WO2011046986A3 - Method and apparatus for forming mems device - Google Patents

Method and apparatus for forming mems device Download PDF

Info

Publication number
WO2011046986A3
WO2011046986A3 PCT/US2010/052403 US2010052403W WO2011046986A3 WO 2011046986 A3 WO2011046986 A3 WO 2011046986A3 US 2010052403 W US2010052403 W US 2010052403W WO 2011046986 A3 WO2011046986 A3 WO 2011046986A3
Authority
WO
WIPO (PCT)
Prior art keywords
cavity
texture
height
deformable mirror
ito layer
Prior art date
Application number
PCT/US2010/052403
Other languages
French (fr)
Other versions
WO2011046986A2 (en
Inventor
Vladimir Bulovic
Corinne E. Packard
Vanessa C. Wood
Original Assignee
Massachusetts Institute Of Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Massachusetts Institute Of Technology filed Critical Massachusetts Institute Of Technology
Publication of WO2011046986A2 publication Critical patent/WO2011046986A2/en
Publication of WO2011046986A3 publication Critical patent/WO2011046986A3/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/14—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators
    • G01L1/142—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators using capacitors
    • G01L1/146—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators using capacitors for measuring force distributions, e.g. using force arrays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
    • B81C1/00444—Surface micromachining, i.e. structuring layers on the substrate
    • B81C1/0046—Surface micromachining, i.e. structuring layers on the substrate using stamping, e.g. imprinting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0264—Pressure sensors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/04—Optical MEMS
    • B81B2201/042—Micromirrors, not used as optical switches
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/01—Suspended structures, i.e. structures allowing a movement
    • B81B2203/0127—Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0174—Manufacture or treatment of microstructural devices or systems in or on a substrate for making multi-layered devices, film deposition or growing
    • B81C2201/0191—Transfer of a layer from a carrier wafer to a device wafer
    • B81C2201/0194—Transfer of a layer from a carrier wafer to a device wafer the layer being structured

Abstract

The disclosure is generally directed to fabrication steps, and operation principles for microelectromechanical (MEMS) transducers. In one embodiment, the disclosure relates to a texture morphing device. The texture morphing device includes: a plurality of supports arranged on a substrate to support a deformable mirror, an ITO layer; and a Distributed Bragg Reflector (DBR ) layer. A pair of adjacent supports form a cavity with the ITO layer and the deformable mirror. When the height of the cavity changes responsive to an external pressure, the internal reflection within the cavity is changed. The change in the height of the cavity causes the exterior texture to morph. Similar principles are disclosed for constructing sensor and actuators.
PCT/US2010/052403 2009-10-13 2010-10-12 Method and apparatus for forming mems device WO2011046986A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US25125509P 2009-10-13 2009-10-13
US61/251,255 2009-10-13

Publications (2)

Publication Number Publication Date
WO2011046986A2 WO2011046986A2 (en) 2011-04-21
WO2011046986A3 true WO2011046986A3 (en) 2011-08-11

Family

ID=43514081

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2010/052403 WO2011046986A2 (en) 2009-10-13 2010-10-12 Method and apparatus for forming mems device

Country Status (1)

Country Link
WO (1) WO2011046986A2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11320329B2 (en) 2016-09-12 2022-05-03 Sitime Corporation Frequency-modulating sensor array
US20210000383A1 (en) * 2018-04-10 2021-01-07 King Abdullah University Of Science And Technology Capacitive sensor
CN112964404B (en) * 2021-02-02 2022-08-19 武汉纺织大学 High-consistency miniature pressure sensing device for intelligent fabric

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4266263A (en) * 1977-01-21 1981-05-05 Semperit Aktiengesellschaft Force measuring capacitor
WO2008133942A2 (en) * 2007-04-23 2008-11-06 Sierra Scientific Instruments, Inc. Suspended membrane pressure sensing array
WO2009096419A1 (en) * 2008-01-28 2009-08-06 Kuraray Co., Ltd. Flexible deformation sensor

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4266263A (en) * 1977-01-21 1981-05-05 Semperit Aktiengesellschaft Force measuring capacitor
WO2008133942A2 (en) * 2007-04-23 2008-11-06 Sierra Scientific Instruments, Inc. Suspended membrane pressure sensing array
WO2009096419A1 (en) * 2008-01-28 2009-08-06 Kuraray Co., Ltd. Flexible deformation sensor

Also Published As

Publication number Publication date
WO2011046986A2 (en) 2011-04-21

Similar Documents

Publication Publication Date Title
WO2008051351A3 (en) Sacrificial spacer process and resultant structure for mems support structure
WO2013061298A3 (en) Pre-collapsed capacitive micro-machined transducer cell with stress layer
WO2007127220A3 (en) Elastomeric article with wireless micro and nano sensor system
EP2248763A3 (en) Capacitive electro-mechanical transducer and fabrication method of the same
WO2011046986A3 (en) Method and apparatus for forming mems device
JP2011124973A5 (en)
TW200739978A (en) MEMS process and device
WO2008002459A3 (en) Support structure for free-standing mems device and methods for forming the same
TW201613820A (en) CMOS-MEMS integrated device including multiple cavities at different controlled pressures and methods of manufacture
WO2008067097A3 (en) Microelectromechanical devices and fabrication methods
WO2011162949A3 (en) Planar cavity mems and related structures, methods of manufacture and design structures
WO2008064689A3 (en) A shape changing manipulator comprising self-sensing actuators made of an electroactive polymer material
WO2009137162A2 (en) Human-readable, bi-state environmental sensors based on mechanical membranes
CN102576149A (en) Actuator for moving a micro mechanical element
WO2010134302A3 (en) Method for manufacturing a capacitive electromechanical transducer
WO2008063433A3 (en) Polymer object optical fabrication process
WO2009092794A3 (en) Object provided with a graphics element transferred onto a support wafer and method of producing such an object
WO2010039660A3 (en) Multi-thickness layers for mems and mask - saving sequence for same
WO2011119346A1 (en) Methods and devices for pressure detection
JP2015505925A5 (en)
WO2009123836A1 (en) Human-readable, bi-state environmental sensors based on mechanical membranes
JP2013515323A (en) Integrated touch screen for interferometric modulator displays
WO2011053778A3 (en) Thinner pij actuators
WO2012173455A3 (en) Method for manufacturing touch panel, and laser device for same
WO2010058193A3 (en) Mirror structure

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 10785548

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 10785548

Country of ref document: EP

Kind code of ref document: A2