WO2012154510A3 - Low inductance light source module - Google Patents
Low inductance light source module Download PDFInfo
- Publication number
- WO2012154510A3 WO2012154510A3 PCT/US2012/036385 US2012036385W WO2012154510A3 WO 2012154510 A3 WO2012154510 A3 WO 2012154510A3 US 2012036385 W US2012036385 W US 2012036385W WO 2012154510 A3 WO2012154510 A3 WO 2012154510A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- light source
- source module
- low inductance
- inductance light
- layer
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
- G01S7/481—Constructional features, e.g. arrangements of optical elements
- G01S7/4814—Constructional features, e.g. arrangements of optical elements of transmitters alone
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
- G01S7/483—Details of pulse systems
- G01S7/484—Transmitters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
- G01S17/88—Lidar systems specially adapted for specific applications
- G01S17/89—Lidar systems specially adapted for specific applications for mapping or imaging
- G01S17/894—3D imaging with simultaneous measurement of time-of-flight at a 2D array of receiver pixels, e.g. time-of-flight cameras or flash lidar
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02208—Mountings; Housings characterised by the shape of the housings
- H01S5/02212—Can-type, e.g. TO-CAN housings with emission along or parallel to symmetry axis
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02253—Out-coupling of light using lenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02257—Out-coupling of light using windows, e.g. specially adapted for back-reflecting light to a detector inside the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0233—Mounting configuration of laser chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
Abstract
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201280022418.1A CN103547851B (en) | 2011-05-09 | 2012-05-03 | Low inductance light source module |
KR1020137029629A KR101992501B1 (en) | 2011-05-09 | 2012-05-03 | Low inductance light source module |
EP12783071.9A EP2707646B1 (en) | 2011-05-09 | 2012-05-03 | Low inductance light source module |
JP2014510366A JP6141260B2 (en) | 2011-05-09 | 2012-05-03 | Low inductance light source module |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/103,120 | 2011-05-09 | ||
US13/103,120 US8888331B2 (en) | 2011-05-09 | 2011-05-09 | Low inductance light source module |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2012154510A2 WO2012154510A2 (en) | 2012-11-15 |
WO2012154510A3 true WO2012154510A3 (en) | 2012-12-27 |
Family
ID=47139903
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2012/036385 WO2012154510A2 (en) | 2011-05-09 | 2012-05-03 | Low inductance light source module |
Country Status (6)
Country | Link |
---|---|
US (1) | US8888331B2 (en) |
EP (1) | EP2707646B1 (en) |
JP (1) | JP6141260B2 (en) |
KR (1) | KR101992501B1 (en) |
CN (1) | CN103547851B (en) |
WO (1) | WO2012154510A2 (en) |
Families Citing this family (22)
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US8882310B2 (en) | 2012-12-10 | 2014-11-11 | Microsoft Corporation | Laser die light source module with low inductance |
US8958448B2 (en) * | 2013-02-04 | 2015-02-17 | Microsoft Corporation | Thermal management in laser diode device |
JP6103998B2 (en) * | 2013-03-15 | 2017-03-29 | スタンレー電気株式会社 | Light emitting device |
US9456201B2 (en) | 2014-02-10 | 2016-09-27 | Microsoft Technology Licensing, Llc | VCSEL array for a depth camera |
JP2015176975A (en) * | 2014-03-14 | 2015-10-05 | パナソニックIpマネジメント株式会社 | semiconductor device |
US9577406B2 (en) | 2014-06-27 | 2017-02-21 | Microsoft Technology Licensing, Llc | Edge-emitting laser diode package comprising heat spreader |
US10257932B2 (en) | 2016-02-16 | 2019-04-09 | Microsoft Technology Licensing, Llc. | Laser diode chip on printed circuit board |
DE102016106896A1 (en) * | 2016-04-14 | 2017-10-19 | Osram Opto Semiconductors Gmbh | Light-emitting component |
DE102017118349B4 (en) | 2016-08-12 | 2023-09-07 | Analog Devices, Inc. | OPTICAL EMITTER ASSEMBLIES |
WO2018100082A1 (en) * | 2016-11-30 | 2018-06-07 | Sony Semiconductor Solutions Corporation | Apparatus and method |
DE102017105997A1 (en) * | 2017-03-21 | 2018-09-27 | Valeo Schalter Und Sensoren Gmbh | Transmission device for an optical detection device of a motor vehicle with a specific pre-assembly module, optical detection device and motor vehicle |
KR102385937B1 (en) * | 2017-03-31 | 2022-04-13 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | Semiconductor device package and optical assembly |
TWI661628B (en) * | 2018-06-04 | 2019-06-01 | 李訓福 | Laser diode surface mounting structure |
WO2020038179A1 (en) * | 2018-08-24 | 2020-02-27 | 宁波舜宇光电信息有限公司 | Circuit board assembly and semi-finished product thereof, flood light, photographing module and application thereof |
EP3874595A1 (en) | 2018-10-30 | 2021-09-08 | Excelitas Canada, Inc. | Low inductance laser driver packaging using lead-frame and thin dielectric layer mask pad definition |
US11264778B2 (en) * | 2018-11-01 | 2022-03-01 | Excelitas Canada, Inc. | Quad flat no-leads package for side emitting laser diode |
EP4019895A4 (en) * | 2019-08-20 | 2022-10-19 | Sony Semiconductor Solutions Corporation | Semiconductor laser drive device, electronic apparatus, and method for manufacturing semiconductor laser drive device |
JP2021048206A (en) * | 2019-09-18 | 2021-03-25 | ソニーセミコンダクタソリューションズ株式会社 | Semiconductor laser drive device, electronic apparatus, and method for manufacturing semiconductor laser drive device |
JP7404929B2 (en) | 2020-02-26 | 2023-12-26 | 富士フイルムビジネスイノベーション株式会社 | Light emitting device, optical device and measuring device |
JP7404930B2 (en) | 2020-02-26 | 2023-12-26 | 富士フイルムビジネスイノベーション株式会社 | Light emitting device, optical device and measuring device |
US11888289B2 (en) * | 2020-03-30 | 2024-01-30 | Namuga, Co., Ltd. | Light source module allowing differential control according to distance to subject and method for controlling the same |
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EP2707646A4 (en) | 2014-10-29 |
WO2012154510A2 (en) | 2012-11-15 |
EP2707646B1 (en) | 2016-09-28 |
CN103547851B (en) | 2016-10-26 |
US20120287646A1 (en) | 2012-11-15 |
CN103547851A (en) | 2014-01-29 |
EP2707646A2 (en) | 2014-03-19 |
US8888331B2 (en) | 2014-11-18 |
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JP6141260B2 (en) | 2017-06-07 |
KR101992501B1 (en) | 2019-06-24 |
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