WO2010135866A1

WO2010135866A1 - Led illumination device and method for manufacturing the same

Info

Publication number: WO2010135866A1
Application number: PCT/CN2009/072014
Authority: WO
Inventors: 赵捷
Original assignee: Zhao Jie
Priority date: 2009-05-27
Filing date: 2009-05-27
Publication date: 2010-12-02

Abstract

A LED illumination device and method for manufacturing the same. The LED illumination device comprises a substrate (10) with a circuitry, at least two LED chips (20) fixed on the substrate (10), and a transparent cover (80) with fluorescent material fixed above each of the LED chips (20). The distance between every two LED chips (20) is 2mm-6mm. The anode and cathode of each of the LED chips (20) are connected with the circuitry of the substrate (10) by wires (50).

Description

LED lighting device and manufacturing method thereof

Technical field

The present invention belongs to the field of semiconductor devices, and in particular, to an LED lighting device and a method of fabricating the same. Background technique

[2] The existing LED lighting devices are usually made of white LEDs that have been packaged (currently mainly DIP LEDs and SMD LEDs).

Disclosure of invention

technical problem

[3] A lighting device made in the prior art, because the center brightness of the LED is high, and the spacing between the LEDs is large

(greater than 6mm), the light emitted by the luminaire is one bright spot, and the center brightness is very high, and the glare is very large, making the eyes feel uncomfortable.

Technical solution

[4] The technical problem to be solved by the embodiments of the present invention is to provide a low-glare, no-brightness LED illumination device and a method of fabricating the same.

[5] In order to solve the above technical problem, an embodiment of the present invention provides an LED lighting device. The LED lighting device includes: a substrate with a line, and at least two LED chips are fixed on the circuitized substrate, each of which The distance between the LED chips is 2mm~6mm, and the positive and negative poles of each LED chip and the circuit of the circuit board with the circuit are electrically connected by a conductive line, and a fluorescent substance is fixed above each LED chip. Transparent cover.

[6] The embodiment of the invention further provides a method for manufacturing an LED lighting device, the method comprising the following steps:

[7] injecting a bonding material on the substrate with the line, placing at least two LED chips on the bonding material on the circuitized substrate, and fixing the at least two LED chips to the substrate with the line Together, every two

The spacing between the LED chips is 2mm ~ 6mm;

[8] baking the bonding material;

[9] 电 electrically connecting the positive and negative poles of each LED chip to the circuit on the circuit board with a conductive line;

[10] The transparent material and the fluorescent material are uniformly mixed in a predetermined ratio, and are produced by one injection molding. A transparent cover containing a fluorescent substance is attached to the substrate with wiring.

Beneficial effect

[11] In the embodiment of the present invention, since the spacing between each two LED chips is limited to a scientific range of 2 mm < d < 6 mm, the light between adjacent LED chips is complemented to form a uniform optical band. Eliminates the bright spots of conventional packaged LEDs (DIP or SMD), reduces glare, and makes the lighting of LED lighting devices very soft.

DRAWINGS

1 is a schematic structural diagram of an LED lighting device according to an embodiment of the present invention;

[13] Figure 2 is a schematic diagram showing the light intensity distribution of a single conventional package white LED;

[14] Figure 3 is a schematic diagram showing the light intensity distribution of a single blue LED;

[15] Figure 4 is a schematic diagram showing the light intensity distribution of a plurality of blue LEDs;

FIG. 5 is a schematic diagram of light intensity distribution of an LED lighting device according to an embodiment of the present invention; FIG.

6 is a schematic flow chart showing the implementation of a method for manufacturing an LED lighting device according to an embodiment of the present invention.

Embodiments of the invention

[18] In order to make the technical problems, technical solutions, and advantageous effects of the present invention more comprehensible, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It is understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

[19] Please refer to FIG. 1 , which is an LED lighting device according to an embodiment of the present invention. The LED lighting device includes: a substrate 10 with a line, and the substrate 10 with a line can be a substrate made of aluminum material. For aluminum substrates with wiring). At least two LED chips 20 are fixed on the circuit board 10 with a line, and a distance d between each two L ED chips 20 satisfies 2 mm < d < 6 mm. A glue injection hole 30 and an air outlet hole 40 are formed in the circuit board 10 with a line. The positive and negative electrodes of each LED chip 20 and the circuit of the substrate 10 with lines are electrically connected by a conductive line 50, which may be a gold wire. A first encapsulating material 60 is injected between each of the LED chips 20 and the substrate 10 with the wiring, and the first encapsulating material 60 covers each of the LED chips 20. A lead-out electrode 70 for deriving a power source is provided in the substrate 10 with a line. A transparent cover 80 containing a fluorescent substance is fixed above each of the LED chips 20. A second encapsulation material 90 is implanted between the substrate 10 with circuitry and a transparent cover 80 containing phosphor.

[20] In the embodiment of the present invention, the LED chip 20 can use blue GaN, and the LED chip 20 can be used with low power. At 0.2W LED chip. The transparent cover 80 containing the fluorescent substance may be made of acrylic, PC or glass. The fluorescent substance can be YAG, TAG or silicate. The encapsulating material can be made of silicone, silicone or other UV-resistant transparent materials.

[21] The following illustration shows that the distance d between two LED chips satisfies 2 mm < d < 6 mm, which can effectively reduce glare.

[22] As shown in Fig. 2, the light intensity distribution of a single conventional package white LED has a strong light intensity at the center position, and multiple white LED combinations will produce obvious bright spots and glare. Fig. 3 is a diagram showing the light intensity distribution of a single blue LED according to an embodiment of the present invention, which is similar to the light intensity of a conventional packaged white LED. When the blue light intensity distribution of a plurality of blue LEDs that are in accordance with the spacing between each of the two LED chips is 2 mm to 6 mm, as shown in Fig. 4, the difference between the maximum light intensity and the minimum light intensity becomes small. By the action of a transparent cover containing a fluorescent substance, on the one hand, the thickness of the transparent cover is designed according to the blue light intensity distribution, that is, where the blue light is strong, the thickness thereof is relatively thick, that is, the fluorescent material is relatively large, and the thickness of the blue light is weak. Thin, that is, less fluorescent substances, so the color produced by the action of blue light and fluorescent substances is relatively uniform, and the light intensity distribution is close to a straight line (as shown in Figure 5), and the transparent cover containing fluorescent substance is far away from the chip. (The conventional packaged fluorescent material is close to the chip), thereby increasing the light-emitting area of the fluorescent material, and the light-emitting area of the single LED chip is equivalent to 9 times that of the DIP-type LED, which is equivalent to 4 times that of the SMD-type LED, and the unit area is reduced. The brightness on the upper side reduces glare.

[23] Please refer to FIG. 6, which is a method for manufacturing an LED lighting device according to an embodiment of the present invention, which includes the following steps:

[24] In step S101, the injection hole 30 and the air outlet 40 are formed on the substrate 10 with the line;

[25] In step S102, a bonding material is injected on the substrate 10 with the line, and at least two LED chips 20 are placed on the bonding material on the circuitized substrate 10, so that the at least two LEDs are The chip 20 is fixed together with the substrate 10 with a line, and the spacing d between each two LED chips 20 satisfies 2 mm < d < 6 mm;

[26] in step S103, baking the bonding material;

[27] In step S104, the positive and negative electrodes of each of the LED chips 20 are electrically connected to the circuits on the substrate 10 with the wires by the conductive wires 50;

[28] In step S105, the transparent material and the fluorescent material are uniformly mixed in a predetermined ratio, and a transparent cover containing a fluorescent substance is formed by one injection molding, and the lower surface of the transparent cover containing the fluorescent substance is flat. The upper surface has an irregular shape, and the specific shape can be designed according to the light intensity distribution of each LED chip; [29] In step S106, a first packaging material is injected between each LED chip 20 and the substrate with the line. 60, the first encapsulating material 60 wraps each LED chip 20, and dries the first encapsulating material 60;

[30] In step S107, the derivation electrode 70 for deriving the power source is mounted on the substrate 10 with the line;

[31] In step S108, the transparent cover containing the fluorescent substance is fixed on the substrate with the line;

[32] In step S109, a second encapsulating material 90 is injected between the substrate 10 with wiring and the transparent cover containing the fluorescent material, and the second encapsulating material 90 is dried.

[33] The embodiments of the present invention can be applied to various illumination devices such as LED fluorescent lamps, LED street lamps, LED spotlights, LED desk lamps, and LED bulbs.

[34] It can be seen from the above that the embodiment of the present invention limits the spacing between each two LED chips to a scientific range of 2 mm < d < 6 m m, so that the light between adjacent LED chips is complementary to form a uniform The light strip eliminates the bright spots of conventional packaged LEDs (DIP or SMD), reduces glare, and makes the light of the LED lighting device very soft. Secondly, due to the flat-up structure of the transparent cover containing the fluorescent substance, and the use of the substrate with the line The injection hole and the air outlet hole realize the injection of the packaging material and the smooth discharge of the internal air, thereby greatly improving the light extraction efficiency; again, since the lead-out electrode for deriving the power source is provided on the substrate with the line, the LED illumination device is made The front side does not see any lines, and the appearance is very beautiful. In addition, since the fluorescent material is isolated from the LED chip by the secondary packaging technology, the life of the LED is long.

The above is only the preferred embodiment of the present invention, and is not intended to limit the present invention, and any modifications, equivalents, and improvements made within the spirit and scope of the present invention should be included in the present invention. Within the scope of protection of the invention.

Claims

Claim

[1] An LED lighting device, wherein the LED lighting device comprises: a substrate with a line

At least two LED chips are fixed on the circuit board with a line, and the spacing between each two LED chips is between 2 mm and 6 mm, between the positive and negative poles of each LED chip and the circuit of the circuit board with the line A transparent cover containing a fluorescent substance is fixed on each of the LED chips by electrically connecting the conductive wires

[2] The LED lighting device according to claim 1, wherein a glue injection hole and an air outlet hole are formed in the circuit board.

[3] The LED lighting device according to claim 1, wherein the lower surface of the transparent cover containing the fluorescent material is a flat surface, and the upper surface is a shape designed according to a light intensity distribution of each of the LED chips.

[4] The LED lighting device according to claim 1, wherein a lead-out electrode for deriving a power source is provided in the circuit board with a line.

[5] The LED lighting device of claim 1, wherein a first encapsulating material is provided between each of the LED chips and the circuitized substrate, and the first encapsulating material covers each of the LED chips

[6] The LED lighting device of claim 1, wherein a second encapsulating material is provided between the substrate with a line and the transparent cover containing the fluorescent substance.

[7] A method of manufacturing an LED lighting device, characterized in that the method comprises the steps of: injecting a bonding material on a substrate with a line, and placing at least two LED chips on the substrate with a line; Bonding the at least two LED chips to the substrate with the line, the spacing between each two LED chips is 2mm ~ 6mm;

Baking the bonding material dry;

电 electrically connecting the positive and negative electrodes of each LED chip to the circuit on the substrate with the line by using a conductive wire; the transparent material and the fluorescent material are uniformly mixed in a predetermined ratio, and the transparent material containing the fluorescent substance is formed by one injection molding. The cover is attached to the substrate with the line.

[8] The method according to claim 7, wherein the lower surface of the transparent cover containing the fluorescent substance is a plane, and the upper surface is a shape designed according to a light intensity distribution of each LED chip; Before the step of injecting the bonding material on the substrate, the following steps are also included: A glue injection hole and an air outlet hole are formed on the circuit board with the line.

[9] The method according to claim 7, wherein the transparent material and the fluorescent substance are uniformly mixed in a predetermined ratio, and the transparent cover containing the fluorescent substance is fixed by a single injection molding to be fixed on the line. Before the steps on the substrate, the following steps are also included:

A lead-out electrode for deriving the power source is mounted on the substrate with the line.

[10] The method according to claim 7, wherein the transparent material and the fluorescent material are uniformly mixed in a predetermined ratio, and the transparent cover containing the fluorescent substance is fixed by a single injection molding to be fixed on the line. Before the steps on the substrate, the following steps are also included:

Injecting a first encapsulating material between each of the LED chips and the circuitized substrate, the first encapsulating material covering each of the LED chips, and drying the first encapsulating material;

The step of mixing the transparent material and the fluorescent material in a predetermined ratio and uniformly forming the transparent cover containing the fluorescent substance on the substrate with the line by one injection molding further includes the following steps:

A second encapsulating material is injected between the substrate with the line and the transparent cover containing the fluorescent substance, and the second encapsulating material is dried.