WO2012099466A3 - Method for manufacturing an electronic device by electrodeposition from an ionic liquid - Google Patents

Method for manufacturing an electronic device by electrodeposition from an ionic liquid Download PDF

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Publication number
WO2012099466A3
WO2012099466A3 PCT/NL2012/050026 NL2012050026W WO2012099466A3 WO 2012099466 A3 WO2012099466 A3 WO 2012099466A3 NL 2012050026 W NL2012050026 W NL 2012050026W WO 2012099466 A3 WO2012099466 A3 WO 2012099466A3
Authority
WO
WIPO (PCT)
Prior art keywords
electrodeposition
conducting layer
takes place
electronic conducting
electronic
Prior art date
Application number
PCT/NL2012/050026
Other languages
French (fr)
Other versions
WO2012099466A2 (en
Inventor
Petrus Marinus Martinus Cornelus Bressers
Jacobus Joannes Thomas Theresia Vermeijlen
Edward Willem Albert Young
Annalisa Branca
Arjan Hovestad
Barend Cornelis Wilhelmus VERMEULEN
Original Assignee
Nederlandse Organisatie Voor Toegepast-Natuurwetenschappelijk Onderzoek Tno
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nederlandse Organisatie Voor Toegepast-Natuurwetenschappelijk Onderzoek Tno filed Critical Nederlandse Organisatie Voor Toegepast-Natuurwetenschappelijk Onderzoek Tno
Publication of WO2012099466A2 publication Critical patent/WO2012099466A2/en
Publication of WO2012099466A3 publication Critical patent/WO2012099466A3/en

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/66—Electroplating: Baths therefor from melts
    • C25D3/665—Electroplating: Baths therefor from melts from ionic liquids
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008—Current shielding devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/04—Electroplating with moving electrodes

Abstract

Method for manufacturing an electronic device, the method comprising - providing an electronic intermediate product, said intermediate product having a an electronic conducting layer and - forming an metallic or metalloid layer on an outer surface the electronic conducting layer by electrodeposition using a plating liquid comprising an ionic liquid and metal ions or metalloid ions, wherein during electrodeposition the electronic conducting layer of the intermediate product on which electrodeposition takes place is connected to an electrical power source and the electronic conducting layer on which electrodeposition takes place provides a cathode for the electrodeposition, and wherein the metallic or metalloid layer is formed gradually in the plane parallel to the surface of the electronic conducting layer on which electrodeposition takes place, which gradual forming comprises starting the electrodeposition on a part of the surface of the electronic conducting layer on which electrodeposition takes place relatively close to the connection to the power source before starting the electrodeposition on a part of the surface of the electronic conducting layer on which electrodeposition takes place relatively remote from the connection to the power source.
PCT/NL2012/050026 2011-01-18 2012-01-17 Method for manufacturing an electronic device by electrodeposition from an ionic liquid WO2012099466A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP11151257A EP2476784A1 (en) 2011-01-18 2011-01-18 Method for manufacturing an electronic device by electrodeposition from an ionic liquid
EP11151257.0 2011-01-18

Publications (2)

Publication Number Publication Date
WO2012099466A2 WO2012099466A2 (en) 2012-07-26
WO2012099466A3 true WO2012099466A3 (en) 2013-01-03

Family

ID=44245687

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/NL2012/050026 WO2012099466A2 (en) 2011-01-18 2012-01-17 Method for manufacturing an electronic device by electrodeposition from an ionic liquid

Country Status (2)

Country Link
EP (1) EP2476784A1 (en)
WO (1) WO2012099466A2 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101942025B1 (en) 2010-08-20 2019-01-24 로디아 오퍼레이션스 Films containing electrically conductive polymers
DE102015103895A1 (en) * 2015-03-17 2016-09-22 Osram Oled Gmbh Method for producing an organic component
FR3047604B1 (en) * 2016-02-04 2018-02-02 Commissariat A L'energie Atomique Et Aux Energies Alternatives HUMIDITY PROTECTED HYBRID ELECTRONIC DEVICE AND HUMIDITY PROTECTION METHOD OF HYBRID ELECTRONIC DEVICE
CN105714364B (en) * 2016-03-30 2018-07-03 河南平高电气股份有限公司 A kind of plating cathode conducting seat, plating cathode electric installation and electroplating device
CN106801248B (en) * 2017-02-03 2020-04-10 中山大学 Device and method for manufacturing three-dimensional micro-nano structure device
KR102482452B1 (en) * 2017-09-28 2022-12-29 삼성디스플레이 주식회사 Organic material purification composition and method of purifying organic materials using the same

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5372699A (en) * 1991-09-13 1994-12-13 Meco Equipment Engineers B.V. Method and apparatus for selective electroplating of metals on products
US5395508A (en) * 1992-10-05 1995-03-07 Commissariat A L'energie Atomique Apparatus for the electrolytic deposition of a metal on a weakly conductive flexible substrate electrolytic deposition process and product obtained by this process
WO1999026275A2 (en) * 1997-11-13 1999-05-27 Novellus Systems, Inc. Electroplating system with shields for varying thickness profile of deposited layer
US6159354A (en) * 1997-11-13 2000-12-12 Novellus Systems, Inc. Electric potential shaping method for electroplating
US6217736B1 (en) * 1997-04-25 2001-04-17 Atotech Deutschland Gmbh Method and apparatus for electrolytically treating a board-shaped substrate comprising shielding edge regions of the substrate during electrolytic treatment
US6402923B1 (en) * 2000-03-27 2002-06-11 Novellus Systems Inc Method and apparatus for uniform electroplating of integrated circuits using a variable field shaping element
US20020079230A1 (en) * 2000-12-21 2002-06-27 Basol Bulent M. Method and apparatus for controlling thickness uniformity of electroplated layer
EP1983078A1 (en) * 2007-04-17 2008-10-22 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Electrodeposition
WO2008127110A1 (en) * 2007-04-17 2008-10-23 Nederlandse Organisatie Voor Toegepast-Natuurwetenschappelijk Onderzoek Tno Barrier layer and method for making the same

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4764440A (en) 1987-05-05 1988-08-16 Eveready Battery Company Low temperature molten compositions
US5731101A (en) 1996-07-22 1998-03-24 Akzo Nobel Nv Low temperature ionic liquids
FR2757850B1 (en) 1996-12-27 1999-04-16 Inst Francais Du Petrole IMPROVED PROCESS FOR DIENIC CONDENSATION CALLED DIELS-ALDER REACTION
GB0023708D0 (en) 2000-09-27 2000-11-08 Scionix Ltd Hydrated salt mixtures
US6576351B2 (en) 2001-02-16 2003-06-10 Universal Display Corporation Barrier region for optoelectronic devices
KR100859818B1 (en) 2001-03-29 2008-09-24 코닌클리케 필립스 일렉트로닉스 엔.브이. Method and apparatus for measuring the permeation rate of a substrate, method for testing a set of substrates from a batch on permeability, and method for measuring the permeation rate of an encapsulation
GB2374202A (en) 2001-04-03 2002-10-09 Seiko Epson Corp Patterning method
GB2379414A (en) 2001-09-10 2003-03-12 Seiko Epson Corp Method of forming a large flexible electronic display on a substrate using an inkjet head(s) disposed about a vacuum roller holding the substrate
US6569706B2 (en) 2001-09-19 2003-05-27 Osram Opto Semiconductors Gmbh Fabrication of organic light emitting diode using selective printing of conducting polymer layers
NL1023680C2 (en) 2003-06-17 2004-12-20 Tno Sensor with polymer components.
NL1023679C2 (en) 2003-06-17 2004-12-20 Tno Light-emitting diode.
WO2010093237A1 (en) 2009-02-11 2010-08-19 Nederlandse Organisatie Voor Toegepast- Natuurwetenschappelijk Onderzoek Tno Optoelectronic device and method for fabricating such device

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5372699A (en) * 1991-09-13 1994-12-13 Meco Equipment Engineers B.V. Method and apparatus for selective electroplating of metals on products
US5395508A (en) * 1992-10-05 1995-03-07 Commissariat A L'energie Atomique Apparatus for the electrolytic deposition of a metal on a weakly conductive flexible substrate electrolytic deposition process and product obtained by this process
US6217736B1 (en) * 1997-04-25 2001-04-17 Atotech Deutschland Gmbh Method and apparatus for electrolytically treating a board-shaped substrate comprising shielding edge regions of the substrate during electrolytic treatment
WO1999026275A2 (en) * 1997-11-13 1999-05-27 Novellus Systems, Inc. Electroplating system with shields for varying thickness profile of deposited layer
US6159354A (en) * 1997-11-13 2000-12-12 Novellus Systems, Inc. Electric potential shaping method for electroplating
US6402923B1 (en) * 2000-03-27 2002-06-11 Novellus Systems Inc Method and apparatus for uniform electroplating of integrated circuits using a variable field shaping element
US20020079230A1 (en) * 2000-12-21 2002-06-27 Basol Bulent M. Method and apparatus for controlling thickness uniformity of electroplated layer
EP1983078A1 (en) * 2007-04-17 2008-10-22 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Electrodeposition
WO2008127110A1 (en) * 2007-04-17 2008-10-23 Nederlandse Organisatie Voor Toegepast-Natuurwetenschappelijk Onderzoek Tno Barrier layer and method for making the same

Also Published As

Publication number Publication date
EP2476784A1 (en) 2012-07-18
WO2012099466A2 (en) 2012-07-26

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