WO2012040374A3 - Superabrasive tools having substantially leveled particle tips and associated methods - Google Patents

Superabrasive tools having substantially leveled particle tips and associated methods Download PDF

Info

Publication number
WO2012040374A3
WO2012040374A3 PCT/US2011/052627 US2011052627W WO2012040374A3 WO 2012040374 A3 WO2012040374 A3 WO 2012040374A3 US 2011052627 W US2011052627 W US 2011052627W WO 2012040374 A3 WO2012040374 A3 WO 2012040374A3
Authority
WO
WIPO (PCT)
Prior art keywords
monolayer
associated methods
superabrasive
substantially leveled
superabrasive tools
Prior art date
Application number
PCT/US2011/052627
Other languages
French (fr)
Other versions
WO2012040374A2 (en
Inventor
Chien-Min Sung
Original Assignee
Ritedia Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=45874363&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=WO2012040374(A3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Ritedia Corporation filed Critical Ritedia Corporation
Priority to CN201180053648XA priority Critical patent/CN103221180A/en
Publication of WO2012040374A2 publication Critical patent/WO2012040374A2/en
Publication of WO2012040374A3 publication Critical patent/WO2012040374A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0072—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using adhesives for bonding abrasive particles or grinding elements to a support, e.g. by gluing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3732—Diamonds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

Superabrasive tools and methods for making and using the same are provided. In one aspect, for example, a CMP pad dresser includes a first monolayer of superabrasive particles disposed on and coupled to one side of a metal support layer and a second monolayer of superabrasive particles disposed on and coupled to the metal support layer on an opposite side from the first monolayer. The superabrasive particles of the second monolayer are positioned to have substantially the same distribution as the superabrasive particles of the first monolayer.
PCT/US2011/052627 2010-09-21 2011-09-21 Superabrasive tools having substantially leveled particle tips and associated methods WO2012040374A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201180053648XA CN103221180A (en) 2010-09-21 2011-09-21 Superabrasive tools having substantially leveled particle tips and associated methods

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US38497610P 2010-09-21 2010-09-21
US61/384,976 2010-09-21
US201161468917P 2011-03-29 2011-03-29
US61/468,917 2011-03-29

Publications (2)

Publication Number Publication Date
WO2012040374A2 WO2012040374A2 (en) 2012-03-29
WO2012040374A3 true WO2012040374A3 (en) 2012-07-05

Family

ID=45874363

Family Applications (2)

Application Number Title Priority Date Filing Date
PCT/US2011/052626 WO2012040373A2 (en) 2010-09-21 2011-09-21 Diamond particle mololayer heat spreaders and associated methods
PCT/US2011/052627 WO2012040374A2 (en) 2010-09-21 2011-09-21 Superabrasive tools having substantially leveled particle tips and associated methods

Family Applications Before (1)

Application Number Title Priority Date Filing Date
PCT/US2011/052626 WO2012040373A2 (en) 2010-09-21 2011-09-21 Diamond particle mololayer heat spreaders and associated methods

Country Status (4)

Country Link
US (4) US8531026B2 (en)
CN (2) CN103221180A (en)
TW (2) TWI464839B (en)
WO (2) WO2012040373A2 (en)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9221154B2 (en) 1997-04-04 2015-12-29 Chien-Min Sung Diamond tools and methods for making the same
US9238207B2 (en) 1997-04-04 2016-01-19 Chien-Min Sung Brazed diamond tools and methods for making the same
US9409280B2 (en) 1997-04-04 2016-08-09 Chien-Min Sung Brazed diamond tools and methods for making the same
US9868100B2 (en) 1997-04-04 2018-01-16 Chien-Min Sung Brazed diamond tools and methods for making the same
US9199357B2 (en) 1997-04-04 2015-12-01 Chien-Min Sung Brazed diamond tools and methods for making the same
US9463552B2 (en) 1997-04-04 2016-10-11 Chien-Min Sung Superbrasvie tools containing uniformly leveled superabrasive particles and associated methods
US8678878B2 (en) 2009-09-29 2014-03-25 Chien-Min Sung System for evaluating and/or improving performance of a CMP pad dresser
US9138862B2 (en) * 2011-05-23 2015-09-22 Chien-Min Sung CMP pad dresser having leveled tips and associated methods
US8622787B2 (en) 2006-11-16 2014-01-07 Chien-Min Sung CMP pad dressers with hybridized abrasive surface and related methods
US9724802B2 (en) 2005-05-16 2017-08-08 Chien-Min Sung CMP pad dressers having leveled tips and associated methods
US8393934B2 (en) 2006-11-16 2013-03-12 Chien-Min Sung CMP pad dressers with hybridized abrasive surface and related methods
US9011563B2 (en) 2007-12-06 2015-04-21 Chien-Min Sung Methods for orienting superabrasive particles on a surface and associated tools
US8531026B2 (en) 2010-09-21 2013-09-10 Ritedia Corporation Diamond particle mololayer heat spreaders and associated methods
CN103329253B (en) * 2011-05-23 2016-03-30 宋健民 There is the CMP pad dresser at planarization tip
JP2013115083A (en) * 2011-11-25 2013-06-10 Fujitsu Semiconductor Ltd Semiconductor device and method of manufacturing the same
TWI466347B (en) * 2012-07-13 2014-12-21 Nat Univ Chung Hsing A light-emitting element having a high heat dissipation characteristic, and a light-emitting element manufactured by the method
TWI530361B (en) * 2012-11-07 2016-04-21 中國砂輪企業股份有限公司 Chemical mechanical polishing conditioner and associated methods
TWI568538B (en) * 2013-03-15 2017-02-01 中國砂輪企業股份有限公司 Chemical mechanical polishing conditioner and manufacturing method thereof
CN104726735B (en) * 2013-12-23 2017-02-08 北京有色金属研究总院 Composite-structure highly-oriented heat conducting material and preparation method thereof
RU2552810C1 (en) * 2013-12-30 2015-06-10 Федеральное государственное бюджетное учреждение науки Институт физико-технических проблем Севера им. В.П. Ларионова Сибирского отделения Российской академии наук Alloy for diamond monocrystal connection with metals
CN105093776B (en) * 2014-05-13 2020-08-25 深圳光峰科技股份有限公司 Wavelength conversion device, light source system and projection system
TWI551400B (en) * 2014-10-23 2016-10-01 中國砂輪企業股份有限公司 Grinding tool and method of manufacturing the same
US9812375B2 (en) * 2015-02-05 2017-11-07 Ii-Vi Incorporated Composite substrate with alternating pattern of diamond and metal or metal alloy
US10695872B2 (en) * 2015-03-11 2020-06-30 Lockheed Martin Corporation Heat spreaders fabricated from metal nanoparticles
KR101927651B1 (en) * 2015-12-10 2018-12-10 가부시끼가이샤 아라이도 마테리아루 Grass Rip Wheel
TW201728411A (en) * 2016-02-01 2017-08-16 中國砂輪企業股份有限公司 Chemical mechanical polishing dresser and manufacturing method thereof capable of elaborating the effect of offsetting thermal stress to reduce the warp and deformation of the supporting layer
KR102164795B1 (en) 2018-09-06 2020-10-13 삼성전자주식회사 Fan-out semiconductor package
CN110052962A (en) * 2019-04-25 2019-07-26 西安奕斯伟硅片技术有限公司 A kind of polishing pad trimmer, processing unit (plant) and method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060073774A1 (en) * 2004-09-29 2006-04-06 Chien-Min Sung CMP pad dresser with oriented particles and associated methods
US7198553B2 (en) * 1998-04-15 2007-04-03 3M Innovative Properties Company Corrosion resistant abrasive article and method of making
US20080271384A1 (en) * 2006-09-22 2008-11-06 Saint-Gobain Ceramics & Plastics, Inc. Conditioning tools and techniques for chemical mechanical planarization
US7651386B2 (en) * 2005-09-09 2010-01-26 Chien-Min Sung Methods of bonding superabrasive particles in an organic matrix

Family Cites Families (405)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US187593A (en) 1877-02-20 Improvement in emery grinding-wheels
US296756A (en) * 1884-04-15 Car-coupling
USRE20660E (en) 1938-02-22 Method of coaxing and apparatus
US238946A (en) * 1881-03-15 Heel-restorer
US5642779A (en) 1909-06-30 1997-07-01 Sumitomo Electric Industries, Ltd. Heat sink and a process for the production of the same
US1382080A (en) 1919-09-18 1921-06-21 William Haas Company Radiator-valve
US2307461A (en) * 1928-05-02 1943-01-05 Minnesota Mining & Mfg Sheeted abrasive
US2027307A (en) 1928-07-30 1936-01-07 Behr Manning Corp Method of coating and apparatus therefor and product
US2027087A (en) 1928-10-03 1936-01-07 Behr Manning Corp Abrasive sheet and process of making the same
US2318570A (en) 1930-01-20 1943-05-04 Minnesota Mining & Mfg Manufacture of abrasives
US1854071A (en) 1930-07-14 1932-04-12 Behr Manning Corp Method of manufacturing abrasives
US1988065A (en) 1931-09-26 1935-01-15 Carborundum Co Manufacture of open-spaced abrasive fabrics
US2187624A (en) 1932-10-10 1940-01-16 Carborundum Co Apparatus for the manufacture of coated webs
US2035521A (en) 1932-10-26 1936-03-31 Carborundum Co Granular coated web and method of making same
US2194253A (en) 1932-10-27 1940-03-19 Carborundum Co Coating apparatus
US2184348A (en) 1932-10-27 1939-12-26 Carborundum Co Coating apparatus
US2281558A (en) 1933-03-06 1942-05-05 Minnesota Mining & Mfg Manufacture of abrasive articles and apparatus therefor
US2078354A (en) 1935-04-25 1937-04-27 Norton Co Abrasive article
US2075354A (en) * 1935-06-10 1937-03-30 Monier Namee Collapsible game table
US2033991A (en) 1935-07-09 1936-03-17 Carborundum Co Coating apparatus
US2268663A (en) 1939-09-19 1942-01-06 J K Smit & Sons Inc Abrasive tool
US2334572A (en) 1941-12-29 1943-11-16 Carborundum Co Manufacture of abrasive materials
US2612348A (en) 1949-09-14 1952-09-30 Wheel Trueing Tool Co Diamond set core bit
US2652951A (en) 1951-03-13 1953-09-22 Esposito Augustus Salt and pepper shaker
US2952951A (en) 1952-07-28 1960-09-20 Simpson Harry Arthur Abrasive or like materials and articles
US2876086A (en) 1954-06-21 1959-03-03 Minnesota Mining & Mfg Abrasive structures and method of making
US2725693A (en) 1954-12-15 1955-12-06 Smith Joseph Leigh Abrasive roll and method of making
US2867086A (en) 1954-12-20 1959-01-06 Emmett L Haley Portable pressure fluid power devices
NL114085C (en) 1955-08-29
US2811960A (en) 1957-02-26 1957-11-05 Fessel Paul Abrasive cutting body
US3067551A (en) 1958-09-22 1962-12-11 Bethlehem Steel Corp Grinding method
US3127715A (en) 1960-04-27 1964-04-07 Christensen Diamond Prod Co Diamond cutting devices
US3146560A (en) 1960-06-14 1964-09-01 Rexall Drug Chemical Abrasive products
US3121981A (en) 1960-09-23 1964-02-25 Rexall Drug Chemical Abrasive wheels and method of making the same
ES272672A1 (en) 1961-12-04 1962-05-01 The Osborn Manufacturing Company Method of manufacturing grinding wheels and the like
US3276852A (en) 1962-11-20 1966-10-04 Jerome H Lemelson Filament-reinforced composite abrasive articles
US3293012A (en) 1962-11-27 1966-12-20 Exxon Production Research Co Process of infiltrating diamond particles with metallic binders
DE1502642A1 (en) 1963-05-13 1969-06-04 Naradi Narodni Podnik Diamond forming tool
US3372010A (en) 1965-06-23 1968-03-05 Wall Colmonoy Corp Diamond abrasive matrix
US3416560A (en) 1965-08-23 1968-12-17 Bruno Peter Fluid leak monitoring apparatus
GB1209139A (en) 1968-06-19 1970-10-21 Ind Distributors 1946 Ltd Abrasive article manufacture
US3574580A (en) 1968-11-08 1971-04-13 Atomic Energy Commission Process for producing sintered diamond compact and products
US3608134A (en) 1969-02-10 1971-09-28 Norton Co Molding apparatus for orienting elongated particles
JPS4823595B1 (en) 1969-06-17 1973-07-14
US3630699A (en) 1969-09-02 1971-12-28 Remington Arms Co Inc Method for producing armored saber saws
US3678995A (en) 1970-06-22 1972-07-25 Rca Corp Support for electrical components and method of making the same
US3829544A (en) 1970-12-09 1974-08-13 Megadiamond Corp Method of making a unitary polycrystalline diamond composite and diamond composite produced thereby
US3852078A (en) 1970-12-24 1974-12-03 M Wakatsuki Mass of polycrystalline cubic system boron nitride and composites of polycrystalline cubic system boron nitride and other hard materials, and processes for manufacturing the same
US3913280A (en) 1971-01-29 1975-10-21 Megadiamond Corp Polycrystalline diamond composites
US3905571A (en) * 1971-03-26 1975-09-16 Joseph Lombardo Nursing bottle holder
ZA713105B (en) 1971-05-12 1972-09-27 De Beers Ind Diamond Diamond and the like grinding wheels
US3767371A (en) 1971-07-01 1973-10-23 Gen Electric Cubic boron nitride/sintered carbide abrasive bodies
US3743489A (en) 1971-07-01 1973-07-03 Gen Electric Abrasive bodies of finely-divided cubic boron nitride crystals
IL39936A (en) 1971-07-30 1975-04-25 De Beers Ind Diamond A diamond particle particularly for use in heat sinks
US4018576A (en) 1971-11-04 1977-04-19 Abrasive Technology, Inc. Diamond abrasive tool
US3894673A (en) 1971-11-04 1975-07-15 Abrasive Tech Inc Method of manufacturing diamond abrasive tools
US3819814A (en) 1972-11-01 1974-06-25 Megadiamond Corp Plural molded diamond articles and their manufacture from diamond powders under high temperature and pressure
GB1382080A (en) 1972-12-01 1975-01-29 Inst Fiziki Vysokikh Davleny Method of preparing a diamond-metal compact
US3912500A (en) 1972-12-27 1975-10-14 Leonid Fedorovich Vereschagin Process for producing diamond-metallic materials
US3872496A (en) 1973-09-13 1975-03-18 Sperry Rand Corp High frequency diode having simultaneously formed high strength bonds with respect to a diamond heat sink and said diode
US3982358A (en) 1973-10-09 1976-09-28 Heijiro Fukuda Laminated resinoid wheels, method for continuously producing same and apparatus for use in the method
US3949263A (en) 1974-12-20 1976-04-06 Raytheon Company Diamond brazing method for slow wave energy propagating structures
US4287168A (en) 1975-01-27 1981-09-01 General Electric Company Apparatus and method for isolation of diamond seeds for growing diamonds
US4028576A (en) * 1975-07-21 1977-06-07 David Wofsey Sonic spark plug
US4273561A (en) 1975-08-27 1981-06-16 Fernandez Moran Villalobos Hum Ultrasharp polycrystalline diamond edges, points, and improved diamond composites, and methods of making and irradiating same
US4211924A (en) 1976-09-03 1980-07-08 Siemens Aktiengesellschaft Transmission-type scanning charged-particle beam microscope
US4078906A (en) 1976-09-29 1978-03-14 Elgin Diamond Products Co., Inc. Method for making an abrading tool with discontinuous diamond abrading surfaces
US4188194A (en) 1976-10-29 1980-02-12 General Electric Company Direct conversion process for making cubic boron nitride from pyrolytic boron nitride
GB1591491A (en) 1977-01-18 1981-06-24 Daichiku Co Ltd Laminated rotary grinder and method of fabrication
ZA771270B (en) 1977-03-03 1978-07-26 De Beers Ind Diamond Abrasive bodies
US4228214A (en) 1978-03-01 1980-10-14 Gte Products Corporation Flexible bilayered sheet, one layer of which contains abrasive particles in a volatilizable organic binder and the other layer of which contains alloy particles in a volatilizable binder, method for producing same and coating produced by heating same
US4224380A (en) 1978-03-28 1980-09-23 General Electric Company Temperature resistant abrasive compact and method for making same
US4211294A (en) 1978-04-21 1980-07-08 Acker Drill Company, Inc. Impregnated diamond drill bit
US4149881A (en) 1978-06-28 1979-04-17 Western Gold And Platinum Company Nickel palladium base brazing alloy
US4182628A (en) 1978-07-03 1980-01-08 GTE Sylvania Products, Inc. Partially amorphous silver-copper-indium brazing foil
IE48798B1 (en) 1978-08-18 1985-05-15 De Beers Ind Diamond Method of making tool inserts,wire-drawing die blank and drill bit comprising such inserts
US4231195A (en) 1979-05-24 1980-11-04 General Electric Company Polycrystalline diamond body and process
US4289503A (en) 1979-06-11 1981-09-15 General Electric Company Polycrystalline cubic boron nitride abrasive and process for preparing same in the absence of catalyst
US4355489A (en) 1980-09-15 1982-10-26 Minnesota Mining And Manufacturing Company Abrasive article comprising abrasive agglomerates supported in a fibrous matrix
US4378233A (en) 1981-07-24 1983-03-29 Norton Company Metal bonded grinding wheel containing diamond or CBN abrasive
US4525179A (en) 1981-07-27 1985-06-25 General Electric Company Process for making diamond and cubic boron nitride compacts
US4712552A (en) 1982-03-10 1987-12-15 William W. Haefliger Cushioned abrasive composite
US4518659A (en) 1982-04-02 1985-05-21 General Electric Company Sweep through process for making polycrystalline compacts
US4544540A (en) 1982-06-25 1985-10-01 Sumitomo Electric Industries, Ltd. Diamond single crystals, a process of manufacturing and tools for using same
US4425195A (en) 1982-11-10 1984-01-10 Martin Marietta Corporation Method of fabricating a diamond heat sink
US4534773A (en) 1983-01-10 1985-08-13 Cornelius Phaal Abrasive product and method for manufacturing
US4629373A (en) 1983-06-22 1986-12-16 Megadiamond Industries, Inc. Polycrystalline diamond body with enhanced surface irregularities
US4617181A (en) 1983-07-01 1986-10-14 Sumitomo Electric Industries, Ltd. Synthetic diamond heat sink
US4828582A (en) 1983-08-29 1989-05-09 General Electric Company Polycrystalline abrasive grit
US4776861A (en) 1983-08-29 1988-10-11 General Electric Company Polycrystalline abrasive grit
GB8325320D0 (en) 1983-09-21 1983-10-26 Plessey Co Plc Diamond heatsink assemblies
US4780274A (en) 1983-12-03 1988-10-25 Reed Tool Company, Ltd. Manufacture of rotary drill bits
US4565034A (en) 1984-01-03 1986-01-21 Disco Abrasive Systems, Ltd. Grinding and/or cutting endless belt
US4610699A (en) 1984-01-18 1986-09-09 Sumitomo Electric Industries, Ltd. Hard diamond sintered body and the method for producing the same
US4632817A (en) 1984-04-04 1986-12-30 Sumitomo Electric Industries, Ltd. Method of synthesizing diamond
WO1986001433A1 (en) 1984-08-24 1986-03-13 The Australian National University Diamond compacts and process for making same
US4551195A (en) 1984-09-25 1985-11-05 Showa Denko Kabushiki Kaisha Method for growing boron nitride crystals of cubic system
US4547257A (en) 1984-09-25 1985-10-15 Showa Denko Kabushiki Kaisha Method for growing diamond crystals
US4649992A (en) 1984-10-05 1987-03-17 Plessey Overseas Limited Diamond heatsink assemblies
GB8508621D0 (en) 1985-04-02 1985-05-09 Nl Petroleum Prod Rotary drill bits
US4797241A (en) 1985-05-20 1989-01-10 Sii Megadiamond Method for producing multiple polycrystalline bodies
US4664705A (en) 1985-07-30 1987-05-12 Sii Megadiamond, Inc. Infiltrated thermally stable polycrystalline diamond
JPS6287407A (en) 1985-10-12 1987-04-21 Res Dev Corp Of Japan Filmy graphite interlaminar compound and production thereof
DE3545308A1 (en) 1985-12-20 1987-06-25 Feldmuehle Ag GRINDING DISC WITH DAMPING
US4949511A (en) 1986-02-10 1990-08-21 Toshiba Tungaloy Co., Ltd. Super abrasive grinding tool element and grinding tool
US4662896A (en) 1986-02-19 1987-05-05 Strata Bit Corporation Method of making an abrasive cutting element
US4680199A (en) 1986-03-21 1987-07-14 United Technologies Corporation Method for depositing a layer of abrasive material on a substrate
DE3788673T2 (en) 1986-04-17 1994-04-28 Sumitomo Electric Industries Wire encrusted with abrasive grains and process for its manufacture.
EP0264674B1 (en) 1986-10-20 1995-09-06 Baker Hughes Incorporated Low pressure bonding of PCD bodies and method
US5116568A (en) 1986-10-20 1992-05-26 Norton Company Method for low pressure bonding of PCD bodies
US4943488A (en) 1986-10-20 1990-07-24 Norton Company Low pressure bonding of PCD bodies and method for drill bits and the like
US5030276A (en) 1986-10-20 1991-07-09 Norton Company Low pressure bonding of PCD bodies and method
AU1215788A (en) 1987-02-27 1988-09-01 Diabrasive International Ltd. Flexible abrasives
US5195404A (en) 1987-06-18 1993-03-23 Notter Theo A Drill bit with cutting insert
US4770907A (en) 1987-10-17 1988-09-13 Fuji Paudal Kabushiki Kaisha Method for forming metal-coated abrasive grain granules
US4908046A (en) 1989-02-14 1990-03-13 Wiand Ronald C Multilayer abrading tool and process
US5022895A (en) 1988-02-14 1991-06-11 Wiand Ronald C Multilayer abrading tool and process
CA1298980C (en) 1988-02-26 1992-04-21 Clyde D. Calhoun Abrasive sheeting having individually positioned abrasive granules
US5273730A (en) 1988-03-08 1993-12-28 Sumitomo Electric Industries, Ltd. Method of synthesizing diamond
US5151107A (en) 1988-07-29 1992-09-29 Norton Company Cemented and cemented/sintered superabrasive polycrystalline bodies and methods of manufacture thereof
US4916869A (en) 1988-08-01 1990-04-17 L. R. Oliver & Company, Inc. Bonded abrasive grit structure
US4849602A (en) 1988-08-12 1989-07-18 Iscar Ltd. Method for fabricating cutting pieces
AU605995B2 (en) 1988-08-31 1991-01-24 De Beers Industrial Diamond Division (Proprietary) Limited Manufacture of abrasive products
US5130771A (en) 1988-10-11 1992-07-14 Amoco Corporation Diamond composite heat sink for use with semiconductor devices
US5008737A (en) 1988-10-11 1991-04-16 Amoco Corporation Diamond composite heat sink for use with semiconductor devices
US4883500A (en) 1988-10-25 1989-11-28 General Electric Company Sawblade segments utilizing polycrystalline diamond grit
US5024680A (en) 1988-11-07 1991-06-18 Norton Company Multiple metal coated superabrasive grit and methods for their manufacture
US5043120A (en) 1988-11-10 1991-08-27 The General Electric Company Process for preparing polycrystalline CBN ceramic masses
US6413589B1 (en) 1988-11-29 2002-07-02 Chou H. Li Ceramic coating method
US4923490A (en) 1988-12-16 1990-05-08 General Electric Company Novel grinding wheels utilizing polycrystalline diamond or cubic boron nitride grit
US5190568B1 (en) 1989-01-30 1996-03-12 Ultimate Abrasive Syst Inc Abrasive tool with contoured surface
US5049165B1 (en) 1989-01-30 1995-09-26 Ultimate Abrasive Syst Inc Composite material
US5094985A (en) 1989-01-30 1992-03-10 Kazunori Kijima Kyoto Sintered silicon carbide body with high thermal conductivity and process of producing the same
US4925457B1 (en) 1989-01-30 1995-09-26 Ultimate Abrasive Syst Inc Method for making an abrasive tool
US4945686A (en) 1989-02-14 1990-08-07 Wiand Ronald C Multilayer abrading tool having an irregular abrading surface and process
US5133782A (en) 1989-02-14 1992-07-28 Wiand Ronald C Multilayer abrading tool having an irregular abrading surface and process
US4954139A (en) 1989-03-31 1990-09-04 The General Electric Company Method for producing polycrystalline compact tool blanks with flat carbide support/diamond or CBN interfaces
EP0391418B2 (en) 1989-04-06 1998-09-09 Sumitomo Electric Industries, Ltd. A diamond for a dresser
US5224017A (en) 1989-05-17 1993-06-29 The Charles Stark Draper Laboratory, Inc. Composite heat transfer device
US5011513A (en) 1989-05-31 1991-04-30 Norton Company Single step, radiation curable ophthalmic fining pad
US4968326A (en) 1989-10-10 1990-11-06 Wiand Ronald C Method of brazing of diamond to substrate
AU634601B2 (en) 1989-12-11 1993-02-25 General Electric Company Single-crystal diamond of very high thermal conductivity
US5096465A (en) 1989-12-13 1992-03-17 Norton Company Diamond metal composite cutter and method for making same
US5000273A (en) 1990-01-05 1991-03-19 Norton Company Low melting point copper-manganese-zinc alloy for infiltration binder in matrix body rock drill bits
US5203881A (en) 1990-02-02 1993-04-20 Wiand Ronald C Abrasive sheet and method
US5131924A (en) 1990-02-02 1992-07-21 Wiand Ronald C Abrasive sheet and method
US5164247A (en) 1990-02-06 1992-11-17 The Pullman Company Wear resistance in a hardfaced substrate
GB9006703D0 (en) 1990-03-26 1990-05-23 De Beers Ind Diamond Abrasive product
JP2940099B2 (en) 1990-08-09 1999-08-25 住友電気工業株式会社 Method for synthesizing high thermal conductive diamond single crystal
US5120495A (en) 1990-08-27 1992-06-09 The Standard Oil Company High thermal conductivity metal matrix composite
US5045972A (en) 1990-08-27 1991-09-03 The Standard Oil Company High thermal conductivity metal matrix composite
AU644213B2 (en) 1990-09-26 1993-12-02 De Beers Industrial Diamond Division (Proprietary) Limited Composite diamond abrasive compact
CA2054050C (en) 1990-11-16 1998-07-07 Louis K. Bigelow Method and apparatus for making grit and abrasive media
AU647549B2 (en) 1990-11-26 1994-03-24 De Beers Industrial Diamond Division (Proprietary) Limited Cutting insert for a rotary cutting tool
US5197249A (en) 1991-02-07 1993-03-30 Wiand Ronald C Diamond tool with non-abrasive segments
US5070936A (en) 1991-02-15 1991-12-10 United States Of America As Represented By The Secretary Of The Air Force High intensity heat exchanger system
GB9104366D0 (en) 1991-03-01 1991-04-17 De Beers Ind Diamond Composite cutting insert
CA2065581C (en) 1991-04-22 2002-03-12 Andal Corp. Plasma enhancement apparatus and method for physical vapor deposition
US5178643A (en) * 1991-05-21 1993-01-12 Sunnen Products Company Process for plating super abrasive materials onto a honing tool
US5380390B1 (en) 1991-06-10 1996-10-01 Ultimate Abras Systems Inc Patterned abrasive material and method
AU647941B2 (en) 1991-07-12 1994-03-31 De Beers Industrial Diamond Division (Proprietary) Limited Diamond synthesis
US5614320A (en) 1991-07-17 1997-03-25 Beane; Alan F. Particles having engineered properties
JP2546558B2 (en) 1991-07-22 1996-10-23 住友電気工業株式会社 Diamond abrasive grain synthesis method
US5247765A (en) 1991-07-23 1993-09-28 Abrasive Technology Europe, S.A. Abrasive product comprising a plurality of discrete composite abrasive pellets in a resilient resin matrix
US5492774A (en) 1991-07-23 1996-02-20 Sony Corporation Perpendicular magnetic recording medium and process for production of the same
US5194071A (en) 1991-07-25 1993-03-16 General Electric Company Inc. Cubic boron nitride abrasive and process for preparing same
US5266236A (en) 1991-10-09 1993-11-30 General Electric Company Thermally stable dense electrically conductive diamond compacts
US5295402A (en) 1991-10-15 1994-03-22 General Electric Company Method for achieving high pressure using isotopically-pure diamond anvils
US5246884A (en) 1991-10-30 1993-09-21 International Business Machines Corporation Cvd diamond or diamond-like carbon for chemical-mechanical polish etch stop
US5437754A (en) 1992-01-13 1995-08-01 Minnesota Mining And Manufacturing Company Abrasive article having precise lateral spacing between abrasive composite members
US5176155A (en) 1992-03-03 1993-01-05 Rudolph Jr James M Method and device for filing nails
US5314513A (en) 1992-03-03 1994-05-24 Minnesota Mining And Manufacturing Company Abrasive product having a binder comprising a maleimide binder
JPH0639729A (en) 1992-05-29 1994-02-15 Canon Inc Precision grinding wheel and its manufacture
US5443032A (en) 1992-06-08 1995-08-22 Air Products And Chemicals, Inc. Method for the manufacture of large single crystals
US5243790A (en) 1992-06-25 1993-09-14 Abrasifs Vega, Inc. Abrasive member
US5264011A (en) 1992-09-08 1993-11-23 General Motors Corporation Abrasive blade tips for cast single crystal gas turbine blades
US5271547A (en) 1992-09-15 1993-12-21 Tunco Manufacturing, Inc. Method for brazing tungsten carbide particles and diamond crystals to a substrate and products made therefrom
US5985228A (en) 1992-12-22 1999-11-16 General Electric Company Method for controlling the particle size distribution in the production of multicrystalline cubic boron nitride
US6238454B1 (en) 1993-04-14 2001-05-29 Frank J. Polese Isotropic carbon/copper composites
GB9310500D0 (en) 1993-05-21 1993-07-07 De Beers Ind Diamond Cutting tool
US5674572A (en) 1993-05-21 1997-10-07 Trustees Of Boston University Enhanced adherence of diamond coatings employing pretreatment process
US5681612A (en) 1993-06-17 1997-10-28 Minnesota Mining And Manufacturing Company Coated abrasives and methods of preparation
EP0702615B1 (en) 1993-06-17 1997-10-22 Minnesota Mining And Manufacturing Company Patterned abrading articles and methods making and using same
US5382314A (en) 1993-08-31 1995-01-17 At&T Corp. Method of shaping a diamond body
WO1995006544A1 (en) 1993-09-01 1995-03-09 Speedfam Corporation Backing pad for machining operations
KR100269924B1 (en) 1993-10-08 2000-11-01 하지메 히토추야나기 A synthetic diamond and process for producing the same
US5453106A (en) 1993-10-27 1995-09-26 Roberts; Ellis E. Oriented particles in hard surfaces
US5542471A (en) 1993-11-16 1996-08-06 Loral Vought System Corporation Heat transfer element having the thermally conductive fibers
US5486131A (en) 1994-01-04 1996-01-23 Speedfam Corporation Device for conditioning polishing pads
US5454343A (en) 1994-01-18 1995-10-03 Korea Institute Of Science And Technology Method for production of diamond particles
US5547417A (en) 1994-03-21 1996-08-20 Intel Corporation Method and apparatus for conditioning a semiconductor polishing pad
ZA9410384B (en) 1994-04-08 1996-02-01 Ultimate Abrasive Syst Inc Method for making powder preform and abrasive articles made therefrom
US5518443A (en) 1994-05-13 1996-05-21 Norton Company Superabrasive tool
US6264882B1 (en) 1994-05-20 2001-07-24 The Regents Of The University Of California Process for fabricating composite material having high thermal conductivity
US6466446B1 (en) 1994-07-01 2002-10-15 Saint Gobain/Norton Industrial Ceramics Corporation Integrated circuit package with diamond heat sink
MY112145A (en) 1994-07-11 2001-04-30 Ibm Direct attachment of heat sink attached directly to flip chip using flexible epoxy
US5536202A (en) 1994-07-27 1996-07-16 Texas Instruments Incorporated Semiconductor substrate conditioning head having a plurality of geometries formed in a surface thereof for pad conditioning during chemical-mechanical polish
US5551959A (en) 1994-08-24 1996-09-03 Minnesota Mining And Manufacturing Company Abrasive article having a diamond-like coating layer and method for making same
US5492771A (en) * 1994-09-07 1996-02-20 Abrasive Technology, Inc. Method of making monolayer abrasive tools
AU687598B2 (en) 1994-09-30 1998-02-26 Minnesota Mining And Manufacturing Company Coated abrasive article, method for preparing the same, and method of using
DE69433791T2 (en) 1994-11-18 2005-06-09 National Institute Of Advanced Industrial Science And Technology Diamond sintered body, high-pressure phase boron nitride sintered body and method for producing these sintered bodies
JP3401107B2 (en) 1995-01-23 2003-04-28 松下電器産業株式会社 Package IC module
US5527424A (en) 1995-01-30 1996-06-18 Motorola, Inc. Preconditioner for a polishing pad and method for using the same
JPH08222669A (en) 1995-02-10 1996-08-30 Fuji Dies Kk Heat sink and production thereof
JPH08337498A (en) 1995-04-13 1996-12-24 Sumitomo Electric Ind Ltd Diamond granule, granule for diamond synthesis, compact and their production
US5801073A (en) 1995-05-25 1998-09-01 Charles Stark Draper Laboratory Net-shape ceramic processing for electronic devices and packages
US5816891A (en) 1995-06-06 1998-10-06 Advanced Micro Devices, Inc. Performing chemical mechanical polishing of oxides and metals using sequential removal on multiple polish platens to increase equipment throughput
US6478831B2 (en) 1995-06-07 2002-11-12 Ultimate Abrasive Systems, L.L.C. Abrasive surface and article and methods for making them
US5560754A (en) 1995-06-13 1996-10-01 General Electric Company Reduction of stresses in the polycrystalline abrasive layer of a composite compact with in situ bonded carbide/carbide support
US5609286A (en) 1995-08-28 1997-03-11 Anthon; Royce A. Brazing rod for depositing diamond coating metal substrate using gas or electric brazing techniques
DE19536463C2 (en) 1995-09-29 2002-02-07 Infineon Technologies Ag Method of manufacturing a plurality of laser diode devices
US5660894A (en) 1995-10-16 1997-08-26 National Science Council Process for depositing diamond by chemical vapor deposition
DE69629651T2 (en) 1995-12-21 2004-02-26 Element Six (Pty) Ltd. diamond synthesis
US5725421A (en) 1996-02-27 1998-03-10 Minnesota Mining And Manufacturing Company Apparatus for rotative abrading applications
JP3111892B2 (en) 1996-03-19 2000-11-27 ヤマハ株式会社 Polishing equipment
US5834337A (en) 1996-03-21 1998-11-10 Bryte Technologies, Inc. Integrated circuit heat transfer element and method
JPH106218A (en) 1996-06-27 1998-01-13 Minnesota Mining & Mfg Co <3M> Abrasive product for dressing
US5719441A (en) 1996-07-11 1998-02-17 Larimer; William R. Transistor package with integral heatsink
US6371838B1 (en) 1996-07-15 2002-04-16 Speedfam-Ipec Corporation Polishing pad conditioning device with cutting elements
US6284315B1 (en) 1996-07-29 2001-09-04 Aurburn University Method of polishing diamond films
US6544599B1 (en) 1996-07-31 2003-04-08 Univ Arkansas Process and apparatus for applying charged particles to a substrate, process for forming a layer on a substrate, products made therefrom
US5833519A (en) 1996-08-06 1998-11-10 Micron Technology, Inc. Method and apparatus for mechanical polishing
US5851138A (en) 1996-08-15 1998-12-22 Texas Instruments Incorporated Polishing pad conditioning system and method
US6206942B1 (en) 1997-01-09 2001-03-27 Minnesota Mining & Manufacturing Company Method for making abrasive grain using impregnation, and abrasive articles
US5779743A (en) 1996-09-18 1998-07-14 Minnesota Mining And Manufacturing Company Method for making abrasive grain and abrasive articles
KR100328108B1 (en) 1996-10-15 2002-03-09 아사무라 타카싯 Semiconductor substrate polishing pad dresser, method of manufacturing the same, and chemicomechanical polishing method using the same dresser
US6167948B1 (en) 1996-11-18 2001-01-02 Novel Concepts, Inc. Thin, planar heat spreader
US5976205A (en) 1996-12-02 1999-11-02 Norton Company Abrasive tool
US5746931A (en) 1996-12-05 1998-05-05 Lucent Technologies Inc. Method and apparatus for chemical-mechanical polishing of diamond
GB9626221D0 (en) 1996-12-18 1997-02-05 Smiths Industries Plc Diamond surfaces
US5916011A (en) 1996-12-26 1999-06-29 Motorola, Inc. Process for polishing a semiconductor device substrate
US5895972A (en) 1996-12-31 1999-04-20 Intel Corporation Method and apparatus for cooling the backside of a semiconductor device using an infrared transparent heat slug
JP3617232B2 (en) 1997-02-06 2005-02-02 住友電気工業株式会社 Semiconductor heat sink, method of manufacturing the same, and semiconductor package using the same
US5855314A (en) * 1997-03-07 1999-01-05 Norton Company Abrasive tool containing coated superabrasive grain
US7124753B2 (en) 1997-04-04 2006-10-24 Chien-Min Sung Brazed diamond tools and methods for making the same
TW394723B (en) 1997-04-04 2000-06-21 Sung Chien Min Abrasive tools with patterned grit distribution and method of manufacture
US7368013B2 (en) 1997-04-04 2008-05-06 Chien-Min Sung Superabrasive particle synthesis with controlled placement of crystalline seeds
US6039641A (en) 1997-04-04 2000-03-21 Sung; Chien-Min Brazed diamond tools by infiltration
US6884155B2 (en) * 1999-11-22 2005-04-26 Kinik Diamond grid CMP pad dresser
US7323049B2 (en) 1997-04-04 2008-01-29 Chien-Min Sung High pressure superabrasive particle synthesis
US7404857B2 (en) 1997-04-04 2008-07-29 Chien-Min Sung Superabrasive particle synthesis with controlled placement of crystalline seeds
US9868100B2 (en) 1997-04-04 2018-01-16 Chien-Min Sung Brazed diamond tools and methods for making the same
US6679243B2 (en) 1997-04-04 2004-01-20 Chien-Min Sung Brazed diamond tools and methods for making
US6286498B1 (en) 1997-04-04 2001-09-11 Chien-Min Sung Metal bond diamond tools that contain uniform or patterned distribution of diamond grits and method of manufacture thereof
US6368198B1 (en) 1999-11-22 2002-04-09 Kinik Company Diamond grid CMP pad dresser
DE69802517T2 (en) 1997-04-17 2002-05-23 De Beers Ind Diamond DIAMOND BREEDING
US5921855A (en) 1997-05-15 1999-07-13 Applied Materials, Inc. Polishing pad having a grooved pattern for use in a chemical mechanical polishing system
JP3244454B2 (en) 1997-06-05 2002-01-07 理化学研究所 Cutting and grinding dual use tool
US5961373A (en) 1997-06-16 1999-10-05 Motorola, Inc. Process for forming a semiconductor device
US5885137A (en) 1997-06-27 1999-03-23 Siemens Aktiengesellschaft Chemical mechanical polishing pad conditioner
US5921856A (en) 1997-07-10 1999-07-13 Sp3, Inc. CVD diamond coated substrate for polishing pad conditioning head and method for making same
US6054183A (en) 1997-07-10 2000-04-25 Zimmer; Jerry W. Method for making CVD diamond coated substrate for polishing pad conditioning head
US6024824A (en) 1997-07-17 2000-02-15 3M Innovative Properties Company Method of making articles in sheet form, particularly abrasive articles
US6093280A (en) 1997-08-18 2000-07-25 Lsi Logic Corporation Chemical-mechanical polishing pad conditioning systems
JP3893681B2 (en) 1997-08-19 2007-03-14 住友電気工業株式会社 Semiconductor heat sink and manufacturing method thereof
US5832360A (en) * 1997-08-28 1998-11-03 Norton Company Bond for abrasive tool
DE69808324T2 (en) 1997-09-05 2003-05-22 Frenton Ltd METHOD FOR PRODUCING A DIAMOND-SILICIUM-CARBIDE-SILICON COMPOSITE AND A COMPOSITE PRODUCED BY THIS METHOD
US6027659A (en) 1997-12-03 2000-02-22 Intel Corporation Polishing pad conditioning surface having integral conditioning points
US6196911B1 (en) 1997-12-04 2001-03-06 3M Innovative Properties Company Tools with abrasive segments
ATE220345T1 (en) 1997-12-11 2002-07-15 De Beers Ind Diamond CRYSTAL GROWTH
JP4623774B2 (en) 1998-01-16 2011-02-02 住友電気工業株式会社 Heat sink and manufacturing method thereof
US6335863B1 (en) 1998-01-16 2002-01-01 Sumitomo Electric Industries, Ltd. Package for semiconductors, and semiconductor module that employs the package
CA2261491C (en) 1998-03-06 2005-05-24 Smith International, Inc. Cutting element with improved polycrystalline material toughness and method for making same
US6001174A (en) 1998-03-11 1999-12-14 Richard J. Birch Method for growing a diamond crystal on a rheotaxy template
JP3295888B2 (en) 1998-04-22 2002-06-24 株式会社藤森技術研究所 Polishing dresser for polishing machine of chemical machine polisher
KR19990081117A (en) 1998-04-25 1999-11-15 윤종용 CMP Pad Conditioning Disc and Conditioner, Manufacturing Method, Regeneration Method and Cleaning Method of the Disc
US6077601A (en) 1998-05-01 2000-06-20 3M Innovative Properties Company Coated abrasive article
US6354918B1 (en) 1998-06-19 2002-03-12 Ebara Corporation Apparatus and method for polishing workpiece
US6258418B1 (en) 1998-06-24 2001-07-10 Ronald A. Rudder Method for producing diamond-tiled cooking utensils and other workpieces for durable stick-resistant surfaces
US6299508B1 (en) 1998-08-05 2001-10-09 3M Innovative Properties Company Abrasive article with integrally molded front surface protrusions containing a grinding aid and methods of making and using
US6280496B1 (en) 1998-09-14 2001-08-28 Sumitomo Electric Industries, Ltd. Silicon carbide based composite material and manufacturing method thereof
US6709747B1 (en) 1998-09-28 2004-03-23 Skeleton Technologies Ag Method of manufacturing a diamond composite and a composite produced by same
US6447852B1 (en) 1999-03-04 2002-09-10 Ambler Technologies, Inc. Method of manufacturing a diamond composite and a composite produced by same
US6346202B1 (en) 1999-03-25 2002-02-12 Beaver Creek Concepts Inc Finishing with partial organic boundary layer
CA2355171C (en) * 1998-12-15 2009-12-15 Parker-Hannifin Corporation Method of applying a phase change thermal interface material
EP1140413B1 (en) 1998-12-22 2004-08-18 Element Six (Pty) Ltd Cutting of ultra-hard materials
US6258237B1 (en) 1998-12-30 2001-07-10 Cerd, Ltd. Electrophoretic diamond coating and compositions for effecting same
US6309277B1 (en) 1999-03-03 2001-10-30 Advanced Micro Devices, Inc. System and method for achieving a desired semiconductor wafer surface profile via selective polishing pad conditioning
JP2000303126A (en) 1999-04-15 2000-10-31 Sumitomo Electric Ind Ltd Aluminum/diamond composite material and its manufacture
EP1044938A1 (en) 1999-04-16 2000-10-18 Misapor AG Flowable and curable castable masses, in particular lightweight concrete, element or building material, and method for obtaining structured surfaces thereon
GB2354470B (en) 1999-05-24 2004-02-04 Honda Motor Co Ltd Cutting tip and manufacturing method thereof
JP3387851B2 (en) 1999-05-28 2003-03-17 株式会社ノリタケスーパーアブレーシブ Grinding wheel and method of manufacturing the same
US6517221B1 (en) 1999-06-18 2003-02-11 Ciena Corporation Heat pipe heat sink for cooling a laser diode
US6319108B1 (en) 1999-07-09 2001-11-20 3M Innovative Properties Company Metal bond abrasive article comprising porous ceramic abrasive composites and method of using same to abrade a workpiece
US6755720B1 (en) 1999-07-15 2004-06-29 Noritake Co., Limited Vitrified bond tool and method of manufacturing the same
US6215661B1 (en) 1999-08-11 2001-04-10 Motorola, Inc. Heat spreader
US6281129B1 (en) 1999-09-20 2001-08-28 Agere Systems Guardian Corp. Corrosion-resistant polishing pad conditioner
US6627168B1 (en) 1999-10-01 2003-09-30 Showa Denko Kabushiki Kaisha Method for growing diamond and cubic boron nitride crystals
US6439986B1 (en) 1999-10-12 2002-08-27 Hunatech Co., Ltd. Conditioner for polishing pad and method for manufacturing the same
TW436375B (en) * 1999-11-16 2001-05-28 Asia Ic Mic Process Inc Formation method for dresser of chemical mechanical polishing pad
US6325709B1 (en) 1999-11-18 2001-12-04 Chartered Semiconductor Manufacturing Ltd Rounded surface for the pad conditioner using high temperature brazing
US7201645B2 (en) 1999-11-22 2007-04-10 Chien-Min Sung Contoured CMP pad dresser and associated methods
US6337513B1 (en) 1999-11-30 2002-01-08 International Business Machines Corporation Chip packaging system and method using deposited diamond film
US20020023733A1 (en) 1999-12-13 2002-02-28 Hall David R. High-pressure high-temperature polycrystalline diamond heat spreader
JP3527448B2 (en) 1999-12-20 2004-05-17 株式会社リード Dresser for CMP polishing cloth and its manufacturing method
US6293980B2 (en) 1999-12-20 2001-09-25 Norton Company Production of layered engineered abrasive surfaces
TW452956B (en) 2000-01-04 2001-09-01 Siliconware Precision Industries Co Ltd Heat dissipation structure of BGA semiconductor package
US6448642B1 (en) 2000-01-27 2002-09-10 William W. Bewley Pressure-bonded heat-sink system
US6517424B2 (en) * 2000-03-10 2003-02-11 Abrasive Technology, Inc. Protective coatings for CMP conditioning disk
US6534792B1 (en) 2000-05-18 2003-03-18 The Boeing Company Microelectronic device structure with metallic interlayer between substrate and die
US6749485B1 (en) 2000-05-27 2004-06-15 Rodel Holdings, Inc. Hydrolytically stable grooved polishing pads for chemical mechanical planarization
JP2001354492A (en) 2000-06-07 2001-12-25 Sumitomo Electric Ind Ltd Method and device for forming diamond film
CN1295368C (en) 2000-08-08 2007-01-17 六号元素(控股)公司 Method for producing an abrasive product containing diamond
US6407922B1 (en) 2000-09-29 2002-06-18 Intel Corporation Heat spreader, electronic package including the heat spreader, and methods of manufacturing the heat spreader
WO2002028598A1 (en) 2000-10-02 2002-04-11 Rodel Holdings, Inc. Method for conditioning polishing pads
US6390181B1 (en) 2000-10-04 2002-05-21 David R. Hall Densely finned tungsten carbide and polycrystalline diamond cooling module
US6551176B1 (en) 2000-10-05 2003-04-22 Applied Materials, Inc. Pad conditioning disk
EP1770142A3 (en) 2000-10-06 2008-05-07 3M Innovative Properties Company A method of making agglomerate abrasive grain
JP3957632B2 (en) 2000-10-12 2007-08-15 エレメント シックス （プロプライエタリイ）リミテッド Polycrystalline abrasive coarse particles
US7132309B2 (en) * 2003-04-22 2006-11-07 Chien-Min Sung Semiconductor-on-diamond devices and methods of forming
US20030207659A1 (en) 2000-11-03 2003-11-06 3M Innovative Properties Company Abrasive product and method of making and using the same
CN100344410C (en) 2000-11-07 2007-10-24 中国砂轮企业股份有限公司 Reparing and milling device for chemical-mechanical polishing soft pad and its producing method
JP4159353B2 (en) 2000-11-09 2008-10-01 エレメント シックス （プロプライエタリイ）リミテッド Manufacturing method of carbide abrasive particles
US8545583B2 (en) 2000-11-17 2013-10-01 Wayne O. Duescher Method of forming a flexible abrasive sheet article
RU2206502C2 (en) 2000-11-21 2003-06-20 Акционерное общество закрытого типа "Карбид" Composite material
US6482248B1 (en) 2000-11-28 2002-11-19 Magnum Research, Inc. Aluminum composite for gun barrels
US6653730B2 (en) 2000-12-14 2003-11-25 Intel Corporation Electronic assembly with high capacity thermal interface
WO2002049807A1 (en) 2000-12-21 2002-06-27 Nippon Steel Corporation Cmp conditioner, method for arranging rigid grains used for cmp conditioner, and method for manufacturing cmp conditioner
US6672943B2 (en) 2001-01-26 2004-01-06 Wafer Solutions, Inc. Eccentric abrasive wheel for wafer processing
US6541115B2 (en) 2001-02-26 2003-04-01 General Electric Company Metal-infiltrated polycrystalline diamond composite tool formed from coated diamond particles
US6409580B1 (en) 2001-03-26 2002-06-25 Speedfam-Ipec Corporation Rigid polishing pad conditioner for chemical mechanical polishing tool
US20020139680A1 (en) * 2001-04-03 2002-10-03 George Kosta Louis Method of fabricating a monolayer abrasive tool
US6538892B2 (en) 2001-05-02 2003-03-25 Graftech Inc. Radial finned heat sink
DE10139762A1 (en) 2001-08-13 2003-02-27 Hilti Ag grinding wheel
US6616725B2 (en) 2001-08-21 2003-09-09 Hyun Sam Cho Self-grown monopoly compact grit
US6692547B2 (en) * 2001-08-28 2004-02-17 Sun Abrasives Corporation Method for preparing abrasive articles
KR100442695B1 (en) 2001-09-10 2004-08-02 삼성전자주식회사 Method for manufacturing flip chip package devices with heat spreaders
KR100428947B1 (en) 2001-09-28 2004-04-29 이화다이아몬드공업 주식회사 Diamond Tool
US6394886B1 (en) 2001-10-10 2002-05-28 Taiwan Semiconductor Manufacturing Company, Ltd Conformal disk holder for CMP pad conditioner
EP2428590B1 (en) 2001-11-09 2018-08-15 Sumitomo Electric Industries, Ltd. Sintered diamond having high thermal conductivity and method for producing the same and heat sink employing it
US6758263B2 (en) 2001-12-13 2004-07-06 Advanced Energy Technology Inc. Heat dissipating component using high conducting inserts
US20030168731A1 (en) 2002-03-11 2003-09-11 Matayabas James Christopher Thermal interface material and method of fabricating the same
US6872127B2 (en) 2002-07-11 2005-03-29 Taiwan Semiconductor Manufacturing Co., Ltd Polishing pad conditioning disks for chemical mechanical polisher
US6899592B1 (en) 2002-07-12 2005-05-31 Ebara Corporation Polishing apparatus and dressing method for polishing tool
AU2003298561A1 (en) 2002-08-23 2004-05-13 Jonathan S. Dahm Method and apparatus for using light emitting diodes
JP4216025B2 (en) 2002-09-09 2009-01-28 株式会社リード Dresser for polishing cloth and dressing method for polishing cloth using the same
US6915796B2 (en) 2002-09-24 2005-07-12 Chien-Min Sung Superabrasive wire saw and associated methods of manufacture
US7173334B2 (en) * 2002-10-11 2007-02-06 Chien-Min Sung Diamond composite heat spreader and associated methods
KR20050084845A (en) 2002-10-11 2005-08-29 치엔 민 성 Carbonaceous heat spreader and associated methods
US20080019098A1 (en) 2002-10-11 2008-01-24 Chien-Min Sung Diamond composite heat spreader and associated methods
US20060113546A1 (en) 2002-10-11 2006-06-01 Chien-Min Sung Diamond composite heat spreaders having low thermal mismatch stress and associated methods
US20050189647A1 (en) 2002-10-11 2005-09-01 Chien-Min Sung Carbonaceous composite heat spreader and associated methods
JP2004146413A (en) 2002-10-22 2004-05-20 Sumitomo Electric Ind Ltd Package for housing semiconductor element and semiconductor device
TWI241939B (en) 2002-10-25 2005-10-21 Alex C Long Producing method and structure of cutting and polishing plate
JP2004142083A (en) 2002-10-28 2004-05-20 Elpida Memory Inc Wafer polishing device and wafer polishing method
US7067903B2 (en) 2002-11-07 2006-06-27 Kabushiki Kaisha Kobe Seiko Sho Heat spreader and semiconductor device and package using the same
JP2004175626A (en) 2002-11-28 2004-06-24 Sumitomo Electric Ind Ltd High thermal conductivity diamond sintered compact, heat sink for mounting semiconductor using the same, and its manufacturing method
JP2004200346A (en) 2002-12-18 2004-07-15 Sumitomo Electric Ind Ltd Package for accommodating semiconductor device, its manufacturing method, and semiconductor apparatus
US20040192178A1 (en) 2003-03-28 2004-09-30 Barak Yardeni Diamond conditioning of soft chemical mechanical planarization/polishing (CMP) polishing pads
US7367872B2 (en) 2003-04-08 2008-05-06 Applied Materials, Inc. Conditioner disk for use in chemical mechanical polishing
US7014093B2 (en) 2003-06-26 2006-03-21 Intel Corporation Multi-layer polymer-solder hybrid thermal interface material for integrated heat spreader and method of making same
US20050025973A1 (en) 2003-07-25 2005-02-03 Slutz David E. CVD diamond-coated composite substrate containing a carbide-forming material and ceramic phases and method for making same
US20050019114A1 (en) 2003-07-25 2005-01-27 Chien-Min Sung Nanodiamond PCD and methods of forming
US7160178B2 (en) 2003-08-07 2007-01-09 3M Innovative Properties Company In situ activation of a three-dimensional fixed abrasive article
KR200339181Y1 (en) 2003-09-13 2004-01-31 장성만 Diamond electrodeposited conditioner for CMP pad
US20050060941A1 (en) 2003-09-23 2005-03-24 3M Innovative Properties Company Abrasive article and methods of making the same
JP2005262341A (en) 2004-03-16 2005-09-29 Noritake Super Abrasive:Kk Cmp pad conditioner
US20050260939A1 (en) 2004-05-18 2005-11-24 Saint-Gobain Abrasives, Inc. Brazed diamond dressing tool
US6945857B1 (en) 2004-07-08 2005-09-20 Applied Materials, Inc. Polishing pad conditioner and methods of manufacture and recycling
US7384436B2 (en) 2004-08-24 2008-06-10 Chien-Min Sung Polycrystalline grits and associated methods
US7658666B2 (en) 2004-08-24 2010-02-09 Chien-Min Sung Superhard cutters and associated methods
US20060258276A1 (en) 2005-05-16 2006-11-16 Chien-Min Sung Superhard cutters and associated methods
US7762872B2 (en) 2004-08-24 2010-07-27 Chien-Min Sung Superhard cutters and associated methods
US7150677B2 (en) 2004-09-22 2006-12-19 Mitsubishi Materials Corporation CMP conditioner
US7066795B2 (en) 2004-10-12 2006-06-27 Applied Materials, Inc. Polishing pad conditioner with shaped abrasive patterns and channels
KR100636793B1 (en) 2004-12-13 2006-10-23 이화다이아몬드공업 주식회사 Conditioner for Chemical Mechanical Planarization Pad
US7169029B2 (en) 2004-12-16 2007-01-30 3M Innovative Properties Company Resilient structured sanding article
US7258708B2 (en) 2004-12-30 2007-08-21 Chien-Min Sung Chemical mechanical polishing pad dresser
TWI286097B (en) * 2004-12-31 2007-09-01 Kinik Co Polishing tool and method for making the same
US7413918B2 (en) 2005-01-11 2008-08-19 Semileds Corporation Method of making a light emitting diode
US20060185836A1 (en) 2005-02-24 2006-08-24 Scott Garner Thermally coupled surfaces having controlled minimum clearance
KR100693251B1 (en) 2005-03-07 2007-03-13 삼성전자주식회사 Pad conditioner for improving removal rate and roughness of polishing pad and chemical mechanical polishing apparatus using the same
US7595507B2 (en) 2005-04-13 2009-09-29 Group4 Labs Llc Semiconductor devices having gallium nitride epilayers on diamond substrates
US20060254154A1 (en) 2005-05-12 2006-11-16 Wei Huang Abrasive tool and method of making the same
US8622787B2 (en) 2006-11-16 2014-01-07 Chien-Min Sung CMP pad dressers with hybridized abrasive surface and related methods
US8393934B2 (en) 2006-11-16 2013-03-12 Chien-Min Sung CMP pad dressers with hybridized abrasive surface and related methods
US20110275288A1 (en) 2010-05-10 2011-11-10 Chien-Min Sung Cmp pad dressers with hybridized conditioning and related methods
US8398466B2 (en) 2006-11-16 2013-03-19 Chien-Min Sung CMP pad conditioners with mosaic abrasive segments and associated methods
TWI290337B (en) * 2005-08-09 2007-11-21 Princo Corp Pad conditioner for conditioning a CMP pad and method of making the same
US7300338B2 (en) 2005-09-22 2007-11-27 Abrasive Technology, Inc. CMP diamond conditioning disk
US8541876B2 (en) * 2005-09-30 2013-09-24 Intel Corporation Microelectronic package having direct contact heat spreader and method of manufacturing same
US7594845B2 (en) 2005-10-20 2009-09-29 3M Innovative Properties Company Abrasive article and method of modifying the surface of a workpiece
US20070128994A1 (en) 2005-12-02 2007-06-07 Chien-Min Sung Electroplated abrasive tools, methods, and molds
US7494404B2 (en) * 2006-02-17 2009-02-24 Chien-Min Sung Tools for polishing and associated methods
US20070232074A1 (en) * 2006-03-31 2007-10-04 Kramadhati Ravi Techniques for the synthesis of dense, high-quality diamond films using a dual seeding approach
US7771498B2 (en) * 2006-05-17 2010-08-10 Chien-Min Sung Superabrasive tools having improved caustic resistance
US7498191B2 (en) * 2006-05-22 2009-03-03 Chien-Min Sung Semiconductor-on-diamond devices and associated methods
US20080096479A1 (en) 2006-10-18 2008-04-24 Chien-Min Sung Low-melting point superabrasive tools and associated methods
US20080292869A1 (en) 2007-05-22 2008-11-27 Chien-Min Sung Methods of bonding superabrasive particles in an organic matrix
US20080296756A1 (en) * 2007-05-30 2008-12-04 Koch James L Heat spreader compositions and materials, integrated circuitry, methods of production and uses thereof
US7791188B2 (en) 2007-06-18 2010-09-07 Chien-Min Sung Heat spreader having single layer of diamond particles and associated methods
WO2009010762A1 (en) 2007-07-19 2009-01-22 Photonstar Led Limited Vertical led with conductive vias
US9011563B2 (en) 2007-12-06 2015-04-21 Chien-Min Sung Methods for orienting superabrasive particles on a surface and associated tools
US20100022174A1 (en) * 2008-07-28 2010-01-28 Kinik Company Grinding tool and method for fabricating the same
US20100104494A1 (en) 2008-10-24 2010-04-29 Meng Yu-Fei Enhanced Optical Properties of Chemical Vapor Deposited Single Crystal Diamond by Low-Pressure/High-Temperature Annealing
KR101501599B1 (en) 2008-10-27 2015-03-11 삼성전자주식회사 Method for removing carbonization catalyst from graphene sheet and method for transferring graphene sheet
US20100186479A1 (en) 2009-01-26 2010-07-29 Araca, Inc. Method for counting and characterizing aggressive diamonds in cmp diamond conditioner discs
US20100203811A1 (en) 2009-02-09 2010-08-12 Araca Incorporated Method and apparatus for accelerated wear testing of aggressive diamonds on diamond conditioning discs in cmp
US20100213175A1 (en) 2009-02-22 2010-08-26 General Electric Company Diamond etching method and articles produced thereby
US7892881B2 (en) 2009-02-23 2011-02-22 Raytheon Company Fabricating a device with a diamond layer
US20100212727A1 (en) 2009-02-26 2010-08-26 Ji Ung Lee Apparatus and methods for continuously growing carbon nanotubes and graphene sheets
US7851819B2 (en) 2009-02-26 2010-12-14 Bridgelux, Inc. Transparent heat spreader for LEDs
SG174351A1 (en) 2009-03-24 2011-10-28 Saint Gobain Abrasives Inc Abrasive tool for use as a chemical mechanical planarization pad conditioner
US20100261419A1 (en) 2009-04-10 2010-10-14 Chien-Min Sung Superabrasive Tool Having Surface Modified Superabrasive Particles and Associated Methods
US8531026B2 (en) 2010-09-21 2013-09-10 Ritedia Corporation Diamond particle mololayer heat spreaders and associated methods

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7198553B2 (en) * 1998-04-15 2007-04-03 3M Innovative Properties Company Corrosion resistant abrasive article and method of making
US20060073774A1 (en) * 2004-09-29 2006-04-06 Chien-Min Sung CMP pad dresser with oriented particles and associated methods
US7651386B2 (en) * 2005-09-09 2010-01-26 Chien-Min Sung Methods of bonding superabrasive particles in an organic matrix
US20080271384A1 (en) * 2006-09-22 2008-11-06 Saint-Gobain Ceramics & Plastics, Inc. Conditioning tools and techniques for chemical mechanical planarization

Also Published As

Publication number Publication date
CN103299418A (en) 2013-09-11
US20140235018A1 (en) 2014-08-21
TW201223704A (en) 2012-06-16
CN103221180A (en) 2013-07-24
US20120244790A1 (en) 2012-09-27
WO2012040374A2 (en) 2012-03-29
WO2012040373A3 (en) 2012-06-21
US8531026B2 (en) 2013-09-10
TW201220445A (en) 2012-05-16
US8777699B2 (en) 2014-07-15
US20150072601A1 (en) 2015-03-12
TWI451942B (en) 2014-09-11
WO2012040373A2 (en) 2012-03-29
TWI464839B (en) 2014-12-11
US20120241943A1 (en) 2012-09-27

Similar Documents

Publication Publication Date Title
WO2012040374A3 (en) Superabrasive tools having substantially leveled particle tips and associated methods
WO2012162430A3 (en) Cmp pad dresser having leveled tips and associated methods
WO2010141464A3 (en) Corrosion-resistant cmp conditioning tools and methods for making and using same
WO2011109188A3 (en) Bonded abrasive wheel
WO2014020068A8 (en) Abrasive particle with at most three surfaces and one corner
WO2011139562A3 (en) Ceramic shaped abrasive particles, methods of making the same, and abrasive articles containing the same
MY167541A (en) Polishing pad with multi-modal distribution of pore diameters
MX2018010142A (en) Depressed center grinding wheel.
WO2009088772A3 (en) Interface pad for use between an abrasive article and a support tool
EP2327088A4 (en) Structured abrasive article, method of making the same, and use in wafer planarization
TWI457206B (en) Superabrasive tool having surface modified superabrasive particles and associated methods
WO2013040125A3 (en) Cutting elements for earth-boring tools, earth-boring tools including such cutting elements and related methods
MX2021006803A (en) Abrasive particles having particular shapes and methods of forming such particles.
EP2601014A4 (en) Intersecting plate shaped abrasive particles
WO2010123744A3 (en) Cmp porous pad with particles in a polymeric matrix
WO2011016941A3 (en) Abrasive article with preconditioning and persistent indicators
WO2011020105A3 (en) Abrasive articles including abrasive particles bonded to an elongated body
EP2925489A4 (en) Smooth diamond surfaces and cmp method for forming
EP2611574A4 (en) Bonded abrasive articles, method of forming such articles, and grinding performance of such articles
EP2669045A4 (en) Fine abrasive particles and process for producing same
WO2011118960A3 (en) Method for preparing nano-particles
WO2012072786A3 (en) Chisel holder
AU2011257417B2 (en) Sanding pad lining carrier with recesses
WO2011159536A3 (en) A splicing technique for fixed abrasives used in chemical mechanical planarization
MX2012007501A (en) Abrasive article incorporating an infiltrated abrasive segment.

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 11827475

Country of ref document: EP

Kind code of ref document: A2

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 11827475

Country of ref document: EP

Kind code of ref document: A2