WO2010108362A1 - Heat dissipating structure with heat conducting and heat dissipating ink layer - Google Patents
Heat dissipating structure with heat conducting and heat dissipating ink layer Download PDFInfo
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- WO2010108362A1 WO2010108362A1 PCT/CN2009/074161 CN2009074161W WO2010108362A1 WO 2010108362 A1 WO2010108362 A1 WO 2010108362A1 CN 2009074161 W CN2009074161 W CN 2009074161W WO 2010108362 A1 WO2010108362 A1 WO 2010108362A1
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- heat dissipating
- layer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the utility model relates to a heat dissipating structure: in particular to a heat dissipating structure composed of a heat conducting, a heat dissipating ink and a heat conducting gel, and can be connected to a surface of a rigid or flexible plane and any shape curved surface heating body.
- hybrid integrated circuits usually include active chips such as integrated circuit (IC) chips or some other electronic components and other types of active components and meta-source components ( Or device), these components either generate heat during operation or withstand heat generated by other components or environments of the HIC; some of these components may be damaged by this heat; for example, the component is supported from the support plate Disengagement, rupture of components, breakage of conductors that connect components to the support base, changes in operating characteristics, etc.; in order to dissipate heat from at least some components of the HIC that are susceptible to heat, many types of heat-dissipating areas have been designed. Heat sink to accommodate heat sources with high heat generation.
- IC integrated circuit
- Or device meta-source components
- the general-purpose radiators are mainly aluminum extrusion type, die-casting type and folding type; among them, the manufacture of aluminum extrusion type and die-casting type heat sink is limited by the machining ability, and the degree of density (total heat dissipation area per unit volume) Limited, so the heat source with higher heat generation has a larger volume and weight.
- the folded heat sink uses metal sheets as the fins to be stacked continuously, and its denseness is high, so it is more efficient than the first two. Better, and the volume and weight are easily accepted by the industry.
- a fan is generally coupled to the heat sink for assisting heat dissipation.
- the fan is fixed to the heat sink by a suitable fixing structure, and when the fan is driven, the fan can be driven around. The cold air is blown to the heat sink to help dissipate heat. Therefore, the heat dissipation devices of the above traditional electronic circuits (such as PCB) (see Figure 1) are not only complicated to install, high in cost, but also bulky and inconvenient to carry and repair and not The ideal cooling effect is greatly limited.
- Utility model content such as PCB
- the utility model discloses a heat dissipation structure with heat conduction and heat dissipation ink. It has the characteristics of simple structure and convenient application.
- the utility model relates to a heat dissipation structure with heat conduction and heat dissipation ink, and the technical scheme thereof is as follows:
- the heat dissipation structure with heat conduction and heat dissipation ink comprises a carrier plate and a heating element; and further comprises a heat conduction or heat dissipation ink And a heat-sensitive layer, and a pressure-sensitive adhesive layer having a heat-conducting function, wherein upper and lower surfaces of the carrier plate are respectively connected to the heat-dissipating layer and the pressure-sensitive adhesive layer in one-to-one correspondence, and the pressure-sensitive adhesive layer is further One side is bonded to the heating element.
- the heat conductive, heat dissipating ink and pressure sensitive adhesive can be used for spraying and printing on flat surface and any curved carrier; and the pressure sensitive adhesive can be quickly and firmly adhered to any rigid or flexible or metal or non-metal heating surface. .
- the carrier may be rigid or flexible or a conductive layer or a non-metal or non-metal such as aluminum, copper, ceramic, plastic, glass or glass cloth (epoxy copper clad sheet FR-4) a conductive layer; and the surface of the heat generating body may be rigid or flexible or a plane in a metal or non-metal or a shape of any curved surface.
- the utility model Compared with the prior art, the utility model has the advantages that: the utility model not only improves the problem of poor heat dissipation effect of the conventional PCB board or any heat generating component, but also solves the problem that the carrier board or the heat sink device is excessively heavy and high in cost.
- the installation is complicated and the like, and provides a structure type with strong operability, direct heat dissipation, high efficiency, and suitable for rigid PCB boards and flexible PCB boards (FPCB) or any heat-generating components.
- Figure 1 is a conventional heat sink structure
- FIG. 2 is a schematic view (cross-sectional view) of a heat dissipating structure when the surface of the heating element is flat
- FIG. 3 is a schematic view (cross-sectional view) of the heat dissipating structure when the surface of the heating element is different from the curved surface of the present invention
- Schematic diagram of the heat dissipation mechanism of the preferred embodiment cross-sectional view, the arrows indicate the direction and path of heat propagation).
- 01 heat dissipation layer, 02, carrier board, 03, pressure sensitive adhesive layer, 04, heating element, 07, fan, 08, traditional metal radiator.
- a heat dissipation structure having heat conduction and heat dissipation ink includes a carrier 02 and a heat generating body 04; a heat dissipation layer 01 having heat conducting or heat dissipating ink, and a pressure sensitive adhesive layer having a heat conducting function.
- the upper and lower surfaces of the carrier 02 are respectively connected to the heat dissipation layer 01 and the pressure sensitive adhesive layer 03 in one-to-one correspondence, and the other surface of the pressure sensitive adhesive layer 03 is bonded to the heating element 04. .
- the heating element 04 When the heating element 04 generates heat, a small part of the heat generated is directly radiated into the air, and the other part is absorbed by the high thermal conductivity pressure sensitive layer 03, and then transmitted to the carrier 02, and then high.
- the heat-dissipating, heat-dissipating heat-dissipating layer 01 absorbs and dissipates into the air (Fig. 4).
- the heat dissipation layer 01 is composed of a heat conductive or heat dissipating ink;
- the pressure sensitive adhesive layer 03 is composed of a highly viscous and heat conductive material; both of which can be used for spraying and printing of a flat surface and any curved carrier 02;
- the pressure layer of the pressure sensitive adhesive layer 03 can be quickly and firmly adhered to any heat-generating surface of a rigid or flexible or metal or non-metal material.
- the carrier 02 may be rigid or flexible or a conductive layer of a full-surface metal or non-metal such as aluminum, copper, ceramic, plastic, glass or glass cloth (epoxy copper-clad board FR-4) or The non-conductive layer; and the surface of the heating element 04 may be rigid or flexible or a plane in a metal or non-metal or a shape of any curved surface.
- a full-surface metal or non-metal such as aluminum, copper, ceramic, plastic, glass or glass cloth (epoxy copper-clad board FR-4) or The non-conductive layer
- the surface of the heating element 04 may be rigid or flexible or a plane in a metal or non-metal or a shape of any curved surface.
- the present scheme describes a heat sink with good heat dissipation and heat dissipation performance, convenient installation, and simple structure, which can well solve the heat dissipation defects existing in the prior art.
Abstract
A heat dissipating structure with a heat conducting and heat dissipating ink layer is provided. The heat dissipating structure comprises a carrier substrate (02), a heat generating body (04), a heat dissipating layer made of heat conducting and heat dissipating ink, and a pressure-sensitive adhesive layer (03) with heat conducting effect. The upper and lower surface of the carrier substrate (02), respectively, contacts with the heat dissipating layer (01) and the pressure-sensitive adhesive layer (03), and the other surface of the pressure-sensitive adhesive layer (03) and the heat source (04) adhere to each other. The heat conducting and heat dissipating ink and the pressure-sensitive adhesive can be used for spraying and printing on a plane carrier substrate and any curved carrier substrate, and the pressure-sensitive adhesive layer can be rapidly and firmly pasted on a heat generating surface made of any rigid, flexible, metal or non-metal material. The structure improves heat dissipating effect of a conventional PCB board or any heat generating element, while addressing issues of the excessive weight, high cost, and installation complexity of the carrier substrate or heat dissipating device.
Description
具有导热及散热油墨层的散热结构 Heat dissipation structure with heat conduction and heat dissipation ink layer
技术领域 Technical field
本实用新型涉及一种散热结构:尤其是一种由导热、 散热油墨和导热胶构 成的散热结构， 且可连接于刚性或柔性平面及任何形状曲面发热体的表面。 背景技术 The utility model relates to a heat dissipating structure: in particular to a heat dissipating structure composed of a heat conducting, a heat dissipating ink and a heat conducting gel, and can be connected to a surface of a rigid or flexible plane and any shape curved surface heating body. Background technique
随着科技的不断发展， 电子电路 (如 PCB)向多层， 高密集发展， 以及埋入 电阻、 电容的技术更新， 使得对电子电路的导热散热性能有了越来越高的要 求， 所以电子电路的散热问题一直都是亟待解决的问题尤其是混合式集成电 路通常包括如集成电路 （IC) 芯片之类的有源芯片或一些其它的电子组件和 其它类型的有源组件和元源组件 （或器件） ， 这些元器件在工作期间或是产 生热量， 或是承受由 HIC的其它组件或环境所产生的热量； 其中某些元器件 可因这些热量而遭到损坏； 例如， 组件从支撑底板脱开， 组件破裂， 将组件 连接到支撑底板的导体断裂， 工作特性变化等等； 为了使 HIC中至少是易于 受热量影响的某些组件的热能散去， 即设计了许多种增加散热面积的散热器, 以适应发热量较高的热源。 With the continuous development of technology, electronic circuits (such as PCB) are multi-layer, high-density development, and technological updates of buried resistors and capacitors, which make higher and higher requirements for thermal conduction and heat dissipation of electronic circuits. The heat dissipation problem of circuits has always been an urgent problem to be solved. In particular, hybrid integrated circuits usually include active chips such as integrated circuit (IC) chips or some other electronic components and other types of active components and meta-source components ( Or device), these components either generate heat during operation or withstand heat generated by other components or environments of the HIC; some of these components may be damaged by this heat; for example, the component is supported from the support plate Disengagement, rupture of components, breakage of conductors that connect components to the support base, changes in operating characteristics, etc.; in order to dissipate heat from at least some components of the HIC that are susceptible to heat, many types of heat-dissipating areas have been designed. Heat sink to accommodate heat sources with high heat generation.
目前通用的散热器主要有铝挤型、 压铸型和折叠型三种； 其中铝挤型和 压铸型散热器的制造由于受限于机械加工能力， 其密至度 （单位体积的总散 热面积） 有限， 因此发热量越高的热源， 其体积和重量也随之增大； 而折叠 型散热器是利用金属片作为鳍片连续堆叠， 其密至度高， 所以比前两种其散 热效率较好一些， 且体积与重量容易被业界接受。 At present, the general-purpose radiators are mainly aluminum extrusion type, die-casting type and folding type; among them, the manufacture of aluminum extrusion type and die-casting type heat sink is limited by the machining ability, and the degree of density (total heat dissipation area per unit volume) Limited, so the heat source with higher heat generation has a larger volume and weight. The folded heat sink uses metal sheets as the fins to be stacked continuously, and its denseness is high, so it is more efficient than the first two. Better, and the volume and weight are easily accepted by the industry.
一般为使散热器得到更佳的散热效率， 一般会于散热器上结合一风扇，用 以协助散热，该风扇藉由适当的固定结构固定于散热器上，当风扇被驱动时， 可鼓动四周的冷空气吹向散热器，用以协助散热. 所以以上几种传统电子电 路 (如 PCB)的散热装置 （见图 1 ) 不但安装复杂、 成本高、 而且笨重的体积不 便于携带和修复以及不太理想的散热效果使其受到很大的局限。
实用新型内容 Generally, in order to achieve better heat dissipation efficiency of the heat sink, a fan is generally coupled to the heat sink for assisting heat dissipation. The fan is fixed to the heat sink by a suitable fixing structure, and when the fan is driven, the fan can be driven around. The cold air is blown to the heat sink to help dissipate heat. Therefore, the heat dissipation devices of the above traditional electronic circuits (such as PCB) (see Figure 1) are not only complicated to install, high in cost, but also bulky and inconvenient to carry and repair and not The ideal cooling effect is greatly limited. Utility model content
针对传统电子电路 (如 PCB)的散热效果不理想、 成本高、 体积大、 安装复 杂等问题， 本实用新型公开一种具有导热及散热油墨的散热结构。 其具有结 构简单， 应用方便的特点。 In view of the problem that the heat dissipation effect of the conventional electronic circuit (such as PCB) is not ideal, the cost is high, the volume is large, and the installation is complicated, the utility model discloses a heat dissipation structure with heat conduction and heat dissipation ink. It has the characteristics of simple structure and convenient application.
本实用新型一种具有导热及散热油墨的散热结构， 其技术方案如下： 本实用新型一种具有导热及散热油墨的散热结构， 包括一载板及一发热 体； 还包括一具有导热或散热油墨的散热层， 及一具有导热功能的感压胶层, 所述载板的上下表面分别与所述散热层及所述感压胶层一一对应连接在一 起， 所述感压胶层的另一面与发热体粘接在一起。 The utility model relates to a heat dissipation structure with heat conduction and heat dissipation ink, and the technical scheme thereof is as follows: The heat dissipation structure with heat conduction and heat dissipation ink comprises a carrier plate and a heating element; and further comprises a heat conduction or heat dissipation ink And a heat-sensitive layer, and a pressure-sensitive adhesive layer having a heat-conducting function, wherein upper and lower surfaces of the carrier plate are respectively connected to the heat-dissipating layer and the pressure-sensitive adhesive layer in one-to-one correspondence, and the pressure-sensitive adhesive layer is further One side is bonded to the heating element.
所述导热、 散热油墨和感压胶均可用于平面及任何曲面载板的喷涂和印 刷； 且所述感压胶可快速、 牢固地粘贴于任何刚性或柔性或金属或非金属材 质的发热面。 The heat conductive, heat dissipating ink and pressure sensitive adhesive can be used for spraying and printing on flat surface and any curved carrier; and the pressure sensitive adhesive can be quickly and firmly adhered to any rigid or flexible or metal or non-metal heating surface. .
所述载板可以是刚性或是柔性或是整面金属或非金属如铝、 铜、 陶瓷、 塑料、 玻璃或者是玻璃布基（环氧树脂覆铜箔板 FR-4 ) 的导电层或非导电层; 且所述发热体表面可为刚性或柔性或金属或非金属中的平面或是任何曲面的 形状。 The carrier may be rigid or flexible or a conductive layer or a non-metal or non-metal such as aluminum, copper, ceramic, plastic, glass or glass cloth (epoxy copper clad sheet FR-4) a conductive layer; and the surface of the heat generating body may be rigid or flexible or a plane in a metal or non-metal or a shape of any curved surface.
本实用新型与现有公知技术相比， 其优点在于： 其不仅改善了惯用 PCB 板或任何发热元器件散热效果不佳的问题， 同时亦解决了载板或散热装置重 量过大、 成本高、 安装繁杂等问题， 并提供了一种可操作性强， 散热直接、 效率好、 同时适用于刚性 PCB板和柔性 PCB板 （FPCB ) 或任何发热元器件制 作的结构型式。 Compared with the prior art, the utility model has the advantages that: the utility model not only improves the problem of poor heat dissipation effect of the conventional PCB board or any heat generating component, but also solves the problem that the carrier board or the heat sink device is excessively heavy and high in cost. The installation is complicated and the like, and provides a structure type with strong operability, direct heat dissipation, high efficiency, and suitable for rigid PCB boards and flexible PCB boards (FPCB) or any heat-generating components.
附图说明 DRAWINGS
图 1是传统散热装置结构； Figure 1 is a conventional heat sink structure;
图 2是本实用新型当发热体表面为平面时散热结构示意图 （剖面图） ； 图 3是本实用新型当发热体表面为不同曲面时散热结构示意图（剖面图)； 图 4是本实用新型较佳实施例之散热机理示意图 （剖面图， 其箭头表示 热量的传播方向及路径） 。
图中： 01、 散热层， 02、 载板， 03、 感压胶层， 04、 发热体， 07、 风扇， 08、 传统金属散热器。 2 is a schematic view (cross-sectional view) of a heat dissipating structure when the surface of the heating element is flat; FIG. 3 is a schematic view (cross-sectional view) of the heat dissipating structure when the surface of the heating element is different from the curved surface of the present invention; Schematic diagram of the heat dissipation mechanism of the preferred embodiment (cross-sectional view, the arrows indicate the direction and path of heat propagation). In the figure: 01, heat dissipation layer, 02, carrier board, 03, pressure sensitive adhesive layer, 04, heating element, 07, fan, 08, traditional metal radiator.
具体实施方式 detailed description
下面， 结合附图介绍本实用新型的具体实施方式。 Hereinafter, specific embodiments of the present invention will be described with reference to the accompanying drawings.
如图所示， 一种具有导热及散热油墨的散热结构， 包括一载板 02及一发 热体 04; 还包括一具有导热或散热油墨的散热层 01， 及一具有导热功能的感 压胶层 03， 所述载板 02的上下表面分别与所述散热层 01及所述感压胶层 03 一一对应连接在一起， 所述感压胶层 03的另一面与发热体 04粘接在一起。 As shown in the figure, a heat dissipation structure having heat conduction and heat dissipation ink includes a carrier 02 and a heat generating body 04; a heat dissipation layer 01 having heat conducting or heat dissipating ink, and a pressure sensitive adhesive layer having a heat conducting function. The upper and lower surfaces of the carrier 02 are respectively connected to the heat dissipation layer 01 and the pressure sensitive adhesive layer 03 in one-to-one correspondence, and the other surface of the pressure sensitive adhesive layer 03 is bonded to the heating element 04. .
当发热体 04产生热量时， 其产生的热量一小部份直接散发至空气中， 而 另一大部份则经高导热的感压胶层 03吸收后， 传导至载板 02， 再由高导热、 散热的散热层 01吸收并散发到空气中去 （如图 4 ) 。 When the heating element 04 generates heat, a small part of the heat generated is directly radiated into the air, and the other part is absorbed by the high thermal conductivity pressure sensitive layer 03, and then transmitted to the carrier 02, and then high. The heat-dissipating, heat-dissipating heat-dissipating layer 01 absorbs and dissipates into the air (Fig. 4).
所述散热层 01是由一种导热或散热油墨构成； 所述感压胶层 03是由一 种具有高度粘性和导热材料构成；其均可用于平面及任何曲面载板 02的喷涂 和印刷； 且所述感压胶层 03的压胶层可快速、 牢固地粘贴于任何刚性或柔性 或金属或非金属材质的发热面。 The heat dissipation layer 01 is composed of a heat conductive or heat dissipating ink; the pressure sensitive adhesive layer 03 is composed of a highly viscous and heat conductive material; both of which can be used for spraying and printing of a flat surface and any curved carrier 02; Moreover, the pressure layer of the pressure sensitive adhesive layer 03 can be quickly and firmly adhered to any heat-generating surface of a rigid or flexible or metal or non-metal material.
所述载板 02可以是刚性或是柔性或是整面金属或非金属如铝、 铜、 陶 瓷、 塑料、 玻璃或者是玻璃布基 （环氧树脂覆铜箔板 FR-4 ) 的导电层或非导 电层； 且所述发热体 04表面可为刚性或柔性或金属或非金属中的平面或是任 何曲面的形状。 The carrier 02 may be rigid or flexible or a conductive layer of a full-surface metal or non-metal such as aluminum, copper, ceramic, plastic, glass or glass cloth (epoxy copper-clad board FR-4) or The non-conductive layer; and the surface of the heating element 04 may be rigid or flexible or a plane in a metal or non-metal or a shape of any curved surface.
从以上所述可知， 本方案描述了一种导热散热性能好， 安装方便， 结构 简单的散热片， 其能很好的解决现有技术中存在的散热缺陷。 As can be seen from the above, the present scheme describes a heat sink with good heat dissipation and heat dissipation performance, convenient installation, and simple structure, which can well solve the heat dissipation defects existing in the prior art.
上述实施例仅是在本实用新型实施中一个较佳的优选方案， 而非限定性 穷举， 在不脱离其发明构思的前提下， 任何微小的变化或修饰均应视为在本 实用新型保护范围之内。
The above-described embodiments are merely preferred embodiments of the present invention, and are not intended to be exhaustive. Any minor changes or modifications should be considered as protection of the present invention without departing from the inventive concept. Within the scope.
Claims
1、 一种具有导热及散热油墨的散热结构， 包括一载板 （02) 及一发热体 (04)， 其特征在于： 还包括一具有导热或散热油墨的散热层 （01)， 及一具 有导热功能的感压胶层 （03)， 所述载板 （02) 的上下表面分别与所述散热层 (01) 及所述感压胶层 （03) —一对应连接在一起； 所述感压胶层 （03) 的 另一面与发热体 （04) 粘接在一起。 A heat dissipation structure having a heat-conducting and heat-dissipating ink, comprising a carrier plate (02) and a heat generating body (04), characterized in that: further comprising a heat dissipation layer (01) having heat conducting or heat dissipating ink, and having a heat-sensitive functional pressure-sensitive adhesive layer (03), wherein upper and lower surfaces of the carrier plate (02) are respectively connected to the heat dissipation layer (01) and the pressure-sensitive adhesive layer (03); The other side of the pressure layer (03) is bonded to the heating element (04).
2、 如权利要求 1所述的一种具有导热及散热油墨的散热结构， 其特征在 于： 所述散热层 （01) 和感压胶层 （03) 均可用喷涂或是印刷的方式覆于载 板 （02) 的上下表面。 2. The heat dissipation structure with heat-conducting and heat-dissipating ink according to claim 1, wherein: the heat dissipation layer (01) and the pressure-sensitive adhesive layer (03) can be covered by spraying or printing. Upper and lower surfaces of the plate (02).
3、 如权利要求 1所述的一种具有导热及散热油墨的散热结构， 其特征在 于：所述散热层（01)和所述感压胶层（03)可用于平面及曲面所述载板（02) 的喷涂和印刷。 3. The heat dissipation structure with heat conducting and heat dissipating ink according to claim 1, wherein the heat dissipation layer (01) and the pressure sensitive adhesive layer (03) are used for the plane and the curved surface of the carrier. (02) Spraying and printing.
4、 如权利要求 1所述的一种具有导热及散热油墨的散热结构， 其特征在 于： 所述发热体 （04) 表面可为刚性或柔性或金属或非金属中的平面或是曲 面的形状。 4. The heat dissipating structure having heat conducting and dissipating ink according to claim 1, wherein: the surface of the heating element (04) is rigid or flexible or a flat or curved shape in a metal or non-metal. .
5、 如权利要求 1所述的一种具有导热及散热油墨的散热结构， 其特征在 于： 所述载板 （02) 可以是整面金属或非金属导电层或非导电层。
5. The heat dissipating structure having heat conducting and dissipating ink according to claim 1, wherein: the carrier (02) is a full-surface metal or non-metal conductive layer or a non-conductive layer.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200920136180 CN201426228Y (en) | 2009-03-23 | 2009-03-23 | Radiating structure with heat-conducting and heat-radiating printing ink |
| CN200920136180.0 | 2009-03-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2010108362A1 true WO2010108362A1 (en) | 2010-09-30 |
Family
ID=42025685
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/CN2009/074161 WO2010108362A1 (en) | 2009-03-23 | 2009-09-23 | Heat dissipating structure with heat conducting and heat dissipating ink layer |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN201426228Y (en) |
| WO (1) | WO2010108362A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113150606A (en) * | 2021-04-15 | 2021-07-23 | Oppo广东移动通信有限公司 | Electronic equipment, heat dissipation shell, heat dissipation membrane, preparation method and heat dissipation ink |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108617079A (en) * | 2018-05-02 | 2018-10-02 | 皆利士多层线路版(中山)有限公司 | Thick copper circuit board and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04192447A (en) * | 1990-11-26 | 1992-07-10 | Mitsubishi Electric Corp | Semiconductor device |
| US5723369A (en) * | 1996-03-14 | 1998-03-03 | Lsi Logic Corporation | Method of flip chip assembly |
| EP1603376A1 (en) * | 2004-06-03 | 2005-12-07 | BREE (Beauce Réalisations et Études Électroniques) | Printed circuit by selective deposition |
| WO2008072845A1 (en) * | 2006-12-12 | 2008-06-19 | Seil Electronics Co., Ltd. | Heat sink and method of manufacturing the same |
| US20090002996A1 (en) * | 2007-06-28 | 2009-01-01 | Keeper Technology Co., Ltd. | Heat-dissipating device for an LED |
-
2009
- 2009-03-23 CN CN 200920136180 patent/CN201426228Y/en not_active Expired - Fee Related
- 2009-09-23 WO PCT/CN2009/074161 patent/WO2010108362A1/en active Application Filing
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04192447A (en) * | 1990-11-26 | 1992-07-10 | Mitsubishi Electric Corp | Semiconductor device |
| US5723369A (en) * | 1996-03-14 | 1998-03-03 | Lsi Logic Corporation | Method of flip chip assembly |
| EP1603376A1 (en) * | 2004-06-03 | 2005-12-07 | BREE (Beauce Réalisations et Études Électroniques) | Printed circuit by selective deposition |
| WO2008072845A1 (en) * | 2006-12-12 | 2008-06-19 | Seil Electronics Co., Ltd. | Heat sink and method of manufacturing the same |
| US20090002996A1 (en) * | 2007-06-28 | 2009-01-01 | Keeper Technology Co., Ltd. | Heat-dissipating device for an LED |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113150606A (en) * | 2021-04-15 | 2021-07-23 | Oppo广东移动通信有限公司 | Electronic equipment, heat dissipation shell, heat dissipation membrane, preparation method and heat dissipation ink |
Also Published As
| Publication number | Publication date |
|---|---|
| CN201426228Y (en) | 2010-03-17 |
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