WO2012006139A3 - Drying method for surface structure body - Google Patents

Drying method for surface structure body Download PDF

Info

Publication number
WO2012006139A3
WO2012006139A3 PCT/US2011/042300 US2011042300W WO2012006139A3 WO 2012006139 A3 WO2012006139 A3 WO 2012006139A3 US 2011042300 W US2011042300 W US 2011042300W WO 2012006139 A3 WO2012006139 A3 WO 2012006139A3
Authority
WO
WIPO (PCT)
Prior art keywords
liquid
surface structure
structure body
drying method
solidified
Prior art date
Application number
PCT/US2011/042300
Other languages
French (fr)
Other versions
WO2012006139A2 (en
Inventor
Masashi Norimoto
Original Assignee
3M Innovative Properties Company
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Company filed Critical 3M Innovative Properties Company
Publication of WO2012006139A2 publication Critical patent/WO2012006139A2/en
Publication of WO2012006139A3 publication Critical patent/WO2012006139A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00912—Treatments or methods for avoiding stiction of flexible or moving parts of MEMS
    • B81C1/0092—For avoiding stiction during the manufacturing process of the device, e.g. during wet etching
    • B81C1/00928—Eliminating or avoiding remaining moisture after the wet etch release of the movable structure

Abstract

To provide a drying method for a surface structure body in which a first liquid deposited onto the surface structure body is rapidly solidified and that makes possible concurrent drying of multiple surface structure bodies. The present invention provides a drying method for a surface structure body having a first liquid deposited thereon, including the steps of: placing a surface structure part of the surface structure body in a second liquid that is a liquid at a temperature, said temperature being lower than a solidification point of the first liquid; solidifying the first liquid in the second liquid; removing the second liquid from the surface structure part while the first liquid is in a solidified state; and sublimating the solidified first liquid.
PCT/US2011/042300 2010-07-05 2011-06-29 Drying method for surface structure body WO2012006139A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010-153070 2010-07-05
JP2010153070A JP5643007B2 (en) 2010-07-05 2010-07-05 Method for drying surface structure

Publications (2)

Publication Number Publication Date
WO2012006139A2 WO2012006139A2 (en) 2012-01-12
WO2012006139A3 true WO2012006139A3 (en) 2012-04-26

Family

ID=45441745

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2011/042300 WO2012006139A2 (en) 2010-07-05 2011-06-29 Drying method for surface structure body

Country Status (3)

Country Link
JP (1) JP5643007B2 (en)
TW (1) TW201206578A (en)
WO (1) WO2012006139A2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5859888B2 (en) * 2012-03-26 2016-02-16 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing apparatus and substrate processing method
JP6117711B2 (en) 2014-02-06 2017-04-19 信越化学工業株式会社 Semiconductor substrate cleaning and drying method
US10766054B2 (en) 2016-09-27 2020-09-08 SCREEN Holdings Co., Ltd. Substrate processing method and substrate processing apparatus
JP6966899B2 (en) * 2017-08-31 2021-11-17 株式会社Ｓｃｒｅｅｎホールディングス Substrate drying method and substrate processing equipment
JP7198618B2 (en) * 2018-09-21 2023-01-04 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing method and substrate processing apparatus

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5914294A (en) * 1996-04-23 1999-06-22 Applied Ceramics, Inc. Adsorptive monolith including activated carbon and method for making said monlith
JPH11354486A (en) * 1998-06-09 1999-12-24 Dainippon Screen Mfg Co Ltd Substrate processor and substrate processing method
KR20070041327A (en) * 2005-10-13 2007-04-18 황선숙 Method and apparatus for rapid freezing vacuum drying a semiconductor wafer
US7364983B2 (en) * 2005-05-04 2008-04-29 Avery Dennison Corporation Method and apparatus for creating RFID devices

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62169420A (en) * 1986-01-22 1987-07-25 Hitachi Tokyo Electron Co Ltd Method and apparatus for surface treatment
JPS63222433A (en) * 1987-03-11 1988-09-16 Mitsubishi Electric Corp Freeze vacuum drying method
EP0428983A3 (en) * 1989-11-13 1991-12-11 Applied Materials, Inc. Particle removal from surfaces by pressure change
JPH05267269A (en) * 1992-03-18 1993-10-15 Hitachi Ltd Method and apparatus for vacuum drying
JP5297959B2 (en) * 2009-09-18 2013-09-25 大日本スクリーン製造株式会社 Substrate drying method and substrate drying apparatus
JP5315189B2 (en) * 2009-09-28 2013-10-16 大日本スクリーン製造株式会社 Substrate processing apparatus and substrate processing method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5914294A (en) * 1996-04-23 1999-06-22 Applied Ceramics, Inc. Adsorptive monolith including activated carbon and method for making said monlith
JPH11354486A (en) * 1998-06-09 1999-12-24 Dainippon Screen Mfg Co Ltd Substrate processor and substrate processing method
US7364983B2 (en) * 2005-05-04 2008-04-29 Avery Dennison Corporation Method and apparatus for creating RFID devices
KR20070041327A (en) * 2005-10-13 2007-04-18 황선숙 Method and apparatus for rapid freezing vacuum drying a semiconductor wafer

Also Published As

Publication number Publication date
JP2012015450A (en) 2012-01-19
JP5643007B2 (en) 2014-12-17
TW201206578A (en) 2012-02-16
WO2012006139A2 (en) 2012-01-12

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