WO2010088338A3 - Rapid cooling of a substrate by motion - Google Patents
Rapid cooling of a substrate by motion Download PDFInfo
- Publication number
- WO2010088338A3 WO2010088338A3 PCT/US2010/022338 US2010022338W WO2010088338A3 WO 2010088338 A3 WO2010088338 A3 WO 2010088338A3 US 2010022338 W US2010022338 W US 2010022338W WO 2010088338 A3 WO2010088338 A3 WO 2010088338A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- substrate
- cooling
- moving
- distance
- motion
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title abstract 11
- 238000001816 cooling Methods 0.000 title abstract 5
- 238000000034 method Methods 0.000 abstract 4
- 238000010438 heat treatment Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011548280A JP2012516576A (en) | 2009-01-28 | 2010-01-28 | Rapid cooling of substrate by motion |
CN2010800158689A CN102365719A (en) | 2009-01-28 | 2010-01-28 | Rapid cooling of a substrate by motion |
SG2011050648A SG172959A1 (en) | 2009-01-28 | 2010-01-28 | Rapid cooling of a substrate by motion |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14789109P | 2009-01-28 | 2009-01-28 | |
US61/147,891 | 2009-01-28 | ||
US12/694,634 US20100193154A1 (en) | 2009-01-28 | 2010-01-27 | Rapid cooling of a substrate by motion |
US12/694,634 | 2010-01-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2010088338A2 WO2010088338A2 (en) | 2010-08-05 |
WO2010088338A3 true WO2010088338A3 (en) | 2010-11-18 |
Family
ID=42396327
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2010/022338 WO2010088338A2 (en) | 2009-01-28 | 2010-01-28 | Rapid cooling of a substrate by motion |
Country Status (7)
Country | Link |
---|---|
US (1) | US20100193154A1 (en) |
JP (1) | JP2012516576A (en) |
KR (1) | KR20110108420A (en) |
CN (1) | CN102365719A (en) |
SG (1) | SG172959A1 (en) |
TW (1) | TW201034110A (en) |
WO (1) | WO2010088338A2 (en) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9245786B2 (en) * | 2011-06-02 | 2016-01-26 | Applied Materials, Inc. | Apparatus and methods for positioning a substrate using capacitive sensors |
US9202730B2 (en) * | 2011-11-03 | 2015-12-01 | Applied Materials, Inc. | Rapid thermal processing chamber |
US8939760B2 (en) * | 2012-02-09 | 2015-01-27 | Applied Materials, Inc. | Spike anneal residence time reduction in rapid thermal processing chambers |
JP6457498B2 (en) * | 2013-05-23 | 2019-01-23 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | Coated liner assembly for a semiconductor processing chamber |
CN105706219A (en) * | 2013-11-11 | 2016-06-22 | 应用材料公司 | Low temperature RTP control using IR camera |
CN105244262A (en) * | 2014-07-09 | 2016-01-13 | 中芯国际集成电路制造(上海)有限公司 | NiSi last formation process |
KR102090152B1 (en) * | 2015-12-30 | 2020-03-17 | 맷슨 테크놀로지, 인크. | Chamber wall heating for millisecond annealing systems |
JP6839940B2 (en) * | 2016-07-26 | 2021-03-10 | 株式会社Screenホールディングス | Heat treatment method |
JP6839939B2 (en) * | 2016-07-26 | 2021-03-10 | 株式会社Screenホールディングス | Heat treatment method |
CN106655025B (en) * | 2016-12-29 | 2019-10-29 | 北京金风科创风电设备有限公司 | The drive system of dynamic radiating layout in building enclosure |
CN106602482B (en) | 2016-12-29 | 2019-05-03 | 北京金风科创风电设备有限公司 | Dynamic heat dissipating method, the dynamic cooling system of the heat source of building enclosure and its inside |
CN110911320B (en) * | 2019-12-09 | 2023-08-18 | 北京北方华创微电子装备有限公司 | Cooling device, control method thereof and semiconductor processing equipment |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1154393A (en) * | 1997-08-04 | 1999-02-26 | Komatsu Ltd | Wafer temperature adjusting equipment and its control method |
US20060160253A1 (en) * | 2005-01-20 | 2006-07-20 | Bong-Kil Kim | Method and apparatus for wafer temperature regulation |
US20080141556A1 (en) * | 2006-12-14 | 2008-06-19 | Applied Materials, Inc. | Rapid conductive cooling using a secondary process plane |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4857689A (en) * | 1988-03-23 | 1989-08-15 | High Temperature Engineering Corporation | Rapid thermal furnace for semiconductor processing |
JPH07254545A (en) * | 1994-03-15 | 1995-10-03 | Oki Electric Ind Co Ltd | Heat treatment method for semiconductor substrate and device therefor |
JPH0817747A (en) * | 1994-06-24 | 1996-01-19 | Tokyo Electron Ltd | Processing method and processing device |
US6179466B1 (en) * | 1994-12-19 | 2001-01-30 | Applied Materials, Inc. | Method and apparatus for measuring substrate temperatures |
JPH11354516A (en) * | 1998-06-08 | 1999-12-24 | Sony Corp | Silicon oxide film forming device and method therefor |
US6957690B1 (en) * | 1998-09-10 | 2005-10-25 | Asm America, Inc. | Apparatus for thermal treatment of substrates |
JP4625183B2 (en) * | 1998-11-20 | 2011-02-02 | ステアーグ アール ティ ピー システムズ インコーポレイテッド | Rapid heating and cooling equipment for semiconductor wafers |
US6809035B2 (en) * | 2002-08-02 | 2004-10-26 | Wafermasters, Inc. | Hot plate annealing |
US8057602B2 (en) * | 2007-05-09 | 2011-11-15 | Applied Materials, Inc. | Apparatus and method for supporting, positioning and rotating a substrate in a processing chamber |
-
2010
- 2010-01-27 US US12/694,634 patent/US20100193154A1/en not_active Abandoned
- 2010-01-28 KR KR1020117020115A patent/KR20110108420A/en not_active Application Discontinuation
- 2010-01-28 SG SG2011050648A patent/SG172959A1/en unknown
- 2010-01-28 CN CN2010800158689A patent/CN102365719A/en active Pending
- 2010-01-28 WO PCT/US2010/022338 patent/WO2010088338A2/en active Application Filing
- 2010-01-28 TW TW099102478A patent/TW201034110A/en unknown
- 2010-01-28 JP JP2011548280A patent/JP2012516576A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1154393A (en) * | 1997-08-04 | 1999-02-26 | Komatsu Ltd | Wafer temperature adjusting equipment and its control method |
US20060160253A1 (en) * | 2005-01-20 | 2006-07-20 | Bong-Kil Kim | Method and apparatus for wafer temperature regulation |
US20080141556A1 (en) * | 2006-12-14 | 2008-06-19 | Applied Materials, Inc. | Rapid conductive cooling using a secondary process plane |
Also Published As
Publication number | Publication date |
---|---|
TW201034110A (en) | 2010-09-16 |
CN102365719A (en) | 2012-02-29 |
KR20110108420A (en) | 2011-10-05 |
US20100193154A1 (en) | 2010-08-05 |
SG172959A1 (en) | 2011-08-29 |
JP2012516576A (en) | 2012-07-19 |
WO2010088338A2 (en) | 2010-08-05 |
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