WO2011119729A3 - Airflow management for low particulate count in a process tool - Google Patents

Airflow management for low particulate count in a process tool Download PDF

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Publication number
WO2011119729A3
WO2011119729A3 PCT/US2011/029623 US2011029623W WO2011119729A3 WO 2011119729 A3 WO2011119729 A3 WO 2011119729A3 US 2011029623 W US2011029623 W US 2011029623W WO 2011119729 A3 WO2011119729 A3 WO 2011119729A3
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
housing
transfer section
substrate transfer
process area
Prior art date
Application number
PCT/US2011/029623
Other languages
French (fr)
Other versions
WO2011119729A2 (en
Inventor
Eric H. Lenz
Original Assignee
Lam Research Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corporation filed Critical Lam Research Corporation
Priority to JP2013501433A priority Critical patent/JP5734409B2/en
Priority to KR20127027648A priority patent/KR20130010903A/en
Priority to SG2012070306A priority patent/SG184199A1/en
Priority to CN201180025217.2A priority patent/CN102906855B/en
Publication of WO2011119729A2 publication Critical patent/WO2011119729A2/en
Publication of WO2011119729A3 publication Critical patent/WO2011119729A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D46/00—Filters or filtering processes specially modified for separating dispersed particles from gases or vapours
    • B01D46/42—Auxiliary equipment or operation thereof
    • B01D46/44—Auxiliary equipment or operation thereof controlling filtration
    • B01D46/446—Auxiliary equipment or operation thereof controlling filtration by pressure measuring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/0318—Processes
    • Y10T137/0396—Involving pressure control
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/8593—Systems
    • Y10T137/85978—With pump
    • Y10T137/85986—Pumped fluid control
    • Y10T137/86002—Fluid pressure responsive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/8593—Systems
    • Y10T137/86292—System with plural openings, one a gas vent or access opening
    • Y10T137/863—Access and outlet
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/8593—Systems
    • Y10T137/87169—Supply and exhaust

Abstract

In various exemplary embodiments described herein, a system and related method to provide airflow management system in a substrate production tool includes a housing to couple the substrate production tool to a fan filter unit to provide filtered air to the housing, a facility connection to couple the substrate production tool to a reduced pressure exhaust mechanism, a substrate transfer section coupled below the housing and in airflow communication with the facility connection, and a substrate process area coupled to the substrate transfer section by one or more substrate transfer slots. A chamber substantially containing the substrate transfer section and the substrate process area is coupled to the housing to receive the filtered air and to the facility connection to provide an exhaust for excess gas flow. The chamber maintains a low pressure in the substrate process area relative to the substrate transfer section.
PCT/US2011/029623 2010-03-24 2011-03-23 Airflow management for low particulate count in a process tool WO2011119729A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2013501433A JP5734409B2 (en) 2010-03-24 2011-03-23 Air flow management system and method for providing an air flow management system for particle number reduction in a processing tool
KR20127027648A KR20130010903A (en) 2010-03-24 2011-03-23 Airflow management for low particulate count in a process tool
SG2012070306A SG184199A1 (en) 2010-03-24 2011-03-23 Airflow management for low particulate count in a process tool
CN201180025217.2A CN102906855B (en) 2010-03-24 2011-03-23 For the treatment of the airflow management of granule number low in instrument

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/730,868 US8893642B2 (en) 2010-03-24 2010-03-24 Airflow management for low particulate count in a process tool
US12/730,868 2010-03-24

Publications (2)

Publication Number Publication Date
WO2011119729A2 WO2011119729A2 (en) 2011-09-29
WO2011119729A3 true WO2011119729A3 (en) 2012-01-19

Family

ID=44654981

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2011/029623 WO2011119729A2 (en) 2010-03-24 2011-03-23 Airflow management for low particulate count in a process tool

Country Status (7)

Country Link
US (2) US8893642B2 (en)
JP (1) JP5734409B2 (en)
KR (1) KR20130010903A (en)
CN (1) CN102906855B (en)
SG (1) SG184199A1 (en)
TW (1) TWI509724B (en)
WO (1) WO2011119729A2 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9117870B2 (en) * 2008-03-27 2015-08-25 Lam Research Corporation High throughput cleaner chamber
ES2487540T3 (en) * 2009-02-11 2014-08-21 Dow Agrosciences Llc Pesticide Compositions
US8562272B2 (en) * 2010-02-16 2013-10-22 Lam Research Corporation Substrate load and unload mechanisms for high throughput
US8893642B2 (en) 2010-03-24 2014-11-25 Lam Research Corporation Airflow management for low particulate count in a process tool
US8282698B2 (en) 2010-03-24 2012-10-09 Lam Research Corporation Reduction of particle contamination produced by moving mechanisms in a process tool
US9958424B2 (en) * 2012-10-01 2018-05-01 Taiwan Semiconductor Manufacturing Company, Ltd. Method of identifying airborne molecular contamination source
CN112892093B (en) * 2021-01-25 2022-05-10 广东钜宏科技股份有限公司 FFU device with uniform air volume

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4890780A (en) * 1984-11-22 1990-01-02 Hitachi, Ltd. Manufacturing apparatus
US20040144316A1 (en) * 2003-01-24 2004-07-29 Soo-Woong Lee Apparatus for processing a substrate
US20070224820A1 (en) * 2003-10-08 2007-09-27 Joung-Hyeon Lim Facility with Multi-Storied Process Chamber for Cleaning Substrates and Method for Cleaning Substrates Using the Facility
US20070295274A1 (en) * 2006-06-26 2007-12-27 Aaron Webb Batch Processing Platform For ALD and CVD

Family Cites Families (78)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5096364A (en) 1986-04-28 1992-03-17 Varian Associates, Inc. Wafer arm handler mechanism
FR2620049B2 (en) 1986-11-28 1989-11-24 Commissariat Energie Atomique PROCESS FOR PROCESSING, STORING AND / OR TRANSFERRING AN OBJECT INTO A HIGHLY CLEAN ATMOSPHERE, AND CONTAINER FOR CARRYING OUT SAID METHOD
JPH0237742A (en) 1988-07-28 1990-02-07 Nec Corp Semiconductor device manufacturing equipment
JP2706665B2 (en) 1990-01-18 1998-01-28 東京エレクトロン株式会社 Substrate transfer device and processing device
US5843233A (en) 1990-07-16 1998-12-01 Novellus Systems, Inc. Exclusion guard and gas-based substrate protection for chemical vapor deposition apparatus
US5133284A (en) 1990-07-16 1992-07-28 National Semiconductor Corp. Gas-based backside protection during substrate processing
JPH0531472A (en) * 1990-11-17 1993-02-09 Tokyo Electron Ltd Washing device
EP0496006A1 (en) 1991-01-19 1992-07-29 International Business Machines Corporation Wafer transfer apparatus
JPH04290454A (en) 1991-03-19 1992-10-15 Fujitsu Ltd Transfer robot between vacuum chambers
JP3309416B2 (en) 1992-02-13 2002-07-29 松下電器産業株式会社 Connected clean space device
US5229615A (en) 1992-03-05 1993-07-20 Eaton Corporation End station for a parallel beam ion implanter
US5295777A (en) 1992-12-23 1994-03-22 Materials Research Corporation Wafer transport module with rotatable and horizontally extendable wafer holder
KR0179405B1 (en) 1993-04-12 1999-04-15 마스다 쇼오이치로오 Load storing equipment with cleaning device
DE4340522A1 (en) 1993-11-29 1995-06-01 Leybold Ag Device and method for the gradual and automatic loading and unloading of a coating system
US5979475A (en) 1994-04-28 1999-11-09 Hitachi, Ltd. Specimen holding method and fluid treatment method of specimen surface and systems therefor
US5765444A (en) 1995-07-10 1998-06-16 Kensington Laboratories, Inc. Dual end effector, multiple link robot arm system with corner reacharound and extended reach capabilities
US6102164A (en) * 1996-02-28 2000-08-15 Applied Materials, Inc. Multiple independent robot assembly and apparatus for processing and transferring semiconductor wafers
WO1997035690A1 (en) 1996-03-22 1997-10-02 Komatsu Ltd. Robot for handling
JP3218425B2 (en) 1996-03-25 2001-10-15 東京エレクトロン株式会社 Processing method and processing apparatus
US6082950A (en) 1996-11-18 2000-07-04 Applied Materials, Inc. Front end wafer staging with wafer cassette turntables and on-the-fly wafer center finding
JP3437734B2 (en) * 1997-02-26 2003-08-18 富士通株式会社 manufacturing device
US5951770A (en) 1997-06-04 1999-09-14 Applied Materials, Inc. Carousel wafer transfer system
KR20010023014A (en) 1997-08-28 2001-03-26 씨브이씨 프로덕츠 인코포레이티드 Wafer handler for multi-station tool
US6155768A (en) 1998-01-30 2000-12-05 Kensington Laboratories, Inc. Multiple link robot arm system implemented with offset end effectors to provide extended reach and enhanced throughput
US6050891A (en) 1998-02-06 2000-04-18 Applied Materials, Inc. Vacuum processing system with turbo-axial fan in clean-air supply system of front end environment
JP4404481B2 (en) 1998-02-18 2010-01-27 アプライド マテリアルズ インコーポレイテッド Vacuum processing system, wafer handler and end effector
JP2000021947A (en) 1998-06-30 2000-01-21 Sony Corp Dry type processor
US6158951A (en) 1998-07-10 2000-12-12 Asm America, Inc. Wafer carrier and method for handling of wafers with minimal contact
JP3212951B2 (en) 1998-10-22 2001-09-25 兼房株式会社 Split cutting tip saw
US6328872B1 (en) 1999-04-03 2001-12-11 Nutool, Inc. Method and apparatus for plating and polishing a semiconductor substrate
JP2000174091A (en) * 1998-12-01 2000-06-23 Fujitsu Ltd Carrying device and manufacturing device
AU2041000A (en) 1998-12-02 2000-06-19 Kensington Laboratories, Inc. Specimen holding robotic arm end effector
US6485250B2 (en) 1998-12-30 2002-11-26 Brooks Automation Inc. Substrate transport apparatus with multiple arms on a common axis of rotation
US6368183B1 (en) 1999-02-03 2002-04-09 Speedfam-Ipec Corporation Wafer cleaning apparatus and associated wafer processing methods
US6882416B1 (en) 1999-09-07 2005-04-19 Applied Materials, Inc. Methods for continuous embedded process monitoring and optical inspection of substrates using specular signature analysis
US6558509B2 (en) 1999-11-30 2003-05-06 Applied Materials, Inc. Dual wafer load lock
US6429139B1 (en) * 1999-12-17 2002-08-06 Eaton Corporation Serial wafer handling mechanism
NL1015397C2 (en) 2000-06-07 2001-12-10 Asm Int Device for treating a wafer.
US20020061248A1 (en) * 2000-07-07 2002-05-23 Applied Materials, Inc. High productivity semiconductor wafer processing system
US20020075478A1 (en) 2000-12-18 2002-06-20 Applied Materials, Inc. Inspection device having wafer exchange stage
KR100433067B1 (en) 2001-01-22 2004-05-27 주식회사 라셈텍 Semiconducter manufacturing apparatus
JP4683453B2 (en) 2001-04-27 2011-05-18 芝浦メカトロニクス株式会社 Vacuum processing equipment
US6663333B2 (en) * 2001-07-13 2003-12-16 Axcelis Technologies, Inc. Wafer transport apparatus
JP4821074B2 (en) 2001-08-31 2011-11-24 東京エレクトロン株式会社 Processing system
US6666928B2 (en) 2001-09-13 2003-12-23 Micell Technologies, Inc. Methods and apparatus for holding a substrate in a pressure chamber
JP2003229466A (en) 2002-02-04 2003-08-15 Seiko Instruments Inc Vacuum processor
US20030202865A1 (en) 2002-04-25 2003-10-30 Applied Materials, Inc. Substrate transfer apparatus
TWI282139B (en) 2002-07-01 2007-06-01 Advanced Display Kabushiki Kai Carrying vehicle, manufacturing apparatus, and carrying system
JP2004193418A (en) 2002-12-12 2004-07-08 Seiko Epson Corp Manufacturing method for semiconductor device
JP2004200329A (en) 2002-12-17 2004-07-15 Tokyo Electron Ltd Substrate processing apparatus and method therefor
JP4468021B2 (en) 2003-03-25 2010-05-26 キヤノン株式会社 Load lock system, exposure processing system, and device manufacturing method
JP4290454B2 (en) 2003-03-28 2009-07-08 三井化学株式会社 Method for producing gas diffusion electrode, electrolytic cell and electrolysis method
JP3680083B2 (en) 2003-09-26 2005-08-10 バンドー化学株式会社 Transmission belt pulley and belt transmission device
JP2005131772A (en) * 2003-10-31 2005-05-26 Ebara Corp Polishing device
US20080003171A1 (en) 2004-04-20 2008-01-03 Smith William L Microbial Control Using Hypochlorous Acid Vapor
WO2005121027A2 (en) 2004-06-04 2005-12-22 Durr Ecoclean, Inc. An integrated machining module for processing workpieces and a method of assembling the same
JP2006028577A (en) 2004-07-15 2006-02-02 Canon Anelva Corp Cvd system
KR20060066415A (en) * 2004-12-13 2006-06-16 삼성전자주식회사 Apparatus for transferring a substrate
KR100782380B1 (en) 2005-01-24 2007-12-07 삼성전자주식회사 Device for making semiconductor
KR101279819B1 (en) 2005-04-12 2013-06-28 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스 인코포레이티드 Radial-biased polishing pad
CN100362620C (en) * 2005-08-11 2008-01-16 中微半导体设备(上海)有限公司 Loading umloading device of semiconductor processing piece and its loading and unloading method
US20070218197A1 (en) 2006-03-15 2007-09-20 Yoichi Kurono Vacuum processing system and method of making
KR100814238B1 (en) 2006-05-03 2008-03-17 위순임 Substrate transfer equipment and substrate processing system using the same
TWI476855B (en) 2006-05-03 2015-03-11 Gen Co Ltd Substrate transferring apparatus and high speed substrate processing system using the same
KR100818044B1 (en) 2006-05-04 2008-03-31 위순임 Substrate pedestal and substrate transfer equipment and substrate processing system and method using the same
US8113757B2 (en) 2006-08-01 2012-02-14 Tokyo Electron Limited Intermediate transfer chamber, substrate processing system, and exhaust method for the intermediate transfer chamber
US20080175694A1 (en) * 2007-01-19 2008-07-24 Dong-Seok Park Unit and method for transferring substrates and apparatus and method for treating substrates with the unit
KR100803559B1 (en) 2007-05-02 2008-02-15 피에스케이 주식회사 A unit and method for transferring substrates, and an apparatus and method for treating substrates with the unit
WO2008140728A2 (en) 2007-05-08 2008-11-20 Brooks Automation, Inc. Substrate transport apparatus with multiple movable arms utilizing a mechanical switch mechanism
US7644757B2 (en) 2007-07-02 2010-01-12 Stinger Wellhand Protection, Inc. Fixed-point packoff element with primary seal test capability
KR20190077134A (en) 2007-07-17 2019-07-02 브룩스 오토메이션 인코퍼레이티드 A substrate transport apparatus
JP4359640B2 (en) 2007-09-25 2009-11-04 東京エレクトロン株式会社 Substrate transfer apparatus and downflow control method
JP4251580B1 (en) * 2008-01-08 2009-04-08 Ｔｄｋ株式会社 Containment transport system
US9117870B2 (en) 2008-03-27 2015-08-25 Lam Research Corporation High throughput cleaner chamber
WO2011022870A1 (en) 2009-08-24 2011-03-03 Wang Lvsha Ballast control apparatus and ballast apparatus configured for high intensity gas discharge lamp
US8562272B2 (en) * 2010-02-16 2013-10-22 Lam Research Corporation Substrate load and unload mechanisms for high throughput
US8893642B2 (en) 2010-03-24 2014-11-25 Lam Research Corporation Airflow management for low particulate count in a process tool
US8282698B2 (en) 2010-03-24 2012-10-09 Lam Research Corporation Reduction of particle contamination produced by moving mechanisms in a process tool

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4890780A (en) * 1984-11-22 1990-01-02 Hitachi, Ltd. Manufacturing apparatus
US20040144316A1 (en) * 2003-01-24 2004-07-29 Soo-Woong Lee Apparatus for processing a substrate
US20070224820A1 (en) * 2003-10-08 2007-09-27 Joung-Hyeon Lim Facility with Multi-Storied Process Chamber for Cleaning Substrates and Method for Cleaning Substrates Using the Facility
US20070295274A1 (en) * 2006-06-26 2007-12-27 Aaron Webb Batch Processing Platform For ALD and CVD

Also Published As

Publication number Publication date
WO2011119729A2 (en) 2011-09-29
KR20130010903A (en) 2013-01-29
US20150040757A1 (en) 2015-02-12
US8893642B2 (en) 2014-11-25
CN102906855B (en) 2015-09-02
CN102906855A (en) 2013-01-30
US20110232771A1 (en) 2011-09-29
US9321000B2 (en) 2016-04-26
TWI509724B (en) 2015-11-21
JP5734409B2 (en) 2015-06-17
TW201207981A (en) 2012-02-16
SG184199A1 (en) 2012-10-30
JP2013526009A (en) 2013-06-20

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