organic group, and may be a residue of a dicarboxylic acid or a residue of a dicarboxylic acid derivative. Specifically, Y ¹ may be an aromatic organic group or a divalent to hexavalent alicyclic organic group.

Examples of the dicarboxylic acid may include Y ¹ (COOH) ₂ , wherein Y ¹ is the same as Y ¹ of Chemical Formula 1.

Examples of the di-carboxylic acid derivatives is Y ¹ (COOH) ₂ of the carbonyl halide derivative, or Y ¹ (COOH) ₂ and 1-hydroxy-1,2,3-benzotriazole-active ester derivative by reacting a sol such as the active compounds may be mentioned (wherein Y ¹ is the same hereinafter as Y ¹ in the formula (1)).

Specific examples of the dicarboxylic acid derivatives include 4,4'-oxydibenzoyl chloride, diphenyloxydicarbonyldichloride, bis (phenylcarbonyl chloride) sulfone, bis (phenylcarbonyl chloride) ether, bis (phenylcarbonyl chloride). ) Phenone, phthaloyldichloride, terephthaloyldichloride, isophthaloyldichloride, dicarbonyldichloride, diphenyloxydicarboxylate dibenzotriazole or combinations thereof, but is not limited thereto.

The polybenzoxazole precursor may have a thermopolymerizable functional group derived from a reactive endblocking monomer at either or both of the branched chain ends. The reactive end-blocking monomer is preferably monoamines or monoanhydrides having a carbon-carbon double bond, or a combination thereof. The monoamines may include, but are not limited to, toluidine, dimethylaniline, ethylaniline, aminophenol, aminobenzyl alcohol, aminoindan, aminoacetonephenone, or a combination thereof.

Polyamic acid and polyimide

[Formula 3]

[Correction under Rule 91 11.07.2013]

[Formula 4]

[Correction under Rule 91 11.07.2013]

In Formulas 3 and 4, X ² and X ³ are each independently a substituted or unsubstituted C6 to C30 aromatic organic group, a substituted or unsubstituted divalent to 6-valent C1 to C30 aliphatic organic group, a substituted or unsubstituted Or a divalent to hexavalent C3 to C30 alicyclic organic group or an organic silane group.

Specifically, in Formulas 3 and 4, X ² and X ³ may each independently be a residue derived from an aromatic diamine, an alicyclic diamine, or a silicone diamine. At this time, the aromatic diamine, alicyclic diamine and silicone diamine may be used alone or in combination of one or more thereof.

Examples of the aromatic diamine include 3,4'-diaminodiphenyl ether, 4,4'-diaminodiphenyl ether, 3,4'-diaminodiphenylmethane, 4,4'-diaminodiphenylmethane, 4,4'-diaminodiphenylsulfone, 4,4'-diaminodiphenylsulfide, benzidine, m-phenylenediamine, p-phenylenediamine, 1,5-naphthalenediamine, 2,6-naphthalenediamine , Bis [4- (4-aminophenoxy) phenyl] sulfone, bis (3-aminophenoxyphenyl) sulfone, bis (4-aminophenoxy) biphenyl, bis [4- (4-aminophenoxy) phenyl ] Ether, 1, 4-bis (4-aminophenoxy) benzene, the compound which substituted the alkyl group or the halogen atom in these aromatic rings, or a combination thereof is mentioned, But it is not limited to these.

Examples of the alicyclic diamine include, but are not limited to, 1,2-cyclohexyl diamine, 1,3-cyclohexyl diamine, or a combination thereof.

Examples of the silicone diamine include bis (4-aminophenyl) dimethylsilane, bis (4-aminophenyl) tetramethylsiloxane, bis (p-aminophenyl) tetramethyldisiloxane, bis (γ-aminopropyl) tetramethyldisiloxane , 1,4-bis (γ-aminopropyldimethylsilyl) benzene, bis (4-aminobutyl) tetramethyldisiloxane, bis (γ-aminopropyl) tetraphenyldisiloxane, 1,3-bis (aminopropyl) tetra Methyldisiloxane, or a combination thereof, but is not limited thereto.

In Formulas 3 and 4, Y ² and Y ³ are each independently substituted or unsubstituted C6 to C30 aromatic organic group, substituted or unsubstituted tetravalent to hexavalent C1 to C30 aliphatic organic group, or substituted or unsubstituted Tetravalent C6 to C30 alicyclic organic group.

Y ² and Y ³ may each independently be a residue derived from an aromatic acid dianhydride or an alicyclic acid dianhydride. In this case, the aromatic acid dianhydride and the alicyclic acid dianhydride may be used alone or in combination of one or more thereof.

Examples of the aromatic acid dianhydride include pyromellitic dianhydride; Benzophenone tetracarboxylic dianhydride such as benzophenone-3,3 ', 4,4'-tetracarboxylic dianhydride ; Oxydiphthalic dianhydride such as 4,4'-oxydiphthalic dianhydride; Biphthalic dianhydrides such as 3,3 ', 4,4'-biphthalic dianhydride (3,3', 4,4'-biphthalic dianhydride); (Hexafluoroisopropyledene) diphthalic dianhydride, such as 4,4 '-(hexafluoroisopropylidene) diphthalic dianhydride (4,4'-(hexafluoroisopropyledene) diphthalic dianhydride) ; Naphthalene-1,4,5,8-tetracarboxylic dianhydride; 3,4,9,10-perylenetetracarboxylic dianhydride (3,4,9,10-perylenetetracarboxylic dianhydride) and the like, but are not limited thereto.

Examples of the alicyclic acid dianhydride include 1,2,3,4-cyclobutanetetracarboxylic dianhydride (1,2,3,4-cyclobutanetetracarboxylic dianhydride), 1,2,3,4-cyclopentanetetracarboxyl Acid dianhydrides (1,2,3,4-cyclopentanetetracarboxylic dianhydride), 5- (2,5-dioxotetrahydrofuryl) -3-methyl-cyclohexane-1,2-dicarboxylic dianhydride (5- (2,5-dioxotetrahydrofuryl) -3-methyl-cyclohexane-1,2-dicarboxylic anhydride), 4- (2,5-dioxotetrahydrofuran-3-yl) -tetraline-1,2-dicar Acid dianhydride (4- (2,5-dioxotetrahydrofuran-3-yl) -tetralin-1,2-dicarboxylic anhydride), bicyclooctene-2,3,5,6-tetracarboxylic dianhydride (bicyclooctene- 2,3,5,6-tetracarboxylic dianhydride), bicyclooctene-1,2,4,5-tetracarboxylic dianhydride (bicyclooctene-1,2,4,5-tetracarboxylic dianhydride), but It is not limited.

The alkali-soluble resin may have a weight average molecular weight (Mw) of 3,000 to 300,000 g / mol, specifically, may have a weight average molecular weight (Mw) of 5,000 to 30,000 g / mol. When having a weight average molecular weight (Mw) in the above range can be obtained a sufficient residual film ratio in the non-exposed part when developing with an aqueous alkali solution, it can be efficiently patterned.

(B) photosensitive diazoquinone compound

As the photosensitive diazoquinone compound, a compound having a 1,2-benzoquinonediazide structure or a 1,2-naphthoquinonediazide structure may be used.

As the photosensitive diazoquinone compound, at least one selected from compounds represented by the following Chemical Formula 5 and Chemical Formulas 7 to 9 may be used, but is not limited thereto.

[Formula 5]

[Correction under Rule 91 11.07.2013]

R ⁶⁰ to R ⁶² in Formula 5 may each independently be a hydrogen atom or a substituted or unsubstituted C1 to C30 alkyl group, and specifically, may be a methyl group.

In Formula 5, R ⁶³ to R ⁶⁵ may be each independently OQ, and Q may be a hydrogen atom, a functional group represented by Formula 6a, or a functional group represented by Formula 6b, wherein Q may be hydrogen at the same time. There is no.

In Formula 5, n20 'to n22 may each be an integer of 0 to 5.

[Formula 6a]

[Correction under Rule 91 11.07.2013]

[Formula 6b]

[Correction under Rule 91 11.07.2013]

[Formula 7]

[Correction under Rule 91 11.07.2013]

In Formula 7, R ⁶⁶ may be a hydrogen atom, or a substituted or unsubstituted C1 to C30 alkyl group, R ⁶⁷ to R ⁶⁹ may be each independently OQ, and Q is the same as defined in Formula 5 above , n23 to n25 may be integers of 0 to 5, respectively.

[Formula 8]

[Correction under Rule 91 11.07.2013]

In Formula 8, A ³ may be CO or CR ⁷⁴ R ⁷⁵ , and R ⁷⁴ and R ⁷⁵ may be each independently a substituted or unsubstituted C1 to C30 alkyl group.

R ⁷⁰ to R ⁷³ in Formula 8 may each independently represent a hydrogen atom, a substituted or unsubstituted C1 to C30 alkyl group, OQ or NHQ, wherein Q is the same as defined in Formula 5 above.

In Formula 8, n26 'to n29 may each be an integer of 0 to 4, and n26 + n27' and n28 + n29 may each be an integer of 5 or less.

However, at least one of R ⁷⁰ and R ⁷¹ may be OQ, one aromatic ring may include 1 to 3 OQ, and the other aromatic ring may include 1 to 4 OQ.

[Formula 9]

[Correction under Rule 91 11.07.2013]

In Chemical Formula 9,

R ⁷⁴ to R ⁸¹ may each independently be a hydrogen atom or a substituted or unsubstituted C1 to C30 alkyl group, n30 and n31 may each be an integer of 1 to 5, and Q is the same as defined in Chemical Formula 5 above .

The photosensitive diazoquinone compound may be included in the positive photosensitive resin composition in an amount of 5 to 100 parts by weight, specifically 10 to 50 parts by weight, based on 100 parts by weight of the alkali-soluble resin. When included in the above range, the pattern is well formed without the residue by exposure, there is no loss of film thickness during development, it is possible to obtain a good pattern.

(C) siloxane-containing particles

The siloxane-containing particles may be produced by surface modification of the siloxane-containing compound by spray drying. The siloxane-containing particles thus formed may be less than nanometers in size, are crystalline or amorphous, and because of their higher purity than normal silica, are transparent and have low refractive index and low light propagation loss.

The specific surface area of the siloxane-containing particles according to one embodiment may be 100 to 400 m ² / g, specifically 100 to 300 m ² / g. When the specific surface area of the siloxane-containing particles is within the above range, the positive type photosensitive partition pixel layer may maintain the high sensitivity, and the functions of heat resistance and insulation may be enhanced.

The siloxane-containing particles may be specifically represented by the following formula (1).

[Formula 1]

R _m Si (OR ¹ ) _4-m

In Formula 1, R is a hydrogen atom, a hydroxyl group, a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C2 to C30 alkenyl group, a substituted or unsubstituted C2 to C30 alkynyl group, a substituted or unsubstituted C3 To C30 cycloalkyl group, substituted or unsubstituted C3 to C30 cycloalkenyl group, substituted or unsubstituted C3 to C30 cycloalkynyl group, substituted or unsubstituted C6 to C30 aryl group, or a combination thereof, and R1 is Substituted or unsubstituted C1 to C30 alkyl group, substituted or unsubstituted C2 to C30 alkenyl group, substituted or unsubstituted C2 to C30 alkynyl group, substituted or unsubstituted C3 to C30 cycloalkyl group, substituted or unsubstituted C3 to A C30 cycloalkenyl group, a substituted or unsubstituted C3 to C30 cycloalkynyl group, a substituted or unsubstituted C6 to C30 aryl group, or a combination thereof, m is an integer of 1 to 3 Can.

The siloxane-containing particles may be included in 1 to 10 parts by weight, specifically 1 to 7 parts by weight based on 100 parts by weight of alkali-soluble resin. When included in the above range, it is possible to uniformly apply to the substrate by preventing the aggregation of the silica particles, it is possible to obtain a photosensitive pixel partition layer composition having high heat resistance and insulation without light loss.

(D) solvent

The photosensitive resin composition for the display device insulating film may include a solvent capable of easily dissolving each component.

Specific examples of the solvent include -methyl-2-pyrrolidone, γ-butyrolactone, N, N-dimethylacetamide, dimethyl sulfoxide, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol di Butyl ether, propylene glycol monomethyl ether, dipropylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, methyl lactate, ethyl lactate, butyl lactate, methyl-1,3-butylene glycol acetate, 1,3-butylene glycol 3-monomethyl ether, methyl pyruvate, ethyl pyruvate, methyl-3-methoxy propionate, etc. are mentioned. These solvents can be used alone or in combination of two or more thereof.

The solvent may be included in the positive photosensitive resin composition at 100 to 400 parts by weight based on 100 parts by weight of the alkali-soluble resin. When included in the above range can be a film of a sufficient thickness, it may have excellent solubility and coating properties.

Specifically, the solvent may be used so that the solid content of the positive photosensitive resin composition is 3 to 50% by weight, specifically 5 to 30% by weight.

(E) phenolic compounds

The photosensitive resin composition for the display device insulating layer may further include a phenol compound. The phenolic compound may increase the dissolution rate and sensitivity of the exposed portion during development with an aqueous alkali solution to form a pattern with the photosensitive resin composition, and may serve as a high resolution pattern without developing residues during development.

Examples of the phenolic compound include compounds represented by the following Chemical Formulas 10 to 16, but are not limited thereto.

[Formula 10]

[Correction under Rule 91 11.07.2013]

In Chemical Formula 10,

R ⁸² to R ⁸⁷ are each independently hydrogen, a hydroxy group (OH), a substituted or unsubstituted alkyl group of C1 to C8, alkoxyalkyl of C1 to C8 or -OCO-R ⁸⁸ , and R ⁸⁸ is a substitution of C1 to C8 or An unsubstituted alkyl group, at least one of R ⁸² to R ⁸⁷ is a hydroxy group, and not all are hydroxy groups.

[Formula 11]

[Correction under Rule 91 11.07.2013]

In Chemical Formula 11,

R ⁹⁹ to R ¹⁰¹ are each independently hydrogen or a substituted or unsubstituted alkyl group of C1 to C8, and R ¹⁰² to R ¹⁰⁶ are each independently H, OH, or a substituted or unsubstituted alkyl group of C1 to C8, Specifically, the alkyl group may be CH ₃ , and n68 is an integer of 1 to 5.

[Formula 12]

[Correction under Rule 91 11.07.2013]

In Chemical Formula 12,

R ¹⁰⁷ to R ¹¹² are each independently H, OH, or a substituted or unsubstituted alkyl group of C1 to C8, A ₃ is CR ²⁰⁵ R ²⁰⁶ or a single bond, and R ²⁰⁵ and R ²⁰⁶ are each independently hydrogen, Or a substituted or unsubstituted alkyl group of C1 to C8, specifically, the alkyl group may be CH ₃ , and n69 + n70 + n71 and n72 + n73 + n74 are each independently an integer of 5 or less.

[Formula 13]

[Correction under Rule 91 11.07.2013]

In Chemical Formula 13,

R ¹¹³ to R ¹¹⁵ are each independently hydrogen or a substituted or unsubstituted alkyl group of C1 to C8, n75, n76 and n79 are each independently an integer of 1 to 5, n77 and n78 are each independently 0 to 4 Is an integer.

[Formula 14]

[Correction under Rule 91 11.07.2013]

In Chemical Formula 14,

R ¹¹⁶ to R ¹²¹ are each independently hydrogen, OH, or a substituted or unsubstituted alkyl group of C1 to C8, and n80 to n83 are each independently an integer of 1 to 4; However, n80 + n82 and n81 + n83 are each independently an integer of 5 or less.

[Formula 15]

[Correction under Rule 91 11.07.2013]

In Chemical Formula 15,

R ¹²² is a C1 to C8 substituted or unsubstituted alkyl group, specifically, CH ₃ , and R ¹²³ to R ¹²⁵ are each independently hydrogen or a C1 to C8 substituted or unsubstituted alkyl group, n84, n86 and n88 are each independently an integer of 1 to 5, and n85, n87 and n89 are each independently an integer of 0 to 4; Provided that n84 + n85, n86 + n87 and n88 + n89 are each independently an integer of 5 or less.

[Formula 16]

[Correction under Rule 91 11.07.2013]

In Chemical Formula 16,

R ¹²⁶ to R ¹²⁸ are each independently a substituted or unsubstituted alkyl group of C1 to C8, specifically, may be CH ₃ , and R ¹²⁹ to R ¹³² are each independently hydrogen or a substituted or unsubstituted of C1 to C8 N90, n92 and n94 are each independently an integer of 1 to 5, n91, n93 and n95 are each independently an integer of 0 to 4, and n96 is an integer of 1 to 4; However, n90 + n91, n92 + n93, and n94 + n95 are each independently an integer of 5 or less.

Specific examples of the phenol compound include 2,6-dimethoxymethyl-4-t-butylphenol, 2,6-dimethoxymethyl-p-cresol, 2,6-diacetoxymethyl-p-cresol, and the like. However, the present invention is not limited thereto.

The amount of the phenol compound used may be 1 to 40 parts by weight based on 100 parts by weight of the alkali-soluble resin. When the content of the phenolic compound is in the above range, it does not cause a decrease in sensitivity during development, and can appropriately increase the dissolution rate of the non-exposed part to obtain a good pattern, and also exhibit excellent storage stability because precipitation does not occur during freezing storage. have.

(F) other additives

The photosensitive resin composition for a display device insulating film according to an embodiment may further include other additives.

The photosensitive resin composition for a display device insulating film may be selected from the group consisting of malonic acid in order to prevent stains and spots during coating, leveling characteristics, or generation of residues due to undevelopment; 3-amino-1,2-propanediol; Silane coupling agents having a vinyl group or a (meth) acryloxy group; And additives such as these. The amount of these additives to be used can be easily adjusted according to the desired physical properties. The silane coupling agent may improve the adhesion between the photosensitive resin composition for a display device insulating film and the substrate. Examples of the silane coupling agent include compounds represented by the following Chemical Formulas 17 to 19; Vinyltrimethoxysilane, vinyltriethoxysilane, vinyltrichlorosilane, vinyltris (β-methoxyethoxy) silane; Or 2- (3,4 epoxycyclohexyl) -ethyltrimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-acryloxypropyltrimethoxysilane, p-styryltrimethoxysilane, 3 -Methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropylmethyldiethoxysilane; Carbon-carbon unsaturated bond containing silane compounds, such as trimethoxy [3- (phenylamino) propyl] silane, are mentioned, but it is not limited to these.

[Formula 17]

[Correction under Rule 91 11.07.2013]

In Formula 17, R ²⁰ is a vinyl group, a substituted or unsubstituted alkyl group, or a substituted or unsubstituted aryl group, specifically 3- (meth) acryloxypropyl, p-styryl or 3- (phenylamino Profile).

In Formula 17, R ²¹ to R ²³ are each independently a substituted or unsubstituted alkoxy group, a substituted or unsubstituted alkyl group, or a halogen, wherein at least one of R ²¹ to R ²³ is an alkoxy group or a halogen, specifically As the alkoxy group may be a C1 to C8 alkoxy group, the alkyl group may be a C1 to C20 alkyl group.

[Formula 18]

[Correction under Rule 91 11.07.2013]

In Formula 18, R ²⁴ is -NH ₂ or -CH ₃ CONH, R ²⁵ to R ²⁷ are each independently a substituted or unsubstituted C1 to C20 alkoxy group, specifically the alkoxy group is OCH ₃ or OCH ₂ CH ₃ and n34 may be an integer from 1 to 5.

[Formula 19]

[Correction under Rule 91 11.07.2013]

In Formula 19, R ²⁸ to R ³¹ are each independently a substituted or unsubstituted C1 to C20 alkyl group, or a substituted or unsubstituted C1 to C20 alkoxy group, and specifically, may be CH ₃ or OCH ₃ .

In Formula 19, R ³² and R ³³ may each independently be a substituted or unsubstituted amino group, and specifically NH ₂ or CH ₃ CONH. In addition, n35 and n36 may be an integer of 1 to 5, respectively.

The silane coupling agent may be used in an amount of 0.1 to 30 parts by weight based on 100 parts by weight of the alkali-soluble resin, and specifically 1 to 7 parts by weight. When used within the above range, the adhesion to the upper and lower membrane layers is excellent, and no residual film is left after development, and optical properties such as transmittance, as well as mechanical properties of the membrane such as tensile strength and elongation can be improved.

In addition, the photosensitive resin composition for a display device insulating film may further include an epoxy compound as an additive to improve adhesion and the like. As the epoxy compound, an epoxy novolac acrylic carboxylate resin, an ortho cresol novolac epoxy resin, a phenol novolac epoxy resin, a tetramethyl biphenyl epoxy resin, a bisphenol A type epoxy resin, an alicyclic epoxy resin or a combination thereof may be used. Can be.

When the epoxy compound is further included, a radical polymerization initiator such as a peroxide initiator or an azobis-based initiator may be further included.

The epoxy compound may be used in an amount of 0.01 to 5 parts by weight based on 100 parts by weight of the photosensitive resin composition for the display device insulating film. When the epoxy compound is included in the above range it is possible to improve the adhesion and other properties in storage and economical.

The method of manufacturing the photosensitive resin composition for the display device insulating film is not particularly limited, but specifically, the above-described dye, acrylic binder resin, photopolymerization initiator, photopolymerizable monomer, solvent, and additives may be optionally mixed to mix the photosensitive resin for display device insulating film. The composition can be prepared.

Other additives include heat latent acid generators. Examples of the heat latent acid generator include arylsulfonic acids such as p-toluenesulfonic acid and benzenesulfonic acid; Perfluoroalkylsulfonic acids such as trifluoromethanesulfonic acid, trifluorobutanesulfonic acid and the like; Alkyl sulfonic acids such as methanesulfonic acid, ethanesulfonic acid, butanesulfonic acid and the like; Or combinations thereof, but is not limited thereto.

The heat latent acid generator can smoothly proceed the cyclization reaction even if the curing temperature is lowered as a catalyst for the dehydration reaction of the phenolic hydroxyl group-containing polyamide of the polybenzoxazole precursor and the cyclization reaction.

In addition, suitable surfactants or leveling agents may be further used as additives in order to prevent staining of the film thickness or to improve developability.

According to another embodiment, a display device insulating film manufactured using the photosensitive resin composition for the display device insulating film is provided.

The display device insulating film may be manufactured by the following method. After applying the prepared photosensitive resin composition to the surface of the substrate by a spray method, a roll coater method, a rotary coating method, etc., the solvent is removed by pre-baking to form a coating film. It is preferable to perform the said prebaking for 1 to 5 minutes at 70-150 degreeC. Thereafter, visible light, ultraviolet rays, far ultraviolet rays, electron beams, far-ultraviolet rays, electron beams, X-rays, and the like are irradiated to the formed coating film according to a pattern prepared in advance, and developed with a developer to remove an unnecessary portion to form a predetermined pattern. At this time, an aqueous alkali solution may be used as the developing solution, specifically, inorganic alkalis such as sodium hydroxide, potassium hydroxide, sodium carbonate; Primary amines such as ethylamine and n-propylamine; Secondary amines such as diethylamine and n-propylamine; Tertiary amines such as trimethylamine, methyldiethylamine, dimethylethylamine and triethylamine; Alcohol amines such as dimethylethanolamine, methyl diethanolamine and triethanolamine; Aqueous solutions of quaternary ammonium salts such as tetramethylammonium hydroxide and tetraethylammonium hydroxide; And mixtures thereof. It is preferable that the density | concentration of the alkaline compound of the said developing solution is 0.1 to 10%. In addition, an appropriate amount of a water-soluble organic solvent or a surfactant such as methanol ethanol may be added together with the solvent. In addition, after developing with the developer as described above, it is washed with ultrapure water for 30 to 140 seconds to remove unnecessary parts and dried to form a pattern, and after irradiating the formed pattern with light such as ultraviolet rays, the pattern is The final pattern may be obtained by heating at 110 to 300 ° C. for 30 to 120 minutes by a heating apparatus.

In another embodiment of the present invention, a display device including the insulating layer is provided. Specifically, the display device may be a liquid crystal display, a light emitting diode, a plasma display, or an organic light emitting diode.

Hereinafter, the present invention will be described in more detail with reference to Examples and Comparative Examples, but the following Examples and Comparative Examples are for illustrative purposes only and are not intended to limit the present invention.

(Production of polybenzoxazole precursor)

Synthesis Example 1 Preparation of Polybenzoxazole Precursor (PBO-1)

2,2-bis (3- (amino-4-hydroxyphenyl) -1,1,1,3,3 while passing nitrogen through a four-necked flask equipped with a stirrer, a thermostat, a nitrogen gas injection device and a cooler 12.4 g of, 3-hexafluoropropane was dissolved in 125 g of N-methyl-2-pyrrolidone (NMP) When the solid was completely dissolved, 4.2 g of pyridine was added to the solution, and the temperature was 0 to 5 ° C. 9.4 g of 4,4'-oxydibenzoyl chloride was added dropwise to 100 g of N-methyl-2-pyrrolidone (NMP) while maintaining the solution, and the solution was slowly added dropwise for 30 minutes. The reaction was carried out, and the reaction was terminated by raising the temperature to room temperature and stirring for 1 hour.

1.1 g of 5-norbornene-2,3-dicarboxylic hydride was added to this, and it stirred at 70 degreeC for 24 hours, and reaction was complete | finished. The reaction mixture was poured into water to form a precipitate, and the precipitate was filtered and thoroughly washed with water. The polybenzoxazole precursor (PBO-1) was prepared by drying at a temperature of 80 ° C. under vacuum for at least 24 hours.

Synthesis Example 2 Preparation of Polybenzoxazole Precursor (PBO-2)

Polybenzoxazole precursor (PBO-2) was prepared in the same manner as in Synthesis Example 1, except that maleic hydride was used instead of 5-norbornene-2,3-dicarboxylic hydride.

Hereinafter, the specifications of the components used in the examples are as follows.

(A) alkali-soluble resin

(A-1) The polybenzoxazole precursor prepared in Synthesis Example 1 was used.

(A-2) The polybenzoxazole precursor prepared in Synthesis Example 2 was used.

(B) photosensitive diazoquinone compound

A photosensitive diazoquinone represented by the following Formula 20 was used.

[Formula 20]

[Correction under Rule 91 11.07.2013]

In Formula 20, two of Q is substituted with Formula 21, and the other is hydrogen.

[Formula 21]

[Correction under Rule 91 11.07.2013]

(C) siloxane-containing particles

A siloxane-containing particle (R805, Aerosil) having a specific surface area of (C-1) 150 ± 25 m ² / g was used.

(C-2) A siloxane-containing particle (R812, Aerosil) having a specific surface area of 260 ± 30 m ² / g was used.

(C-3) A siloxane-containing particle (R816, Aerosil) having a specific surface area of 190 ± 20m ² / g was used.

(C-4) A siloxane-containing particle (R200, Aerosil) having a specific surface area of 200 ± 15 m ² / g was used.

(C-5) A siloxane-containing particle (OX50, Aerosil) having a specific surface area of 50 ± 15 m ² / g was used.

(D) solvent

γ-butyrolactone was used.

(E) phenolic compounds

The phenolic compound represented by following formula (22) was used.

[Formula 22]

[Correction under Rule 91 11.07.2013]

Examples 1 to 5 and Comparative Example 1 and Comparative Example 2

Each component was mixed with the composition of Table 1 below to prepare a positive photosensitive resin composition. Specifically, the alkali-soluble resin (A) was dissolved in the solvent (D) and then dissolved by adding a photosensitive diazoquinone compound (B) and a phenol compound (E). Thereafter, the siloxane-containing particles were added to the mixture, stirred for 1 hour at room temperature, stabilized, and filtered through a 0.45 µm fluororesin filter to prepare a positive photosensitive resin composition.

Table 1 (Parts by weight)

		Example 1	Example 2	Example 3	Example 4	Example 5	Comparative Example 1	Comparative Example 2
(A) alkali-soluble resin	(A-1)	100	100	100	100	-	100	100
	(A-2)	-	-	-	-	100	-	-
(B) photosensitive diazoquinone compound		30	30	30	30	30	30	30
(C) siloxane-containing particles	(C-1)	5	-	-	-	5	-	-
	(C-2)	-	5	-	-	-	-	-
	(C-3)	-	-	5	-	-	-	-
	(C-4)	-	-	-	5	-	-	-
	(C-5)	-	-	-	-	-	-	5
(D) solvent		350	350	350	350	350	350	350
(E) phenolic compounds		20	20	20	20	20	20	20

In Table 1, the content units of (B) to (E) are parts by weight added based on 100 parts by weight of (A).

Production of pattern film

The positive photosensitive resin compositions prepared in Examples 1 to 5 and Comparative Examples 1 and 2 were applied to ITO glass using a spin coater, and then heated to 120 ° C. on a hot plate for 100 seconds to form a photosensitive polyimide precursor coating film. It was. After exposure using an exposure apparatus (I-line stepper, Nikon Co., NSR i10C) using a pattern mask engraved with a pattern of various sizes on the polyimide precursor coating film, 23% in an aqueous solution of tetramethylammonium hydroxide at room temperature of 2.38% Washed for 60 seconds. Subsequently, the obtained pattern was cured at 250 ° C. for 40 minutes at an oxygen concentration of 1000 ppm or less using an electric furnace to obtain a pattern film.

Evaluation example

Regarding the prepared pattern film, a residual film rate, sensitivity, heat resistance, residue, dielectric constant, coating property, and transparency were evaluated in the following manner, and the results are shown in Table 2 below.

(1) residual film rate measurement

The prefired film was developed in a 2.38% tetramethylammonium hydroxide (TMAH) aqueous solution for 23 ° C./60 seconds, washed with ultrapure water for 60 seconds, dried, and measured for change in film thickness using Alpha Step (Tencor). And it calculated by the following formula 1.

[Calculation 1]

Residual film ratio = (film thickness after development / initial film thickness before development) × 100

(○: excellent residual film ratio of 90% or more, △: moderate level of 80-90%, X: low residual film ratio of 80% or less)

(2) sensitivity measurement

After exposure and development, an exposure time for which a 10 µm L / S pattern was formed with a line width of 1 to 1 was obtained and this was taken as the optimum exposure time. The resolution was measured by making the minimum pattern dimension in the said optimal exposure time into the resolution.

(○: excellent sensitivity at 100 mJ / cm 2 or less, △: sensitive sensitivity at 100 to 200 mJ / cm 2, and X: low sensitivity at 200 mJ / cm 2 or more)

(3) residue evaluation

The residue level of the pattern formed using the photosensitive resin composition prepared above was confirmed by an optical microscope and CD-SEM.

(○: level of residue clean, △: level of residual residue, X: level vulnerable to residual residue)

(4-1) Heat resistance evaluation: glass transition temperature (Tg) measurement

The photosensitive resin film-coated wafer formed by using the prepared photosensitive resin composition was immersed in a 2% hydrofluoric acid (HF) aqueous solution to separate the resin film without damage. The glass transition temperature was measured by TMA (thermo-mechanical analyzer) analysis of each of the separated resin films.

(○: excellent heat resistance at Tg 280 ° C or higher, △: normal heat resistance at Tg 230 to 280 ° C, X: low heat resistance at Tg 330 ° C or lower)

(4-2) Heat resistance evaluation: 5% weight loss temperature (Td) measurement

The photosensitive resin film-coated wafer formed by using the prepared photosensitive resin composition was immersed in a 2% hydrofluoric acid (HF) aqueous solution to separate the resin film without damage. The 5% weight loss temperature was measured by TGA (thermogravimetric analyzer) analysis of each resin film separated.

(○: excellent heat resistance at Td 380 ° C or higher, △: normal heat resistance at Td 330-380 ° C, X: low heat resistance at Td 330 ° C or lower)

(5) permittivity measurement

The positive photosensitive resin composition prepared above was applied to a chromium substrate and subjected to 120 ° C./100 seconds treatment on a hot plate to form a coating film having a final thickness of 3.0 μm. The formed coating film was cured in an electric furnace at a temperature of 250 ° C. for 40 minutes, and then the dielectric constant was confirmed through a DEA (dielectric analyzer) device.

(○: dielectric constant below 3.0, X: dielectric constant above 3.0)

(6) coating evaluation

The positive photosensitive resin composition prepared above was applied to ITO glass using a spin coater, and then treated on a hot plate at 120 ° C./100 seconds to confirm uniformity and defects of the coated film with an optical microscope and SP1 equipment.

(○: excellent coatability, △: good coatability / some defects present, X: poor coatability)

(7) Transparency evaluation: Haze meter measurement

The positive photosensitive resin composition prepared above was coated on a quartz substrate using a fin spin coater, and then coated on a hot plate at 120 ° C./100 seconds for curing for 40 minutes in an electric furnace at a temperature of 250 ° C., followed by a haze meter (NDH-2000). , DENSHOKU) equipment to check the transparency.

(○: excellent level of transmittance of 90% or more, △: transparency of 80 to 90% of transmittance is moderate, X: transparency of low of transmittance of 80% or less is low)

TABLE 2

division	Residual rate	Sensitivity	Residue	Heat Resistance (1)	Heat Resistance (2)	permittivity	Coating	Transparency
Example 1	○	○	○	○	○	○	○	○
Example 2	○	○	○	○	○	○	○	○
Example 3	○	○	○	○	○	○	○	○
Example 4	○	○	○	○	○	○	○	○
Example 5	○	○	○	○	○	○	○	○
Comparative Example 1	○	○	○	X	X	X	○	○
Comparative Example 2	○	△	X	○	○	○	△	△

Through the above evaluation examples, it can be seen that the positive photosensitive resin composition of the present invention can realize the sensitivity (EOP) at the time when the residual film does not remain by appropriately adjusting the developing speed of the exposed portion, and the overall difference in the film thickness of the exposed portion It was confirmed that no residue occurred in the area.

As shown in Table 2, in Comparative Example 1, the glass transition temperature and the 5% weight loss temperature are relatively low, whereas the heat resistance is low, whereas in Examples 1 to 5, the residual film rate and sensitivity, dielectric constant, and heat resistance of the non-exposed part are low. The remaining film of the exposed portion was cleanly removed while maintaining the excellent level. Although the comparative example 2 is somewhat superior in terms of heat resistance and dielectric constant, due to the small specific surface area of the siloxane-containing particles, the coating property and transparency are deteriorated and the sensitivity is adversely affected, resulting in a problem of scum after development.

Although the preferred embodiments of the present invention have been described above, the present invention is not limited thereto, and various modifications and changes can be made within the scope of the claims and the detailed description of the invention. It is natural to belong.

Claims (8)

1. (A) alkali-soluble resins;

   (B) photosensitive diazoquinone compound;

   (C) siloxane-containing particles having a specific surface area of 100 to 400 m ² / g; And

   (D) solvent

   Positive photosensitive resin composition comprising a.
2. In claim 1,

   The siloxane-containing particles (C) is a positive photosensitive resin composition having a specific surface area of 100 to 300 m ² / g.
3. In claim 1,

   The said alkali-soluble resin (A) is a positive photosensitive resin composition which is a polybenzoxazole precursor, a polyamic acid, a polyimide, or a combination thereof.
4. In claim 1,

   Positive siloxane-containing particles are represented by the following formula (1).

   [Formula 1]

   R _m Si (OR ¹ ) _4-m

   (In Formula 1, R is a hydrogen atom, a hydroxyl group, a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C2 to C30 alkenyl group, a substituted or unsubstituted C2 to C30 alkynyl group, a substituted or unsubstituted A C3 to C30 cycloalkyl group, a substituted or unsubstituted C3 to C30 cycloalkenyl group, a substituted or unsubstituted C3 to C30 cycloalkynyl group, a substituted or unsubstituted C6 to C30 aryl group, or a combination thereof,

   R1 is a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C2 to C30 alkenyl group, a substituted or unsubstituted C2 to C30 alkynyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, a substituted or unsubstituted A C3 to C30 cycloalkenyl group, a substituted or unsubstituted C3 to C30 cycloalkynyl group, a substituted or unsubstituted C6 to C30 aryl group, or a combination thereof,

   m is an integer of 1 to 3.)
5. In claim 1,

   The positive photosensitive resin composition

   Based on 100 parts by weight of the (A) alkali-soluble resin

   5 to 100 parts by weight of the (B) photosensitive diazoquinone compound;

   1 to 10 parts by weight of the (C) siloxane-containing particles; And

   100 to 400 parts by weight of the solvent (D)

   Positive photosensitive resin composition comprising a.
6. In claim 1,

   The positive photosensitive resin composition further comprises a phenol compound.
7. The insulating film manufactured using the positive photosensitive resin composition of any one of Claims 1-6.
8. A display device comprising the insulating film according to claim 7.

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