WO2011087215A3 - Probe card - Google Patents

Probe card Download PDF

Info

Publication number
WO2011087215A3
WO2011087215A3 PCT/KR2010/009143 KR2010009143W WO2011087215A3 WO 2011087215 A3 WO2011087215 A3 WO 2011087215A3 KR 2010009143 W KR2010009143 W KR 2010009143W WO 2011087215 A3 WO2011087215 A3 WO 2011087215A3
Authority
WO
WIPO (PCT)
Prior art keywords
interface blocks
wires
lower parts
substrate pieces
boards
Prior art date
Application number
PCT/KR2010/009143
Other languages
French (fr)
Korean (ko)
Other versions
WO2011087215A2 (en
Inventor
김형익
이호준
Original Assignee
주식회사 미코티엔
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 미코티엔 filed Critical 주식회사 미코티엔
Publication of WO2011087215A2 publication Critical patent/WO2011087215A2/en
Publication of WO2011087215A3 publication Critical patent/WO2011087215A3/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0491—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets for testing integrated circuits on wafers, e.g. wafer-level test cartridge
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2853—Electrical testing of internal connections or -isolation, e.g. latch-up or chip-to-lead connections
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester

Abstract

A probe card comprises probe structures, substrate pieces, interface blocks, supporting boards, and circuit boards. The probe structures have probes that transmit and receive electric signals to and from a chip pad of an inspection target through physical contact. The substrate pieces are respectively arranged in the lower parts of the probe structures, are electrically connected with the probes, and are equipped with wires having different intervals on upper and lower surfaces. The interface blocks are respectively arranged in the lower parts of the substrate pieces, are respectively connected with the wires, and are equipped with connection members having the same intervals on upper and lower surfaces. The supporting boards have holes through which the interface blocks are inserted in order to be detachably attached thereto, respectively, and support the interface blocks. The circuit boards are arranged in the lower parts of the supporting boards, and are equipped with wires electrically connected with the connection members of the interface blocks, respectively.
PCT/KR2010/009143 2010-01-13 2010-12-21 Probe card WO2011087215A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020100003060A KR101674135B1 (en) 2010-01-13 2010-01-13 Probe card
KR10-2010-0003060 2010-01-13

Publications (2)

Publication Number Publication Date
WO2011087215A2 WO2011087215A2 (en) 2011-07-21
WO2011087215A3 true WO2011087215A3 (en) 2011-11-10

Family

ID=44304760

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2010/009143 WO2011087215A2 (en) 2010-01-13 2010-12-21 Probe card

Country Status (2)

Country Link
KR (1) KR101674135B1 (en)
WO (1) WO2011087215A2 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101229233B1 (en) * 2011-08-17 2013-02-04 (주)기가레인 Probe card
KR101280419B1 (en) * 2011-08-17 2013-06-28 (주)기가레인 probe card
EP3114488B1 (en) * 2014-03-06 2018-08-01 Technoprobe S.p.A High-planarity probe card for a testing apparatus for electronic devices
KR101785428B1 (en) 2016-04-21 2017-10-16 (주) 마이크로프랜드 Test Socket of Semiconductor Device
IT201600079679A1 (en) * 2016-07-28 2018-01-28 Technoprobe Spa Measurement board for electronic devices
IT201700017061A1 (en) * 2017-02-15 2018-08-15 Technoprobe Spa Improved measurement card for high frequency applications
CN107272046B (en) * 2017-06-09 2023-10-03 东莞中子科学中心 Detector for measuring beam profile
KR102139584B1 (en) * 2019-03-07 2020-07-30 (주)티에스이 Socket for testing semiconductor device
KR102342805B1 (en) * 2019-12-26 2021-12-23 (주)포인트엔지니어링 Probe card
KR102361396B1 (en) * 2020-04-22 2022-02-10 (주)포인트엔지니어링 Anodic oxide structure and probe card comprising thereof
KR102388030B1 (en) * 2020-07-15 2022-04-20 (주)엠투엔 Probe pin, method for manufaturing the same and probe card including the same
KR102520860B1 (en) * 2022-11-08 2023-04-12 주식회사 유니밴스 Thermal Deformation Improvement Stiffner Probe Card

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5828226A (en) * 1996-11-06 1998-10-27 Cerprobe Corporation Probe card assembly for high density integrated circuits
US20040113640A1 (en) * 2002-12-16 2004-06-17 Cooper Timothy E. Apparatus and method for limiting over travel in a probe card assembly
US20050035775A1 (en) * 2003-08-13 2005-02-17 Yu Zhou Probe contact system using flexible printed circuit board
US20070152689A1 (en) * 2006-01-03 2007-07-05 Chipmos Technologies (Bermuda) Ltd. Modular probe card
KR20080075978A (en) * 2007-02-14 2008-08-20 (주) 미코티엔 Probe structure and probe card having the same
KR20090080210A (en) * 2008-01-21 2009-07-24 (주) 미코티엔 Probe structure and electric tester having a probe structure
KR20090096582A (en) * 2009-04-22 2009-09-11 주식회사 엠아이티 Advanced Probe cards and method of constitution the Probe head assembly thereof

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5828226A (en) * 1996-11-06 1998-10-27 Cerprobe Corporation Probe card assembly for high density integrated circuits
US20040113640A1 (en) * 2002-12-16 2004-06-17 Cooper Timothy E. Apparatus and method for limiting over travel in a probe card assembly
US20050035775A1 (en) * 2003-08-13 2005-02-17 Yu Zhou Probe contact system using flexible printed circuit board
US20070152689A1 (en) * 2006-01-03 2007-07-05 Chipmos Technologies (Bermuda) Ltd. Modular probe card
KR20080075978A (en) * 2007-02-14 2008-08-20 (주) 미코티엔 Probe structure and probe card having the same
KR20090080210A (en) * 2008-01-21 2009-07-24 (주) 미코티엔 Probe structure and electric tester having a probe structure
KR20090096582A (en) * 2009-04-22 2009-09-11 주식회사 엠아이티 Advanced Probe cards and method of constitution the Probe head assembly thereof

Also Published As

Publication number Publication date
KR101674135B1 (en) 2016-11-09
WO2011087215A2 (en) 2011-07-21
KR20110083053A (en) 2011-07-20

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