WO2011021719A1 - Fluorescent-light-type led lighting appliance - Google Patents

Fluorescent-light-type led lighting appliance Download PDF

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Publication number
WO2011021719A1
WO2011021719A1 PCT/JP2010/064426 JP2010064426W WO2011021719A1 WO 2011021719 A1 WO2011021719 A1 WO 2011021719A1 JP 2010064426 W JP2010064426 W JP 2010064426W WO 2011021719 A1 WO2011021719 A1 WO 2011021719A1
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WO
WIPO (PCT)
Prior art keywords
led
cover member
fluorescent lamp
heat
heat dissipation
Prior art date
Application number
PCT/JP2010/064426
Other languages
French (fr)
Japanese (ja)
Inventor
伊藤 亮
Original Assignee
Itoh Ryoh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Itoh Ryoh filed Critical Itoh Ryoh
Priority to JP2011527726A priority Critical patent/JPWO2011021719A1/en
Publication of WO2011021719A1 publication Critical patent/WO2011021719A1/en

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • F21V19/001Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/0055Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by screwing
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/27Retrofit light sources for lighting devices with two fittings for each light source, e.g. for substitution of fluorescent tubes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00Lighting devices or systems using a string or strip of light sources
    • F21S4/20Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • F21V19/001Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/004Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by deformation of parts or snap action mountings, e.g. using clips
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/16Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/16Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting
    • F21V17/164Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting the parts being subjected to bending, e.g. snap joints
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00Globes; Bowls; Cover glasses
    • F21V3/04Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/049Patterns or structured surfaces for diffusing light, e.g. frosted surfaces
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Definitions

  • the present invention relates to an LED illuminating lamp that uses an LED (light emitting diode) chip as a light source, and more particularly to a fluorescent lamp type LED illuminating lamp.
  • LED light emitting diode
  • Patent Document 1 discloses a transparent cylindrical pipe (2), a support plate (3) provided inside the pipe (2), and both ends of the support plate (3).
  • the conventional fluorescent lamp type LED lighting shown in FIG. 12 includes an LED package B having an LED chip A, a package substrate C on which the LED package B is mounted on one surface, and the other surface of the package substrate C.
  • Heat sink D stacked on top of each other, heat sink E with a semicircular cross section covering the heat sink D side with both side edges of the heat sink D sandwiched, and a semicircular cross section covering the LED package B side Further, both side edges thereof are provided with translucent covers F connected to both side edges of the heat radiation cover E.
  • JP 2001-351402 A JP 2001-351402 A
  • the fluorescent lamp type LED lighting device described in Patent Document 1 does not include means for radiating heat generated by lighting of the plurality of LEDs (9), each LED (9) is heated to high temperature. Its life is likely to be reduced.
  • the conventional fluorescent lamp type LED lighting shown in FIG. 12 includes a heat radiating plate D and a heat radiating cover E for radiating heat generated by lighting the LED chip A, but an LED package B having the LED chip A. Is mounted on one surface of the package substrate C, and the heat sink D is superimposed on the other surface of the package substrate C.
  • the conventional fluorescent lamp type LED illuminating lamp shown in FIG. 12 is a wide one in which the heat radiating plate D crosses the diameter direction of the fluorescent light type LED illuminating lamp, and the heat radiating cover E covers the heat radiating plate D. Since it has a large arc-shaped cross section, there is a problem that the weight increases.
  • the present invention has been made in response to such problems of the prior art, and can significantly improve the heat dissipation efficiency of the LED chip to achieve a long life, and also achieve a reduction in weight. It is an object of the present invention to provide a fluorescent lamp type LED illumination lamp that can be used.
  • the fluorescent lamp type LED lighting lamp according to the present invention is a straight tube type or annular fluorescent lamp type LED lighting lamp having a base having a terminal connectable to an existing fluorescent lamp socket. And presenting a tubular shape to which a base is attached, a translucent cover having a slit-like opening on a part of its peripheral surface, and a heat dissipation cover member attached to the slit-like opening of the translucent cover,
  • a plurality of LED packages having LED chips have a long plate shape or an annular plate shape arranged in the longitudinal direction, and are fixed to the heat dissipation cover member in a state where the plurality of LED packages are in contact with the inner surface of the heat dissipation cover member.
  • a package substrate is a straight tube type or annular fluorescent lamp type LED lighting lamp having a base having a terminal connectable to an existing fluorescent lamp socket. And presenting a tubular shape to which a base is attached, a translucent cover having a slit-like opening on a part of its peripheral surface
  • the lighting switch when the terminal of the base is connected to the existing fluorescent lamp socket, the lighting switch is turned on, so that a plurality of the LED lamps arranged along the longitudinal direction of the package substrate are provided. Each LED chip of the LED package is turned on, and the lighting light is irradiated through the translucent cover.
  • the generated heat is directly transferred from each LED package to the heat dissipation cover member and efficiently dissipated.
  • each of the plurality of LED packages has an electrode layer in contact with the LED chip in a state of protruding from a base end surface opposite to the light projecting direction of the LED chip.
  • Each LED package can be fitted and mounted in a plurality of mounting holes formed in the package substrate in a state where the LED package is in contact with the inner surface of the heat dissipation cover member.
  • the heat radiating cover member can be formed in a groove shape that enters from the slit-like opening of the translucent cover. In this case, the terminal of the base and the power supply unit connected to the package substrate can be disposed in the groove portion of the heat dissipation cover member.
  • the reflecting surfaces that are inclined so that the width on the side of the rushing end portion becomes gradually narrower than the width on the base end portion side can be formed on the left and right outer surfaces.
  • the fluorescent lamp type LED illuminating lamp of the present invention provided with fastening means for pressing the package substrate against the inner surface side of the heat dissipation cover member together with the LED package, and when the package substrate is fixed to the heat dissipation cover member via the fastening means, Each LED package is pressed and pressed against the inner surface of the heat dissipation cover member, which is preferable because heat transfer from each LED package to the heat dissipation cover member is ensured and heat transfer efficiency is improved.
  • the fluorescent lamp type LED illumination lamp of the present invention when the spring piece elastically contacting each LED package is formed on the inner surface of the heat dissipation cover member, heat transfer from each LED package to the heat dissipation cover member is ensured. At the same time, the heat transfer efficiency is further improved, which is preferable. Further, in the fluorescent lamp type LED illumination lamp of the present invention, when the LED package is disposed at a position near the slit-shaped opening from the center of the cross section of the translucent cover, the LED chip that transmits the translucent cover This is preferable because the illumination light irradiation area is expanded.
  • the heat generation is caused by the heat radiation cover in which the projecting top surface contacts the electrode layer that contacts each LED chip. Heat is transferred directly and reliably to the member and efficiently radiated. Therefore, according to the present invention, the heat dissipation efficiency of each LED chip can be remarkably improved and the lifetime can be increased.
  • the heat dissipation cover member is attached to the slit-like opening of the translucent cover and protrudes to the inside of the translucent cover.
  • the heat dissipation plate D of the conventional fluorescent lamp type LED illumination lamp (see FIG. 12) and Since it is smaller than the heat radiating cover E, the present invention can achieve weight reduction.
  • FIG. 1 is a perspective view of a fluorescent lamp type LED illumination lamp according to a first embodiment of the present invention.
  • FIG. 2 is a schematic longitudinal sectional view of the fluorescent lamp type LED illumination lamp shown in FIG. 3 is a longitudinal sectional view taken along line III-III in FIG.
  • FIG. 4 is a longitudinal sectional view corresponding to FIG. 2 schematically showing a first modification of the first embodiment.
  • FIG. 5 is a longitudinal sectional view corresponding to FIG. 2 schematically showing a second modification of the first embodiment.
  • FIG. 6 is a longitudinal sectional view corresponding to FIG. 2 schematically showing a third modification of the first embodiment.
  • FIG. 7 is a longitudinal sectional view corresponding to FIG. 2 schematically showing a fourth modification of the first embodiment.
  • FIG. 1 is a perspective view of a fluorescent lamp type LED illumination lamp according to a first embodiment of the present invention.
  • FIG. 2 is a schematic longitudinal sectional view of the fluorescent lamp type LED illumination lamp shown in FIG. 3 is a longitudinal sectional view taken
  • FIG. 8 is a longitudinal cross-sectional view corresponding to FIG. 2 schematically showing a main part structure of a fluorescent lamp type LED illumination lamp according to the second embodiment of the present invention.
  • FIG. 9 is a longitudinal sectional view corresponding to FIG. 8 schematically showing a first modification of the second embodiment.
  • FIG. 10 is a longitudinal sectional view corresponding to FIG. 8 schematically showing a second modification of the second embodiment.
  • FIG. 11 is a plan view of a fluorescent lamp type LED illumination lamp according to a third embodiment of the present invention.
  • FIG. 12 is a schematic longitudinal sectional view corresponding to FIG. 2 showing a conventional example.
  • Translucent cover 13A Lenticular lens 13B ... Cut-off opening edge part 14 ... Radiation cover member 14A ... Clamping part 14B ... Bottom part 14C ... Side wall part 14D ... Partition wall 14E ... Radiation fin 15 ... Package board 17 ... LED package 21 ... terminal 22 ... base 23 ... translucent cover 24 ... heat dissipation cover Wood
  • the fluorescent lamp type LED illuminating lamp of the first embodiment is a straight tube type fluorescent lamp type LED illuminating lamp having a standard length in a range of 600 to 2400 mm.
  • caps 2 and 2 each having two terminals 1 and 1 connectable to an existing fluorescent lamp socket (not shown).
  • the caps 2 and 2 are attached to both ends of a straight tubular translucent cover 3 having a slit-like opening on a part of its peripheral surface.
  • a groove-type heat radiation cover member 4 extending along the longitudinal direction of the cover 3 is mounted.
  • the translucent cover 3 is formed by mixing an appropriate light diffusing agent in a transparent resin such as polycarbonate (PC) or acrylic resin, and exhibits a so-called ground glass-like appearance.
  • the translucent cover 3 may have a transparent appearance in which a light diffusing agent is not mixed or a translucent appearance such as milky white.
  • the translucent cover 3 has a diameter of, for example, 32 mm and a thickness of, for example, about 0.8 to 1.0 mm.
  • the groove-type heat radiation cover member 4 is formed by press-molding, for example, an aluminum plate having a thickness of 0.8 to 1.0 mm into a groove-shaped cross-sectional shape shown in FIG. The depth is set to about 8 mm, and the weight is extremely reduced.
  • Engagement recesses 4A and 4A that are detachably engaged with the engagement projections 3A and 3A of the translucent cover 3 are formed at the end of the heat radiation cover member 4 on the opening side by bending.
  • the groove-type heat radiation cover member 4 is detachably attached to the slit-like opening of the translucent cover 3 by engaging the engaging recesses 4A and 4A with the engaging convex portions 3A and 3A of the translucent cover 3.
  • the heat radiating cover member 4 enters from the slit-like opening of the translucent cover 3. Further, as shown in FIG. 3, a long plate-like shape extending along the longitudinal direction of the heat dissipation cover member 4 is formed on the inner surface of the heat dissipation cover member 4 protruding inside the translucent cover 3, that is, the flat protruding top surface 4B.
  • the package substrate 5 is fixed by a plurality of set screws 6 as fastening means.
  • a plurality of mounting holes 5A are formed in the package substrate 5 at predetermined intervals along the longitudinal direction, and the LED packages 7 are respectively fitted in the mounting holes 5A.
  • an LED chip 7C is arranged at the bottom of a reflector recess 7B formed in a thin box-shaped cavity base 7A made of polycarbonate (PC) or ceramics, and the LED chip 7C is filled in the reflector recess 7B. It has a structure enclosed with resin 7D.
  • the LED chip 7C emits blue light to cause the LED package 7 to emit white light, for example.
  • the encapsulating resin 7D is made of an epoxy resin or a silicon resin.
  • a phosphor that emits the complementary yellow light by the blue light of the LED chip 7C is dispersed.
  • Such an LED package 7 is arranged such that the base end surface opposite to the light projecting direction of the LED chip 7 ⁇ / b> C directed downward in FIG. 2 faces the protruding top surface 4 ⁇ / b> B that is the inner surface of the heat dissipation cover member 4.
  • the position where the LED package 7 is disposed is a position that is closer to the slit-shaped opening from the center of the cross section of the translucent cover 3.
  • the package substrate 5 has a plurality of fastening means as fastening means.
  • the proximal end surface side of the LED package 7 is pressed to the protruding top surface 4B side of the heat dissipation cover member 4 by being fixed to the protruding top surface 4B of the heat dissipation cover member 4 by the screws 6.
  • an electrode layer 7 ⁇ / b> F that constitutes a part of a circuit that connects the LED chip 7 ⁇ / b> C to the package substrate 5 is formed in an exposed state on the bottom of the reflector recess 7 ⁇ / b> B on the base end face side of the LED package 7.
  • the electrode layer 7F has a thickness of about 0.025 mm and protrudes from the base end surface of the LED package 7 by about 0.015 to 0.020 mm.
  • the electrode layer 7F contacts the LED chip 7C and protrudes from the heat dissipation cover member 4.
  • the top surface 4B is pressed and pressed.
  • a power supply unit 8 connected to the package substrate 5 and the terminals 1 and 1 of the caps 2 and 2 shown in FIG. It is installed.
  • a reflector plating layer that reflects the light emitted from the LED chip 7C is formed on the peripheral wall surface of the reflector recess 7B of each LED package 7. This plating layer is formed by sequentially laminating, for example, copper (Cu), nickel (Ni), and silver (Ag) plating layers.
  • a lighting switch (not shown) in a state where the terminals 1 and 1 of the caps 2 and 2 at both ends are connected to an existing fluorescent lamp socket.
  • each LED chip 7C of the plurality of LED packages 7 is turned on as shown in FIG. Irradiated.
  • each LED package 7 is disposed at a position near the slit-shaped opening from the center of the cross section of the translucent cover 3, the lighting light of each LED chip 7 ⁇ / b> C is below the translucent cover 3. Irradiated from a wide area of the half.
  • each LED chip 7C of the plurality of LED packages 7 generates heat when it is turned on, but the heat generation is caused by the projecting top surface 4B of the heat dissipation cover member 4 that is in pressure contact with each electrode layer 7F that contacts each LED chip 7C.
  • the heat is directly and reliably transferred to the heat and is efficiently radiated by the heat radiating cover member 4.
  • the heat dissipation efficiency reaches about 90%, compared with about 25% in the conventional fluorescent lamp type LED lighting having the cross-sectional structure shown in FIG.
  • the temperature of each LED chip 7C can be maintained at about 60 ° C.
  • the heat dissipation efficiency of the LED chip A is about 25%, a large and heavy heat sink D and a heat sink E are required.
  • the heat dissipation efficiency of the LED chip 7C reaches about 90%, so that the heat can be sufficiently radiated by the small and light heat dissipation cover member 4. Therefore, according to the fluorescent lamp type LED illuminating lamp of the first embodiment, the heat dissipation efficiency of each LED chip 7C of the plurality of LED packages 7 can be remarkably improved to achieve a long life, and the weight can be reduced. Can also be achieved.
  • the fluorescent lamp type LED illumination lamp of the present invention is not limited to the first embodiment described above.
  • the heat radiating cover member 4 may be a press-formed product of a stainless steel plate or a three-extrusion product of aluminum alloy or copper.
  • each LED package 7 that emits white light may have a configuration in which three LED chips that emit light of three primary colors of red (R), green (G), and blue (B) are incorporated.
  • the longitudinal cross-sectional shape of the thermal radiation cover member 4 shown in FIG. 2 can be changed into the longitudinal cross-sectional shape shown in FIG.
  • the heat radiating cover member 4 has reflection surfaces 4C and 4C that are inclined so that the width on the protruding top surface 4B side is gradually narrowed on the left and right side surfaces on both sides of the protruding top surface 4B.
  • the heat dissipation cover member 4 shown in FIG. 2 can be changed to an extruded product of aluminum or copper having the longitudinal cross-sectional shape shown in FIG.
  • the heat radiating cover member 4 is formed by protruding fastening pieces 4D and 4D facing the package substrate 5 from the left and right side surfaces on both sides of the protruding top surface 4B.
  • the left and right edges of the package substrate 5 are fastened to the fastening pieces 4D, 4D via U-shaped cross-section clips 9, 9 as fastening means.
  • the electrode layer 7F is in pressure contact with the protruding top surface 4B of the heat dissipation cover member 4.
  • the longitudinal sectional shape of the cavity substrate 7A of the package substrate 5 and the LED package 7 shown in FIG. 2 can be changed to the longitudinal sectional shape shown in FIG.
  • the left and right inclined wall surfaces 5B and 5B of the package substrate 5 are changed to straight wall surfaces 5C and 5C
  • the left and right inclined side surfaces 7E and 7E of the cavity base 7A face the straight wall surfaces 5C and 5C of the package substrate 5.
  • the straight side surfaces 7G and 7G are changed.
  • the vertical cross-sectional shape of the heat dissipation cover member 4 shown in FIG. 2 can be changed to the vertical cross-sectional shape shown in FIG.
  • spring pieces 4 ⁇ / b> E that elastically contact the electrode layers 7 ⁇ / b> F of the LED packages 7 are formed on the protruding top surface 4 ⁇ / b> B. In this case, the heat transfer efficiency from each electrode layer 7F to the groove-type heat radiating member 4 is further improved.
  • the spring piece 4E shown in FIG. 7 is formed in a single tongue shape that is cut and raised so as to protrude from one side in the width direction of the heat dissipation cover member 4 and extends in the longitudinal direction of the heat dissipation cover member 4. It may be formed in the shape of a plurality of tongue pieces cut and raised so as to protrude in the longitudinal direction of the heat radiation cover member 4 corresponding to each electrode layer 7F, or cut and raised so as to protrude to the electrode layer 7F side. It may be formed in a plurality of spiral pieces.
  • a thin adhesive sheet of about 0.20 mm made of epoxy resin (not shown).
  • each electrode layer 7F of each LED package 7 shown in FIGS. 2, 4, 5, 6, and 7 is provided with a heat dissipation cover member 4 through a uniform and thin adhesive layer such as an epoxy resin. You may adhere to the protruding top surface 4B.
  • the fluorescent lamp type LED illuminating lamp of the second embodiment corresponds to the light transmitting cover 3, the heat radiating cover member 4, the package substrate 5, and the LED package 7 in the fluorescent lamp type LED illuminating lamp of the first embodiment shown in FIG.
  • a translucent cover 13, a heat radiating cover member 14, a package substrate 15 and an LED package 17 as shown in FIG. 8 are provided.
  • a lenticular lens 13 ⁇ / b> A that diffuses the lighting light of the LED package 17 in the circumferential direction is formed on the inner surface of the translucent cover 13.
  • the heat radiation cover member 14 is formed into a groove-shaped cross-sectional shape by extrusion molding of an aluminum alloy, and the slit-like opening edge portions 13B and 13B of the translucent cover 13 are attached to and detached from the end portion on the opening side. Clamping portions 14A and 14A that are freely sandwiched are formed.
  • the LED package 17 has a general structure including lead frames 7F and 17F having a thickness of about 0.15 to 0.20 mm to which the LED chip 17C is connected via wires 17G and 17G as electrodes. Yes.
  • the LED package 17 is fixed to the bottom portion 14 ⁇ / b> B of the heat dissipation cover member 14 via the package substrate 15, thereby contacting the inner surface of the bottom portion 14 ⁇ / b> B of the heat dissipation cover member 14.
  • the fluorescent lamp type LED illuminating lamp of the second embodiment the same effect as that of the fluorescent lamp type LED illuminating lamp of the first embodiment can be obtained, and the lenticular lens 13A of the translucent cover 13 can be used to The lighting light of each LED chip 17C can be diffused in the circumferential direction of the translucent cover 13 and irradiated over a wide range.
  • the heat radiating cover member 14 is formed in a shallow groove shape in which sandwiching portions 14A and 14A are continuous on both sides of the bottom portion 14B, and left and right side wall portions 14C and 14C rise from the sandwiching portions 14A and 14A.
  • Each LED package 17 is installed, and partition walls 14D and 14D having substantially the same height as the left and right side wall portions 14C and 14C are integrally formed on the outer surface of the bottom portion 14B.
  • each LED package 7 installed on the inner surface of the bottom portion 14 ⁇ / b> B of the heat dissipation cover member 14 is positioned near the slit-like opening of the translucent cover 13.
  • the lighting range of the LED chip 17 ⁇ / b> C expands to the range indicated by ⁇ in FIG. 9 in the circumferential direction of the translucent cover 13.
  • the longitudinal cross-sectional shape of the heat radiating cover member 14 shown in FIG. 8 in the fluorescent lamp type LED lighting lamp of 2nd Embodiment can be changed into the longitudinal cross-sectional shape shown in FIG.
  • the heat radiating cover member 14 is formed in a reverse groove shape in which a bottom portion 14B is located radially outward from the slit-like opening of the translucent cover 13, and each LED package 17 is installed on the inner surface of the bottom portion 14B.
  • a plurality of radiating fins 14E and 14E are integrally formed on the outer surface of the bottom portion 14B.
  • each LED package 7 installed on the inner surface of the bottom portion 14 ⁇ / b> B of the heat dissipation cover member 14 is positioned radially outward from the slit-like opening of the translucent cover 13. Therefore, the irradiation range of the lighting light of each LED chip 17 ⁇ / b> C greatly expands to the range indicated by ⁇ in FIG.
  • the lenticular lens 13A formed on the inner surface of the translucent cover 13 is not essential and may be omitted.
  • the thickness of an LED package is not restrict
  • FIGS. 8 to 10 when the thickness of the LED package is made relatively thin, a straight line is drawn vertically from the center point of the LED chip upper surface (light projecting surface) to the inner wall of the translucent cover. It becomes possible to make the length ( ⁇ ) of the vertical line relatively long.
  • the addition amount of the light diffusing agent contained in the translucent cover can be relatively reduced, and as a result, the LED package can be made difficult to be visually recognized as grains, and the desired brightness is uniformly white. Can be light.
  • the fluorescent lamp type LED lighting lamp in which the distance between the LED package and the translucent cover is short, unless a large amount of light diffusing agent is added, irregular reflection is insufficient and uniform light cannot be obtained. Increasing the amount of the diffusing agent may cause a problem that light is hardly transmitted.
  • the distance from the bottom surface of the LED chip to the protruding top surface 4B of the groove-type heat radiating member 4 is short, for example, 0.3 mm or less, and / or The ⁇ is long, for example, preferably 25 mm or more.
  • the fluorescent lamp type LED illumination lamp of the third embodiment is configured as an annular fluorescent lamp type LED illumination lamp as shown in FIG.
  • This annular fluorescent lamp type LED lighting lamp includes an annular light-transmitting cover 23 having both ends continuous via a single base 22 having four terminals 21, 21.
  • a heat-radiating cover member 24 having an annular shape in plan view, which is attached to a slit-like opening formed in a part of the peripheral surface, and the longitudinal sectional structure thereof is shown in FIGS. 2 and 4 to 10.
  • Various vertical cross-sectional structures can be used.

Abstract

Provided is a lighter-weight fluorescent-light-type LED lighting appliance, the LED chips of which have greatly increased heat-dissipation efficiency and longer life. With terminals in bases (2) on both ends of the provided fluorescent-light-type LED lighting appliance connected to an existing fluorescent light socket, when the light switch for said socket is turned on, LED chips (7C) in a plurality of LED packages (7) arranged along the long direction of a package substrate (5) turn on, and the light therefrom is emitted through a light-transmitting cover (3). When the LED chips (7C) in the plurality of LED packages (7) emit heat due to having been turned on, said emitted heat is directly transmitted from electrode layers (7F) in contact with the LED chips (7C) to a protruding top surface (4B) of a groove-type heat-dissipation member (4) up against which the electrode layers press. The heat is then efficiently dissipated by the groove-type heat-dissipation member (4).

Description

蛍光灯型LED照明灯Fluorescent LED lighting
 本発明は、LED(発光ダイオード)チップを光源とするLED照明灯に関し、詳しくは、蛍光灯型のLED照明灯に関するものである。 The present invention relates to an LED illuminating lamp that uses an LED (light emitting diode) chip as a light source, and more particularly to a fluorescent lamp type LED illuminating lamp.
 LEDチップを光源とするLED照明灯として、既存の蛍光灯ソケットに対応した端子を有する口金が両端部に設けられている蛍光灯型のLED照明灯が従来一般に知られている(例えば特許文献1参照)。また、この種の蛍光灯型LED照明灯として、図12に示すような断面構造を有するものも従来一般に知られている。
 ここで、特許文献1には、透明な円筒パイプ(2)と、このパイプ(2)の内側に設けた支持板(3)と、この支持板(3)の両端に設けられ、蛍光灯器具(11)のソケット部(14)に嵌合する端子(4)と、この端子(4)に接続し、支持板(3)の上面に設けられたAC/DC変換器(7)と、これに接続され、支持板(3)の底面に設けられた複数のLED(9)にそれぞれ供給する電圧を調整する電圧制御部(8)とを備えた蛍光灯型LED照明装置が提案されている。
 一方、図12に示す従来の蛍光灯型LED照明灯は、LEDチップAを有するLEDパッケージBと、このLEDパッケージBを一方の面に実装したパッケージ基板Cと、このパッケージ基板Cの他方の面に重ねられた放熱板Dと、この放熱板Dの両側縁部を挟み込んだ状態で放熱板D側を覆う半円状断面の放熱カバーEと、LEDパッケージB側を覆う半円状断面に形成され、その両側縁部が放熱カバーEの両側縁部に接続された透光カバーFとを備えている。
特開2001−351402号公報
As an LED illumination lamp using an LED chip as a light source, a fluorescent lamp type LED illumination lamp in which a base having terminals corresponding to an existing fluorescent lamp socket is provided at both ends is generally known (for example, Patent Document 1). reference). Further, as this type of fluorescent lamp type LED illumination lamp, one having a cross-sectional structure as shown in FIG. 12 is generally known.
Here, Patent Document 1 discloses a transparent cylindrical pipe (2), a support plate (3) provided inside the pipe (2), and both ends of the support plate (3). A terminal (4) fitted in the socket part (14) of (11), an AC / DC converter (7) provided on the upper surface of the support plate (3) connected to the terminal (4), and And a fluorescent lamp type LED lighting device including a voltage control unit (8) for adjusting a voltage supplied to each of the plurality of LEDs (9) provided on the bottom surface of the support plate (3). .
On the other hand, the conventional fluorescent lamp type LED lighting shown in FIG. 12 includes an LED package B having an LED chip A, a package substrate C on which the LED package B is mounted on one surface, and the other surface of the package substrate C. Heat sink D stacked on top of each other, heat sink E with a semicircular cross section covering the heat sink D side with both side edges of the heat sink D sandwiched, and a semicircular cross section covering the LED package B side Further, both side edges thereof are provided with translucent covers F connected to both side edges of the heat radiation cover E.
JP 2001-351402 A
 ところで、特許文献1に記載された蛍光灯型LED照明装置は、複数のLED(9)の点灯による発熱を放熱するための手段を備えていないため、各LED(9)が点灯により高温化してその寿命が低下する恐れが大きい。
 一方、図12に示した従来の蛍光灯型LED照明灯は、LEDチップAの点灯による発熱を放熱するための放熱板Dおよび放熱カバーEを備えているものの、LEDチップAを有するLEDパッケージBはパッケージ基板Cの一方の面に実装され、放熱板Dはパッケージ基板Cの他方の面に重ねられている。このため、LEDチップAから放熱板Dへの放熱は、LEDパッケージBおよびパッケージ基板Cを介して行われることとなり、その放熱効率は、例えば25%程度の低い効率となってしまう。
 加えて、図12に示した従来の蛍光灯型LED照明灯は、放熱板Dが蛍光灯型LED照明灯の直径方向に横切る幅広のものであり、放熱カバーEが放熱板Dを覆う半円弧状断面の大型のものであるため、重量が嵩むという問題がある。
 本発明は、このような従来技術の問題点に対応してなされたものであり、LEDチップの放熱効率を格段に向上させてその高寿命化を達成することができ、加えて軽量化も達成することができる蛍光灯型LED照明灯を提供することを課題とする。
By the way, since the fluorescent lamp type LED lighting device described in Patent Document 1 does not include means for radiating heat generated by lighting of the plurality of LEDs (9), each LED (9) is heated to high temperature. Its life is likely to be reduced.
On the other hand, the conventional fluorescent lamp type LED lighting shown in FIG. 12 includes a heat radiating plate D and a heat radiating cover E for radiating heat generated by lighting the LED chip A, but an LED package B having the LED chip A. Is mounted on one surface of the package substrate C, and the heat sink D is superimposed on the other surface of the package substrate C. For this reason, heat dissipation from the LED chip A to the heat sink D is performed through the LED package B and the package substrate C, and the heat dissipation efficiency is as low as about 25%, for example.
In addition, the conventional fluorescent lamp type LED illuminating lamp shown in FIG. 12 is a wide one in which the heat radiating plate D crosses the diameter direction of the fluorescent light type LED illuminating lamp, and the heat radiating cover E covers the heat radiating plate D. Since it has a large arc-shaped cross section, there is a problem that the weight increases.
The present invention has been made in response to such problems of the prior art, and can significantly improve the heat dissipation efficiency of the LED chip to achieve a long life, and also achieve a reduction in weight. It is an object of the present invention to provide a fluorescent lamp type LED illumination lamp that can be used.
 このような課題を解決するため、本発明に係る蛍光灯型LED照明灯は、既存の蛍光灯ソケットに接続可能な端子を有する口金を備えた直管形または円環形の蛍光灯型LED照明灯であって、口金が装着される管状を呈し、その周面一部に切割り状開口部を有する透光カバーと、この透光カバーの切割り状開口部に装着される放熱カバー部材と、LEDチップを有する複数のLEDパッケージが長手方向に沿って配列される長板状または円環板状を呈し、放熱カバー部材の内面に複数のLEDパッケージが接触する状態で放熱カバー部材に固定されるパッケージ基板とを備えていることを特徴とする。
 本発明に係る蛍光灯型LED照明灯では、口金の端子が既存の蛍光灯ソケットに接続された状態において、その点灯スイッチがオンされることにより、パッケージ基板の長手方向に沿って配列された複数のLEDパッケージの各LEDチップが点灯し、その点灯光が透光カバーを通して照射される。
 ここで、複数のLEDパッケージの各LEDチップが点灯により発熱すると、その発熱は、各LEDパッケージから放熱カバー部材に直接伝熱されて効率よく放熱される。
 本発明の蛍光灯型LED照明灯において、複数のLEDパッケージは、LEDチップの投光方向と反対側の基端面から突出する状態でLEDチップに接触する電極層をそれぞれ有するものとし、各電極層が放熱カバー部材の内面に接触する状態で各LEDパッケージがパッケージ基板に形成された複数の装着穴にそれぞれ嵌め込んで装着される構成とすることができる。
 また、本発明の蛍光灯型LED照明灯において、放熱カバー部材は、透光カバーの切割り状開口部から突入する溝型に形成することができる。この場合、口金の端子およびパッケージ基板に接続される電源ユニットを放熱カバー部材の溝部内に配置することができる。また、このような溝型の放熱カバー部材においては、突入端部側の幅が基端部側の幅より漸次狭くなるように傾斜する反射面を左右の外側面に形成することができる。
 本発明の蛍光灯型LED照明灯において、LEDパッケージと共にパッケージ基板を放熱カバー部材の内面側に押圧する締結手段を備え、この締結手段を介してパッケージ基板が放熱カバー部材に固定されていると、各LEDパッケージが放熱カバー部材の内面に押圧されて圧接し、各LEDパッケージから放熱カバー部材への伝熱が確実となると共に、伝熱効率が向上するので好ましい。
 また、本発明の蛍光灯型LED照明灯において、各LEDパッケージに弾性接触するばね片が放熱カバー部材の内面に形成されていると、各LEDパッケージから放熱カバー部材への伝熱が確実となると共に、伝熱効率が一層向上するので好ましい。
 また、本発明の蛍光灯型LED照明灯において、透光カバーの断面中央部から切割り状開口部側に寄った位置にLEDパッケージが配置されていると、透光カバーを透過するLEDチップの点灯光の照射領域が拡がるので好ましい。
In order to solve such a problem, the fluorescent lamp type LED lighting lamp according to the present invention is a straight tube type or annular fluorescent lamp type LED lighting lamp having a base having a terminal connectable to an existing fluorescent lamp socket. And presenting a tubular shape to which a base is attached, a translucent cover having a slit-like opening on a part of its peripheral surface, and a heat dissipation cover member attached to the slit-like opening of the translucent cover, A plurality of LED packages having LED chips have a long plate shape or an annular plate shape arranged in the longitudinal direction, and are fixed to the heat dissipation cover member in a state where the plurality of LED packages are in contact with the inner surface of the heat dissipation cover member. And a package substrate.
In the fluorescent lamp type LED illuminating lamp according to the present invention, when the terminal of the base is connected to the existing fluorescent lamp socket, the lighting switch is turned on, so that a plurality of the LED lamps arranged along the longitudinal direction of the package substrate are provided. Each LED chip of the LED package is turned on, and the lighting light is irradiated through the translucent cover.
Here, when each LED chip of the plurality of LED packages generates heat by lighting, the generated heat is directly transferred from each LED package to the heat dissipation cover member and efficiently dissipated.
In the fluorescent lamp type LED illuminating lamp of the present invention, each of the plurality of LED packages has an electrode layer in contact with the LED chip in a state of protruding from a base end surface opposite to the light projecting direction of the LED chip. Each LED package can be fitted and mounted in a plurality of mounting holes formed in the package substrate in a state where the LED package is in contact with the inner surface of the heat dissipation cover member.
Moreover, in the fluorescent lamp type LED illumination lamp of the present invention, the heat radiating cover member can be formed in a groove shape that enters from the slit-like opening of the translucent cover. In this case, the terminal of the base and the power supply unit connected to the package substrate can be disposed in the groove portion of the heat dissipation cover member. Further, in such a groove-type heat radiation cover member, the reflecting surfaces that are inclined so that the width on the side of the rushing end portion becomes gradually narrower than the width on the base end portion side can be formed on the left and right outer surfaces.
In the fluorescent lamp type LED illuminating lamp of the present invention, provided with fastening means for pressing the package substrate against the inner surface side of the heat dissipation cover member together with the LED package, and when the package substrate is fixed to the heat dissipation cover member via the fastening means, Each LED package is pressed and pressed against the inner surface of the heat dissipation cover member, which is preferable because heat transfer from each LED package to the heat dissipation cover member is ensured and heat transfer efficiency is improved.
Moreover, in the fluorescent lamp type LED illumination lamp of the present invention, when the spring piece elastically contacting each LED package is formed on the inner surface of the heat dissipation cover member, heat transfer from each LED package to the heat dissipation cover member is ensured. At the same time, the heat transfer efficiency is further improved, which is preferable.
Further, in the fluorescent lamp type LED illumination lamp of the present invention, when the LED package is disposed at a position near the slit-shaped opening from the center of the cross section of the translucent cover, the LED chip that transmits the translucent cover This is preferable because the illumination light irradiation area is expanded.
 本発明に係る蛍光灯型LED照明灯では、複数のLEDパッケージの各LEDチップが点灯により発熱すると、その発熱は、各LEDチップに接触する各電極層からこれに突出頂面が接触する放熱カバー部材に直接かつ確実に伝熱されて効率よく放熱される。従って、本発明によれば、各LEDチップの放熱効率を格段に向上させてその高寿命化を達成することができる。
 また、放熱カバー部材は、透光カバーの切割り状開口部に装着されて透光カバーの内側に突出するものであり、従来の蛍光灯型LED照明灯(図12参照)の放熱板Dおよび放熱カバーEに較べて小型であるため、本発明によれば、軽量化を達成することができる。
In the fluorescent lamp type LED illuminating lamp according to the present invention, when each LED chip of the plurality of LED packages generates heat by lighting, the heat generation is caused by the heat radiation cover in which the projecting top surface contacts the electrode layer that contacts each LED chip. Heat is transferred directly and reliably to the member and efficiently radiated. Therefore, according to the present invention, the heat dissipation efficiency of each LED chip can be remarkably improved and the lifetime can be increased.
The heat dissipation cover member is attached to the slit-like opening of the translucent cover and protrudes to the inside of the translucent cover. The heat dissipation plate D of the conventional fluorescent lamp type LED illumination lamp (see FIG. 12) and Since it is smaller than the heat radiating cover E, the present invention can achieve weight reduction.
 図1は本発明の第1実施形態に係る蛍光灯型LED照明灯の斜視図である。
 図2は図1に示した蛍光灯型LED照明灯の模式的な縦断面図である。
 図3は図2のIII−III線に沿う縦断面図である。
 図4は第1実施形態の第1変形例を模式的に示す図2に対応した縦断面図である。
 図5は第1実施形態の第2変形例を模式的に示す図2に対応した縦断面図である。
 図6は第1実施形態の第3変形例を模式的に示す図2に対応した縦断面図である。
 図7は第1実施形態の第4変形例を模式的に示す図2に対応した縦断面図である。
 図8は本発明の第2実施形態に係る蛍光灯型LED照明灯の要部構造を模式的に示す図2に対応した縦断面図である。
 図9は第2実施形態の第1変形例を模式的に示す図8に対応した縦断面図である。
 図10は第2実施形態の第2変形例を模式的に示す図8に対応した縦断面図である。
 図11は本発明の第3実施形態に係る蛍光灯型LED照明灯の平面図である。
 図12は一従来例を示す図2に対応した模式的な縦断面図である。
FIG. 1 is a perspective view of a fluorescent lamp type LED illumination lamp according to a first embodiment of the present invention.
FIG. 2 is a schematic longitudinal sectional view of the fluorescent lamp type LED illumination lamp shown in FIG.
3 is a longitudinal sectional view taken along line III-III in FIG.
FIG. 4 is a longitudinal sectional view corresponding to FIG. 2 schematically showing a first modification of the first embodiment.
FIG. 5 is a longitudinal sectional view corresponding to FIG. 2 schematically showing a second modification of the first embodiment.
FIG. 6 is a longitudinal sectional view corresponding to FIG. 2 schematically showing a third modification of the first embodiment.
FIG. 7 is a longitudinal sectional view corresponding to FIG. 2 schematically showing a fourth modification of the first embodiment.
FIG. 8 is a longitudinal cross-sectional view corresponding to FIG. 2 schematically showing a main part structure of a fluorescent lamp type LED illumination lamp according to the second embodiment of the present invention.
FIG. 9 is a longitudinal sectional view corresponding to FIG. 8 schematically showing a first modification of the second embodiment.
FIG. 10 is a longitudinal sectional view corresponding to FIG. 8 schematically showing a second modification of the second embodiment.
FIG. 11 is a plan view of a fluorescent lamp type LED illumination lamp according to a third embodiment of the present invention.
FIG. 12 is a schematic longitudinal sectional view corresponding to FIG. 2 showing a conventional example.
 1  …端子
 2  …口金
 3  …透光カバー
 3A …係合凸部
 4  …放熱カバー部材
 4A …係合凹部
 4B …突出頂面
 4C …反射面
 4D …締結片
 4E …ばね片
 5  …パッケージ基板
 5A …装着穴
 5B …傾斜壁面
 6  …止ねじ
 7  …LEDパッケージ
 7A …キャビティ基体
 7B …リフレクタ凹部
 7C …LEDチップ
 7D …封入樹脂
 7E …傾斜側面
 7F …電極層
 7G …ストレート側面
 7H …ツバ部
 8  …電源ユニット
 9  …クリップ
 13 …透光カバー
 13A…レンチキュラーレンズ
 13B…切割り状開口縁部
 14 …放熱カバー部材
 14A…挟持部
 14B…底部
 14C…側壁部
 14D…仕切壁
 14E…放熱フィン
 15 …パッケージ基板
 17 …LEDパッケージ
 21 …端子
 22 …口金
 23 …透光カバー
 24 …放熱カバー部材
DESCRIPTION OF SYMBOLS 1 ... Terminal 2 ... Base 3 ... Translucent cover 3A ... Engagement convex part 4 ... Radiation cover member 4A ... Engagement recessed part 4B ... Projection top face 4C ... Reflective surface 4D ... Fastening piece 4E ... Spring piece 5 ... Package board 5A ... Mounting hole 5B ... Inclined wall surface 6 ... Set screw 7 ... LED package 7A ... Cavity base 7B ... Reflector recess 7C ... LED chip 7D ... Encapsulated resin 7E ... Inclined side face 7F ... Electrode layer 7G ... Straight side face 7H ... Head part 8 ... Power supply unit DESCRIPTION OF SYMBOLS 9 ... Clip 13 ... Translucent cover 13A ... Lenticular lens 13B ... Cut-off opening edge part 14 ... Radiation cover member 14A ... Clamping part 14B ... Bottom part 14C ... Side wall part 14D ... Partition wall 14E ... Radiation fin 15 ... Package board 17 ... LED package 21 ... terminal 22 ... base 23 ... translucent cover 24 ... heat dissipation cover Wood
 以下、添付の図面を参照して本発明に係る蛍光灯型LED照明灯の実施の形態を説明する。図1に示すように、第1実施形態の蛍光灯型LED照明灯は、600~2400mmの範囲の規格の長さを有する直管形の蛍光灯型LED照明灯であって、その両端部には、図示しない既存の蛍光灯ソケットに接続可能な2本の端子1,1を有する口金2,2がそれぞれ設けられている。
 口金2,2は、周面一部に切割り状開口部を有する直管状の透光カバー3の両端部に装着されており、この透光カバー3の切割り状開口部には、透光カバー3の長手方向に沿って延びる溝型の放熱カバー部材4が装着されている。
 透光カバー3は、例えばポリカーボネート(PC)やアクリル樹脂などの透明樹脂に適宜の光拡散剤を混入して成形されており、いわゆるすりガラス状の外観を呈する。なお、透光カバー3は、光拡散剤が混入されていない透明な外観を呈するものや、乳白色などの半透明の外観を呈するものであってもよい。
 この透光カバー3は、直径が例えば32mm、肉厚が例えば0.8~1.0mm程度に成形されている。そして、この透光カバー3の切割り状開口部には、図2に示すように、溝型の放熱カバー部材4を装着するための山形断面の係合凸部3A,3Aが相互に対向して形成されている。
 溝型の放熱カバー部材4は、例えば板厚が0.8~1.0mmのアルミニウム板を図2に示す溝型の断面形状にプレス成形したものであり、溝部の開口幅は8~12mm程度、深さは8mm程度に設定されていて、極めて軽量化されている。この放熱カバー部材4の開口側の端部には、透光カバー3の係合凸部3A,3Aに着脱自在に係合する係合凹部4A,4Aが折曲げ加工により形成されている。
 溝型の放熱カバー部材4は、その係合凹部4A,4Aが透光カバー3の係合凸部3A,3Aに係合することで透光カバー3の切割り状開口部に着脱自在に装着されており、この装着状態で放熱カバー部材4は透光カバー3の切割り状開口部から突入している。そして、透光カバー3の内側に突出する放熱カバー部材の4の内面、すなわち平坦な突出頂面4Bには、図3に示すように、放熱カバー部材4の長手方向に沿って延びる長板状のパッケージ基板5が締結手段としての複数の止ねじ6により固定されている。
 パッケージ基板5には、複数の装着穴5Aが長手方向に沿って所定間隔で形成されており、各装着穴5AにはLEDパッケージ7がそれぞれ嵌め込まれている。パッケージ基板5の装着穴5Aの壁面のうち、図2に示す横断面に表れる左右の壁面は、放熱カバー部材4側の相互間隔が広く、反対側の相互間隔が狭くなるように左右対称に傾斜する傾斜壁面5B,5Bとされている。
 LEDパッケージ7は、ポリカーボネート(PC)やセラミックスからなる薄型ボックス状のキャビティ基体7Aに形成されたリフレクタ凹部7Bの底部にLEDチップ7Cが配置され、このLEDチップ7Cがリフレクタ凹部7Bに充填された封入樹脂7Dにより封入された構造を有する。LEDチップ7Cは、例えばLEDパッケージ7に白色光を発光させるために青色光を発光するものである。封入樹脂7Dは、エポキシ樹脂やシリコン樹脂からなり、この封入樹脂7Dには、LEDチップ7Cの青色光によりその補色の黄色光を発光する蛍光体が分散されている。
 このようなLEDパッケージ7は、図2の下方に向かうLEDチップ7Cの投光方向とは反対側の基端面を放熱カバー部材4の内面である突出頂面4Bに対面させて配置されている。このLEDパッケージ7が配置される位置は、透光カバー3の断面中央部から切割り状開口部側に寄った位置となっている。
 LEDパッケージ7のキャビティ基体7Aの外側面のうち、図2に示す横断面に表れる左右の外側面は、パッケージ基板5の左右の傾斜壁面5B,5Bと同じ角度で傾斜する傾斜側面7E,7Eとされている。そして、LEDパッケージ7の基端面側である傾斜側面7E,7Eの基端部がパッケージ基板5の傾斜壁面5B,5Bに斜面係合し、この状態でパッケージ基板5が締結手段としての複数の止ねじ6により放熱カバー部材4の突出頂面4Bに固定されることで、LEDパッケージ7の基端面側が放熱カバー部材4の突出頂面4B側に押圧されている。
 ここで、LEDパッケージ7の基端面側となるリフレクタ凹部7Bの底部には、LEDチップ7Cをパッケージ基板5に接続する回路の一部を構成する電極層7Fが露出状態で形成されている。この電極層7Fは、厚さが0.025mm程度であって、LEDパッケージ7の基端面から0.015~0.020mm程度突出しており、LEDチップ7Cに接触すると共に、放熱カバー部材4の突出頂面4Bに押圧されて圧接している。
 また、図2に示すように、溝型の放熱カバー部材4の溝部内には、パッケージ基板5および図1に示した口金2,2の各端子1,1に接続される電源ユニット8が配設されている。なお、図示省略したが、各LEDパッケージ7のリフレクタ凹部7Bの周壁面には、LEDチップ7Cの投光を反射するリフレクタ用のメッキ層が形成されている。このメッキ層は、例えば、銅(Cu),ニッケル(Ni),銀(Ag)のメッキ層を順次積層したものである。
 以上のように構成された第1実施形態に係る蛍光灯型LED照明灯では、両端部の口金2,2の端子1,1が既存の蛍光灯ソケットに接続された状態において、図示しない点灯スイッチがオンされると、図3に示すようにパッケージ基板5の長手方向に沿って配列された複数のLEDパッケージ7の各LEDチップ7Cが点灯し、その白色光の点灯光が透光カバー3を通して照射される。
 ここで、各LEDパッケージ7は、透光カバー3の断面中央部から切割り状開口部側に寄った位置に配置されているため、各LEDチップ7Cの点灯光は、透光カバー3の下半部の広い領域から照射される。
 その際、複数のLEDパッケージ7の各LEDチップ7Cは、その点灯により発熱するが、その発熱は、各LEDチップ7Cに接触する各電極層7Fからこれが圧接する放熱カバー部材4の突出頂面4Bに直接かつ確実に伝熱され、放熱カバー部材4により効率よく放熱される。その放熱効率は、図13に示した断面構造を有する従来の蛍光灯型LED照明灯では25%程度であるのに対し、90%程度に達する。その結果、各LEDチップ7Cの温度は、60℃程度に保持することが可能となる。
 また、図12に示した断面構造の従来の蛍光灯型LED照明灯では、LEDチップAの放熱効率が25%程度であるため、大型で重量の嵩む放熱板Dおよび放熱カバーEを必要とするのに対し、第1実施形態のLED照明灯では、LEDチップ7Cの放熱効率が90%程度に達するため、小型で軽量な放熱カバー部材4により十分に放熱することができる。
 従って、第1実施形態の蛍光灯型LED照明灯によれば、複数のLEDパッケージ7の各LEDチップ7Cの放熱効率を格段に向上させてその高寿命化を達成することができると共に、軽量化も達成することができる。
 本発明の蛍光灯型LED照明灯は、前述した第1実施形態に限定されるものではない。例えば、放熱カバー部材4は、ステンレス板のプレス成形品としてもよいし、アルミニウム合金や銅の3押出し成形品としてもよい。また、白色光を発光する各LEDパッケージ7は、赤色(R)、緑色(G)、青色(B)の3原色の光を発光する3個のLEDチップを内蔵した構成としてもよい。
 また、図2に示した放熱カバー部材4の縦断面形状は、図4に示す縦断面形状に変更することができる。この放熱カバー部材4は、突出頂面4Bの両側の左右の側面に、突出頂面4B側の幅が漸次狭くなるように傾斜する反射面4C,4Cが形成されたものである。この場合、透光カバー3の内面で反射したLEDチップ7Cからの投光の一部が反射面4C,4Cにより反射されて透光カバー3の左右の両側から斜め下方に照射されるため、LED照明灯の光量が増大する。
 さらに、図2に示した放熱カバー部材4は、図5に示す縦断面形状を有するアルミニウムや銅の押出し成形品に変更することができる。この放熱カバー部材4は、パッケージ基板5に対面する締結片4D,4Dが突出頂面4Bの両側の左右の側面から突出して形成されたものである。この締結片4D,4Dには、締結手段としてのU字状断面のクリップ9,9を介してパッケージ基板5の左右の両縁部が締結されており、この締結状態で各LEDパッケージ7の各電極層7Fが放熱カバー部材4の突出頂面4Bに圧接している。
 また、図2に示したパッケージ基板5およびLEDパッケージ7のキャビティ基体7Aの縦断面形状は、図6に示す縦断面形状に変更することができる。ここで、パッケージ基板5の左右の傾斜壁面5B,5Bは、ストレート壁面5C,5Cに変更され、キャビティ基体7Aの左右の傾斜側面7E,7Eは、パッケージ基板5のストレート壁面5C,5Cに対面するストレート側面7G,7Gに変更されている。そして、LEDパッケージ7の基端面と反対側のキャビティ基体7Aの先端部にはツバ部7H,7Hが形成されており、このツバ部7H,7Hがパッケージ基板5にハンダ付け固定されている。
 さらに、図2に示した放熱カバー部材4の縦断面形状は、図7に示す縦断面形状に変更することができる。この放熱カバー部材4は、各LEDパッケージ7の各電極層7Fに弾性接触するばね片4Eが突出頂面4Bに形成されたものである。この場合、各電極層7Fから溝型放熱部材4への伝熱効率が一層向上する。
 なお、図7に示したばね片4Eは、放熱カバー部材4の幅方向片側から突出するように切り起こされて放熱カバー部材4の長手方向に延びる単一の舌片状に形成されているが、各電極層7Fに対応して放熱カバー部材4の長手方向に突出するように切り起こされた複数の舌片状に形成されていてもよいし、各電極層7F側に突出するように切り起こされた複数の渦巻き片状に形成されていてもよい。
 ここで、図2、図4、図5、図6、図7に示した各LEDパッケージ7の各電極層7Fの表面には、例えばエポキシ樹脂からなる0.20mm程度の薄い接着シート(図示省略)を貼付し、この接着シートを介して各電極層7Fを放熱カバー部材4の突出頂面4Bに密着状態で圧接させてもよい。この場合、熱抵抗値の小さい0.20mm程度の薄い接着シートが各電極層7Fを放熱カバー部材4の突出頂面4Bに密着させるため、各LEDパッケージ7の放熱効率が一層高くなる。
 同様の理由から、図2、図4、図5、図6、図7に示した各LEDパッケージ7の各電極層7Fは、均一で薄いエポキシ樹脂などの接着剤層を介して放熱カバー部材4の突出頂面4Bに接着してもよい。
 次に、本発明の第2実施形態に係る蛍光灯型LED照明灯を説明する。第2実施形態の蛍光灯型LED照明灯は、図2に示した第1実施形態の蛍光灯型LED照明灯における透光カバー3、放熱カバー部材4、パッケージ基板5およびLEDパッケージ7に対応する部品として、図8に示すような透光カバー13、放熱カバー部材14、パッケージ基板15およびLEDパッケージ17を備えている。
 図8に示すように、透光カバー13の内面には、その周方向にLEDパッケージ17の点灯光を拡散させるレンチキュラーレンズ13Aが形成されている。また、放熱カバー部材14は、アルミニウム合金の押出成型により溝型の断面形状に成形されており、その開口側の端部には、透光カバー13の切割り状開口縁部13B,13Bを着脱自在に挟み込む挟持部14A,14Aが形成されている。ここで、LEDパッケージ17は、LEDチップ17Cがワイヤ17G,17Gを介して接続される厚さ0.15~0.20mm程度のリードフレーム7F,17Fを電極として備えた一般的な構造とされている。そして、このLEDパッケージ17は、パッケージ基板15を介して放熱カバー部材14の底部14Bに固定されることで、放熱カバー部材14の底部14Bの内面に接触している。
 第2実施形態の蛍光灯型LED照明灯においては、第1実施形態の蛍光灯型LED照明灯と同様の作用効果が得られる他、透光カバー13のレンチキュラーレンズ13Aにより、各LEDパッケージ17の各LEDチップ17Cの点灯光を透光カバー13の周方向に拡散させて広範囲に照射させることができる。
 ここで、第2実施形態の蛍光灯型LED照明灯における図8に示した放熱カバー部材14の縦断面形状は、図9に示す縦断面形状に変更することができる。この放熱カバー部材14は、底部14Bの両側に挟持部14A,14Aが連続し、挟持部14A,14Aから左右の側壁部14C,14Cが立ち上がる浅い溝型に成形されており、底部14Bの内面には各LEDパッケージ17が設置され、底部14Bの外面には、左右の側壁部14C,14Cと略同じ高さの仕切壁14D,14Dが一体に成形されている。
 図9に示した第2実施形態の変形例においては、放熱カバー部材14の底部14Bの内面に設置された各LEDパッケージ7が透光カバー13の切割り状開口部付近に位置するため、各LEDチップ17Cの点灯光の照射範囲は、透光カバー13の周方向おいて、図9にαで示す範囲まで拡大する。
 また、第2実施形態の蛍光灯型LED照明灯における図8に示した放熱カバー部材14の縦断面形状は、図10に示す縦断面形状に変更することができる。この放熱カバー部材14は、透光カバー13の切割り状開口部より径方向外方に底部14Bが位置する逆溝型に成形されており、その底部14Bの内面には各LEDパッケージ17が設置され、底部14Bの外面には、複数条の放熱フィン14E,14Eが一体に成形されている。
 図10に示した第2実施形態の変形例においては、放熱カバー部材14の底部14Bの内面に設置された各LEDパッケージ7が透光カバー13の切割り状開口部より径方向外方に位置するため、各LEDチップ17Cの点灯光の照射範囲は、透光カバー13の周方向おいて、図10にβで示す範囲まで大きく拡大する。
 なお、図9および図10に示した第2実施形態の変形例において、透光カバー13内面に形成されたレンチキュラーレンズ13Aは必須のものではなく、省略されていてもよい。
 また、第2実施形態の蛍光灯型LED照明灯において、LEDパッケージの厚さは何ら制限されるものではないが、当該厚みが薄い態様について以下に説明する。
 たとえば、図8~10において、LEDパッケージの厚さを相対的に薄くさせることによって、LEDチップ上面(投光面)の中央点から透光カバー内壁に対して鉛直方向に直線を引いたときの当該鉛直線の長さ(δ)を相対的に長くすることが可能となる。そうすることにより、透光カバーに含まれる光拡散剤の添加量を相対的に低減させることができ、その結果LEDパッケージを粒として視認されにくくすることができ、明るく全体が均一に白い所望の光とすることができる。
 これに対して、LEDパッケージと透光カバーの距離が短い蛍光灯型LED照明灯では、光拡散剤を多く入れないと、乱反射が不十分で、均一な光とすることができないばかりか、光拡散剤を多くすることにより光が透過しにくいという不具合を生ずるおそれがある。
 また、第2実施形態の蛍光灯型LED照明灯の一例として、LEDチップ底面から溝型放熱部材4の突出頂面4Bまでの距離が短く、たとえば0.3mm以下であること、および/または、上記δが長く、たとえば25mm以上であることが好ましい。
 続いて、本発明の第3実施形態に係る蛍光灯型LED照明灯を説明する。第3実施形態の蛍光灯型LED照明灯は、図11に示すような円環形の蛍光灯型LED照明灯として構成されている。この円環形の蛍光灯型LED照明灯は、4本の端子21,21…を有する単一の口金22を介して両端部が連続する円環形の透光カバー23と、この透光カバー23の周面一部に形成された切割り状開口部に装着される平面視円環状の放熱カバー部材24とを備えたものであり、その縦断面構造は、図2、図4~図10に示した種々の縦断面構造とすることができる。
Embodiments of a fluorescent lamp type LED illumination lamp according to the present invention will be described below with reference to the accompanying drawings. As shown in FIG. 1, the fluorescent lamp type LED illuminating lamp of the first embodiment is a straight tube type fluorescent lamp type LED illuminating lamp having a standard length in a range of 600 to 2400 mm. Are provided with caps 2 and 2 each having two terminals 1 and 1 connectable to an existing fluorescent lamp socket (not shown).
The caps 2 and 2 are attached to both ends of a straight tubular translucent cover 3 having a slit-like opening on a part of its peripheral surface. A groove-type heat radiation cover member 4 extending along the longitudinal direction of the cover 3 is mounted.
The translucent cover 3 is formed by mixing an appropriate light diffusing agent in a transparent resin such as polycarbonate (PC) or acrylic resin, and exhibits a so-called ground glass-like appearance. The translucent cover 3 may have a transparent appearance in which a light diffusing agent is not mixed or a translucent appearance such as milky white.
The translucent cover 3 has a diameter of, for example, 32 mm and a thickness of, for example, about 0.8 to 1.0 mm. Then, as shown in FIG. 2, engaging projections 3A and 3A having a chevron cross section for mounting the groove-shaped heat radiation cover member 4 face each other in the slit-like opening of the light transmitting cover 3. Is formed.
The groove-type heat radiation cover member 4 is formed by press-molding, for example, an aluminum plate having a thickness of 0.8 to 1.0 mm into a groove-shaped cross-sectional shape shown in FIG. The depth is set to about 8 mm, and the weight is extremely reduced. Engagement recesses 4A and 4A that are detachably engaged with the engagement projections 3A and 3A of the translucent cover 3 are formed at the end of the heat radiation cover member 4 on the opening side by bending.
The groove-type heat radiation cover member 4 is detachably attached to the slit-like opening of the translucent cover 3 by engaging the engaging recesses 4A and 4A with the engaging convex portions 3A and 3A of the translucent cover 3. In this mounted state, the heat radiating cover member 4 enters from the slit-like opening of the translucent cover 3. Further, as shown in FIG. 3, a long plate-like shape extending along the longitudinal direction of the heat dissipation cover member 4 is formed on the inner surface of the heat dissipation cover member 4 protruding inside the translucent cover 3, that is, the flat protruding top surface 4B. The package substrate 5 is fixed by a plurality of set screws 6 as fastening means.
A plurality of mounting holes 5A are formed in the package substrate 5 at predetermined intervals along the longitudinal direction, and the LED packages 7 are respectively fitted in the mounting holes 5A. Of the wall surface of the mounting hole 5A of the package substrate 5, the left and right wall surfaces shown in the cross section shown in FIG. 2 are symmetrically inclined so that the mutual space on the side of the heat dissipation cover member 4 is wide and the mutual space on the opposite side is narrow. Inclined wall surfaces 5B and 5B are used.
In the LED package 7, an LED chip 7C is arranged at the bottom of a reflector recess 7B formed in a thin box-shaped cavity base 7A made of polycarbonate (PC) or ceramics, and the LED chip 7C is filled in the reflector recess 7B. It has a structure enclosed with resin 7D. The LED chip 7C emits blue light to cause the LED package 7 to emit white light, for example. The encapsulating resin 7D is made of an epoxy resin or a silicon resin. In the encapsulating resin 7D, a phosphor that emits the complementary yellow light by the blue light of the LED chip 7C is dispersed.
Such an LED package 7 is arranged such that the base end surface opposite to the light projecting direction of the LED chip 7 </ b> C directed downward in FIG. 2 faces the protruding top surface 4 </ b> B that is the inner surface of the heat dissipation cover member 4. The position where the LED package 7 is disposed is a position that is closer to the slit-shaped opening from the center of the cross section of the translucent cover 3.
Of the outer surface of the cavity base 7A of the LED package 7, the left and right outer surfaces shown in the cross section shown in FIG. 2 are inclined side surfaces 7E and 7E inclined at the same angle as the left and right inclined wall surfaces 5B and 5B of the package substrate 5, respectively. Has been. Then, the base end portions of the inclined side surfaces 7E and 7E, which are the base end surface side of the LED package 7, are inclinedly engaged with the inclined wall surfaces 5B and 5B of the package substrate 5, and in this state, the package substrate 5 has a plurality of fastening means as fastening means. The proximal end surface side of the LED package 7 is pressed to the protruding top surface 4B side of the heat dissipation cover member 4 by being fixed to the protruding top surface 4B of the heat dissipation cover member 4 by the screws 6.
Here, an electrode layer 7 </ b> F that constitutes a part of a circuit that connects the LED chip 7 </ b> C to the package substrate 5 is formed in an exposed state on the bottom of the reflector recess 7 </ b> B on the base end face side of the LED package 7. The electrode layer 7F has a thickness of about 0.025 mm and protrudes from the base end surface of the LED package 7 by about 0.015 to 0.020 mm. The electrode layer 7F contacts the LED chip 7C and protrudes from the heat dissipation cover member 4. The top surface 4B is pressed and pressed.
In addition, as shown in FIG. 2, a power supply unit 8 connected to the package substrate 5 and the terminals 1 and 1 of the caps 2 and 2 shown in FIG. It is installed. Although not shown, a reflector plating layer that reflects the light emitted from the LED chip 7C is formed on the peripheral wall surface of the reflector recess 7B of each LED package 7. This plating layer is formed by sequentially laminating, for example, copper (Cu), nickel (Ni), and silver (Ag) plating layers.
In the fluorescent lamp type LED illuminating lamp according to the first embodiment configured as described above, a lighting switch (not shown) in a state where the terminals 1 and 1 of the caps 2 and 2 at both ends are connected to an existing fluorescent lamp socket. Is turned on, the LED chips 7C of the plurality of LED packages 7 arranged along the longitudinal direction of the package substrate 5 are turned on as shown in FIG. Irradiated.
Here, since each LED package 7 is disposed at a position near the slit-shaped opening from the center of the cross section of the translucent cover 3, the lighting light of each LED chip 7 </ b> C is below the translucent cover 3. Irradiated from a wide area of the half.
At this time, each LED chip 7C of the plurality of LED packages 7 generates heat when it is turned on, but the heat generation is caused by the projecting top surface 4B of the heat dissipation cover member 4 that is in pressure contact with each electrode layer 7F that contacts each LED chip 7C. The heat is directly and reliably transferred to the heat and is efficiently radiated by the heat radiating cover member 4. The heat dissipation efficiency reaches about 90%, compared with about 25% in the conventional fluorescent lamp type LED lighting having the cross-sectional structure shown in FIG. As a result, the temperature of each LED chip 7C can be maintained at about 60 ° C.
Moreover, in the conventional fluorescent lamp type LED illuminating lamp having the cross-sectional structure shown in FIG. 12, since the heat dissipation efficiency of the LED chip A is about 25%, a large and heavy heat sink D and a heat sink E are required. On the other hand, in the LED illuminating lamp of the first embodiment, the heat dissipation efficiency of the LED chip 7C reaches about 90%, so that the heat can be sufficiently radiated by the small and light heat dissipation cover member 4.
Therefore, according to the fluorescent lamp type LED illuminating lamp of the first embodiment, the heat dissipation efficiency of each LED chip 7C of the plurality of LED packages 7 can be remarkably improved to achieve a long life, and the weight can be reduced. Can also be achieved.
The fluorescent lamp type LED illumination lamp of the present invention is not limited to the first embodiment described above. For example, the heat radiating cover member 4 may be a press-formed product of a stainless steel plate or a three-extrusion product of aluminum alloy or copper. In addition, each LED package 7 that emits white light may have a configuration in which three LED chips that emit light of three primary colors of red (R), green (G), and blue (B) are incorporated.
Moreover, the longitudinal cross-sectional shape of the thermal radiation cover member 4 shown in FIG. 2 can be changed into the longitudinal cross-sectional shape shown in FIG. The heat radiating cover member 4 has reflection surfaces 4C and 4C that are inclined so that the width on the protruding top surface 4B side is gradually narrowed on the left and right side surfaces on both sides of the protruding top surface 4B. In this case, part of the light emitted from the LED chip 7C reflected by the inner surface of the translucent cover 3 is reflected by the reflecting surfaces 4C and 4C and irradiated obliquely downward from both the left and right sides of the translucent cover 3. The light quantity of the illumination lamp increases.
Furthermore, the heat dissipation cover member 4 shown in FIG. 2 can be changed to an extruded product of aluminum or copper having the longitudinal cross-sectional shape shown in FIG. The heat radiating cover member 4 is formed by protruding fastening pieces 4D and 4D facing the package substrate 5 from the left and right side surfaces on both sides of the protruding top surface 4B. The left and right edges of the package substrate 5 are fastened to the fastening pieces 4D, 4D via U-shaped cross-section clips 9, 9 as fastening means. The electrode layer 7F is in pressure contact with the protruding top surface 4B of the heat dissipation cover member 4.
Further, the longitudinal sectional shape of the cavity substrate 7A of the package substrate 5 and the LED package 7 shown in FIG. 2 can be changed to the longitudinal sectional shape shown in FIG. Here, the left and right inclined wall surfaces 5B and 5B of the package substrate 5 are changed to straight wall surfaces 5C and 5C, and the left and right inclined side surfaces 7E and 7E of the cavity base 7A face the straight wall surfaces 5C and 5C of the package substrate 5. The straight side surfaces 7G and 7G are changed. Then, flanges 7H and 7H are formed at the tip of the cavity base 7A opposite to the base end surface of the LED package 7, and the flanges 7H and 7H are fixed to the package substrate 5 by soldering.
Furthermore, the vertical cross-sectional shape of the heat dissipation cover member 4 shown in FIG. 2 can be changed to the vertical cross-sectional shape shown in FIG. In the heat dissipation cover member 4, spring pieces 4 </ b> E that elastically contact the electrode layers 7 </ b> F of the LED packages 7 are formed on the protruding top surface 4 </ b> B. In this case, the heat transfer efficiency from each electrode layer 7F to the groove-type heat radiating member 4 is further improved.
The spring piece 4E shown in FIG. 7 is formed in a single tongue shape that is cut and raised so as to protrude from one side in the width direction of the heat dissipation cover member 4 and extends in the longitudinal direction of the heat dissipation cover member 4. It may be formed in the shape of a plurality of tongue pieces cut and raised so as to protrude in the longitudinal direction of the heat radiation cover member 4 corresponding to each electrode layer 7F, or cut and raised so as to protrude to the electrode layer 7F side. It may be formed in a plurality of spiral pieces.
Here, on the surface of each electrode layer 7F of each LED package 7 shown in FIGS. 2, 4, 5, 6, and 7, a thin adhesive sheet of about 0.20 mm made of epoxy resin (not shown). ), And the electrode layers 7F may be brought into pressure contact with the protruding top surface 4B of the heat dissipation cover member 4 in close contact with each other through the adhesive sheet. In this case, since the thin adhesive sheet having a small thermal resistance value of about 0.20 mm brings each electrode layer 7F into close contact with the protruding top surface 4B of the heat dissipation cover member 4, the heat dissipation efficiency of each LED package 7 is further increased.
For the same reason, each electrode layer 7F of each LED package 7 shown in FIGS. 2, 4, 5, 6, and 7 is provided with a heat dissipation cover member 4 through a uniform and thin adhesive layer such as an epoxy resin. You may adhere to the protruding top surface 4B.
Next, a fluorescent lamp type LED illumination lamp according to a second embodiment of the present invention will be described. The fluorescent lamp type LED illuminating lamp of the second embodiment corresponds to the light transmitting cover 3, the heat radiating cover member 4, the package substrate 5, and the LED package 7 in the fluorescent lamp type LED illuminating lamp of the first embodiment shown in FIG. As components, a translucent cover 13, a heat radiating cover member 14, a package substrate 15 and an LED package 17 as shown in FIG. 8 are provided.
As shown in FIG. 8, a lenticular lens 13 </ b> A that diffuses the lighting light of the LED package 17 in the circumferential direction is formed on the inner surface of the translucent cover 13. Further, the heat radiation cover member 14 is formed into a groove-shaped cross-sectional shape by extrusion molding of an aluminum alloy, and the slit-like opening edge portions 13B and 13B of the translucent cover 13 are attached to and detached from the end portion on the opening side. Clamping portions 14A and 14A that are freely sandwiched are formed. Here, the LED package 17 has a general structure including lead frames 7F and 17F having a thickness of about 0.15 to 0.20 mm to which the LED chip 17C is connected via wires 17G and 17G as electrodes. Yes. The LED package 17 is fixed to the bottom portion 14 </ b> B of the heat dissipation cover member 14 via the package substrate 15, thereby contacting the inner surface of the bottom portion 14 </ b> B of the heat dissipation cover member 14.
In the fluorescent lamp type LED illuminating lamp of the second embodiment, the same effect as that of the fluorescent lamp type LED illuminating lamp of the first embodiment can be obtained, and the lenticular lens 13A of the translucent cover 13 can be used to The lighting light of each LED chip 17C can be diffused in the circumferential direction of the translucent cover 13 and irradiated over a wide range.
Here, the vertical cross-sectional shape of the heat dissipation cover member 14 shown in FIG. 8 in the fluorescent lamp type LED lighting lamp of the second embodiment can be changed to the vertical cross-sectional shape shown in FIG. The heat radiating cover member 14 is formed in a shallow groove shape in which sandwiching portions 14A and 14A are continuous on both sides of the bottom portion 14B, and left and right side wall portions 14C and 14C rise from the sandwiching portions 14A and 14A. Each LED package 17 is installed, and partition walls 14D and 14D having substantially the same height as the left and right side wall portions 14C and 14C are integrally formed on the outer surface of the bottom portion 14B.
In the modification of the second embodiment shown in FIG. 9, each LED package 7 installed on the inner surface of the bottom portion 14 </ b> B of the heat dissipation cover member 14 is positioned near the slit-like opening of the translucent cover 13. The lighting range of the LED chip 17 </ b> C expands to the range indicated by α in FIG. 9 in the circumferential direction of the translucent cover 13.
Moreover, the longitudinal cross-sectional shape of the heat radiating cover member 14 shown in FIG. 8 in the fluorescent lamp type LED lighting lamp of 2nd Embodiment can be changed into the longitudinal cross-sectional shape shown in FIG. The heat radiating cover member 14 is formed in a reverse groove shape in which a bottom portion 14B is located radially outward from the slit-like opening of the translucent cover 13, and each LED package 17 is installed on the inner surface of the bottom portion 14B. A plurality of radiating fins 14E and 14E are integrally formed on the outer surface of the bottom portion 14B.
In the modification of the second embodiment shown in FIG. 10, each LED package 7 installed on the inner surface of the bottom portion 14 </ b> B of the heat dissipation cover member 14 is positioned radially outward from the slit-like opening of the translucent cover 13. Therefore, the irradiation range of the lighting light of each LED chip 17 </ b> C greatly expands to the range indicated by β in FIG. 10 in the circumferential direction of the translucent cover 13.
In the modification of the second embodiment shown in FIGS. 9 and 10, the lenticular lens 13A formed on the inner surface of the translucent cover 13 is not essential and may be omitted.
Moreover, in the fluorescent lamp type LED lighting lamp of 2nd Embodiment, although the thickness of an LED package is not restrict | limited at all, the aspect with the said thin thickness is demonstrated below.
For example, in FIGS. 8 to 10, when the thickness of the LED package is made relatively thin, a straight line is drawn vertically from the center point of the LED chip upper surface (light projecting surface) to the inner wall of the translucent cover. It becomes possible to make the length (δ) of the vertical line relatively long. By doing so, the addition amount of the light diffusing agent contained in the translucent cover can be relatively reduced, and as a result, the LED package can be made difficult to be visually recognized as grains, and the desired brightness is uniformly white. Can be light.
On the other hand, in the fluorescent lamp type LED lighting lamp in which the distance between the LED package and the translucent cover is short, unless a large amount of light diffusing agent is added, irregular reflection is insufficient and uniform light cannot be obtained. Increasing the amount of the diffusing agent may cause a problem that light is hardly transmitted.
Moreover, as an example of the fluorescent lamp type LED illumination lamp of the second embodiment, the distance from the bottom surface of the LED chip to the protruding top surface 4B of the groove-type heat radiating member 4 is short, for example, 0.3 mm or less, and / or The δ is long, for example, preferably 25 mm or more.
Subsequently, a fluorescent lamp type LED illumination lamp according to a third embodiment of the present invention will be described. The fluorescent lamp type LED illumination lamp of the third embodiment is configured as an annular fluorescent lamp type LED illumination lamp as shown in FIG. This annular fluorescent lamp type LED lighting lamp includes an annular light-transmitting cover 23 having both ends continuous via a single base 22 having four terminals 21, 21. And a heat-radiating cover member 24 having an annular shape in plan view, which is attached to a slit-like opening formed in a part of the peripheral surface, and the longitudinal sectional structure thereof is shown in FIGS. 2 and 4 to 10. Various vertical cross-sectional structures can be used.

Claims (8)

  1.  既存の蛍光灯ソケットに接続可能な端子を有する口金を備えた直管形または円環形の蛍光灯型LED照明灯であって、
     前記口金が装着される管状を呈し、その周面一部に切割り状開口部を有する透光カバーと、
     前記透光カバーの切割り状開口部に装着される放熱カバー部材と、
    LEDチップを有する複数のLEDパッケージが長手方向に沿って配列される長板状または円環板状を呈し、前記放熱カバー部材の内面に前記複数のLEDパッケージが接触する状態で放熱カバー部材に固定されるパッケージ基板とを備えていることを特徴とする蛍光灯型LED照明灯。
    A straight tube type or an annular type fluorescent lamp type LED illumination lamp having a base having a terminal connectable to an existing fluorescent lamp socket,
    Presenting a tubular shape to which the base is mounted, a translucent cover having a slit-like opening on a part of its peripheral surface;
    A heat dissipating cover member attached to the slit-like opening of the translucent cover;
    A plurality of LED packages having LED chips have a long plate shape or an annular plate shape arranged along the longitudinal direction, and are fixed to the heat dissipation cover member in a state where the plurality of LED packages are in contact with the inner surface of the heat dissipation cover member. And a fluorescent lamp type LED illumination lamp.
  2.  前記複数のLEDパッケージは、前記LEDチップの投光方向と反対側の基端面から突出する状態でLEDチップに接触する電極層をそれぞれ有し、各電極層が前記放熱カバー部材の内面に接触する状態で各LEDパッケージが前記パッケージ基板に形成された複数の装着穴にそれぞれ嵌め込んで装着されていることを特徴とする請求項1に記載の蛍光灯型LED照明灯。 Each of the plurality of LED packages has an electrode layer that contacts the LED chip in a state of protruding from a base end surface opposite to the light projecting direction of the LED chip, and each electrode layer contacts an inner surface of the heat dissipation cover member. 2. The fluorescent lamp type LED illumination lamp according to claim 1, wherein each LED package is fitted in a plurality of mounting holes formed in the package substrate.
  3.  前記放熱カバー部材は、前記透光カバーの切割り状開口部から突入する溝型に形成されていることを特徴とする請求項1または2に記載の蛍光灯型LED照明灯。 The fluorescent lamp type LED illumination lamp according to claim 1 or 2, wherein the heat radiation cover member is formed in a groove shape that enters from a slit-like opening of the translucent cover.
  4.  前記LEDパッケージと共に前記パッケージ基板を前記放熱カバー部材の内面側に押圧する締結手段を備え、この締結手段を介してパッケージ基板が放熱カバー部材に固定されていることを特徴とする請求項1~3の何れか1項に記載の蛍光灯型LED照明灯。 A fastening means for pressing the package substrate together with the LED package against the inner surface side of the heat dissipation cover member is provided, and the package substrate is fixed to the heat dissipation cover member via the fastening means. The fluorescent lamp type LED illumination lamp according to any one of the above.
  5.  前記放熱カバー部材の内面には、前記各LEDパッケージに弾性接触するばね片が形成されていることを特徴とする請求項1~4の何れか1項に記載の蛍光灯型LED照明灯。 5. The fluorescent lamp type LED illumination lamp according to claim 1, wherein a spring piece elastically contacting each LED package is formed on an inner surface of the heat radiation cover member.
  6.  前記口金の端子およびパッケージ基板に接続される電源ユニットが溝型に形成された前記放熱カバー部材の溝部内に配置されていることを特徴とする請求項3~5の何れか1項に記載の蛍光灯型LED照明灯。 6. The power source unit connected to the terminal of the base and the package substrate is disposed in a groove portion of the heat radiation cover member formed in a groove shape. Fluorescent lamp type LED lighting.
  7.  前記透光カバーの切割り状開口部から突入する溝型に形成された前記放熱カバー部材の左右の外側面には、突入端部側の幅が基端部側の幅より漸次狭くなるように傾斜する反射面が形成されていることを特徴とする請求項3~6の何れか1項に記載の蛍光灯型LED照明灯。 On the left and right outer surfaces of the heat dissipation cover member formed in a groove shape that pierces from the slit-like opening of the translucent cover, the width of the rushing end side is gradually narrower than the width of the base end side. The fluorescent lamp type LED illumination lamp according to any one of claims 3 to 6, wherein an inclined reflection surface is formed.
  8.  前記透光カバーの断面中央部から切割り状開口部側に寄った位置に前記LEDパッケージが配置されていることを特徴とする請求項1~7の何れか1項に記載の蛍光灯型LED照明灯。 The fluorescent lamp type LED according to any one of claims 1 to 7, wherein the LED package is arranged at a position close to a slit-like opening side from a central portion of the cross section of the translucent cover. Lighting light.
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Cited By (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012142167A (en) * 2010-12-28 2012-07-26 Panasonic Corp Lamp and lighting system
WO2012138937A1 (en) * 2011-04-08 2012-10-11 Lunera Lighting, Inc. Light well providing wide angle up lighting in a led luminaire
JP2013114923A (en) * 2011-11-29 2013-06-10 Useful Person:Kk Straight-tube type led lighting device
WO2014008463A1 (en) * 2012-07-06 2014-01-09 Ilumisys, Inc. Power supply assembly for led-based light tube
US8807785B2 (en) 2008-05-23 2014-08-19 Ilumisys, Inc. Electric shock resistant L.E.D. based light
US8840282B2 (en) 2010-03-26 2014-09-23 Ilumisys, Inc. LED bulb with internal heat dissipating structures
US8894430B2 (en) 2010-10-29 2014-11-25 Ilumisys, Inc. Mechanisms for reducing risk of shock during installation of light tube
US8901823B2 (en) 2008-10-24 2014-12-02 Ilumisys, Inc. Light and light sensor
US8928025B2 (en) 2007-12-20 2015-01-06 Ilumisys, Inc. LED lighting apparatus with swivel connection
US8946996B2 (en) 2008-10-24 2015-02-03 Ilumisys, Inc. Light and light sensor
US9013119B2 (en) 2010-03-26 2015-04-21 Ilumisys, Inc. LED light with thermoelectric generator
US9101026B2 (en) 2008-10-24 2015-08-04 Ilumisys, Inc. Integration of LED lighting with building controls
JP2015222731A (en) * 2015-08-07 2015-12-10 ローム株式会社 LED lighting device
US9267650B2 (en) 2013-10-09 2016-02-23 Ilumisys, Inc. Lens for an LED-based light
US9285084B2 (en) 2013-03-14 2016-03-15 Ilumisys, Inc. Diffusers for LED-based lights
US9353939B2 (en) 2008-10-24 2016-05-31 iLumisys, Inc Lighting including integral communication apparatus
US9510400B2 (en) 2014-05-13 2016-11-29 Ilumisys, Inc. User input systems for an LED-based light
US9574717B2 (en) 2014-01-22 2017-02-21 Ilumisys, Inc. LED-based light with addressed LEDs
US9807842B2 (en) 2012-07-09 2017-10-31 Ilumisys, Inc. System and method for controlling operation of an LED-based light
US10161568B2 (en) 2015-06-01 2018-12-25 Ilumisys, Inc. LED-based light with canted outer walls
WO2020015429A1 (en) * 2019-02-14 2020-01-23 旭宇光电(深圳)股份有限公司 High-power remote phosphor-type white light led heat dissipation packaging
CN112952400A (en) * 2021-02-01 2021-06-11 西安电子科技大学 Broadband wave-absorbing structure with high-transmittance wave-transmitting window

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016086901A2 (en) * 2014-12-05 2016-06-09 Jiaxing Super Lighting Electric Appliance Co., Ltd Led tube lamp
TWI464348B (en) * 2012-01-17 2014-12-11 南亞光電股份有限公司 Tube type led lighting assembly
US10560989B2 (en) 2014-09-28 2020-02-11 Jiaxing Super Lighting Electric Appliance Co., Ltd LED tube lamp
US10514134B2 (en) 2014-12-05 2019-12-24 Jiaxing Super Lighting Electric Appliance Co., Ltd LED tube lamp

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004045192A (en) * 2002-07-11 2004-02-12 Kyoto Denkiki Kk Luminaire
JP2005038771A (en) * 2003-07-17 2005-02-10 Mitsubishi Electric Corp Surface light source, display device and guiding light device
JP2006236895A (en) * 2005-02-28 2006-09-07 Iwasaki Electric Co Ltd Led unit and lighting system
JP3145174U (en) * 2008-07-01 2008-10-02 株式会社ディーケイプラスチック Synthetic resin fluorescent lampshade with two-color molded light diffusibility
JP3146172U (en) * 2008-08-26 2008-11-06 熱速得控股股▲ふん▼有限公司 LED lighting fixture
JP3148721U (en) * 2008-12-11 2009-02-26 株式会社サンテック LED lighting device
JP3151501U (en) * 2008-12-22 2009-06-25 馨意科技股▲分▼有限公司 Structure of light-emitting diode lamp tube

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7535030B2 (en) * 2007-05-22 2009-05-19 Hsiang-Chou Lin LED lamp with exposed heat-conductive fins

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004045192A (en) * 2002-07-11 2004-02-12 Kyoto Denkiki Kk Luminaire
JP2005038771A (en) * 2003-07-17 2005-02-10 Mitsubishi Electric Corp Surface light source, display device and guiding light device
JP2006236895A (en) * 2005-02-28 2006-09-07 Iwasaki Electric Co Ltd Led unit and lighting system
JP3145174U (en) * 2008-07-01 2008-10-02 株式会社ディーケイプラスチック Synthetic resin fluorescent lampshade with two-color molded light diffusibility
JP3146172U (en) * 2008-08-26 2008-11-06 熱速得控股股▲ふん▼有限公司 LED lighting fixture
JP3148721U (en) * 2008-12-11 2009-02-26 株式会社サンテック LED lighting device
JP3151501U (en) * 2008-12-22 2009-06-25 馨意科技股▲分▼有限公司 Structure of light-emitting diode lamp tube

Cited By (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8928025B2 (en) 2007-12-20 2015-01-06 Ilumisys, Inc. LED lighting apparatus with swivel connection
US8807785B2 (en) 2008-05-23 2014-08-19 Ilumisys, Inc. Electric shock resistant L.E.D. based light
US9398661B2 (en) 2008-10-24 2016-07-19 Ilumisys, Inc. Light and light sensor
US9353939B2 (en) 2008-10-24 2016-05-31 iLumisys, Inc Lighting including integral communication apparatus
US11333308B2 (en) 2008-10-24 2022-05-17 Ilumisys, Inc. Light and light sensor
US10973094B2 (en) 2008-10-24 2021-04-06 Ilumisys, Inc. Integration of LED lighting with building controls
US10932339B2 (en) 2008-10-24 2021-02-23 Ilumisys, Inc. Light and light sensor
US10560992B2 (en) 2008-10-24 2020-02-11 Ilumisys, Inc. Light and light sensor
US10342086B2 (en) 2008-10-24 2019-07-02 Ilumisys, Inc. Integration of LED lighting with building controls
US10182480B2 (en) 2008-10-24 2019-01-15 Ilumisys, Inc. Light and light sensor
US8946996B2 (en) 2008-10-24 2015-02-03 Ilumisys, Inc. Light and light sensor
US10036549B2 (en) 2008-10-24 2018-07-31 Ilumisys, Inc. Lighting including integral communication apparatus
US9101026B2 (en) 2008-10-24 2015-08-04 Ilumisys, Inc. Integration of LED lighting with building controls
US9635727B2 (en) 2008-10-24 2017-04-25 Ilumisys, Inc. Light and light sensor
US9585216B2 (en) 2008-10-24 2017-02-28 Ilumisys, Inc. Integration of LED lighting with building controls
US8901823B2 (en) 2008-10-24 2014-12-02 Ilumisys, Inc. Light and light sensor
US8840282B2 (en) 2010-03-26 2014-09-23 Ilumisys, Inc. LED bulb with internal heat dissipating structures
US9013119B2 (en) 2010-03-26 2015-04-21 Ilumisys, Inc. LED light with thermoelectric generator
US8894430B2 (en) 2010-10-29 2014-11-25 Ilumisys, Inc. Mechanisms for reducing risk of shock during installation of light tube
JP2012142167A (en) * 2010-12-28 2012-07-26 Panasonic Corp Lamp and lighting system
US8915611B2 (en) 2011-04-08 2014-12-23 Lunera Lighting, Inc. Light well providing wide angle up lighting in an LED luminaire
WO2012138937A1 (en) * 2011-04-08 2012-10-11 Lunera Lighting, Inc. Light well providing wide angle up lighting in a led luminaire
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US9267650B2 (en) 2013-10-09 2016-02-23 Ilumisys, Inc. Lens for an LED-based light
US10260686B2 (en) 2014-01-22 2019-04-16 Ilumisys, Inc. LED-based light with addressed LEDs
US9574717B2 (en) 2014-01-22 2017-02-21 Ilumisys, Inc. LED-based light with addressed LEDs
US9510400B2 (en) 2014-05-13 2016-11-29 Ilumisys, Inc. User input systems for an LED-based light
US10161568B2 (en) 2015-06-01 2018-12-25 Ilumisys, Inc. LED-based light with canted outer walls
US11428370B2 (en) 2015-06-01 2022-08-30 Ilumisys, Inc. LED-based light with canted outer walls
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