WO2012039658A1 - Led lamp - Google Patents

Led lamp Download PDF

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Publication number
WO2012039658A1
WO2012039658A1 PCT/SE2010/051022 SE2010051022W WO2012039658A1 WO 2012039658 A1 WO2012039658 A1 WO 2012039658A1 SE 2010051022 W SE2010051022 W SE 2010051022W WO 2012039658 A1 WO2012039658 A1 WO 2012039658A1
Authority
WO
WIPO (PCT)
Prior art keywords
led
lamp
light source
lamp fitting
fitting
Prior art date
Application number
PCT/SE2010/051022
Other languages
French (fr)
Inventor
Lars-Göran PERSSON
Hamid Yousefzadegan
Original Assignee
Enercomp Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Enercomp Ab filed Critical Enercomp Ab
Priority to PCT/SE2010/051022 priority Critical patent/WO2012039658A1/en
Publication of WO2012039658A1 publication Critical patent/WO2012039658A1/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S6/00—Lighting devices intended to be free-standing
    • F21S6/002—Table lamps, e.g. for ambient lighting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S6/00—Lighting devices intended to be free-standing
    • F21S6/005—Lighting devices intended to be free-standing with a lamp housing maintained at a distance from the floor or ground via a support, e.g. standing lamp for ambient lighting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00—Lighting devices intended for fixed installation
    • F21S8/02—Lighting devices intended for fixed installation of recess-mounted type, e.g. downlighters
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00—Lighting devices intended for fixed installation
    • F21S8/02—Lighting devices intended for fixed installation of recess-mounted type, e.g. downlighters
    • F21S8/022—Lighting devices intended for fixed installation of recess-mounted type, e.g. downlighters intended to be recessed in a floor or like ground surface, e.g. pavement or false floor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/0055—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by screwing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/04—Fastening of light sources or lamp holders with provision for changing light source, e.g. turret
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V27/00—Cable-stowing arrangements structurally associated with lighting devices, e.g. reels 
    • F21V27/02—Cable inlets
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/507—Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S6/00—Lighting devices intended to be free-standing
    • F21S6/002—Table lamps, e.g. for ambient lighting
    • F21S6/003—Table lamps, e.g. for ambient lighting for task lighting, e.g. for reading or desk work, e.g. angle poise lamps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to a LED lamp, comprising a lamp fitting and a light source comprising at least one LED, wherein said light source comprises a substrate intended to be fitted onto said lamp fitting.
  • LED:s Light Emitting Diodes
  • LED-technology is more and more used in desk- and floor lamps and applications for outdoor lighting and functional illuminations are on advance.
  • EP 2039982 Al discloses a LED lighting device for street light with a large quantity LED:s on a circuit board, a heat conductor plate, a reflection member and a transparent globe for housing said devices.
  • low power LED:s which are capable of illuminating an enlarged range and having a uniform luminance distribution as a result of a reflective layer and the reflection member.
  • a disadvantage with this design is that it is rather complex and therefore expensive, furthermore the whole light device must be dismantled in connection with maintenance/service, e.g. exchange of an LED-lamp, which leads to relatively high maintenance costs.
  • US 2006/0097385 Al discloses a mounting substrate for a semiconductor light emitting device, e.g. LED, that includes a solid metal block with cavities, on a first metal face, that are configured to mount semiconductor light emitting devices therein and to reflect light away from the cavity.
  • a second metal face includes a plurality of heat sink fins. Reflective coatings, conductive traces, insulating layers, pedestals, lenses etc. may also be provided in the package. This design is very complex and therefore relatively expensive.
  • LED:s are sensitive to the surrounding temperature and especially against heat. The light intensity and the lifetime is affected by the surrounding temperature. A too high temperature directly gives a big luminous flux loss and also reduces the lifetime.
  • Known LED design often suffer from disadvantages in this respect, and as a consequence it leads to a relatively limited use of LED-illuminating applications.
  • a kind of heat-dissipating paste between the lamp fitting and the LED substrate to safeguard appropriate heat dissipation from the LED:s to the housing for cooling purposes. This paste may stiffen and cause problems in connection with exchange of the LED substrate.
  • a novel illumination concept is provided that facilitates surprising cost- and energy savings, by means of a design that may provide efficient cooling, wherein the lamp fitting acts like an efficient heat sink which lowers the temperature around the LED leading to a longer lifetime.
  • the lamp fitting acts like an efficient heat sink which lowers the temperature around the LED leading to a longer lifetime.
  • the invention provides a cost-efficient design whereby a drastic increase in the use of LED illumination may be achieved, leading to a considerable environmentally positive impact.
  • the illumination source is easily exchangeable which is economically beneficial and environment-friendly since the lamp fitting can be reused.
  • conventional LED-lamps soldering is often used which may damage the LED and of course makes an exchange difficult or even impossible.
  • soldering may be avoided, thanks to the design concept.
  • the lamp fitting is made in one piece, which may provide cost advantages, and also advantages regarding heat conduction.
  • the substrate is made of ceramic which yields a good heat dissipation, e.g. by the materials providing good thermal conductivity, and ability to provide good heat conducting contact with the lamp fitting.
  • ceramics are well known to the skilled person within the field of micro electronics, e.g. chips, but their use is novel in connection with concepts according to the invention and provide surprising advantages.
  • the substrate is placed directly at the bottom of the lamp fitting leading to a direct contact and heat dissipation to cooling devices placed on the opposite surface of the bottom.
  • there are no cables in the lamp fitting and therefore the risk of electrical damages or possible injuries for installation personnel is dramatically reduced and of course the heat conduction becomes much better with the direct contact between the lamp fitting and the substrate.
  • Figure 1 shows a backside view of a lamp fitting according to a preferred embodiment of the invention
  • Figure 2 shows a side view of the lamp fitting in fig. 1,
  • Figure 3 shows a cross-section of a first side view of the lamp fitting, in figs 1 and 2,
  • Figure 4 shows a cross-section along IV-IV in fig. 3
  • Figure 5 shows a cross-section along V-V in fig. 4
  • Figure 6 shows a view from above of a LED-substrate, according to the invention
  • Figure 7 shows a cross-section along VI-VI in fig 6
  • Figure 8 shows a cross-section of an assembled inventive LED-lamp, i.e. comprising the lamp fitting and the LED-substrate
  • Figure 9 shows an alternative embodiment of a lamp fitting, according to the invention.
  • Figure 1 shows a lamp fitting 1 according to a preferred embodiment of the invention, seen from behind.
  • said lamp fitting 1 is made as one-piece metallic cast preferably made from Aluminium or an Aluminium alloy. This feature (one-piece) may enhance the thermal conduction, efficiently enabling the whole lamp fitting 1 to function as a cooler.
  • cooling devices in the form of fins 101 on a rear side 102' of a bottom 102 portion of a cup formed central part 108. Said cooling fins 101 are spaced apart and extend parallelly along said bottom 102. The cooling devices fins 101 improves the cooling ability which is of particular importance.
  • a circular flange 105 extends all around the cup formed part 108.
  • fixation devices 104 are equally spaced on the backside of said flange 105 primarily used for the fixation of the lamp fitting 1 in a wall or a ceiling so that it is properly arranged and orientated. Additionally the fixation devices 104 may act as coolers by heat absorption, too.
  • In the bottom 102' there are four screw holes 106 and a larger, e.g. rectangular through hole 107.
  • the whole lamp fitting 1 may preferably have an outer diameter D' in the interval 20- 300 mm, more preferably 50-150 mm, for most purposes.
  • Figure 2 shows a side view of the lamp fitting 1 in figure 1 , presenting a substantially planar flange 105 at the front side and said cooling fins 101, protruding out from the backside 102'.
  • the cup formed part 108 comprises a first annular substantially vertical (In case of positioning it with the flange 105/bottom 102 extending in a horizontal plane) wall 103' with an outer diameter D" and a height Z, and a second annular substantially vertical wall 103 with a slightly smaller diameter than D" but a larger height Y.
  • a cover not shown
  • a cover e.g. a glass
  • the second wall 103 bridges over into the horizontal bottom 102.
  • the number of cooling fins 101 is more than 8 and the thickness of the cooling fins 101 relatively small, preferably below or equal to 3 mm.
  • the shape of said cooling fins 101 may be formed like a peak, having the thickest part integrated with the rear side 102' and then converge down to a smaller thickness, e.g. of about 1 mm. This advantageously contributes to the cooling efficiency of the whole lamp fitting 1 due to the technical effect that the surface of the lamp fitting 1 is increased which directly increases the thermal radiation.
  • the cooling fins 101 may have a height X in the interval 3-30 mm, more preferably 6-12 mm.
  • the outer diameter D" may be in the range 20-200 mm, more preferably 40-120 mm and the height Z in the interval 2-10 mm, more preferably 4-6 mm.
  • the height Y may be between 10-30 mm, more preferably 15-19 mm.
  • fixation devices 104 Three of four of said fixation devices 104 are seen in the figure, wherein the one in the middle is seen from above, and has a height H as high as the whole lamp fitting 1, in the interval 20-60 mm, more preferably 30-40 mm. Said fixation devices 104 have a width w in the range 10-40 mm, more preferably 25-32 mm. At one end of the fixation device there is a slit 110 that enables an easy and quick "snap-in" function when installing the lamp fitting 1 in a wall or ceiling.
  • the flange 105 is preferably relatively thin and provides as much surface as possible due to the same reasons (improved cooling efficiency) as described above when discussing the cooling fins 101.
  • the thickness of the lamp flange 105 is equal to or less than 2 mm.
  • Figure 3 shows a cross-section of a first side view of said lamp fitting 1.
  • the lamp wall 103 should preferably be - as pointed out before - of roughly the same thickness t as the other parts, like the cooling fins 101 or the fixation devices 104.
  • the lamp wall 103 is configured very thin, preferably between 1 and 3 mm, most suitably 2 mm.
  • FIG 4 shows a cross-section along IV-IV in fig.3,
  • the fixation devices 104 may be the only parts of the lamp fitting 1 which interact with the attachment cavity (not shown), e.g. a wall or ceiling.
  • the installation of the lamp fitting 1 itself can be done in a very quick and efficient manner.
  • the cup formed part 108 has an inner planar bottom 100 with an inner diameter D that is roughly 4 x t smaller than D".
  • the bottom 100 has been machined to obtain a very good overall flatness, preferably below 3, to allow for good conductive contact as will be described more in detail below.
  • Figure 5 shows a cross-section along V-V in fig. 4 presenting a cross-section along a cooling fin 101.
  • Figure 6 shows a front view of a LED-light source 2.
  • Said LED-light source 2 comprises a substrate 200 preferably made of a heat conductive ceramics which may enable an improved thermal conduction.
  • the shown substrate 200 is a circular planar plate that serves as a foundation upon which an integrated circuit 201 is
  • a circuit 201 intended for e.g. four, six or eight LED:s 202 is printed directly onto the ceramic substrate 200, which makes the production process easy and reliable. Thereafter the LED chips 202 are
  • a female contact 3 is directly fixed to and connected to the circuit substrate 201 for the power supply of the LED:s 202, via contact devices 301 between said female contact 3 and said circuit 201.
  • Said female contact 3 is fixed to the substrate 200 and arranged to protrude below the bottom surface 207 of the substrate 200 and extend through the through hole 107 in the lamp fitting 1 when placed onto the bottom 100, thereby enabling easy connection of a male contact 204.
  • the LED-light source 2 has four through holes 206 arranged to match the screw holes 106, when the LED-light source 2 is placed at the bottom 100 of said lamp fitting 1, wherein the through holes 206 have substantially larger diameter than the screw holes 106 to avoid possibly damaging squeezing.
  • the substrate 200 has a diameter in the interval 30-100 mm, more preferably 50-70 mm. Hence, the substrate may be smaller than the bottom, but preferably it should cover at least 60% of the bottom area 100, to enable good heat dissipation.
  • Figure 7 shows a cross-sectional view along VI-VI in fig 6.
  • the LED-light substrate 200 has a thickness T that may vary between 0,5 and 3 mm, preferably about 1 mm.
  • the number of LED:s 202 may vary between one and 20, preferably 3 and 8 depending on the size of the substrate 200 and the needs of the customer. A LED-light source 2 with 3- 8 appropriate LED:s is quite sufficient for all normal needs.
  • Figure 8 shows a cross-section of a completely assembled inventive LED-lamp comprising the lamp fitting 1 and the LED-light source 2 connected to a power supply 204, 205.
  • the LED-light source 2 is placed at the bottom 100 of said lamp fitting 1.
  • a rear side 207 of the LED-substrate 2 has an almost 100% contact with said bottom 100 to enable the best possible thermal conduction, hence cooling efficiency of the LED lamp.
  • Said bottom 100 and said rear side 207 has a surface providing an overall flatness of 5 or less, preferably in the range 0,5-3.
  • the cooling fins 101 are extending in the opposite direction than the LED-light source 2 which improves the thermal conduction of the LED-light source 2 to said bottom 100 due to the fact that the plane bottom 100 and the plane LED-light source 2 provide a direct and large contacting surfaces providing good thermal conductivity.
  • the substrate 200 is preferably firmly pressed in contact with the bottom by means of screws (not shown) that act gently in relation to the ceramic substrate, to avoid damaging the relatively brittle ceramic.
  • the lamp fitting 1 may be fitted to a wall or ceiling merely by firstly plugging a male contact 204 into the female contact 3 in the LED-light source 2, to enable the LED-light source 2 to be directly connected to a power supply. Secondly, the fixation devices 104 are pushed into contact with the cavity (not shown), and it will be ready to use. When removing, it will be performed in an opposite sequence. After unplugging the male contact 204 the fitting 1 is free and the substrate 200 can be removed (e.g. for exchange) by removing the screws, preferably nylon screws (which are most suitable for the relatively high temperature and provide a gentle pressure on the ceramic material) are used to connect the LED-light source 2 to the lamp fitting 1.
  • This installation method enables for a quick, reliable and easy method to install and/or change parts of the LED lamp, either the lamp fitting 1 or the LED-light source 2.
  • the exchange of the LED- light source 2 for example when it is broken or damaged or the need for other kind or amount of LED lights is needed is much easier and can be performed without the need of replacement of the lamp fitting 1 itself.
  • the power is supplied via a cable 205 which is connected to the LED-light source 2 via a male contact 204 and female contact 3 (or vice versa).
  • a cable 205 which is connected to the LED-light source 2 via a male contact 204 and female contact 3 (or vice versa).
  • LED: s 202 instead of conventional lighting means is basically due to the fact that LED:s are more reliable, have a longer lifetime and especially need much less energy. Hence the same level of lumen can be reached with drastically lower level (e.g. about 15%) of the energy consumption compared to conventional lighting means.
  • LED:s 202 it is preferred to choose two circuits which form LED:s 202 in each that do not need more current than maximum 450 mA each, i.e. a total of 900 mA for eight LED's due to thermal conductivity and which have a good cooling capacity, preferably 1-10° / W, more preferably maximum 5-6 ° / W.
  • the LED:s also may preferably have a distribution angle of about 100-120°.
  • the power supply may be of standard type and if the supply does not provide appropriate voltage (for example 12 - 15 V) it might be needed that a power transformer/driver (not shown) is connected in between.
  • Said driver may comprise a circuit assembled by state of the art components to eliminate any need of a PVM-circuit or other relatively expensive parts.
  • the power is fed through cables 205 that are connected to said LED-lamp in appropriate manner like said male- 204 and female 3 snap in contact.
  • Figure 9 shows an alternative embodiment of a lamp fitting 1 according to the invention, presenting a flat mounting surface 100 of a base plate 102 provided with cooling fins 101 at the rear side 102'.
  • the embodiment may be used in other applications than that described above, e.g. as a lamp unit in larger more powerful illuminating devices, e.g. instead of ordinary large sized lamps for example that may replace luminescent-screen tube.
  • both the lamp fitting and the substrate may be made in other materials (e.g. copper) and the different parts may be attached to each other in other ways than those described above, still providing the same basic functionality.
  • the lamp fitting may have other shapes than described above e.g. pipe like or a plane body of varying outer contours.
  • the substrate may have other shapes e.g. strings, oval or rectangular etc.
  • Said ceramic substrate may by assembled on any body providing a similar cooling capacity as aluminum.
  • LED as illumination source is in no way limiting, but as readily understood other light emitting means may be combined with LED.
  • the attachment of the lamp fitting may be made in other ways than that described e.g. by recessed feathers.

Abstract

The present invention relates to a LED lamp, comprising a lamp fitting (1) and a light source (2) comprising at least one LED (202), wherein said light source (2) comprises a substrate (200) intended to be fitted onto said lamp fitting (1), wherein said lamp fitting (1) is arranged to provide effective cooling of the light source (2) by means of cooling devices (101) arranged at a rear side (102).

Description

LED LAMP
FIELD OF THE INVENTION
The present invention relates to a LED lamp, comprising a lamp fitting and a light source comprising at least one LED, wherein said light source comprises a substrate intended to be fitted onto said lamp fitting.
BACKGROUND INFORMATION
Illumination in most spaces, e.g. companies, warehouses, libraries, hospitals, hotels and even at homes often constitutes of lighting fittings with luminescent-screen tubes and light bulbs. These lamps require a relatively high energy input leading to considerable electrical expenses and from an environmental aspect the broken luminescent-screen tubes and bulbs become a burden, e.g. due to their bulkiness. Another problem with this traditional illumination is the exchange of broken lamps since they have a short lifetime, leading to unwanted costs and labour.
Nowadays there are alternative illuminating ways, for example LED:s (Light Emitting Diodes) that are small, emit light in an effective way and have a longer lifetime than ordinary bulbs/tubes. LED-technology is more and more used in desk- and floor lamps and applications for outdoor lighting and functional illuminations are on advance.
EP 2039982 Al discloses a LED lighting device for street light with a large quantity LED:s on a circuit board, a heat conductor plate, a reflection member and a transparent globe for housing said devices. There is used low power LED:s which are capable of illuminating an enlarged range and having a uniform luminance distribution as a result of a reflective layer and the reflection member. A disadvantage with this design is that it is rather complex and therefore expensive, furthermore the whole light device must be dismantled in connection with maintenance/service, e.g. exchange of an LED-lamp, which leads to relatively high maintenance costs.
US 2006/0097385 Al discloses a mounting substrate for a semiconductor light emitting device, e.g. LED, that includes a solid metal block with cavities, on a first metal face, that are configured to mount semiconductor light emitting devices therein and to reflect light away from the cavity. A second metal face includes a plurality of heat sink fins. Reflective coatings, conductive traces, insulating layers, pedestals, lenses etc. may also be provided in the package. This design is very complex and therefore relatively expensive.
LED:s are sensitive to the surrounding temperature and especially against heat. The light intensity and the lifetime is affected by the surrounding temperature. A too high temperature directly gives a big luminous flux loss and also reduces the lifetime. Known LED design often suffer from disadvantages in this respect, and as a consequence it leads to a relatively limited use of LED-illuminating applications. Furthermore, in many LED-applications there is used a kind of heat-dissipating paste between the lamp fitting and the LED substrate to safeguard appropriate heat dissipation from the LED:s to the housing for cooling purposes. This paste may stiffen and cause problems in connection with exchange of the LED substrate.
SUMMARY OF THE INVENTION
It is an object of the present invention to overcome or at least minimize at least some of the drawbacks and disadvantages of the above described lighting methods. This can be obtained by a LED lamp in accordance with claim 1.
Thanks to this invention a novel illumination concept is provided that facilitates surprising cost- and energy savings, by means of a design that may provide efficient cooling, wherein the lamp fitting acts like an efficient heat sink which lowers the temperature around the LED leading to a longer lifetime. Surprisingly good results have been obtained during tests and measuring the temperature around LED:s according to the invention, enabling keeping temperatures well below 60°C, at full power, and an ambient temperature of 22°C.
In the preferred mode the invention provides a cost-efficient design whereby a drastic increase in the use of LED illumination may be achieved, leading to a considerable environmentally positive impact.
According to one aspect of the invention the illumination source is easily exchangeable which is economically beneficial and environment-friendly since the lamp fitting can be reused. In conventional LED-lamps soldering is often used which may damage the LED and of course makes an exchange difficult or even impossible. According to the invention soldering may be avoided, thanks to the design concept. According to another aspect of the invention the lamp fitting is made in one piece, which may provide cost advantages, and also advantages regarding heat conduction.
According to yet another aspect of the invention the substrate is made of ceramic which yields a good heat dissipation, e.g. by the materials providing good thermal conductivity, and ability to provide good heat conducting contact with the lamp fitting. These kind of ceramics are well known to the skilled person within the field of micro electronics, e.g. chips, but their use is novel in connection with concepts according to the invention and provide surprising advantages.
According to still another aspect of the invention the substrate is placed directly at the bottom of the lamp fitting leading to a direct contact and heat dissipation to cooling devices placed on the opposite surface of the bottom. According to another aspect of the invention there are no cables in the lamp fitting, and therefore the risk of electrical damages or possible injuries for installation personnel is dramatically reduced and of course the heat conduction becomes much better with the direct contact between the lamp fitting and the substrate. BRIEF DESCRIPTION OF THE DRAWINGS
The invention will be described in more detail with reference to the enclosed figures, in which:
Figure 1 shows a backside view of a lamp fitting according to a preferred embodiment of the invention,
Figure 2 shows a side view of the lamp fitting in fig. 1,
Figure 3 shows a cross-section of a first side view of the lamp fitting, in figs 1 and 2,
Figure 4 shows a cross-section along IV-IV in fig. 3, Figure 5 shows a cross-section along V-V in fig. 4, Figure 6 shows a view from above of a LED-substrate, according to the invention, Figure 7 shows a cross-section along VI-VI in fig 6, Figure 8 shows a cross-section of an assembled inventive LED-lamp, i.e. comprising the lamp fitting and the LED-substrate, and Figure 9 shows an alternative embodiment of a lamp fitting, according to the invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
The following detailed description, and the examples contained therein, are provided for the purpose of describing and illustrating certain embodiments of the invention only and are not intended to limit the scope of the invention in any way.
Figure 1 shows a lamp fitting 1 according to a preferred embodiment of the invention, seen from behind. In a preferred embodiment said lamp fitting 1 is made as one-piece metallic cast preferably made from Aluminium or an Aluminium alloy. This feature (one-piece) may enhance the thermal conduction, efficiently enabling the whole lamp fitting 1 to function as a cooler.
Furthermore, as revealed in figure 1 there are cooling devices in the form of fins 101 on a rear side 102' of a bottom 102 portion of a cup formed central part 108. Said cooling fins 101 are spaced apart and extend parallelly along said bottom 102. The cooling devices fins 101 improves the cooling ability which is of particular importance. A circular flange 105 extends all around the cup formed part 108. Four fixation devices 104 are equally spaced on the backside of said flange 105 primarily used for the fixation of the lamp fitting 1 in a wall or a ceiling so that it is properly arranged and orientated. Additionally the fixation devices 104 may act as coolers by heat absorption, too. In the bottom 102' there are four screw holes 106 and a larger, e.g. rectangular through hole 107.
The whole lamp fitting 1 may preferably have an outer diameter D' in the interval 20- 300 mm, more preferably 50-150 mm, for most purposes.
Figure 2 shows a side view of the lamp fitting 1 in figure 1 , presenting a substantially planar flange 105 at the front side and said cooling fins 101, protruding out from the backside 102'. The cup formed part 108 comprises a first annular substantially vertical (In case of positioning it with the flange 105/bottom 102 extending in a horizontal plane) wall 103' with an outer diameter D" and a height Z, and a second annular substantially vertical wall 103 with a slightly smaller diameter than D" but a larger height Y. Between the two walls 103,103' there is a bridging edge 109 forming a support for a cover (not shown), e.g. a glass, that may be used to protect the inner of the cup 108. The second wall 103 bridges over into the horizontal bottom 102. In a preferred embodiment the number of cooling fins 101 is more than 8 and the thickness of the cooling fins 101 relatively small, preferably below or equal to 3 mm. Furthermore the shape of said cooling fins 101 may be formed like a peak, having the thickest part integrated with the rear side 102' and then converge down to a smaller thickness, e.g. of about 1 mm. This advantageously contributes to the cooling efficiency of the whole lamp fitting 1 due to the technical effect that the surface of the lamp fitting 1 is increased which directly increases the thermal radiation. The cooling fins 101 may have a height X in the interval 3-30 mm, more preferably 6-12 mm. The outer diameter D" may be in the range 20-200 mm, more preferably 40-120 mm and the height Z in the interval 2-10 mm, more preferably 4-6 mm. The height Y may be between 10-30 mm, more preferably 15-19 mm.
Three of four of said fixation devices 104 are seen in the figure, wherein the one in the middle is seen from above, and has a height H as high as the whole lamp fitting 1, in the interval 20-60 mm, more preferably 30-40 mm. Said fixation devices 104 have a width w in the range 10-40 mm, more preferably 25-32 mm. At one end of the fixation device there is a slit 110 that enables an easy and quick "snap-in" function when installing the lamp fitting 1 in a wall or ceiling.
The flange 105 is preferably relatively thin and provides as much surface as possible due to the same reasons (improved cooling efficiency) as described above when discussing the cooling fins 101. In a preferred embodiment the thickness of the lamp flange 105 is equal to or less than 2 mm.
Figure 3 shows a cross-section of a first side view of said lamp fitting 1. The lamp wall 103 should preferably be - as pointed out before - of roughly the same thickness t as the other parts, like the cooling fins 101 or the fixation devices 104. In a preferred embodiment the lamp wall 103 is configured very thin, preferably between 1 and 3 mm, most suitably 2 mm.
The very easy installation ability of an advantageous embodiment of the LED lamp is illustrated in figure 4. It shows a cross-section along IV-IV in fig.3, The fixation devices 104 may be the only parts of the lamp fitting 1 which interact with the attachment cavity (not shown), e.g. a wall or ceiling. Hence, the installation of the lamp fitting 1 itself can be done in a very quick and efficient manner. As shown the cup formed part 108 has an inner planar bottom 100 with an inner diameter D that is roughly 4 x t smaller than D". The bottom 100 has been machined to obtain a very good overall flatness, preferably below 3, to allow for good conductive contact as will be described more in detail below.
Figure 5 shows a cross-section along V-V in fig. 4 presenting a cross-section along a cooling fin 101. Figure 6 shows a front view of a LED-light source 2. Said LED-light source 2 comprises a substrate 200 preferably made of a heat conductive ceramics which may enable an improved thermal conduction. The shown substrate 200 is a circular planar plate that serves as a foundation upon which an integrated circuit 201 is
deposited/printed. This kind of ceramics has the advantage that it does not conduct electricity, but heat and also that it remains substantially form stable when heated, which is especially beneficial in combination with the fact that the substrate 200 may be obtained with a very accurate overall flatness, e.g. below 2 and even sometimes as good as 1 or better. In a preferred embodiment a circuit 201 intended for e.g. four, six or eight LED:s 202, is printed directly onto the ceramic substrate 200, which makes the production process easy and reliable. Thereafter the LED chips 202 are
ap lied/connected to the substrate 200, in a manner per se. Additionally, a female contact 3 is directly fixed to and connected to the circuit substrate 201 for the power supply of the LED:s 202, via contact devices 301 between said female contact 3 and said circuit 201. Said female contact 3 is fixed to the substrate 200 and arranged to protrude below the bottom surface 207 of the substrate 200 and extend through the through hole 107 in the lamp fitting 1 when placed onto the bottom 100, thereby enabling easy connection of a male contact 204. The LED-light source 2 has four through holes 206 arranged to match the screw holes 106, when the LED-light source 2 is placed at the bottom 100 of said lamp fitting 1, wherein the through holes 206 have substantially larger diameter than the screw holes 106 to avoid possibly damaging squeezing. The substrate 200 has a diameter in the interval 30-100 mm, more preferably 50-70 mm. Hence, the substrate may be smaller than the bottom, but preferably it should cover at least 60% of the bottom area 100, to enable good heat dissipation. Figure 7 shows a cross-sectional view along VI-VI in fig 6. The LED-light substrate 200 has a thickness T that may vary between 0,5 and 3 mm, preferably about 1 mm. The number of LED:s 202 may vary between one and 20, preferably 3 and 8 depending on the size of the substrate 200 and the needs of the customer. A LED-light source 2 with 3- 8 appropriate LED:s is quite sufficient for all normal needs.
Figure 8 shows a cross-section of a completely assembled inventive LED-lamp comprising the lamp fitting 1 and the LED-light source 2 connected to a power supply 204, 205. The LED-light source 2 is placed at the bottom 100 of said lamp fitting 1. In a preferred embodiment, a rear side 207 of the LED-substrate 2 has an almost 100% contact with said bottom 100 to enable the best possible thermal conduction, hence cooling efficiency of the LED lamp. Said bottom 100 and said rear side 207 has a surface providing an overall flatness of 5 or less, preferably in the range 0,5-3.
Advantageously, and rather contrary to the common art, the cooling fins 101 are extending in the opposite direction than the LED-light source 2 which improves the thermal conduction of the LED-light source 2 to said bottom 100 due to the fact that the plane bottom 100 and the plane LED-light source 2 provide a direct and large contacting surfaces providing good thermal conductivity. The substrate 200 is preferably firmly pressed in contact with the bottom by means of screws (not shown) that act gently in relation to the ceramic substrate, to avoid damaging the relatively brittle ceramic.
The lamp fitting 1 may be fitted to a wall or ceiling merely by firstly plugging a male contact 204 into the female contact 3 in the LED-light source 2, to enable the LED-light source 2 to be directly connected to a power supply. Secondly, the fixation devices 104 are pushed into contact with the cavity (not shown), and it will be ready to use. When removing, it will be performed in an opposite sequence. After unplugging the male contact 204 the fitting 1 is free and the substrate 200 can be removed (e.g. for exchange) by removing the screws, preferably nylon screws (which are most suitable for the relatively high temperature and provide a gentle pressure on the ceramic material) are used to connect the LED-light source 2 to the lamp fitting 1. This installation method enables for a quick, reliable and easy method to install and/or change parts of the LED lamp, either the lamp fitting 1 or the LED-light source 2. The exchange of the LED- light source 2 for example when it is broken or damaged or the need for other kind or amount of LED lights is needed is much easier and can be performed without the need of replacement of the lamp fitting 1 itself.
The power is supplied via a cable 205 which is connected to the LED-light source 2 via a male contact 204 and female contact 3 (or vice versa). No cables and in particular no wires are part of the lamp fitting 1 or the LED-light source 2, therefore the risk of electrical damages or possible injuries for installation personnel is dramatically reduced and of course the heat conduction becomes much better with the direct contact between the lamp fitting 1 and the LED-light source 2, without any in-between positioned wires.
The usage of LED: s 202 instead of conventional lighting means is basically due to the fact that LED:s are more reliable, have a longer lifetime and especially need much less energy. Hence the same level of lumen can be reached with drastically lower level (e.g. about 15%) of the energy consumption compared to conventional lighting means.
At the choice of LED:s 202 it is preferred to choose two circuits which form LED:s 202 in each that do not need more current than maximum 450 mA each, i.e. a total of 900 mA for eight LED's due to thermal conductivity and which have a good cooling capacity, preferably 1-10° / W, more preferably maximum 5-6 ° / W. The LED:s also may preferably have a distribution angle of about 100-120°.
The power supply may be of standard type and if the supply does not provide appropriate voltage (for example 12 - 15 V) it might be needed that a power transformer/driver (not shown) is connected in between. Said driver may comprise a circuit assembled by state of the art components to eliminate any need of a PVM-circuit or other relatively expensive parts. The power is fed through cables 205 that are connected to said LED-lamp in appropriate manner like said male- 204 and female 3 snap in contact.
Figure 9 shows an alternative embodiment of a lamp fitting 1 according to the invention, presenting a flat mounting surface 100 of a base plate 102 provided with cooling fins 101 at the rear side 102'. Hence the embodiment may be used in other applications than that described above, e.g. as a lamp unit in larger more powerful illuminating devices, e.g. instead of ordinary large sized lamps for example that may replace luminescent-screen tube.
As will be understood by those skilled in the present field of art, numerous changes and modifications may be made to the above described and other embodiments of the present invention, without departing from its scope as defined in the appending claims. For example both the lamp fitting and the substrate may be made in other materials (e.g. copper) and the different parts may be attached to each other in other ways than those described above, still providing the same basic functionality.
The lamp fitting may have other shapes than described above e.g. pipe like or a plane body of varying outer contours. Also the substrate may have other shapes e.g. strings, oval or rectangular etc.
Said ceramic substrate may by assembled on any body providing a similar cooling capacity as aluminum.
The use of LED:s as illumination source is in no way limiting, but as readily understood other light emitting means may be combined with LED.
The attachment of the lamp fitting may be made in other ways than that described e.g. by recessed feathers.
Of course there may exist details on/in the lamp fitting that does not interact to obtain cooling. Furthermore, to improve the thermal conduction it may be an advantage if the thickness of all parts is roughly the same. This fact may also be advantageous in the production stage of casting, wherein the same thickness helps to enhance the casting and especially the cooling of the cast. It is also realized that the preferred intervals in no way is limiting but may be changed depending on varying needs. There may exist different kinds of needs that implies that other intervals and other materials are more suitable than exemplified without going beyond the functional base principles of the invention.

Claims

1. LED lamp, comprising a lamp fitting (1) and a light source (2) comprising at least one LED (202), wherein said light source (2) comprises a substrate (200) intended to be fitted onto said lamp fitting (1), characterized in that the lamp fitting (1) is arranged to provide effective cooling of the light source (2) by means of cooling devices (101) arranged at a rear side (102'), of a bottom (102) of said substrate (200).
LED lamp, according to claim 1, characterized in that said lamp fitting (1) is cup shaped and that there is also arranged a cooling device (105) at the front side of said lamp fitting (1).
LED lamp, according to claim 2, characterized in that the lamp fitting (1) is arranged with a collar/flange (105) providing said front side device for cooling.
LED lamp, according to any of claims 1-3, characterized in that the lamp fitting (1) is made in one piece and that substantially the whole lamp fitting (1) acts like a heat sink.
LED lamp, according to any preceding claim, characterized in that said cooling device (101) at the rear side (102) is in the form of cooling fins (101) protruding from the bottom (102) of said lamp fitting (1).
LED lamp, according to any preceding claim, characterized in that the light source (2) comprises a prefabricated LED- light source (2) with a printed circuit (201) comprising said at least one LED (202).
LED lamp, according to any preceding claim, characterized in that said substrate (200) is made of ceramic material arranged to maintain its form when heated and also provide good heat dissipation.
LED lamp, according to claim 6 or 7, characterized in that said LED-light source (2) and said lamp fitting (1) is releasable attached to each other making the LED-light source (2) an exchangeable unit.
LED lamp, according to claim 8, characterized in that said LED-light source (2) and said lamp fitting (1) is releasable attached to each other preferably by at least one screw, of a kind arranged to limit the squeezing force between said lamp fitting (1), and said LED-light source (2).
10. LED lamp, according to any preceding claim, characterized in that the rear side (207) of said LED-light source (2) and the bottom (100) of said lamp fitting (1) have matching surfaces, preferably plane, to provide a direct heat dissipating contact between the substrate (200) and the bottom (100 ) of said lamp fitting (1) enabling a good thermal conduction.
11. LED lamp, according to any of claims 1-10, characterized in that said lamp fitting (1) is made of metal, preferably aluminum.
12. LED lamp, according to any of claims 1-11, characterized in that the bottom (102) is arranged with a through hole (107) for a contact device (3) enabling easy connection/disconnection of said LED-light source (2).
13. Method for exchange of LED-light source (2) in a lamp fitting (1) according to any of claims 1-12, characterized in the following steps:
Detach the existing LED-light source (2) from lamp fitting (1) and
Assembling a new LED-light source (2) to the lamp fitting (1).
PCT/SE2010/051022 2010-09-22 2010-09-22 Led lamp WO2012039658A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
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Application Number Priority Date Filing Date Title
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WO2014135820A1 (en) * 2013-03-06 2014-09-12 Aurora Limited Improved downlights
CN107127417A (en) * 2017-06-08 2017-09-05 东莞大市自动化科技有限公司 A kind of automatic bonding wire craft of T8 fluorescent tubes

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