WO2010080983A3 - Robot systems, apparatus and methods for transporting substrates in electronic device manufacturing - Google Patents

Robot systems, apparatus and methods for transporting substrates in electronic device manufacturing Download PDF

Info

Publication number
WO2010080983A3
WO2010080983A3 PCT/US2010/020477 US2010020477W WO2010080983A3 WO 2010080983 A3 WO2010080983 A3 WO 2010080983A3 US 2010020477 W US2010020477 W US 2010020477W WO 2010080983 A3 WO2010080983 A3 WO 2010080983A3
Authority
WO
WIPO (PCT)
Prior art keywords
methods
electronic device
device manufacturing
robot systems
transporting substrates
Prior art date
Application number
PCT/US2010/020477
Other languages
French (fr)
Other versions
WO2010080983A2 (en
Inventor
Izya Kremerman
Jeffrey C. Hudgens
Original Assignee
Applied Materials, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials, Inc. filed Critical Applied Materials, Inc.
Priority to KR1020117018755A priority Critical patent/KR101781808B1/en
Priority to JP2011545450A priority patent/JP5581338B2/en
Priority to KR1020167024097A priority patent/KR101778519B1/en
Priority to CN201080008862.9A priority patent/CN102326244B/en
Publication of WO2010080983A2 publication Critical patent/WO2010080983A2/en
Publication of WO2010080983A3 publication Critical patent/WO2010080983A3/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B25HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25JMANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00Programme-controlled manipulators
    • B25J9/02Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041Cylindrical coordinate type
    • B25J9/042Cylindrical coordinate type comprising an articulated arm
    • B25J9/043Cylindrical coordinate type comprising an articulated arm double selective compliance articulated robot arms [SCARA]
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B25HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25JMANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00Manipulators not otherwise provided for
    • B25J11/0095Manipulators transporting wafers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B25HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25JMANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00Programme-controlled manipulators
    • B25J9/02Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041Cylindrical coordinate type
    • B25J9/042Cylindrical coordinate type comprising an articulated arm
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B25HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25JMANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00Programme-controlled manipulators
    • B25J9/10Programme-controlled manipulators characterised by positioning means for manipulator elements
    • B25J9/106Programme-controlled manipulators characterised by positioning means for manipulator elements with articulated links
    • B25J9/1065Programme-controlled manipulators characterised by positioning means for manipulator elements with articulated links with parallelograms
    • B25J9/107Programme-controlled manipulators characterised by positioning means for manipulator elements with articulated links with parallelograms of the froglegs type
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742Mechanical parts of transfer devices
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00Material or article handling
    • Y10S414/135Associated with semiconductor wafer handling
    • Y10S414/139Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S901/00Robots
    • Y10S901/14Arm movement, spatial
    • Y10S901/15Jointed arm
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T74/00Machine element or mechanism
    • Y10T74/20Control lever and linkage systems
    • Y10T74/20207Multiple controlling elements for single controlled element
    • Y10T74/20305Robotic arm

Abstract

Substrate transport systems, apparatus and methods are described. The systems are adapted to efficiently put or pick substrates at a destination by rotating a boom linkage to a position adjacent to the destination and then actuating a robot assembly to put or pick the substrate at the destination. Numerous other aspects are provided.
PCT/US2010/020477 2009-01-11 2010-01-08 Robot systems, apparatus and methods for transporting substrates in electronic device manufacturing WO2010080983A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020117018755A KR101781808B1 (en) 2009-01-11 2010-01-08 Robot systems, apparatus and methods for transporting substrates in electronic device manufacturing
JP2011545450A JP5581338B2 (en) 2009-01-11 2010-01-08 Robot system, apparatus and method for transporting substrates in electronic device manufacturing
KR1020167024097A KR101778519B1 (en) 2009-01-11 2010-01-08 Robot systems, apparatus and methods for transporting substrates in electronic device manufacturing
CN201080008862.9A CN102326244B (en) 2009-01-11 2010-01-08 Robot systems, apparatus and methods for transporting substrates in electronic device manufacturing

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14380409P 2009-01-11 2009-01-11
US61/143,804 2009-01-11

Publications (2)

Publication Number Publication Date
WO2010080983A2 WO2010080983A2 (en) 2010-07-15
WO2010080983A3 true WO2010080983A3 (en) 2010-08-26

Family

ID=42317154

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2010/020477 WO2010080983A2 (en) 2009-01-11 2010-01-08 Robot systems, apparatus and methods for transporting substrates in electronic device manufacturing

Country Status (6)

Country Link
US (2) US8784033B2 (en)
JP (1) JP5581338B2 (en)
KR (2) KR101778519B1 (en)
CN (1) CN102326244B (en)
TW (1) TWI515095B (en)
WO (1) WO2010080983A2 (en)

Families Citing this family (84)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9117859B2 (en) * 2006-08-31 2015-08-25 Brooks Automation, Inc. Compact processing apparatus
KR101287000B1 (en) 2009-01-11 2013-07-23 어플라이드 머티어리얼스, 인코포레이티드 Systems, apparatus and methods for making an electrical connection to a robot and electrical end effector thereof
WO2010080983A2 (en) 2009-01-11 2010-07-15 Applied Materials, Inc. Robot systems, apparatus and methods for transporting substrates in electronic device manufacturing
US8777547B2 (en) 2009-01-11 2014-07-15 Applied Materials, Inc. Systems, apparatus and methods for transporting substrates
JP5480562B2 (en) * 2009-08-26 2014-04-23 日本電産サンキョー株式会社 Industrial robot
US8642448B2 (en) 2010-06-22 2014-02-04 Applied Materials, Inc. Wafer dicing using femtosecond-based laser and plasma etch
KR102427795B1 (en) * 2010-11-10 2022-08-01 브룩스 오토메이션 인코퍼레이티드 A Substrate Processing Apparatus and A Substrate Transport Apparatus
JP5565345B2 (en) * 2011-03-07 2014-08-06 株式会社安川電機 Transfer robot
KR102436038B1 (en) 2011-03-11 2022-08-24 브룩스 오토메이션 인코퍼레이티드 Substrate processing tool
DE102011101255A1 (en) * 2011-05-11 2012-11-15 Krones Aktiengesellschaft Device and method for transporting containers
CN102709221A (en) * 2011-06-28 2012-10-03 清华大学 Planar three degree-of-freedom wafer transmitting device
US9076829B2 (en) 2011-08-08 2015-07-07 Applied Materials, Inc. Robot systems, apparatus, and methods adapted to transport substrates in electronic device manufacturing
US8768513B2 (en) 2011-08-08 2014-07-01 Applied Materials, Inc. Systems having multi-linkage robots and methods to correct positional and rotational alignment in multi-linkage robots
US9076830B2 (en) 2011-11-03 2015-07-07 Applied Materials, Inc. Robot systems and apparatus adapted to transport dual substrates in electronic device manufacturing with wrist drive motors mounted to upper arm
WO2013090181A1 (en) * 2011-12-12 2013-06-20 Applied Materials, Inc Fully-independent robot systems, apparatus, and methods adapted to transport multiple substrates in electronic device manufacturing
KR102359364B1 (en) * 2012-02-10 2022-02-07 브룩스 오토메이션 인코퍼레이티드 Substrate Processing Apparatus
TW202203356A (en) * 2012-02-10 2022-01-16 美商布魯克斯自動機械公司 Substrate processing apparatus
WO2013154863A1 (en) * 2012-04-12 2013-10-17 Applied Materials, Inc Robot systems, apparatus, and methods having independently rotatable waists
FR2989947B1 (en) * 2012-04-26 2014-05-09 Delachaux Sa CONNECTION SYSTEM FOR CHARGING AN ELECTRIC VEHICLE
JP6285926B2 (en) * 2012-07-05 2018-02-28 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated Boom drive apparatus, multi-arm robot apparatus, electronic device processing system, and method for transporting a substrate in an electronic device manufacturing system
US10363665B2 (en) * 2012-07-10 2019-07-30 Persimmon Technologies Corporation Linear robot arm with multiple end effectors
JP6110612B2 (en) * 2012-07-19 2017-04-05 川崎重工業株式会社 Substrate transfer device
CN102897335B (en) * 2012-09-14 2015-09-09 昆山古鳌电子机械有限公司 Paper money binding machine folder paper money hand shift mechanism
KR101859441B1 (en) * 2012-11-30 2018-05-21 어플라이드 머티어리얼스, 인코포레이티드 Vibration-controlled substrate handling robot, systems, and methods
US9190306B2 (en) * 2012-11-30 2015-11-17 Lam Research Corporation Dual arm vacuum robot
CN104823272B (en) * 2012-11-30 2017-07-14 应用材料公司 Multi-spindle machining hand equipment, electronic device manufacturing system with non-isometric forearm and the method for transmitting substrate in being manufactured in electronic installation
US9149936B2 (en) 2013-01-18 2015-10-06 Persimmon Technologies, Corp. Robot having arm with unequal link lengths
US10224232B2 (en) 2013-01-18 2019-03-05 Persimmon Technologies Corporation Robot having two arms with unequal link lengths
TWI624897B (en) 2013-03-15 2018-05-21 應用材料股份有限公司 Multi-position batch load lock apparatus and systems and methods including same
KR20210014778A (en) 2013-03-15 2021-02-09 어플라이드 머티어리얼스, 인코포레이티드 Substrate deposition systems, robot transfer apparatus, and methods for electronic device manufacturing
KR102308221B1 (en) * 2013-06-05 2021-10-01 퍼시몬 테크놀로지스 코포레이션 Robot and adaptive placement system and method
WO2015023591A1 (en) 2013-08-12 2015-02-19 Applied Materials, Inc Substrate processing systems, apparatus, and methods with factory interface environmental controls
JP6362681B2 (en) 2013-09-26 2018-07-25 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated Pneumatic end effector device, substrate transfer system, and substrate transfer method
CN105580107B (en) 2013-09-30 2019-02-19 应用材料公司 Transfer chamber gas cleaning plant, electronic equipment processing system and purification method
WO2015068185A1 (en) 2013-11-06 2015-05-14 川崎重工業株式会社 Substrate carrier apparatus
US11587813B2 (en) 2013-12-17 2023-02-21 Brooks Automation Us, Llc Substrate transport apparatus
US10134621B2 (en) * 2013-12-17 2018-11-20 Brooks Automation, Inc. Substrate transport apparatus
TWI657524B (en) * 2013-12-17 2019-04-21 美商布魯克斯自動機械公司 Substrate transport apparatus
JP6550391B2 (en) * 2014-01-05 2019-07-24 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated Robotic apparatus, drive assembly and method for transferring a substrate in electronic device manufacturing
US9986598B2 (en) 2014-07-02 2018-05-29 Applied Materials, Inc. Temperature control apparatus including groove-routed optical fiber heating, substrate temperature control systems, electronic device processing systems, and processing methods
JP6822953B2 (en) 2014-11-25 2021-01-27 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated Substrate processing systems, equipment, and methods with environmental control of substrate carriers and purge chambers
JP1534869S (en) * 2015-01-30 2015-10-13
KR102567510B1 (en) 2015-03-12 2023-08-17 퍼시몬 테크놀로지스 코포레이션 Robots with subordinated end effector movements
WO2016172003A1 (en) * 2015-04-20 2016-10-27 Applied Materials, Inc. Buffer chamber wafer heating mechanism and supporting robot
US10520371B2 (en) 2015-10-22 2019-12-31 Applied Materials, Inc. Optical fiber temperature sensors, temperature monitoring apparatus, and manufacturing methods
US9799544B2 (en) 2015-10-23 2017-10-24 Applied Materials, Inc. Robot assemblies, substrate processing apparatus, and methods for transporting substrates in electronic device manufacturing
JP6649768B2 (en) * 2015-12-28 2020-02-19 日本電産サンキョー株式会社 Industrial robot
US10788264B2 (en) 2016-04-12 2020-09-29 Vanrx Pharmasystems, Inc. Method and apparatus for loading a lyophilization system
CN106015497B (en) * 2016-05-16 2017-11-14 太原理工大学 A kind of confined space position manipulator mechanism
US20170353014A1 (en) * 2016-06-07 2017-12-07 Belden Canada Inc. Rackmount case for the accommodation of optical equipment
US10119191B2 (en) 2016-06-08 2018-11-06 Applied Materials, Inc. High flow gas diffuser assemblies, systems, and methods
TWI724971B (en) 2016-06-28 2021-04-11 美商應用材料股份有限公司 Dual robot including spaced upper arms and interleaved wrists and systems and methods including same
US10099377B2 (en) * 2016-06-29 2018-10-16 Applied Materials, Inc. Methods and systems providing misalignment correction in robots
US11270904B2 (en) * 2016-07-12 2022-03-08 Brooks Automation Us, Llc Substrate processing apparatus
JP7125430B2 (en) 2017-06-23 2022-08-24 アプライド マテリアルズ インコーポレイテッド Indexable Side Storage Pod Apparatus, Heated Side Storage Pod Apparatus, System, and Method
US10388547B2 (en) 2017-06-23 2019-08-20 Applied Materials, Inc. Side storage pods, equipment front end modules, and methods for processing substrates
US10629472B2 (en) 2017-08-17 2020-04-21 Persimmon Technologies Corporation Material handling robot
US10453725B2 (en) 2017-09-19 2019-10-22 Applied Materials, Inc. Dual-blade robot including vertically offset horizontally overlapping frog-leg linkages and systems and methods including same
CN109994358B (en) 2017-12-29 2021-04-27 中微半导体设备(上海)股份有限公司 Plasma processing system and operation method thereof
US10763134B2 (en) 2018-02-27 2020-09-01 Applied Materials, Inc. Substrate processing apparatus and methods with factory interface chamber filter purge
US10943805B2 (en) 2018-05-18 2021-03-09 Applied Materials, Inc. Multi-blade robot apparatus, electronic device manufacturing apparatus, and methods adapted to transport multiple substrates in electronic device manufacturing
JP7183635B2 (en) * 2018-08-31 2022-12-06 東京エレクトロン株式会社 SUBSTRATE TRANSFER MECHANISM, SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE TRANSFER METHOD
TWI691152B (en) * 2018-09-27 2020-04-11 台達電子工業股份有限公司 Robot system
CN110957931B (en) 2018-09-27 2020-11-27 台达电子工业股份有限公司 Robot system
US11241800B2 (en) 2019-03-11 2022-02-08 Persimmon Technologies Corporation Asymmetric dual end effector robot arm
JP1644507S (en) * 2019-03-27 2019-10-28
JP1644505S (en) * 2019-03-27 2019-10-28
JP1644506S (en) * 2019-03-27 2019-10-28
JP1650339S (en) * 2019-03-27 2020-01-20
US11279032B2 (en) 2019-04-11 2022-03-22 Applied Materials, Inc. Apparatus, systems, and methods for improved joint coordinate teaching accuracy of robots
US10964584B2 (en) 2019-05-20 2021-03-30 Applied Materials, Inc. Process kit ring adaptor
US11883958B2 (en) * 2019-06-07 2024-01-30 Applied Materials, Inc. Robot apparatus including dual end effectors with variable pitch and methods
US11850742B2 (en) 2019-06-07 2023-12-26 Applied Materials, Inc. Dual robot including splayed end effectors and systems and methods including same
US11626305B2 (en) 2019-06-25 2023-04-11 Applied Materials, Inc. Sensor-based correction of robot-held object
US11211269B2 (en) 2019-07-19 2021-12-28 Applied Materials, Inc. Multi-object capable loadlock system
JP6880519B2 (en) * 2019-11-11 2021-06-02 株式会社安川電機 Robot system, robot control method, semiconductor manufacturing system
US11370114B2 (en) 2019-12-09 2022-06-28 Applied Materials, Inc. Autoteach enclosure system
USD980176S1 (en) 2020-06-02 2023-03-07 Applied Materials, Inc. Substrate processing system carrier
USD954769S1 (en) 2020-06-02 2022-06-14 Applied Materials, Inc. Enclosure system shelf
KR20230116766A (en) * 2020-07-07 2023-08-04 퍼시몬 테크놀로지스 코포레이션 Material handling robot with multiple semi-independent arms
USD1019725S1 (en) * 2020-10-14 2024-03-26 Daihen Corporation Industrial robot
CN113628994A (en) * 2021-08-27 2021-11-09 沈阳芯源微电子设备股份有限公司 Wafer conveying device and wafer conveying method
KR102394121B1 (en) * 2021-10-08 2022-05-04 (주) 티로보틱스 Travel robot for driving substrate transfer robot in chamber
WO2023102497A1 (en) * 2021-12-03 2023-06-08 Lam Research Corporation Direct-pick robot for multi station semiconductor processing chambers

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002158272A (en) * 2000-11-17 2002-05-31 Tatsumo Kk Double-arm substrate transfer device
JP2002172571A (en) * 2000-12-05 2002-06-18 Kawasaki Heavy Ind Ltd Double arm and robot having it
JP2005186259A (en) * 2003-12-26 2005-07-14 Daihen Corp Transfer robot
JP2007130733A (en) * 2005-11-14 2007-05-31 Hirata Corp Double arm row type substrate conveying robot

Family Cites Families (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4597708A (en) * 1984-06-04 1986-07-01 Tencor Instruments Wafer handling apparatus
JPH0825151B2 (en) * 1988-09-16 1996-03-13 東京応化工業株式会社 Handling unit
JPH07142551A (en) 1993-11-20 1995-06-02 Tokyo Electron Ltd Carrier arm device and processing chamber collector using carrier arm device
US5765444A (en) * 1995-07-10 1998-06-16 Kensington Laboratories, Inc. Dual end effector, multiple link robot arm system with corner reacharound and extended reach capabilities
US5954472A (en) * 1996-07-15 1999-09-21 Brooks Automation, Inc. Batch loader arm
JP3757016B2 (en) 1997-02-20 2006-03-22 ローツェ株式会社 Handling robot
JP3735175B2 (en) * 1997-03-04 2006-01-18 大日本スクリーン製造株式会社 Substrate processing equipment
JPH1116981A (en) 1997-06-20 1999-01-22 Dainippon Screen Mfg Co Ltd Substrate treatment equipment
JPH11277467A (en) 1998-03-25 1999-10-12 Mecs Corp Thin substrate carrying robot
JP2000072248A (en) * 1998-08-27 2000-03-07 Rorze Corp Substrate conveyance device
US6543306B1 (en) 1998-12-04 2003-04-08 Daihen Corporation Conveying device
US6485250B2 (en) * 1998-12-30 2002-11-26 Brooks Automation Inc. Substrate transport apparatus with multiple arms on a common axis of rotation
US6601468B2 (en) * 2000-10-24 2003-08-05 Innovative Robotic Solutions Drive system for multiple axis robot arm
JP2002166376A (en) * 2000-11-30 2002-06-11 Hirata Corp Robot for substrate transfer
JP4435443B2 (en) * 2001-04-17 2010-03-17 大日本スクリーン製造株式会社 Substrate transport apparatus and substrate transport method
JP4245387B2 (en) * 2003-03-19 2009-03-25 東京エレクトロン株式会社 Substrate transport apparatus and substrate processing apparatus
KR100582697B1 (en) * 2003-07-16 2006-05-23 동경 엘렉트론 주식회사 Transportation apparatus and drive mechanism
KR100583724B1 (en) * 2003-10-29 2006-05-25 삼성전자주식회사 Transfer apparatus for wafer
KR101398665B1 (en) * 2004-06-09 2014-05-26 브룩스 오토메이션 인코퍼레이티드 Dual scara arm
US20060216137A1 (en) * 2004-07-02 2006-09-28 Katsunori Sakata Carrying apparatus and carrying control method for sheet-like substrate
JP4974118B2 (en) * 2005-02-12 2012-07-11 アプライド マテリアルズ インコーポレイテッド Multi-axis vacuum motor assembly
TW200642812A (en) * 2005-04-11 2006-12-16 Nidec Sankyo Corp Articulated robot
TWI342597B (en) * 2005-11-21 2011-05-21 Applied Materials Inc Methods and apparatus for transferring substrates during electronic device manufacturing
CN101375385B (en) 2006-01-13 2012-05-30 纳博特斯克株式会社 Drive apparatus for substrate transfer robot having coolant circulating passage
KR100758298B1 (en) * 2006-03-03 2007-09-12 삼성전자주식회사 Apparatus and method for treating substrates
KR101035896B1 (en) * 2006-05-29 2011-05-23 가부시키가이샤 알박 Substrate transfer apparatus
US7695232B2 (en) * 2006-06-15 2010-04-13 Applied Materials, Inc. Multi-level load lock chamber, transfer chamber, and robot suitable for interfacing with same
JP5185932B2 (en) * 2006-08-11 2013-04-17 アプライド マテリアルズ インコーポレイテッド Method and apparatus for robot wrist assembly
US20080175694A1 (en) * 2007-01-19 2008-07-24 Dong-Seok Park Unit and method for transferring substrates and apparatus and method for treating substrates with the unit
JP4973267B2 (en) * 2007-03-23 2012-07-11 東京エレクトロン株式会社 Substrate transport apparatus, substrate transport module, substrate transport method, and storage medium
US7946800B2 (en) 2007-04-06 2011-05-24 Brooks Automation, Inc. Substrate transport apparatus with multiple independently movable articulated arms
JP4970128B2 (en) 2007-04-27 2012-07-04 日本電産サンキョー株式会社 Industrial robot and collective processing device
WO2008140728A2 (en) * 2007-05-08 2008-11-20 Brooks Automation, Inc. Substrate transport apparatus with multiple movable arms utilizing a mechanical switch mechanism
US8752449B2 (en) * 2007-05-08 2014-06-17 Brooks Automation, Inc. Substrate transport apparatus with multiple movable arms utilizing a mechanical switch mechanism
CN101678974A (en) * 2007-05-31 2010-03-24 应用材料股份有限公司 Methods and apparatus for extending the reach of a dual scara robot linkage
WO2010080983A2 (en) 2009-01-11 2010-07-15 Applied Materials, Inc. Robot systems, apparatus and methods for transporting substrates in electronic device manufacturing
US8777547B2 (en) 2009-01-11 2014-07-15 Applied Materials, Inc. Systems, apparatus and methods for transporting substrates
KR101287000B1 (en) 2009-01-11 2013-07-23 어플라이드 머티어리얼스, 인코포레이티드 Systems, apparatus and methods for making an electrical connection to a robot and electrical end effector thereof
JP5480562B2 (en) 2009-08-26 2014-04-23 日本電産サンキョー株式会社 Industrial robot
US20120063874A1 (en) 2010-09-15 2012-03-15 Applied Materials, Inc. Low profile dual arm vacuum robot
KR102427795B1 (en) * 2010-11-10 2022-08-01 브룩스 오토메이션 인코퍼레이티드 A Substrate Processing Apparatus and A Substrate Transport Apparatus
US9076829B2 (en) 2011-08-08 2015-07-07 Applied Materials, Inc. Robot systems, apparatus, and methods adapted to transport substrates in electronic device manufacturing
US9076830B2 (en) 2011-11-03 2015-07-07 Applied Materials, Inc. Robot systems and apparatus adapted to transport dual substrates in electronic device manufacturing with wrist drive motors mounted to upper arm
WO2013090181A1 (en) 2011-12-12 2013-06-20 Applied Materials, Inc Fully-independent robot systems, apparatus, and methods adapted to transport multiple substrates in electronic device manufacturing
WO2013154863A1 (en) 2012-04-12 2013-10-17 Applied Materials, Inc Robot systems, apparatus, and methods having independently rotatable waists
JP6285926B2 (en) 2012-07-05 2018-02-28 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated Boom drive apparatus, multi-arm robot apparatus, electronic device processing system, and method for transporting a substrate in an electronic device manufacturing system
KR20210014778A (en) 2013-03-15 2021-02-09 어플라이드 머티어리얼스, 인코포레이티드 Substrate deposition systems, robot transfer apparatus, and methods for electronic device manufacturing

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002158272A (en) * 2000-11-17 2002-05-31 Tatsumo Kk Double-arm substrate transfer device
JP2002172571A (en) * 2000-12-05 2002-06-18 Kawasaki Heavy Ind Ltd Double arm and robot having it
JP2005186259A (en) * 2003-12-26 2005-07-14 Daihen Corp Transfer robot
JP2007130733A (en) * 2005-11-14 2007-05-31 Hirata Corp Double arm row type substrate conveying robot

Also Published As

Publication number Publication date
TWI515095B (en) 2016-01-01
KR20160105949A (en) 2016-09-07
WO2010080983A2 (en) 2010-07-15
US9457464B2 (en) 2016-10-04
JP5581338B2 (en) 2014-08-27
JP2012514569A (en) 2012-06-28
KR101778519B1 (en) 2017-09-15
KR101781808B1 (en) 2017-10-23
US20140286741A1 (en) 2014-09-25
US20100178147A1 (en) 2010-07-15
KR20110104995A (en) 2011-09-23
TW201032970A (en) 2010-09-16
US8784033B2 (en) 2014-07-22
CN102326244B (en) 2014-12-17
CN102326244A (en) 2012-01-18

Similar Documents

Publication Publication Date Title
WO2010080983A3 (en) Robot systems, apparatus and methods for transporting substrates in electronic device manufacturing
WO2013022616A3 (en) Robot systems, apparatus, and methods adapted to transport substrates in electronic device manufacturing
WO2009089472A3 (en) Photovoltaic devices
WO2012057512A3 (en) Compound semiconductor device and method for manufacturing same
WO2009089470A3 (en) Photovoltaic devices
WO2009094558A3 (en) Method for reversibly mounting a device wafer to a carrier substrate
WO2009094663A3 (en) Photovoltaic devices having metal oxide electron-transport layers
WO2011042107A3 (en) Materials for organic electroluminescent devices
WO2012021197A3 (en) Method of manufacturing electronic devices on both sides of a carrier substrate and electronic devices thereof
EP2660891A4 (en) Substrate for an organic light-emitting device, and method for manufacturing same
WO2008024380A3 (en) Organic electronic devices
EP2595211A4 (en) A flexible electronic device, method for manufacturing same, and a flexible substrate
EP2134809A4 (en) Material for organic photoelectric device including electron transporting unit and hole transporting unit, and organic photoelectric device including the same
WO2008067181A3 (en) Photovoltaic device including a metal stack
EP2420599A4 (en) Substrate, substrate provided with thin film, semiconductor device, and method for manufacturing semiconductor device
SG122949A1 (en) A method for engineering hybrid orientation/material semiconductor substrate
EP2180762A4 (en) Organic electroluminescent device and method for manufacturing the same
HK1144235A1 (en) Method for picking up semiconductor chips from a wafer table and mounting the removed semiconductor chips on a substrate
EP2219417A4 (en) Organic electroluminescent device and method for manufacturing the same
MX2010003226A (en) Photovoltaic devices including heterojunctions.
EP2628742A4 (en) Chalcogen-containing aromatic compound, organic semiconductor material, and organic electronic device
WO2008063337A3 (en) Semiconductor-on-diamond devices and associated methods
EP2178132A4 (en) Organic electroluminescent device, method for manufacturing the same, and coating liquid
EP2175479A4 (en) A method for processing a semiconductor substrate surface and a chemical processing device for the semiconductor substrate surface
HK1148112A1 (en) Semiconductor-based, large-area, flexible, electronic devices on 110 <100>oriented substrates 110<100>

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 201080008862.9

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 10729557

Country of ref document: EP

Kind code of ref document: A2

ENP Entry into the national phase

Ref document number: 2011545450

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

ENP Entry into the national phase

Ref document number: 20117018755

Country of ref document: KR

Kind code of ref document: A

122 Ep: pct application non-entry in european phase

Ref document number: 10729557

Country of ref document: EP

Kind code of ref document: A2