WO2013120469A1 - Traversée hf - Google Patents

Traversée hf Download PDF

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Publication number
WO2013120469A1
WO2013120469A1 PCT/DE2012/001176 DE2012001176W WO2013120469A1 WO 2013120469 A1 WO2013120469 A1 WO 2013120469A1 DE 2012001176 W DE2012001176 W DE 2012001176W WO 2013120469 A1 WO2013120469 A1 WO 2013120469A1
Authority
WO
WIPO (PCT)
Prior art keywords
sleeve
feedthrough
dielectric material
hole
glass
Prior art date
Application number
PCT/DE2012/001176
Other languages
German (de)
English (en)
Inventor
Michael Lausch
Albert Chmelicek
Harald Mayr
Dirk HÖFIG
Original Assignee
Eads Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eads Deutschland Gmbh filed Critical Eads Deutschland Gmbh
Priority to EP12826525.3A priority Critical patent/EP2815408B1/fr
Publication of WO2013120469A1 publication Critical patent/WO2013120469A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
    • H01R24/38—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts
    • H01R24/40—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency
    • H01R24/50—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency mounted on a PCB [Printed Circuit Board]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
    • H01P5/10—Coupling devices of the waveguide type for linking dissimilar lines or devices for coupling balanced with unbalanced lines or devices
    • H01P5/103—Hollow-waveguide/coaxial-line transitions

Definitions

  • the invention relates to an RF implementation according to the features of patent claim 1.
  • feedthroughs are made of glass and metal, the glass being disposed in a hole in the packaging wall, serving as an insulating support and dielectric that holds a straight metal pin, the transmission lead, in an insulated relationship with the walls of the metal package as an impenetrable barrier to the outside environment.
  • US 5,376,901 discloses a hermetically sealed millimeter-waveguide insertion transition bushing for passing high frequency electrical signals into a circuit including at least one waveguide. It uses glass to fill in the space defined by a ring and pin to hermetically seal the pin within the ring and isolated from the waveguide wall.
  • RF feedthroughs are e.g. from DE 699 23 805 T2 or DE 20 2009 001 395 U1.
  • US Pat. No. 7,517,258 B1 describes an HF feedthrough comprising two sleeves enclosing a central conductor and welded together, wherein a sleeve is completely filled with a dielectric material.
  • a further HF feedthrough is known, in which an HF feedthrough is formed by means of a sleeve whose length corresponds to the through-hole through a housing.
  • borosilicate glass is allowed to flow back between the central metal pin, typically a pin formed of Kovar material, and the outer end ring. When reflowed, the molten glass forms a glass meniscus around part of the length of the pin. When hardened, the glass forms a strong outer seal.
  • Such glass-to-metal bushings have a disadvantage. They are not permanent. The glass is brittle. When the glass enclosed metal pin is bent or deformed during handling or testing, glass particles are broken in the glass meniscus surrounding the pin. This break endangers the integrity of the execution. In some cases, radial cracks or cracks occur circumferentially in the glass.
  • FIG. 1 shows a schematic sectional view of a glass-metal lead-through D of the prior art.
  • the reference numeral 1 denotes the wall of a housing.
  • the through-hole DB has a first diameter GD and a second diameter KD.
  • an RF feedthrough is introduced in the area of the through hole DB with the larger diameter GD.
  • the HF feedthrough comprises an annular body RK which is filled with a dielectric material DK.
  • a center conductor ML is arranged to guide the RF signals.
  • the center conductor ML protrudes into the inner and outer area IB, AB of the housing.
  • a connection of the center conductor ML to a substrate can take place.
  • the connection can not be made directly at the exit of the center conductor ML from the ring body RK filled with a dielectric material DK.
  • a so-called Heilkoax LK This results in transmission errors and signal losses.
  • the object of the invention is to provide an RF implementation in which a direct connection to a substrate is possible.
  • the RF feedthrough comprises a sleeve completely filled with a dielectric material and a middle conductor arranged axially in the sleeve for transmitting RF signals.
  • the sleeve has at one end a radially outwardly extending collar part.
  • the collar portion has an outer diameter greater than the central opening of the throughbore.
  • the length of the sleeve completely filled with the dielectric material corresponds to the length of the through-hole.
  • the HF conductor according to the invention makes it easier to contact the center conductor to a substrate.
  • the sleeve is expediently made of Kovar.
  • Sintered glass is expediently used as the dielectric material.
  • the advantage here is that sintered glass combines better thermally and chemically with Kovar than with oxidic surfaces, e.g. Tungsten.
  • a compound with iron is not possible because of the very different expansion coefficients.
  • Fig. 1 is a schematic representation of an HF implementation according to the state
  • FIG. 2 shows a schematic representation of an HF according to the invention Execution.
  • Fig. 2 shows a schematic representation of an RF implementation according to the invention.
  • the reference numeral 1 denotes the wall of a housing.
  • the housing 1 has a through hole DB, in which the RF feedthrough D according to the invention can be introduced.
  • the HF feedthrough D has an annular body RK which is filled with a dielectric material DK. Axially in the ring body RK is a center conductor ML arranged to guide the RF signals.
  • the center conductor ML projects into the inner and outer regions IB, AB of the housing 1. In the inner region IB, a connection of the center conductor ML to a substrate (not shown), e.g. a microstrip line or a waveguide made.
  • the HF feedthrough D has a collar part K extending radially outwards.
  • the collar part K has an outer diameter DM_K, which is greater than the diameter DM_DB of the through hole DB.
  • the ring body RK can be glued or soldered into the through hole DB.
  • RF signals of up to 40 GHz can be transmitted.
  • the RF feedthrough may be a glass-to-metal feedthrough.
  • the housing 1 has a matching for the collar part K recess.

Abstract

L'invention concerne une traversée HF, destinée à être introduite dans un trou de passage (DB) réalisé dans un circuit imprimé, un guide d'ondes ou un boîtier, comprenant une douille (RK) entièrement remplie d'un matériau diélectrique (DK) et un conducteur central (ML) disposé axialement dans la douille (RK) afin de transmettre des signaux HF. À une extrémité, la douille (RK) présente une partie de collerette (K) qui s'étend vers l'extérieur et qui possède un diamètre extérieur (DM_K) supérieur à celui de l'ouverture centrale (DM_DB) du trou de passage (DB). Selon l'invention, la longueur de la douille (RK) entièrement remplie du matériau diélectrique correspond à la longueur du trou de passage (DB).
PCT/DE2012/001176 2012-02-14 2012-12-07 Traversée hf WO2013120469A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP12826525.3A EP2815408B1 (fr) 2012-02-14 2012-12-07 Traversée hf

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102012003054.1A DE102012003054B4 (de) 2012-02-14 2012-02-14 HF-Durchführung
DE102012003054.1 2012-02-14

Publications (1)

Publication Number Publication Date
WO2013120469A1 true WO2013120469A1 (fr) 2013-08-22

Family

ID=47747263

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2012/001176 WO2013120469A1 (fr) 2012-02-14 2012-12-07 Traversée hf

Country Status (3)

Country Link
EP (1) EP2815408B1 (fr)
DE (1) DE102012003054B4 (fr)
WO (1) WO2013120469A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107611730A (zh) * 2017-08-30 2018-01-19 上海航天科工电器研究院有限公司 一种用于实现与pcb板免焊垂直互连的射频同轴结构

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5223672A (en) * 1990-06-11 1993-06-29 Trw Inc. Hermetically sealed aluminum package for hybrid microcircuits
US5376901A (en) 1993-05-28 1994-12-27 Trw Inc. Hermetically sealed millimeter waveguide launch transition feedthrough
US5866851A (en) * 1995-07-28 1999-02-02 Medtronic Inc. Implantable medical device with multi-pin feedthrough
US6841731B1 (en) 2003-12-18 2005-01-11 Emerson Electric Co. Terminal assembly
DE69923805T2 (de) 1998-04-28 2005-07-14 Northrop Grumman Corp., Los Angeles Keramik-Metall Durchführungen für Millimeterwellen
US7517258B1 (en) 2006-01-31 2009-04-14 H-Tech, Llc Hermetically sealed coaxial type feed-through RF Connector
DE202009001395U1 (de) 2009-02-05 2009-04-16 Endress + Hauser Gmbh + Co. Kg Vorrichtung zur Einkopplung von Hochfrequenzsignalen für Frequenzen größer als 1 GHz in einen elektrisch leitenden Hohlleiter
US20090295494A1 (en) * 2008-06-02 2009-12-03 Bsc Filters Ltd Waveguide connector

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1846706U (de) * 1961-08-23 1962-02-15 Bbc Brown Boveri & Cie Gehaeuse fuer halbleiter-bauelemente.

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5223672A (en) * 1990-06-11 1993-06-29 Trw Inc. Hermetically sealed aluminum package for hybrid microcircuits
US5376901A (en) 1993-05-28 1994-12-27 Trw Inc. Hermetically sealed millimeter waveguide launch transition feedthrough
US5866851A (en) * 1995-07-28 1999-02-02 Medtronic Inc. Implantable medical device with multi-pin feedthrough
DE69923805T2 (de) 1998-04-28 2005-07-14 Northrop Grumman Corp., Los Angeles Keramik-Metall Durchführungen für Millimeterwellen
US6841731B1 (en) 2003-12-18 2005-01-11 Emerson Electric Co. Terminal assembly
US7517258B1 (en) 2006-01-31 2009-04-14 H-Tech, Llc Hermetically sealed coaxial type feed-through RF Connector
US20090295494A1 (en) * 2008-06-02 2009-12-03 Bsc Filters Ltd Waveguide connector
DE202009001395U1 (de) 2009-02-05 2009-04-16 Endress + Hauser Gmbh + Co. Kg Vorrichtung zur Einkopplung von Hochfrequenzsignalen für Frequenzen größer als 1 GHz in einen elektrisch leitenden Hohlleiter

Also Published As

Publication number Publication date
EP2815408B1 (fr) 2019-10-09
DE102012003054A1 (de) 2013-08-14
EP2815408A1 (fr) 2014-12-24
DE102012003054B4 (de) 2016-03-31

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