WO2012163539A1 - Infrarot-sensor - Google Patents
Infrarot-sensor Download PDFInfo
- Publication number
- WO2012163539A1 WO2012163539A1 PCT/EP2012/002328 EP2012002328W WO2012163539A1 WO 2012163539 A1 WO2012163539 A1 WO 2012163539A1 EP 2012002328 W EP2012002328 W EP 2012002328W WO 2012163539 A1 WO2012163539 A1 WO 2012163539A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- optical element
- sensor
- once
- mirror
- pass
- Prior art date
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 5
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- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 3
- 229910052749 magnesium Inorganic materials 0.000 claims description 3
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- -1 polyethylene Polymers 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
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- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 2
- 238000004616 Pyrometry Methods 0.000 description 2
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- 230000000007 visual effect Effects 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 1
- 230000036760 body temperature Effects 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/08—Optical arrangements
- G01J5/0801—Means for wavelength selection or discrimination
- G01J5/0802—Optical filters
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/0205—Mechanical elements; Supports for optical elements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/06—Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/07—Arrangements for adjusting the solid angle of collected radiation, e.g. adjusting or orienting field of view, tracking position or encoding angular position
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/08—Optical arrangements
- G01J5/0808—Convex mirrors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/08—Optical arrangements
- G01J5/0893—Arrangements to attach devices to a pyrometer, i.e. attaching an optical interface; Spatial relative arrangement of optical elements, e.g. folded beam path
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
- H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
Definitions
- the invention relates to an infrared (IR) sensor device comprising:
- an IR sensor element having a radiation-sensitive region detecting IR rays
- a first optical element which is arranged in front of the IR sensor element, viewed in an irradiation direction, wherein the optical element may have one or more of the following elements:
- the set of externally irradiated IR rays is set
- CONFIRMATION COPY if a wavelength-dependent filter is present as part of the first optical element, pass only once through these wavelength-dependent filters,
- the invention relates to a use of such an infrared sensor array.
- optical elements e.g., lenses, mirrors, or the like
- planar protective windows or foils are used by v.a. Mirror optics to protect against environmental influences.
- a typical infrared sensor arrangement for pyrometry comprises an IR sensor element (eg a thermopile radiation sensor, pyroelectric radiation sensor, bolometer or the like), optical elements for focusing (lenses, mirrors etc.), diaphragms, filters, etc., as well as a possibly Multi-part housing, in which, or as part of which the various elements are combined.
- IR sensor element eg a thermopile radiation sensor, pyroelectric radiation sensor, bolometer or the like
- optical elements for focusing e.g., mirrors etc.
- diaphragms e.g., filters, etc.
- Multi-part housing e.g., Multi-part housing, in which, or as part of which the various elements are combined.
- Typical of these types of sensors are a TO package 1 with bottom plate 2 (also called “header") and cap 3, in which a sensor element 4, e.g. a thermopile chip, usually a reference sensor 5 for measuring the housing temperature and an optical element 6, z.
- a sensor element 4 e.g. a thermopile chip, usually a reference sensor 5 for measuring the housing temperature and an optical element 6, z.
- B a lens, a diaphragm or a plane window, are provided.
- the lens and the IR sensor element define a field of view 7 of the sensor according to the laws of the beam optics.
- Within this field of view lying rays 8 pass through simple transmission to the sensor element 4.
- Outside the intended field of view lying rays 9a pass through simple transmission not to the sensor element 4. Nevertheless, lying outside the intended field of view rays 9b pass through multiple reflections within the optical element 6 to the sensor element 4 and thus possibly distort measurements.
- An IR sensor arrangement with or without lens US 4,626,686 a Thermopile radiation sensor is mounted from the back into a tube, with the back of the sensor housing is not connected to the tube.
- a shutter and behind a lens or a plane window Before the Radiation sensor (the radiation incidence opposite) is first mounted a shutter and behind a lens or a plane window. The diaphragm is thus placed between the sensor element and the lens or window. Everything together is mounted in a possibly multipart tube.
- Incident IR radiation may u.U. be reflected multiple times within the optical element.
- IR radiation which is actually outside the calculated field of view, can reach the sensor element.
- This effect can also occur in mirror optics, which are provided with a protective window. Although the multiple reflections do not occur within the optical element itself, but possibly within the combination of mirror and guard window.
- the optical elements of the infrared sensor array behave thermally differently than the actual sensor element (e.g., thermopile chip), i. they heat up (cool down) relative to the actual sensor element. This results in additional thermal effects, which can also falsify measurements. Uneven heating (or cooling) of the optical elements can be caused by heat conduction or convection of the surrounding media or by the heat radiation of the object to be measured.
- the actual sensor element e.g., thermopile chip
- the housing itself of the actual sensor can be heated in an inhomogeneous manner (cooled down).
- the causes heat conduction, convection, thermal radiation
- thermal effects e.g., additional IR radiation
- a thermal trap coupled to the sensor housing is described in WO 201004505. However, this is between the lens or mirror and sensor element. This reduces the problem of inhomogeneous heating of the housing, but not other of the aforementioned disadvantages.
- DE 10 2004 030 418 shows the structure of a sensor housing in which some parts are connected to the sensor chip on the wafer level. This composite is then inserted into a plastic or ceramic housing. Although all parts produced in the wafer composite are effectively thermally coupled (thermally homogeneous). However, the external diaphragm is thermally both structurally and coupled via the choice of material plastic or ceramic incomplete with the sensor chip. It can thus occur distorting thermal effects. The optics of the wafer assembly including the external aperture can not completely rule out multiple reflections.
- the object of the present invention is thus to provide an infrared sensor arrangement in which the problems explained in connection with the prior art are at least partially solved.
- a second optical element (10) arranged in the direction of irradiation at a distance (a) in front of the first optical element (6) can have one or more of the following elements:
- the second optical element as a limited field of view of the IR sensor element, the family of externally irradiated IR rays is set, the
- wavelength-dependent filter if a wavelength-dependent filter is present as part of the first optical element, pass only once through these wavelength-dependent filters,
- a wavelength-dependent filter is present, only once pass through these wavelength-dependent filter.
- the space defined by the gap is used to form between the first optical element and the second optical element a beam trap which comprises at least a portion of the infrared rays passing through the second optical element for passage through a member of the first optical element.
- a beam trap which comprises at least a portion of the infrared rays passing through the second optical element for passage through a member of the first optical element.
- An infrared (IR) sensor arrangement increases the measurement accuracy of the IR sensor arrangement by reducing or completely preventing the influence of stray radiation on the IR sensor element.
- the field of view is limited to such an extent that all the rays passing through the optical elements reach the region of the IR sensor element without disturbing multiple reflections.
- IR sensor elements which have a radiation-sensitive area.
- the elements forming the radiation-sensitive region are generally arranged in one plane or in several parallel planes. The direction of irradiation is therefore understood in particular to be the direction perpendicular to these planes.
- the IR sensor element can be designed, in particular, as a thermopile radiation sensor known from the prior art, a pyroelectric radiation sensor, or as a bolometer also known from the prior art.
- the IR sensor arrangement according to the invention has a first and a second optical element.
- the first and second optical elements may be made similar.
- the second optical element is formed as a diaphragm and thus forms a simple passage opening through which the IR rays can pass.
- the optical elements used according to the invention can consist of one or more components and / or form a passage opening.
- the optical element is formed by a diaphragm through which the IR rays pass substantially without changing their beam path.
- the passage opening of such a diaphragm can also be closed by a protective window or a protective film, but not significantly change the beam path of the IR rays.
- an optical element may be formed as an element with a refractive surface, in particular as an element with two refractive surfaces, particularly preferably as a lens, which changes the beam path of the IR rays passing through them.
- the optical element may be formed by one or more mirrors on which the IR Rays are reflected.
- the IR rays pass through the passage opening and possibly the protective window closing the diaphragm for protection purposes, or the protective film of the diaphragm.
- the optical element is designed as a lens, the IR radiation passes through the lens.
- the optical element has one or more mirrors, the IR radiation is reflected at the one or more mirrors. It is also possible to form the optical element from a combination, for example, of a plurality of mirrors and a lens, so that an IR beam is reflected by the mirrors and passes through the lens.
- the first optical element and the size of the IR sensor element define, as an intended field of view of the IR sensor element, the family of externally irradiated IR-rays which
- wavelength-dependent filter if a wavelength-dependent filter is present as part of the first optical element, pass only once through these wavelength-dependent filters,
- IR-rays which enter at an angle into a possibly provided in the first optical element lens, which causes the IR-rays are reflected multiple times within the lens, but then hit the radiation-sensitive region of the Ir sensor element or
- IR-rays which impinge at an angle on a mirror possibly provided in the first optical element, which leads to the IR-rays at this or possibly further elements provided in the first optical element (mirrors, lenses, filters, Protective window, etc.) are reflected multiple times, but then hit the radiation-sensitive area of the IR sensor element.
- the second optical element determines a limited field of view of the IR sensor element, which is understood as the family of IR radiated from the outside, the
- wavelength-dependent filter if a wavelength-dependent filter is present as part of the first optical element, pass only once through these wavelength-dependent filters,
- a wavelength-dependent filter is present, only once pass through these wavelength-dependent filter.
- IR rays that leave the second optical element in such a way that they would have to be reflected between the passage through the second optical element and the passage through the first optical element on a further surface by the first light field do not belong to the restricted field of view to pass through optical element.
- FIG. 80% of the power incident on the IR sensor element originates from the intended field of view marked by the truncated cone (7). About 20% of the power falling on the IR sensor element gets there from outside, eg. Rays (9b), and falsifies the measurement result.
- a first optical element in the inventive arrangement of an IR sensor element, a first optical element, a second optical element and a beam trap, Fig. 1, about 95% of the power falling on the IR sensor element from the marked by the truncated cone , intended visual field.
- about 5% or less of the power falling on the IR sensor element gets there from outside, e.g., rays are mostly absorbed in the beam trap, and the measurement result is only slightly falsified.
- the beam trap is adapted to receive the energy introduced by an IR beam impinging on its surface and to propagate from the surface to which IR beam impinges without heating that surface.
- This can be achieved, for example, by a jet trap which consists at least in part of a material which conducts heat well, for example a metal, for example aluminum, copper, magnesium, zinc or a semiconductor, for example silicon or a ceramic material used in semiconductor technology.
- the beam trap can also be designed so that it at least partially absorbs and dissipates the energy introduced by an IR beam incident on its surface and heats the surface only by a part of the radiated energy.
- the first and second optical elements have a circular or elliptical outer circumference.
- the radiation trap in particular has a circular or elliptical passageway, wherein the first optical element is disposed at one end and the second optical element at the second end of the circular or elliptical passageway.
- the diameter of the circular through-channel is greater than the diameter of the first optical element and larger than the diameter of the second optical element.
- the passageway between the first and second optical elements is completely formed as a circular or elliptical passageway.
- transition surfaces are provided at the end of the passageway on which the first optical element is arranged and / or at the end of the passageway on which the second optical element is arranged, the transition, for example in the form of a truncated cone of a smaller Create diameter of the first, or second optical element to the larger diameter of the passage channel.
- lens and / or mirror are provided, which can focus as incoming radiation beam with a first cross-sectional area on a radiation-sensitive region of the IR sensor element having a second, smaller cross-sectional area.
- the IR sensor arrangement according to the invention has a beam trap which is formed between the first optical element and the second optical element and which comprises at least a portion of the IR beams which, after passing through the second optical element, pass through the first optical element at least at one Surface should be reflected, absorbed.
- the surface of the jet trap may have structures that enhance absorption, e.g. Roughening, corrugation, pyramids, trapezoids, they can be designed as a thread etc.
- the IR sensor element is arranged in a housing forming an interior space.
- a component of the housing is preferably a base plate carrying the IR sensor element.
- Such a housing protects the IR sensor element, makes it possible to make the immediate environment of the IR sensor element particularly, for example to provide a filling gas or vacuum and allows the production side good handling of the IR sensor element, without this risk runs to be damaged because in subsequent manufacturing steps, only the housing must be handled.
- the arrangement of the IR sensor element on a bottom plate makes it possible to perform connection lines for the IR sensor element through this bottom plate.
- the material or the combination of materials of the bottom plate has a heat conduction coefficient of more than 1 W / mK, particularly preferably more than 10 W / mK.
- the optical element is formed as a component connected to the housing. This makes it possible to set and set important for the detection of the IR rays settings of the geometric arrangement of the optical element relative to the IR sensor element in an early manufacturing step, without running the risk that this geometric relationship is affected in later manufacturing steps .
- the housing can also be closed by a plane window. In such a case, the optical element may be spaced from the housing.
- a reference sensor is provided, which is particularly preferably arranged together with the IR sensor element on the bottom plate or integrated in the IR sensor element.
- the reference sensor allows a particularly simple and accurate calibration of the IR sensor element as a function of the ambient temperature.
- the optically and thermally acting elements are coupled together via a heat balance body.
- the heat balance body may be formed one or more parts.
- a heat balance body can reduce local temperature differences of the individual components, for example the IR sensor element, the optical elements and the beam trap, so that only the radiation within the field of view is taken into account during the measurement, and no "internal radiation" generated by local heating produces the measurement result
- the optically and thermally acting elements are coupled to one another via a heat balance body.
- the IR radiation absorbed by the beam trap causes the beam trap to heat up and in turn be able to emit its own IR rays
- the jet trap is coupled to a heat balance body, or if the jet trap forms part of the heat balance body, then the energy absorbed by the absorption of IR radiation can be dissipated at least in part via the heat balance body without the jet fall e heated and own IR radiation (“internal radiation”) generated.
- elements which have a surface on which IR radiation impinges or passes through the IR radiation are understood as optically active elements.
- Thermally acting elements of an IR sensor arrangement are, in particular, any mass body which can emit heat radiation.
- the heat balance body provided in the preferred embodiment can be used to form a second optical element designed as a diaphragm and / or the beam trap. Advantages of this embodiment are already achieved when some of the optically and thermally acting elements are coupled together via a heat balance body. Particularly preferably, all optically and thermally acting elements are coupled together via a heat balance body.
- the heat balance body is preferably arranged outside the housing, but in particular thermally conductive with the bottom plate and possibly Coupled with other areas of the housing.
- the housing may form part of the heat balance body.
- the heat balance body comprises components of aluminum, copper, magnesium and / or zinc and is particularly preferably made entirely of one of these materials. It has been shown that these components cause a particularly good homogenization of the temperature. These materials can also be processed well.
- materials for the heat balance body are basically good heat conductive materials in question, eg. Metals but also semiconductors, e.g. Silicon, and used in the semiconductor field ceramic materials.
- materials having a thermal conductivity of more than 10 W / mK, in particular preferably more than 20 W / mK are understood to be good heat-conducting materials. Such thermal conductivity values can also be achieved by highly heat-conductive plastics.
- the heat balance body has a wall thickness of greater than 1.5 mm. This additionally strengthens the heat conduction.
- At least parts of the surfaces where IR-rays impinge or pass through the IR-rays are coated with an IR-radiation-permeable, dirt-repellent layer.
- Such layers can be made of PE (polyethylene), polypropylene (PP), PTFE (polytetrafluoroethylene) or poly-para- Xylenes (PPX) are formed.
- PE polyethylene
- PP polypropylene
- PTFE polytetrafluoroethylene
- PPX poly-para- Xylenes
- the infrared sensor arrangement according to the invention is preferably used in a temperature measuring device.
- a temperature measuring device may be a so-called pyrometer, which is used for non-contact measurement of the temperature on hard-to-reach surfaces or current-carrying (live) components. Pyrometers are also widely used as measuring devices for rapid determination of body temperature.
- FIG. 1 shows an embodiment of a sensor arrangement according to the invention in a schematic sectional view
- FIG. 2 shows an example of a known infrared sensor arrangement.
- the IR sensor arrangement shown in FIG. 1 uses as base the IR sensor 4 already described in FIG. 2 on a bottom plate 2 in the TO (transistor outline) housing 1. This is provided with a multipart heat sink 12
- the heat balance body 12, 13 is made of a good thermally conductive material (eg brass, aluminum, copper, etc.), is thick-walled (wall thickness> 1, 5mm) .
- the IR sensor assembly is constructed so that both the bottom plate 2 and the upper side of the lens 3, 6 of the TO housing 1 and the two parts of the heat balance body 12, 13 have a good thermal connection 14a-c
- This good thermal connection 14a-c can be achieved, for example, by squeezing or screwing 14a or by pressing 14b, c take place.
- a diaphragm 10 and a jet trap 1 1 are integrated, so that they are thermally coupled well. This causes rays lying in the field of view 8 to continue to reach the sensor element 4. Furthermore, furthermore, beams 9a, which do not reach the sensor element 4 by simple transmission, can reach the housing. However, rays with a larger angle of incidence 9b, which could reach the sensor element via multiple reflection, can no longer strike the lens 6 directly. They are absorbed in the beam trap 11. ⁇
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201280030660.3A CN103797345B (zh) | 2011-06-01 | 2012-06-01 | 红外传感器 |
DE112012002312.9T DE112012002312A5 (de) | 2011-06-01 | 2012-06-01 | Infrarot-Sensoranordnung und deren Verwendung |
US14/123,049 US9052235B2 (en) | 2011-06-01 | 2012-06-01 | Infrared sensor and use of same |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102011103818A DE102011103818A1 (de) | 2011-06-01 | 2011-06-01 | Infrarot-Sensoranordnung und deren Verwendung |
DE102011103818.7 | 2011-06-01 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2012163539A1 true WO2012163539A1 (de) | 2012-12-06 |
Family
ID=46395568
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2012/002328 WO2012163539A1 (de) | 2011-06-01 | 2012-06-01 | Infrarot-sensor |
Country Status (4)
Country | Link |
---|---|
US (1) | US9052235B2 (de) |
CN (1) | CN103797345B (de) |
DE (2) | DE102011103818A1 (de) |
WO (1) | WO2012163539A1 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014169924A (ja) * | 2013-03-04 | 2014-09-18 | Mikuni Corp | 温度測定装置 |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
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US9735135B2 (en) * | 2014-12-04 | 2017-08-15 | Pixart Imaging (Penang) Sdn. Bhd. | Optical sensor package and optical sensor assembly |
CN107407603B (zh) * | 2015-03-25 | 2020-10-23 | 世美特株式会社 | 红外线温度传感器以及使用红外线温度传感器的装置 |
US9917242B2 (en) | 2015-03-27 | 2018-03-13 | Maxim Integrated Products, Inc. | Thermopile temperature sensor field of view narrowing using integrated light blocking layer and lens |
EP3078951A1 (de) * | 2015-04-10 | 2016-10-12 | Silverlight AG | Einrichtung mit pir sensor |
US9915567B2 (en) * | 2016-06-28 | 2018-03-13 | Excelitas Technologies Singapore Pte. Ltd. | Unreleased thermopile infrared sensor using material transfer method |
US10775030B2 (en) | 2017-05-05 | 2020-09-15 | Flex Ltd. | Light fixture device including rotatable light modules |
US20180320885A1 (en) * | 2017-05-05 | 2018-11-08 | Flex Ltd. | Light module having a heatsink crimped around a lens, and a method for crimping a heat sink around a lens of a light module |
CN108151887A (zh) * | 2017-12-25 | 2018-06-12 | 湖南航天诚远精密机械有限公司 | 一种微波实验炉 |
JP7121289B2 (ja) * | 2019-02-05 | 2022-08-18 | 日本電信電話株式会社 | 波長選択型光受信装置 |
US11041742B2 (en) * | 2019-09-27 | 2021-06-22 | Lyft, Inc. | Secure thermally-managed case for a sensing device |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1914468A1 (de) * | 1969-03-21 | 1970-11-12 | Siemens Ag | Verfahren und Vorrichtung zur beruehrungslosen Temperaturmessung |
US4495416A (en) * | 1981-09-03 | 1985-01-22 | New Zealand Government Property Corporation | Remote sensing instrument |
US4626686A (en) | 1984-04-09 | 1986-12-02 | Exergen Corporation | Variable field of view heat scanner |
US4797840A (en) | 1985-04-17 | 1989-01-10 | Thermoscan Inc. | Infrared electronic thermometer and method for measuring temperature |
US4986672A (en) * | 1987-03-19 | 1991-01-22 | Land Infrared Limited | Radiation thermometer |
US5018872A (en) | 1988-11-01 | 1991-05-28 | Diatek, Inc. | Probe assembly for infrared thermometer |
DE102004030418A1 (de) | 2004-06-24 | 2006-01-19 | Robert Bosch Gmbh | Mikrostrukturierter Infrarot-Sensor und ein Verfahren zu seiner Herstellung |
WO2010004505A2 (en) | 2008-07-07 | 2010-01-14 | Max Canti | A method for obtaining a mixture for production of handmade articles suitable for covering or forming surfaces and a mixture obtained by the method |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4384207A (en) * | 1981-01-23 | 1983-05-17 | Eltec Instruments, Inc. | Differential pyroelectric detector |
JPH0530105Y2 (de) * | 1987-05-29 | 1993-08-02 | ||
US4970403A (en) * | 1988-11-18 | 1990-11-13 | Ltv Aerospace And Defense Company | Focal array reimaging system |
US5672875A (en) * | 1992-07-15 | 1997-09-30 | Optix Lp | Methods of minimizing scattering and improving tissue sampling in non-invasive testing and imaging |
US5721430A (en) * | 1995-04-13 | 1998-02-24 | Engelhard Sensor Technologies Inc. | Passive and active infrared analysis gas sensors and applicable multichannel detector assembles |
JPH10281864A (ja) * | 1997-04-03 | 1998-10-23 | Nikon Corp | 熱型赤外線カメラ |
KR100370001B1 (ko) * | 1998-10-31 | 2003-01-29 | 엘지전자 주식회사 | 온도감지장치 |
DE10144343A1 (de) * | 2001-09-10 | 2003-03-27 | Perkinelmer Optoelectronics | Sensor zum berührugslosen Messen einer Temperatur |
US7157706B2 (en) * | 2003-05-28 | 2007-01-02 | Opto-Knowledge Systems, Inc. | Cryogenically cooled adjustable apertures for infrared cameras |
US7427758B2 (en) * | 2003-05-28 | 2008-09-23 | Opto-Knowledge Systems, Inc. | Cryogenically cooled adjustable apertures for infra-red cameras |
US7064909B2 (en) * | 2004-08-26 | 2006-06-20 | Prodisc Technology Inc. | Image pickup lens assembly with a filter lens |
US20080204757A1 (en) * | 2006-08-17 | 2008-08-28 | Christopher Manning | Handheld FT-IR spectrometer |
US9335219B2 (en) * | 2010-06-07 | 2016-05-10 | Exergen Corporation | Dual waveband temperature detector |
US9007683B2 (en) * | 2011-01-20 | 2015-04-14 | Fivefocal Llc | Dual element passively athemalized infrared imaging systems |
-
2011
- 2011-06-01 DE DE102011103818A patent/DE102011103818A1/de not_active Withdrawn
-
2012
- 2012-06-01 US US14/123,049 patent/US9052235B2/en active Active
- 2012-06-01 CN CN201280030660.3A patent/CN103797345B/zh active Active
- 2012-06-01 DE DE112012002312.9T patent/DE112012002312A5/de active Pending
- 2012-06-01 WO PCT/EP2012/002328 patent/WO2012163539A1/de active Application Filing
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1914468A1 (de) * | 1969-03-21 | 1970-11-12 | Siemens Ag | Verfahren und Vorrichtung zur beruehrungslosen Temperaturmessung |
US4495416A (en) * | 1981-09-03 | 1985-01-22 | New Zealand Government Property Corporation | Remote sensing instrument |
US4626686A (en) | 1984-04-09 | 1986-12-02 | Exergen Corporation | Variable field of view heat scanner |
US4797840A (en) | 1985-04-17 | 1989-01-10 | Thermoscan Inc. | Infrared electronic thermometer and method for measuring temperature |
US4986672A (en) * | 1987-03-19 | 1991-01-22 | Land Infrared Limited | Radiation thermometer |
US5018872A (en) | 1988-11-01 | 1991-05-28 | Diatek, Inc. | Probe assembly for infrared thermometer |
DE102004030418A1 (de) | 2004-06-24 | 2006-01-19 | Robert Bosch Gmbh | Mikrostrukturierter Infrarot-Sensor und ein Verfahren zu seiner Herstellung |
WO2010004505A2 (en) | 2008-07-07 | 2010-01-14 | Max Canti | A method for obtaining a mixture for production of handmade articles suitable for covering or forming surfaces and a mixture obtained by the method |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014169924A (ja) * | 2013-03-04 | 2014-09-18 | Mikuni Corp | 温度測定装置 |
Also Published As
Publication number | Publication date |
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CN103797345A (zh) | 2014-05-14 |
DE102011103818A1 (de) | 2012-12-06 |
US20140291521A1 (en) | 2014-10-02 |
US9052235B2 (en) | 2015-06-09 |
DE112012002312A5 (de) | 2014-02-27 |
CN103797345B (zh) | 2017-06-16 |
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