WO2012109577A3 - Nanomechanical testing system - Google Patents

Nanomechanical testing system Download PDF

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Publication number
WO2012109577A3
WO2012109577A3 PCT/US2012/024712 US2012024712W WO2012109577A3 WO 2012109577 A3 WO2012109577 A3 WO 2012109577A3 US 2012024712 W US2012024712 W US 2012024712W WO 2012109577 A3 WO2012109577 A3 WO 2012109577A3
Authority
WO
WIPO (PCT)
Prior art keywords
probe
instrument
stage
change unit
actuator
Prior art date
Application number
PCT/US2012/024712
Other languages
French (fr)
Other versions
WO2012109577A2 (en
Inventor
David J. Vodnick
Michael David OKERLUND
Christopher David Young
Roger Schmitz
Lucas Paul Keranen
Arpit DWIVEDI
Oden Lee WARREN
Original Assignee
Hysitron, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to KR1020137024188A priority Critical patent/KR101438472B1/en
Priority to US13/984,250 priority patent/US8939041B2/en
Priority to EP12745280.3A priority patent/EP2673901B1/en
Priority to KR1020137024135A priority patent/KR101535519B1/en
Priority to JP2013553607A priority patent/JP2014511566A/en
Priority to SG2013060264A priority patent/SG192678A1/en
Application filed by Hysitron, Inc. filed Critical Hysitron, Inc.
Priority to EP13193954.8A priority patent/EP2746721B1/en
Priority to KR1020137023943A priority patent/KR101386602B1/en
Publication of WO2012109577A2 publication Critical patent/WO2012109577A2/en
Publication of WO2012109577A3 publication Critical patent/WO2012109577A3/en
Priority to US13/962,849 priority patent/US8959980B2/en
Priority to US13/962,865 priority patent/US8770036B2/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P21/00—Testing or calibrating of apparatus or devices covered by the preceding groups
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
    • G01B11/27—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • G01B21/02—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness
    • G01B21/04—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness by measuring coordinates of points
    • G01B21/047—Accessories, e.g. for positioning, for tool-setting, for measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N19/00—Investigating materials by mechanical methods
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N3/02—Details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N3/40—Investigating hardness or rebound hardness
    • G01N3/42—Investigating hardness or rebound hardness by performing impressions under a steady load by indentors, e.g. sphere, pyramid
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01Q—SCANNING-PROBE TECHNIQUES OR APPARATUS; APPLICATIONS OF SCANNING-PROBE TECHNIQUES, e.g. SCANNING PROBE MICROSCOPY [SPM]
    • G01Q40/00—Calibration, e.g. of probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01Q—SCANNING-PROBE TECHNIQUES OR APPARATUS; APPLICATIONS OF SCANNING-PROBE TECHNIQUES, e.g. SCANNING PROBE MICROSCOPY [SPM]
    • G01Q60/00—Particular types of SPM [Scanning Probe Microscopy] or microscopes; Essential components thereof
    • G01Q60/24—AFM [Atomic Force Microscopy] or apparatus therefor, e.g. AFM probes
    • G01Q60/36—DC mode
    • G01Q60/366—Nanoindenters, i.e. wherein the indenting force is measured
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/0058—Kind of property studied
    • G01N2203/0076—Hardness, compressibility or resistance to crushing
    • G01N2203/0078—Hardness, compressibility or resistance to crushing using indentation
    • G01N2203/0082—Indentation characteristics measured during load
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/02—Details not specific for a particular testing method
    • G01N2203/026—Specifications of the specimen
    • G01N2203/0286—Miniature specimen; Testing on microregions of a specimen
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining

Abstract

An automated testing system includes systems and methods to facilitate inline production testing of samples at a micro (multiple microns) or less scale with a mechanical testing instrument. In an example, the system includes a probe changing assembly for coupling and decoupling a probe of the instrument. The probe changing assembly includes a probe change unit configured to grasp one of a plurality of probes in a probe magazine and couple one of the probes with an instrument probe receptacle. An actuator is coupled with the probe change unit, and the actuator is configured to move and align the probe change unit with the probe magazine and the instrument probe receptacle. In another example, the automated testing system includes a multiple degree of freedom stage for aligning a sample testing location with the instrument. The stage includes a sample stage and a stage actuator assembly including translational and rotational actuators.
PCT/US2012/024712 2011-02-10 2012-02-10 Nanomechanical testing system WO2012109577A2 (en)

Priority Applications (10)

Application Number Priority Date Filing Date Title
US13/984,250 US8939041B2 (en) 2011-02-10 2012-02-10 Nanomechanical testing system
EP12745280.3A EP2673901B1 (en) 2011-02-10 2012-02-10 Nanomechanical testing system
KR1020137024135A KR101535519B1 (en) 2011-02-10 2012-02-10 Nanomechanical testing system
JP2013553607A JP2014511566A (en) 2011-02-10 2012-02-10 Nano mechanical test system
SG2013060264A SG192678A1 (en) 2011-02-10 2012-02-10 Nanomechanical testing system
KR1020137024188A KR101438472B1 (en) 2011-02-10 2012-02-10 Method for automatically examining an instrument probe and a transducer response of a mechanical testing instrument
EP13193954.8A EP2746721B1 (en) 2011-02-10 2012-02-10 Nanomechanical testing system
KR1020137023943A KR101386602B1 (en) 2011-02-10 2012-02-10 Nanomechanical testing system
US13/962,849 US8959980B2 (en) 2011-02-10 2013-08-08 Nanomechanical testing system
US13/962,865 US8770036B2 (en) 2011-02-10 2013-08-08 Nanomechanical testing system

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201161441511P 2011-02-10 2011-02-10
US61/441,511 2011-02-10
US201161551394P 2011-10-25 2011-10-25
US61/551,394 2011-10-25

Related Child Applications (4)

Application Number Title Priority Date Filing Date
EP13193952.2A Previously-Filed-Application EP2762895B1 (en) 2011-02-10 2012-02-10 Nanomechnical testing system
EP13193954.8A Previously-Filed-Application EP2746721B1 (en) 2011-02-10 2012-02-10 Nanomechanical testing system
US13/962,865 Continuation US8770036B2 (en) 2011-02-10 2013-08-08 Nanomechanical testing system
US13/962,849 Continuation US8959980B2 (en) 2011-02-10 2013-08-08 Nanomechanical testing system

Publications (2)

Publication Number Publication Date
WO2012109577A2 WO2012109577A2 (en) 2012-08-16
WO2012109577A3 true WO2012109577A3 (en) 2012-11-15

Family

ID=46639222

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2012/024712 WO2012109577A2 (en) 2011-02-10 2012-02-10 Nanomechanical testing system

Country Status (7)

Country Link
US (3) US8939041B2 (en)
EP (3) EP2762895B1 (en)
JP (3) JP2014511566A (en)
KR (3) KR101386602B1 (en)
MY (3) MY173918A (en)
SG (1) SG192678A1 (en)
WO (1) WO2012109577A2 (en)

Families Citing this family (57)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011066018A1 (en) 2009-11-27 2011-06-03 Hysitron, Inc. Micro electro-mechanical heater
JP5846773B2 (en) * 2010-06-29 2016-01-20 エフ．ホフマン−ラ ロシュ アーゲーＦ． Ｈｏｆｆｍａｎｎ−Ｌａ Ｒｏｃｈｅ Ａｋｔｉｅｎｇｅｓｅｌｌｓｃｈａｆｔ Sample distribution
US8939041B2 (en) 2011-02-10 2015-01-27 Hysitron, Inc. Nanomechanical testing system
JP5788719B2 (en) * 2011-06-09 2015-10-07 株式会社日立ハイテクノロジーズ Stage device and control method of stage device
EP2786115B1 (en) 2011-11-28 2023-05-24 Bruker Nano, Inc. High temperature heating system
MX343825B (en) * 2011-12-13 2016-11-24 Wavelight Gmbh Test device for calibrating a laser device.
JP6084364B2 (en) * 2012-03-08 2017-02-22 株式会社ミツトヨ Measuring instrument
JP5977556B2 (en) * 2012-03-27 2016-08-24 株式会社ミツトヨ Hardness testing machine
JP5963955B2 (en) * 2012-06-13 2016-08-03 ハイジトロン, インク.Hysitron, Inc. Environmental conditioning assembly for mechanical testing at micron or nanoscale
US9063048B2 (en) * 2012-07-12 2015-06-23 Mitutoyo Corporation Hardness tester and program
US20150260624A1 (en) * 2012-12-05 2015-09-17 Illinois Tool Works Inc. Snap grip indenter mount used on a hardness tester
US9651525B2 (en) * 2013-06-27 2017-05-16 TecScan Systems Inc. Method and apparatus for scanning an object
EP3027365B1 (en) * 2013-08-01 2018-05-23 Hysitron, Inc. Instrument changing assembly and methods for the same
GB201314302D0 (en) * 2013-08-09 2013-09-25 Infinitesima Ltd Probe and sample exchange mechanism
TWD165448S (en) * 2013-09-30 2015-01-11 愛斯佩克股份有限公司 Parts of thermostat and hygrostat
US9658281B2 (en) * 2013-10-25 2017-05-23 Taiwan Semiconductor Manufacturing Company Limited Alignment testing for tiered semiconductor structure
US9575093B2 (en) * 2014-01-17 2017-02-21 Femtotools Ag System for the combined, probe-based mechanical and electrical testing of MEMS
US9837291B2 (en) * 2014-01-24 2017-12-05 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer processing method and apparatus
US20150286384A1 (en) * 2014-04-08 2015-10-08 Quality Vision International, Inc. Method Of Establishing Multi-Sensor Measuring Machine Routines
CN107004554B (en) * 2014-06-25 2019-06-04 Fei埃法有限公司 Using online nanometer detection in the chip of process flow and the electroanalysis of chip chamber and process control
JP6346538B2 (en) * 2014-10-02 2018-06-20 オリンパス株式会社 Shape measuring apparatus and shape measuring method
JP6599094B2 (en) * 2014-11-13 2019-10-30 株式会社ミツトヨ Optical device
WO2016172078A1 (en) * 2015-04-20 2016-10-27 Edison Welding Institute, Inc. Automated weld inspection system
US20160334315A1 (en) * 2015-05-12 2016-11-17 Nanovea, Inc. Method for automated parameter and selection testing based on known characteristics of the sample being tested
WO2016205243A1 (en) * 2015-06-15 2016-12-22 Atantares Corp. A mems thrombelastograph/viscoelasticity analyzer
CN105241398B (en) * 2015-10-20 2017-08-25 中国科学院沈阳自动化研究所 A kind of noncontact body axiality fully-automated synthesis equipment
US10041976B2 (en) * 2016-02-03 2018-08-07 Globalfoundries Inc. Gimbal assembly test system and method
KR20180040186A (en) 2016-10-11 2018-04-20 삼성전자주식회사 Inspection method, inspection system, and method of forming semiconductor package using the same
US10900193B2 (en) * 2016-11-08 2021-01-26 Weatherford Technology Holdings, Llc Pumping unit bases with driven piles
US10254105B2 (en) 2016-12-05 2019-04-09 Quality Vision International, Inc. Exchangeable lens module system for probes of optical measuring machines
US10401464B2 (en) 2017-03-20 2019-09-03 Taiwan Semiconductor Manufacturing Company, Ltd. Scanning ferromagnetic resonance (FMR) for wafer-level characterization of magnetic films and multilayers
JP6854183B2 (en) * 2017-04-28 2021-04-07 株式会社ミツトヨ Hardness tester and program
US10258239B2 (en) * 2017-05-30 2019-04-16 Vishal Khosla Method for in-line testing and surface analysis of test material with participation of raman spectroscopy
EP3662253A1 (en) * 2017-07-31 2020-06-10 Dow Global Technologies LLC System for analyzing impact and puncture resistance
WO2019084260A1 (en) * 2017-10-25 2019-05-02 Axcelis Technologies, Inc. Shallow angle, multi-wavelength, multi-receiver, adjustable sensitivity aligner sensor for semiconductor manufacturing equipment
EP3483571B1 (en) * 2017-11-10 2020-04-29 Rolls-Royce Corporation Displacement determination using optical measurements
CN107941588B (en) * 2017-11-15 2020-07-31 北京工业大学 Calcified bone mechanical property experiment method based on nano indentation and nano scratch
DE102017129356B3 (en) * 2017-12-08 2019-03-07 Infineon Technologies Ag INSPECTION PROCEDURE FOR SEMICONDUCTOR SUBSTRATES USING TILTING DATA AND INSPECTION DEVICE
US10761154B2 (en) 2018-01-19 2020-09-01 Taiwan Semiconductor Manufacturing Company, Ltd. Ferromagnetic resonance (FMR) electrical testing apparatus for spintronic devices
CN108445330A (en) * 2018-06-12 2018-08-24 清华大学 Original position detection device
EP4134680A1 (en) * 2018-08-06 2023-02-15 Bruker Nano, Inc. Nanoscale dynamic mechanical analysis via atomic force microscopy
US10754000B2 (en) 2018-08-07 2020-08-25 Taiwan Semiconductor Manufacturing Company, Ltd. Multi-probe ferromagnetic resonance (FMR) apparatus for wafer level characterization of magnetic films
US10788561B2 (en) 2018-10-16 2020-09-29 Taiwan Semiconductor Manufacturing Company, Ltd. Method for measuring saturation magnetization of magnetic films and multilayer stacks
DE102018125669A1 (en) * 2018-10-16 2020-04-16 Bareiss Prüfgerätebau GmbH Measuring device for determining hardness values on a specimen
EP3951350A4 (en) * 2019-03-28 2022-11-16 Tohoku University Resonance shear measurement device
US11264566B2 (en) 2019-06-21 2022-03-01 Headway Technologies, Inc. Magnetic element with perpendicular magnetic anisotropy (PMA) and improved coercivity field (Hc)/switching current ratio
US11264560B2 (en) 2019-06-21 2022-03-01 Headway Technologies, Inc. Minimal thickness, low switching voltage magnetic free layers using an oxidation control layer and magnetic moment tuning layer for spintronic applications
CN110611168B (en) * 2019-09-21 2020-11-20 深圳市锦凌电子有限公司 Multi-antenna calibration device for 5G communication
CN111174899B (en) * 2019-11-27 2022-06-07 中国船舶重工集团有限公司第七一0研究所 Device and method for testing underwater mine self-guide head acoustic receiving system in air
US11579056B2 (en) 2020-06-16 2023-02-14 Gautam Char Universal material tester with several consecutively arranged test units
CN112611662A (en) * 2020-12-29 2021-04-06 湘潭大学 Observable micro-nano mechanical testing device and method
US11717967B2 (en) 2021-03-04 2023-08-08 TecScan Systems Inc. System and method for scanning an object using an array of ultrasonic transducers
CN113012119A (en) * 2021-03-08 2021-06-22 电子科技大学 Metal stamping part surface defect detection method and device based on fringe deflection method
US20230058964A1 (en) * 2021-08-18 2023-02-23 Mpi Corporation Optical detection system and alignment method for a predetermined target object
KR20230091463A (en) * 2021-12-16 2023-06-23 (주)레보스케치 Rotational-type multi-channel fluorescence scanner
TWI812568B (en) * 2022-12-29 2023-08-11 卓金星 Test device
CN116678778B (en) * 2023-08-03 2023-10-27 福建省国鼎检测技术有限公司 Rubber wearability check out test set

Citations (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4074554A (en) * 1973-03-29 1978-02-21 Aerpat A.G. Fastener placing apparatus
JPS6279923A (en) * 1985-10-01 1987-04-13 Mitsubishi Electric Corp Hand for robot
US4750141A (en) * 1985-11-26 1988-06-07 Ade Corporation Method and apparatus for separating fixture-induced error from measured object characteristics and for compensating the measured object characteristic with the error, and a bow/warp station implementing same
US4864227A (en) * 1987-02-27 1989-09-05 Canon Kabushiki Kaisha Wafer prober
US5058816A (en) * 1988-09-23 1991-10-22 Maschinenfabrik Rieter Ag Cops preparation station
US5340261A (en) * 1991-03-26 1994-08-23 Tokyo Electron Limited Load-lock unit and wafer transfer system
US5642298A (en) * 1994-02-16 1997-06-24 Ade Corporation Wafer testing and self-calibration system
US5729394A (en) * 1996-01-24 1998-03-17 Hewlett-Packard Company Multi-direction optical data port
US5773951A (en) * 1996-03-25 1998-06-30 Digital Test Corporation Wafer prober having sub-micron alignment accuracy
US5825666A (en) * 1995-06-07 1998-10-20 Freifeld; Daniel Optical coordinate measuring machines and optical touch probes
US20020184975A1 (en) * 2001-06-11 2002-12-12 Saitama Seiki Kabushiki Kaisha And Akira Ono Power ratchet wrench
US6747746B2 (en) * 2001-07-16 2004-06-08 Therma-Wave, Inc. System and method for finding the center of rotation of an R-theta stage
US20050204868A1 (en) * 2004-03-19 2005-09-22 Kuo-Chen Liu Ratchet wrench
US20060043809A1 (en) * 2004-08-25 2006-03-02 Lau Michael R Torque-limited electrical connector
US20060131696A1 (en) * 2001-03-21 2006-06-22 Kabushiki Kaisha Toshiba Semiconductor wafer with ID mark, equipment for and method of manufacturing semiconductor device from them
US20060212248A1 (en) * 2005-03-01 2006-09-21 Suss Microtec Test Systems Gmbh Procedure for reproduction of a calibration position of an aligned and afterwards displaced calibration substrate in a probe station
US20070068232A1 (en) * 2003-07-26 2007-03-29 Carl Mahr Holding Gmbh Roughness measuring instrument with testing standard
US20070148792A1 (en) * 2005-12-27 2007-06-28 Marx David S Wafer measurement system and apparatus
US20070227236A1 (en) * 2006-03-13 2007-10-04 Bonilla Flavio A Nanoindenter
US20080047749A1 (en) * 2002-11-27 2008-02-28 Thomas Koithan Methods and apparatus for applying torque and rotation to connections
US20080105063A1 (en) * 2003-12-08 2008-05-08 Covaris, Inc. Apparatus for sample preparation
US20080255608A1 (en) * 2007-04-16 2008-10-16 Hinman Cameron D Tool with end effector force limiter
US20080307662A1 (en) * 2006-04-24 2008-12-18 Carl Zeiss Industrielle Messtechnik Gmbh Method for Scanning a Surface with the Aid of a Coordinate Measuring Machine and Coordinate Measuring Machine
US20100088788A1 (en) * 2007-02-21 2010-04-08 The Board Of Trustees Of The University Of Illinois Stress micro mechanical test cell, device, system and methods
US7884326B2 (en) * 2007-01-22 2011-02-08 Fei Company Manipulator for rotating and translating a sample holder

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4331026A (en) * 1980-07-14 1982-05-25 The Boeing Company Indenter-type hardness testing apparatus
US4534212A (en) 1983-06-30 1985-08-13 K. J. Law Engineers, Inc. Fully automatic penetration hardness tester
US4693110A (en) 1985-06-06 1987-09-15 Gte Valeron Corporation Method and apparatus for testing the operability of a probe
JPH05113308A (en) 1991-10-23 1993-05-07 Hitachi Constr Mach Co Ltd Scanning type tunnel microscope
JP2813147B2 (en) * 1995-02-14 1998-10-22 三菱電機株式会社 Method for analyzing minute foreign matter, analyzer and method for producing semiconductor element or liquid crystal display element using the same
US5705814A (en) 1995-08-30 1998-01-06 Digital Instruments, Inc. Scanning probe microscope having automatic probe exchange and alignment
US6021380A (en) * 1996-07-09 2000-02-01 Scanis, Inc. Automatic semiconductor wafer sorter/prober with extended optical inspection
JPH10307093A (en) 1997-03-04 1998-11-17 Nippon Steel Corp Method and instrument for performing indentation hardness measurement and recording medium
JP3425383B2 (en) * 1998-12-03 2003-07-14 株式会社島津製作所 Scanning probe microscope and probe holder
JP3950610B2 (en) 2000-01-24 2007-08-01 日本電子株式会社 Scanning probe microscope
US6731104B1 (en) 2002-12-05 2004-05-04 Tektronix, Inc. Measurement probe system with EOS/ESD protection
JP3968440B2 (en) * 2003-05-21 2007-08-29 独立行政法人物質・材料研究機構 One-point measurement of thermal diffusivity using general-purpose nanoscale measurement technology
JP2005010502A (en) 2003-06-19 2005-01-13 Toshiba Matsushita Display Technology Co Ltd Liquid crystal display element and method for manufacturing the same
US20070180889A1 (en) * 2003-07-23 2007-08-09 Ken Murayama Probe replacement method for scanning probe microscope
JP4171694B2 (en) 2003-10-22 2008-10-22 株式会社ミツトヨ Hardness testing machine
US7242173B2 (en) 2004-08-31 2007-07-10 Fluke Corporation Combined test instrument probe and voltage detector
US7164353B2 (en) * 2004-12-22 2007-01-16 Avery Dennison Corporation Method and system for testing RFID devices
TWI372868B (en) * 2005-01-13 2012-09-21 Ibm Probe for scanning over a substrate and data storage device
US7167011B2 (en) 2005-05-27 2007-01-23 Tektronix, Inc. Differential measurement probe having retractable double cushioned variable spacing probing tips with EOS/ESD protection capabilities
EP1744325B1 (en) * 2005-07-14 2015-06-10 Consejo Superior de Investigaciones Cientificas (CSIC) System and method for surface inspection of micro and nanomechanical structures
JP4559928B2 (en) * 2005-08-11 2010-10-13 セイコーインスツル株式会社 Cantilever
US7375636B1 (en) * 2005-12-05 2008-05-20 Lawrence Joseph Martin Apparatus and method for real time functional testing of RFID tags
US7798011B2 (en) * 2006-02-08 2010-09-21 Hysitron, Inc. Actuatable capacitive transducer for quantitative nanoindentation combined with transmission electron microscopy
JP4858773B2 (en) * 2006-12-04 2012-01-18 独立行政法人物質・材料研究機構 Verification method of nanoindentation test
US7681432B2 (en) * 2006-12-12 2010-03-23 Agilent Technologies, Inc. Calibrating force and displacement sensors of mechanical probes
US7966866B2 (en) 2007-04-03 2011-06-28 The Regents Of The University Of California Methods and instruments for materials testing
US7816930B2 (en) 2007-10-12 2010-10-19 On Semiconductor High temperature range electrical circuit testing
JP5121619B2 (en) * 2008-07-31 2013-01-16 エスアイアイ・ナノテクノロジー株式会社 Probe microscope probe alignment method and probe microscope operated by the method
KR100963555B1 (en) * 2008-10-16 2010-06-15 한국기계연구원 a testing apparatus for mechanical-electrical behavior of metal thin film using nature frequency of the status quo
US8939041B2 (en) 2011-02-10 2015-01-27 Hysitron, Inc. Nanomechanical testing system
JP2012237566A (en) * 2011-05-10 2012-12-06 Hitachi High-Technologies Corp Defect observation method and apparatus for the same

Patent Citations (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4074554A (en) * 1973-03-29 1978-02-21 Aerpat A.G. Fastener placing apparatus
JPS6279923A (en) * 1985-10-01 1987-04-13 Mitsubishi Electric Corp Hand for robot
US4750141A (en) * 1985-11-26 1988-06-07 Ade Corporation Method and apparatus for separating fixture-induced error from measured object characteristics and for compensating the measured object characteristic with the error, and a bow/warp station implementing same
US4864227A (en) * 1987-02-27 1989-09-05 Canon Kabushiki Kaisha Wafer prober
US5058816A (en) * 1988-09-23 1991-10-22 Maschinenfabrik Rieter Ag Cops preparation station
US5340261A (en) * 1991-03-26 1994-08-23 Tokyo Electron Limited Load-lock unit and wafer transfer system
US5642298A (en) * 1994-02-16 1997-06-24 Ade Corporation Wafer testing and self-calibration system
US5825666A (en) * 1995-06-07 1998-10-20 Freifeld; Daniel Optical coordinate measuring machines and optical touch probes
US5729394A (en) * 1996-01-24 1998-03-17 Hewlett-Packard Company Multi-direction optical data port
US5773951A (en) * 1996-03-25 1998-06-30 Digital Test Corporation Wafer prober having sub-micron alignment accuracy
US20060131696A1 (en) * 2001-03-21 2006-06-22 Kabushiki Kaisha Toshiba Semiconductor wafer with ID mark, equipment for and method of manufacturing semiconductor device from them
US20020184975A1 (en) * 2001-06-11 2002-12-12 Saitama Seiki Kabushiki Kaisha And Akira Ono Power ratchet wrench
US6747746B2 (en) * 2001-07-16 2004-06-08 Therma-Wave, Inc. System and method for finding the center of rotation of an R-theta stage
US20080047749A1 (en) * 2002-11-27 2008-02-28 Thomas Koithan Methods and apparatus for applying torque and rotation to connections
US20070068232A1 (en) * 2003-07-26 2007-03-29 Carl Mahr Holding Gmbh Roughness measuring instrument with testing standard
US20080105063A1 (en) * 2003-12-08 2008-05-08 Covaris, Inc. Apparatus for sample preparation
US20050204868A1 (en) * 2004-03-19 2005-09-22 Kuo-Chen Liu Ratchet wrench
US20060043809A1 (en) * 2004-08-25 2006-03-02 Lau Michael R Torque-limited electrical connector
US20060212248A1 (en) * 2005-03-01 2006-09-21 Suss Microtec Test Systems Gmbh Procedure for reproduction of a calibration position of an aligned and afterwards displaced calibration substrate in a probe station
US20070148792A1 (en) * 2005-12-27 2007-06-28 Marx David S Wafer measurement system and apparatus
US20070227236A1 (en) * 2006-03-13 2007-10-04 Bonilla Flavio A Nanoindenter
US20080307662A1 (en) * 2006-04-24 2008-12-18 Carl Zeiss Industrielle Messtechnik Gmbh Method for Scanning a Surface with the Aid of a Coordinate Measuring Machine and Coordinate Measuring Machine
US7884326B2 (en) * 2007-01-22 2011-02-08 Fei Company Manipulator for rotating and translating a sample holder
US20100088788A1 (en) * 2007-02-21 2010-04-08 The Board Of Trustees Of The University Of Illinois Stress micro mechanical test cell, device, system and methods
US20080255608A1 (en) * 2007-04-16 2008-10-16 Hinman Cameron D Tool with end effector force limiter

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
BHUSHAN ET AL.: "Nanomechanical characterisation of solid surfaces and thin films", December 2003 (2003-12-01), XP055085459, Retrieved from the Internet <URL:http://www.micronano.ethz.ch/education/Lecture_4_Paper_IMR_Nanoinden_Li_03.pdf> [retrieved on 20120909] *
NIEHE: "A NEW FORCE MEASURING FACILITY FOR THE RANGE OF 10 mN TO 10 N", 27 June 2003 (2003-06-27), pages 339, XP055112905, Retrieved from the Internet <URL:http://www.imeko.org/publications/wc-2003/PWC-2003-TC3-019.pdf> [retrieved on 20120909] *
VANLANDINGHAM ET AL.: "NANOINDENTATION OF POLYMERS: an OVERVIEW", vol. 167, no. 1, December 2000 (2000-12-01), pages 15 - 44, XP055112907, Retrieved from the Internet <URL:http://fire.nist.gov/bfrlpubs/build00/PDF/b00063.pdf> [retrieved on 20120909] *

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