WO2012052039A1 - Apparatus for coating a wafer - Google Patents
Apparatus for coating a wafer Download PDFInfo
- Publication number
- WO2012052039A1 WO2012052039A1 PCT/EP2010/006372 EP2010006372W WO2012052039A1 WO 2012052039 A1 WO2012052039 A1 WO 2012052039A1 EP 2010006372 W EP2010006372 W EP 2010006372W WO 2012052039 A1 WO2012052039 A1 WO 2012052039A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- wafer
- ring
- coating
- receiving
- circumference
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
Definitions
- the invention relates to a device for coating a surface of a wafer according to claim 1.
- the invention is therefore based on the object to provide a device for coating wafers, in which the coating, in particular in the edge region of the wafer, is more homogeneous.
- This object is achieved with the features of claim 1.
- Advantageous developments of the invention are specified in the subclaims. All combinations of at least two features specified in the description, the claims and / or the figures also fall within the scope of the invention. For given ranges of values, values within the stated limits are also to be disclosed as limit values and to be able to be claimed in any combination.
- the invention is based on the idea by providing egg nes
- the edge region of the wafer is virtually displaced onto the ring, so that the actual edge of the wafer and thus the entire wafer is coated more homogeneously.
- the coating surrounding the wafer with its inner circumference surrounding the wafer on one side circumference of the wafer for expanding the coating surface formed from the surface of the wafer and one end face of the wafer is advantageously interchangeable and thus on the outer contour or the shape and size of the wafer customizable.
- the ring is therefore circular at least on its inner contour, ie on the inner circumference.
- the concentric arrangement of the wafer to the ring or the ring to the wafer results in a uniform distance H between the wafer and the ring, which in turn leads to a more homogeneous result of the coating in the edge region of the wafer.
- the L-shaped configuration of the ring collects coating material which penetrates between the ring and the wafer so that the material can be absorbed by the ring
- an upper ring surface of the ring can be arranged above the receiving surface, in particular in alignment or above the surface, the homogeneity of the coating result is further improved, since the coating material after leaving the nozzle device
- the ring by an X-Y-adjustment in egg ner paral lel to the receiving surface extending X-Y plane relative to the wafer j ustierbar i st.
- This measure according to the invention makes it possible to align the ring concentrically with respect to the wafer, in particular fixed to the receiving device.
- the ring is fixed in the device in an XY direction that is orthogonal to the Z direction, so al only has a degree of freedom in the Z direction.
- the concentric takes place Alignment of the wafer to the ring in the recording of the wafer on the receiving surface by the wafer is applied concentrically to the ri ng or the distance between the wafer and the ring is set as uniformly as possible. Alignment of the wafer to the ring may be by optical detection means or by other means known in the art.
- the ring is adjustable by a, in particular in the X-Y adjustment in the Z direction slidably guided, Z-alignment in the orthogonal to the receiving surface directed Z-direction relative to the wafer.
- the upper annular surface of the ring can be adjusted in height relative to the surface of the wafer in the Z direction so that an optimum coating of the surface is made possible.
- the homogeneity of the coating of the surface of the wafer is further improved.
- the ring can be arranged such that the coating surface is formed from the surface and the Z-directional upper ring surface of the ring.
- Figure 1 is a schematic, sectional side view of
- Fi gur 2 is a schematic view of a ring according to the invention.
- FIG. 1 shows the coating apparatus 1 according to the invention in an embodiment, wherein a cutout on the left edge of a wafer 2, which is of crucial importance for the present invention, is shown enlarged.
- the wafer 2 is mounted on a chuck 8 of a rotatable and height-adjustable in a Z direction via a robot arm not shown dargestel
- Recording device 1 6 stored and centered at or after depositing and recording on the receiving device with respect to a
- the rotation of the receiving device 1 6 is carried out by a shaft 9 with a shaft drive Wel, not shown.
- the wafer 2 is deposited on the chuck 8 so that its surface 2o in the Z direction on the side facing away from the chuck 8 to one
- Nozzle device 1 0 white st.
- the nozzle device 10 is movable along the surface 2o in an X-Y plane extending transversely to the Z direction in order to homogeneously coat the entire surface 2o with a coating substance.
- Coating substance is, for example, photoresist.
- a housing wall 5 of the coating device 1 is a
- a bottom 5b of the housing wall 5 is centrally penetrated by the shaft 9 and di e receiving device 1 6 is movable in the Z direction.
- the ring 4 can be arranged such that an inner circumference 4i of the cross-sectionally L-förmi ring 4 is arranged so that the inner circumference 4i is opposite to the side circumference 2a of the wafer 2.
- the ring 4 surrounds the wafer 2 at its side circumference 2a completely, with its outer leg 1 2. A from the outside
- Leg 1 2 in the direction of the receiving device 1 6 in the X direction and Y direction facing inner leg 1 3 of the ring extends beyond the side circumference 2a also in the direction of the wafer center and forms an annular opening 4r, through which inter alia the Chuck 8 runs.
- the ring opening 4r is formed by an inner ring surface 1 4 of the ring 4 (see Figure 2).
- the ring 4 is fixed in X- and Y-direction, ie in an X-Y plane by an X-Y-fixation 6 by a projecting from the X-Y-fixing 6 upwards fixing ring 3 by conditioning the fixing ring 3 on the
- Inner ring surface 1 4 is fixed in the X-Y direction.
- the fixing ring 3 and / or the X-Y-fixing 6 can vertei on the circumference of the ring 4 in at least three places, so not circumferentially closed
- a vacuum device 1 5 is also provided, which serves for fixing the wafer 2 to the X-Y-fixing 6.
- a Z-adjusting device 7 in the form of several, arranged on the circumference of the ring 4, movable in the Z direction pins 1 7 provided, which bear against the upper ring surface 4o 4u bottom of the ring 4.
- the pins 1 7 are through the Z- Adjusting 7 g eichgearedd in the Z direction movable to avoid tilting of the ring 4 on the fixing ring 3.
- the pins 1 7 extend in guide holes 1 8 of the X-Y-fixation 6, so that the X-Y-fixation 6 at the same time the Sti fte 1 7 i n fixed in the X and Y direction.
- the diameter of the ring 4 on the inner circumference 4i is larger than that
- Diameter of the wafer 2 on the side circumference 2a so that a distance H between the inner circumference 4i and the side circumference 2a is adjustable.
- the upper ring surface 4o is to the surface 2o
Abstract
Description
Claims
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/EP2010/006372 WO2012052039A1 (en) | 2010-10-19 | 2010-10-19 | Apparatus for coating a wafer |
KR1020137006971A KR101497848B1 (en) | 2010-10-19 | 2010-10-19 | Apparatus for coating a wafer |
SG2013015789A SG188953A1 (en) | 2010-10-19 | 2010-10-19 | Device for coating a wafer |
CN201080069727.5A CN103155097B (en) | 2010-10-19 | 2010-10-19 | For the device of coated wafers |
JP2013534169A JP5661937B2 (en) | 2010-10-19 | 2010-10-19 | Wafer coating equipment |
EP10770723.4A EP2630653B1 (en) | 2010-10-19 | 2010-10-19 | Apparatus for coating a wafer |
US13/820,331 US20130160706A1 (en) | 2010-10-19 | 2010-10-19 | Device for coating a wafer |
TW100137971A TWI495516B (en) | 2010-10-19 | 2011-10-19 | Device for coating a wafer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/EP2010/006372 WO2012052039A1 (en) | 2010-10-19 | 2010-10-19 | Apparatus for coating a wafer |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2012052039A1 true WO2012052039A1 (en) | 2012-04-26 |
Family
ID=43759829
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2010/006372 WO2012052039A1 (en) | 2010-10-19 | 2010-10-19 | Apparatus for coating a wafer |
Country Status (8)
Country | Link |
---|---|
US (1) | US20130160706A1 (en) |
EP (1) | EP2630653B1 (en) |
JP (1) | JP5661937B2 (en) |
KR (1) | KR101497848B1 (en) |
CN (1) | CN103155097B (en) |
SG (1) | SG188953A1 (en) |
TW (1) | TWI495516B (en) |
WO (1) | WO2012052039A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2802004A1 (en) | 2013-05-08 | 2014-11-12 | Ams Ag | Method of structuring a device layer of a recessed semiconductor device and recessed semiconductor device comprising a structured device layer |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102371362B1 (en) | 2021-05-20 | 2022-03-07 | 주식회사 우진에프에이 | Apparatus for coating PLP wafer surfaces |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6012858A (en) * | 1997-08-01 | 2000-01-11 | Tokyo Electron Limited | Apparatus and method for forming liquid film |
JP2003197716A (en) * | 2001-12-21 | 2003-07-11 | Applied Materials Inc | Substrate support and semiconductor production unit |
WO2006125744A1 (en) * | 2005-05-25 | 2006-11-30 | Sez Ag | Device and method for liquid treatment of wafer-shaped articles |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4559718A (en) * | 1983-08-02 | 1985-12-24 | Oki Electric Industry Co., Ltd. | Method and apparatus for drying semiconductor wafers |
JPH08107063A (en) * | 1994-09-30 | 1996-04-23 | New Japan Radio Co Ltd | Resist coater |
JPH08141478A (en) * | 1994-11-21 | 1996-06-04 | Dainippon Screen Mfg Co Ltd | Rotary type substrate treating device |
TW410374B (en) * | 1999-02-05 | 2000-11-01 | United Microelectronics Corp | Developer tank |
ATE211855T1 (en) * | 1999-04-28 | 2002-01-15 | Sez Semiconduct Equip Zubehoer | DEVICE AND METHOD FOR THE LIQUID TREATMENT OF DISK-SHAPED OBJECTS |
JP3635217B2 (en) * | 1999-10-05 | 2005-04-06 | 東京エレクトロン株式会社 | Liquid processing apparatus and method |
JP2008525996A (en) * | 2004-12-10 | 2008-07-17 | エルジー・ケム・リミテッド | Spin coating apparatus and substrate prepared using the spin coating |
CN201374317Y (en) * | 2009-03-20 | 2009-12-30 | 昆山西钛微电子科技有限公司 | Epoxy resin membrane coating station used for wafer-level chip package |
-
2010
- 2010-10-19 KR KR1020137006971A patent/KR101497848B1/en active IP Right Grant
- 2010-10-19 WO PCT/EP2010/006372 patent/WO2012052039A1/en active Application Filing
- 2010-10-19 CN CN201080069727.5A patent/CN103155097B/en active Active
- 2010-10-19 JP JP2013534169A patent/JP5661937B2/en active Active
- 2010-10-19 EP EP10770723.4A patent/EP2630653B1/en active Active
- 2010-10-19 US US13/820,331 patent/US20130160706A1/en not_active Abandoned
- 2010-10-19 SG SG2013015789A patent/SG188953A1/en unknown
-
2011
- 2011-10-19 TW TW100137971A patent/TWI495516B/en active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6012858A (en) * | 1997-08-01 | 2000-01-11 | Tokyo Electron Limited | Apparatus and method for forming liquid film |
JP2003197716A (en) * | 2001-12-21 | 2003-07-11 | Applied Materials Inc | Substrate support and semiconductor production unit |
WO2006125744A1 (en) * | 2005-05-25 | 2006-11-30 | Sez Ag | Device and method for liquid treatment of wafer-shaped articles |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2802004A1 (en) | 2013-05-08 | 2014-11-12 | Ams Ag | Method of structuring a device layer of a recessed semiconductor device and recessed semiconductor device comprising a structured device layer |
Also Published As
Publication number | Publication date |
---|---|
SG188953A1 (en) | 2013-05-31 |
US20130160706A1 (en) | 2013-06-27 |
TW201235112A (en) | 2012-09-01 |
CN103155097B (en) | 2016-03-23 |
KR101497848B1 (en) | 2015-03-04 |
JP5661937B2 (en) | 2015-01-28 |
TWI495516B (en) | 2015-08-11 |
EP2630653A1 (en) | 2013-08-28 |
CN103155097A (en) | 2013-06-12 |
JP2013543267A (en) | 2013-11-28 |
KR20130071474A (en) | 2013-06-28 |
EP2630653B1 (en) | 2015-04-01 |
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