WO2010075324A3 - Semiconductor input control device - Google Patents
Semiconductor input control device Download PDFInfo
- Publication number
- WO2010075324A3 WO2010075324A3 PCT/US2009/069091 US2009069091W WO2010075324A3 WO 2010075324 A3 WO2010075324 A3 WO 2010075324A3 US 2009069091 W US2009069091 W US 2009069091W WO 2010075324 A3 WO2010075324 A3 WO 2010075324A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- force
- sensor die
- axis
- applications
- force sensor
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/033—Pointing devices displaced or positioned by the user, e.g. mice, trackballs, pens or joysticks; Accessories therefor
- G06F3/0338—Pointing devices displaced or positioned by the user, e.g. mice, trackballs, pens or joysticks; Accessories therefor with detection of limited linear or angular displacement of an operating part of the device from a neutral position, e.g. isotonic or isometric joysticks
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/02—Input arrangements using manually operated switches, e.g. using keyboards or dials
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE112009003763T DE112009003763T5 (en) | 2008-12-22 | 2009-12-22 | Semiconductor input control device |
CN2009801554878A CN102292692A (en) | 2008-12-22 | 2009-12-22 | Semiconductor input control device |
JP2011542555A JP2012513660A (en) | 2008-12-22 | 2009-12-22 | Semiconductor input control device |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/342,001 | 2008-12-22 | ||
US12/342,001 US7880247B2 (en) | 2003-12-29 | 2008-12-22 | Semiconductor input control device |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2010075324A2 WO2010075324A2 (en) | 2010-07-01 |
WO2010075324A3 true WO2010075324A3 (en) | 2010-10-14 |
Family
ID=42288525
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2009/069091 WO2010075324A2 (en) | 2008-12-22 | 2009-12-22 | Semiconductor input control device |
Country Status (6)
Country | Link |
---|---|
US (1) | US7880247B2 (en) |
JP (1) | JP2012513660A (en) |
KR (1) | KR20110125210A (en) |
CN (1) | CN102292692A (en) |
DE (1) | DE112009003763T5 (en) |
WO (1) | WO2010075324A2 (en) |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8350345B2 (en) | 2003-12-29 | 2013-01-08 | Vladimir Vaganov | Three-dimensional input control device |
US9034666B2 (en) | 2003-12-29 | 2015-05-19 | Vladimir Vaganov | Method of testing of MEMS devices on a wafer level |
US8327715B2 (en) * | 2009-07-02 | 2012-12-11 | Honeywell International Inc. | Force sensor apparatus |
WO2011044244A2 (en) * | 2009-10-06 | 2011-04-14 | Knowles Electronics, Llc | A low profile human interface device |
US8525334B2 (en) * | 2010-04-27 | 2013-09-03 | International Rectifier Corporation | Semiconductor on semiconductor substrate multi-chip-scale package |
EP2617344B1 (en) * | 2011-02-28 | 2016-12-07 | Olympus Corporation | Bending portion-equipped medical apparatus |
US20130164068A1 (en) * | 2011-12-21 | 2013-06-27 | Apple Inc. | Bonded keyboard and method for making the same |
US9728652B2 (en) * | 2012-01-25 | 2017-08-08 | Infineon Technologies Ag | Sensor device and method |
US8806964B2 (en) | 2012-03-23 | 2014-08-19 | Honeywell International Inc. | Force sensor |
US9003899B2 (en) | 2012-03-23 | 2015-04-14 | Honeywell International Inc. | Force sensor |
US9003897B2 (en) | 2012-05-10 | 2015-04-14 | Honeywell International Inc. | Temperature compensated force sensor |
CN103579490B (en) * | 2012-07-18 | 2019-02-19 | 北京纳米能源与系统研究所 | A kind of transistor and transistor array |
US8757001B2 (en) * | 2012-09-27 | 2014-06-24 | Honeywell International Inc. | Mechanically coupled force sensor on flexible platform assembly structure |
US9548275B2 (en) * | 2013-05-23 | 2017-01-17 | Globalfoundries Inc. | Detecting sudden changes in acceleration in semiconductor device or semiconductor packaging containing semiconductor device |
US9615417B2 (en) * | 2014-02-25 | 2017-04-04 | Grote Industries, Llc | Dual polarity LED lighting device |
US9203951B1 (en) | 2014-07-03 | 2015-12-01 | International Business Machines Corporation | Mobile telephone adapted for use with one hand |
US10444862B2 (en) | 2014-08-22 | 2019-10-15 | Synaptics Incorporated | Low-profile capacitive pointing stick |
CN104147779A (en) * | 2014-08-29 | 2014-11-19 | 钟卫 | Game system and method based on control buttons |
US10068727B2 (en) | 2015-08-04 | 2018-09-04 | Apple Inc. | Key surface lighting |
US10134649B2 (en) * | 2016-01-06 | 2018-11-20 | International Business Machines Corporation | Scanning acoustic microscope sensor array for chip-packaging interaction package reliability monitoring |
US10245112B2 (en) | 2016-06-27 | 2019-04-02 | Corindus, Inc. | Interlocking system and method for joysticks in a catheter procedure system |
GB2552025B (en) | 2016-07-08 | 2020-08-12 | Sovex Ltd | Boom conveyor |
US20180180494A1 (en) | 2016-12-22 | 2018-06-28 | Honeywell International Inc. | High Sensitivity Silicon Piezoresistor Force Sensor |
CN116907693A (en) | 2017-02-09 | 2023-10-20 | 触控解决方案股份有限公司 | Integrated digital force sensor and related manufacturing method |
US11243125B2 (en) | 2017-02-09 | 2022-02-08 | Nextinput, Inc. | Integrated piezoresistive and piezoelectric fusion force sensor |
WO2019023552A1 (en) | 2017-07-27 | 2019-01-31 | Nextinput, Inc. | A wafer bonded piezoresistive and piezoelectric force sensor and related methods of manufacture |
US11579028B2 (en) | 2017-10-17 | 2023-02-14 | Nextinput, Inc. | Temperature coefficient of offset compensation for force sensor and strain gauge |
WO2019099821A1 (en) * | 2017-11-16 | 2019-05-23 | Nextinput, Inc. | Force attenuator for force sensor |
US10719142B2 (en) * | 2017-11-22 | 2020-07-21 | Microsoft Technology Licensing, Llc | Multi-functional stylus |
EP4245239A3 (en) | 2019-07-15 | 2023-11-15 | Corindus, Inc. | Systems and methods for a control station for robotic interventional procedures using a plurality of elongated medical devices |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050217386A1 (en) * | 2002-04-12 | 2005-10-06 | Hokuriku Electric Industry Co., | Semiconductor force sensor |
JP2007010379A (en) * | 2005-06-28 | 2007-01-18 | Honda Motor Co Ltd | Force sensor |
US20070245836A1 (en) * | 2004-12-28 | 2007-10-25 | Vladimir Vaganov | Three-dimensional force input control device and fabrication |
US20070264743A1 (en) * | 2004-12-28 | 2007-11-15 | Vladimir Vaganov | Semiconductor input control device |
Family Cites Families (57)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4680577A (en) * | 1983-11-28 | 1987-07-14 | Tektronix, Inc. | Multipurpose cursor control keyswitch |
US4891985A (en) * | 1985-07-22 | 1990-01-09 | Honeywell Inc. | Force sensor with attached mass |
GB8701706D0 (en) * | 1987-01-27 | 1987-03-04 | Ici Plc | Immobilisation of enzymes |
EP0625701A1 (en) | 1987-04-24 | 1994-11-23 | Enplas Laboratories, Inc. | Force detector using piezoresistive elements |
US5263375A (en) * | 1987-09-18 | 1993-11-23 | Wacoh Corporation | Contact detector using resistance elements and its application |
US5035148A (en) * | 1989-02-01 | 1991-07-30 | Wacoh Corporation | Force detector using resistance elements |
US5231386A (en) * | 1990-07-24 | 1993-07-27 | Home Row, Inc. | Keyswitch-integrated pointing assembly |
US6314823B1 (en) * | 1991-09-20 | 2001-11-13 | Kazuhiro Okada | Force detector and acceleration detector and method of manufacturing the same |
DE4137624A1 (en) * | 1991-11-15 | 1993-05-19 | Bosch Gmbh Robert | SILICON CHIP FOR USE IN A FORCE SENSOR |
US5489900A (en) * | 1994-06-03 | 1996-02-06 | International Business Machines Corporation | Force sensitive transducer for use in a computer keyboard |
JPH0887375A (en) * | 1994-09-16 | 1996-04-02 | Fujitsu Ltd | Pointing device |
JPH0915074A (en) * | 1995-06-27 | 1997-01-17 | Mitsubishi Electric Corp | Semiconductor pressure detector and manufacture thereof |
US5760313A (en) * | 1997-03-05 | 1998-06-02 | Honeywell Inc. | Force sensor with multiple piece actuation system |
US6211558B1 (en) * | 1997-07-18 | 2001-04-03 | Kavlico Corporation | Surface micro-machined sensor with pedestal |
US6121954A (en) * | 1997-09-26 | 2000-09-19 | Cts Corporation | Unified bodied z-axis sensing pointing stick |
GB2335024A (en) * | 1998-03-06 | 1999-09-08 | Ibm | Joystick for portable computer system |
US6195082B1 (en) * | 1998-03-31 | 2001-02-27 | International Business Machines Corporation | Low noise circuit board for trackpoint pointing device |
US6534711B1 (en) * | 1998-04-14 | 2003-03-18 | The Goodyear Tire & Rubber Company | Encapsulation package and method of packaging an electronic circuit module |
JP4018813B2 (en) * | 1998-07-03 | 2007-12-05 | 富士通株式会社 | Mobile phone |
US6359613B1 (en) * | 1998-10-07 | 2002-03-19 | Cts Corporation | Pointing stick having chip resistors |
DE19852968C1 (en) * | 1998-11-17 | 2000-03-30 | Micronas Intermetall Gmbh | Semiconductor component with a pressure sensor and a semiconductor chip for additional functions and with a position sensor for indirect measurement of deflecting pressure |
US6388299B1 (en) * | 1998-12-10 | 2002-05-14 | Honeywell Inc. | Sensor assembly and method |
JP2000193544A (en) * | 1998-12-25 | 2000-07-14 | Ngk Insulators Ltd | Force sensor |
TW468128B (en) * | 1999-01-08 | 2001-12-11 | Acer Peripherals Inc | Pointing stick and its manufacturing method |
US6373265B1 (en) * | 1999-02-02 | 2002-04-16 | Nitta Corporation | Electrostatic capacitive touch sensor |
US6809721B2 (en) * | 1999-04-22 | 2004-10-26 | Gateway, Inc. | “Mini-stick” module—new mobiles joystick input device |
JP4233174B2 (en) * | 1999-04-30 | 2009-03-04 | 富士通コンポーネント株式会社 | pointing device |
TW430098U (en) * | 1999-05-04 | 2001-04-11 | Acer Peripherals Inc | Sensitive pointing device with ability of being miniatured |
DE19952087C1 (en) * | 1999-10-29 | 2001-06-07 | Bosch Gmbh Robert | Input device |
JP4295883B2 (en) * | 1999-12-13 | 2009-07-15 | 株式会社ワコー | Force detection device |
AU2001232876A1 (en) * | 2000-01-19 | 2001-07-31 | Synaptics, Inc. | Capacitive pointing stick |
JP2001221700A (en) * | 2000-02-08 | 2001-08-17 | Nitta Ind Corp | Electrostatic capacity sensor |
US6697049B2 (en) * | 2000-05-31 | 2004-02-24 | Darfon Electronics Corp. | Pointing stick with a rectangular-shaped hollow structure |
GB2362944A (en) * | 2000-06-02 | 2001-12-05 | Ismo Ltd | A keypad joystick |
US6903724B2 (en) * | 2000-12-08 | 2005-06-07 | Motorola, Inc. | Handheld communications devices with joysticks and switch contact layouts therefor |
US6441503B1 (en) * | 2001-01-03 | 2002-08-27 | Amkor Technology, Inc. | Bond wire pressure sensor die package |
US6518083B2 (en) * | 2001-01-31 | 2003-02-11 | Nippon Telegraph And Telephone Corporation | Surface shape recognition sensor and method of manufacturing the same |
US6950092B2 (en) * | 2001-02-27 | 2005-09-27 | International Business Machines Corporation | Input device with multiple controls having interchangeable functionality |
JP3814154B2 (en) * | 2001-03-02 | 2006-08-23 | 富士通テン株式会社 | Navigation device |
TW507981U (en) * | 2001-04-13 | 2002-10-21 | Huo-Sheng Wang | Joystick of mobile phone |
JP2003004562A (en) * | 2001-06-18 | 2003-01-08 | Alps Electric Co Ltd | Input device and detecting device |
US6753850B2 (en) * | 2001-07-24 | 2004-06-22 | Cts Corporation | Low profile cursor control device |
US6809529B2 (en) * | 2001-08-10 | 2004-10-26 | Wacoh Corporation | Force detector |
US6774887B2 (en) * | 2001-08-23 | 2004-08-10 | Shin Jiuh Corp. | Joystick |
US20030052861A1 (en) * | 2001-09-17 | 2003-03-20 | Jiang Peng | Portable communication device with detachable joystick and method therefor |
US6654005B2 (en) * | 2001-09-21 | 2003-11-25 | Cts Corporation | Low profile joy stick and switch |
US20030076302A1 (en) * | 2001-10-24 | 2003-04-24 | Gateway, Inc. | Joystick input device for palmtop information appliance |
US6788291B2 (en) * | 2001-11-06 | 2004-09-07 | Cts Corporation | Integrated surface-mount pointing device |
JP4260406B2 (en) * | 2002-02-14 | 2009-04-30 | 富士通コンポーネント株式会社 | Pressing direction detection sensor and input device using the same |
US6826042B2 (en) * | 2002-05-03 | 2004-11-30 | Hewlett-Packard Development Company, L.P. | Input device and methods and systems for same |
JP3960132B2 (en) * | 2002-06-06 | 2007-08-15 | 松下電器産業株式会社 | Multidirectional operation switch and multidirectional input device using the same |
JP2004070789A (en) * | 2002-08-08 | 2004-03-04 | Brother Ind Ltd | Pointing device and electronic device provided with pointing device |
US7123240B2 (en) * | 2003-05-13 | 2006-10-17 | Nokia Corporation | Mobile terminal with joystick |
US7554167B2 (en) * | 2003-12-29 | 2009-06-30 | Vladimir Vaganov | Three-dimensional analog input control device |
US7273767B2 (en) * | 2004-12-31 | 2007-09-25 | Carsem (M) Sdn. Bhd. | Method of manufacturing a cavity package |
DE102005004878B4 (en) * | 2005-02-03 | 2015-01-08 | Robert Bosch Gmbh | Micromechanical capacitive pressure sensor and corresponding manufacturing method |
JP2007010338A (en) * | 2005-06-28 | 2007-01-18 | Alps Electric Co Ltd | Surface pressure distribution sensor |
-
2008
- 2008-12-22 US US12/342,001 patent/US7880247B2/en not_active Expired - Fee Related
-
2009
- 2009-12-22 JP JP2011542555A patent/JP2012513660A/en active Pending
- 2009-12-22 DE DE112009003763T patent/DE112009003763T5/en not_active Withdrawn
- 2009-12-22 CN CN2009801554878A patent/CN102292692A/en active Pending
- 2009-12-22 WO PCT/US2009/069091 patent/WO2010075324A2/en active Application Filing
- 2009-12-22 KR KR1020117017296A patent/KR20110125210A/en not_active Application Discontinuation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050217386A1 (en) * | 2002-04-12 | 2005-10-06 | Hokuriku Electric Industry Co., | Semiconductor force sensor |
US20070245836A1 (en) * | 2004-12-28 | 2007-10-25 | Vladimir Vaganov | Three-dimensional force input control device and fabrication |
US20070264743A1 (en) * | 2004-12-28 | 2007-11-15 | Vladimir Vaganov | Semiconductor input control device |
JP2007010379A (en) * | 2005-06-28 | 2007-01-18 | Honda Motor Co Ltd | Force sensor |
Also Published As
Publication number | Publication date |
---|---|
JP2012513660A (en) | 2012-06-14 |
WO2010075324A2 (en) | 2010-07-01 |
US7880247B2 (en) | 2011-02-01 |
DE112009003763T5 (en) | 2012-10-04 |
KR20110125210A (en) | 2011-11-18 |
US20090212377A1 (en) | 2009-08-27 |
CN102292692A (en) | 2011-12-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2010075324A3 (en) | Semiconductor input control device | |
WO2007139730A3 (en) | Semiconductor input control device | |
US20140090485A1 (en) | MEMS Pressure Sensor Assembly | |
SG134334A1 (en) | Semiconductor package with passive device integration | |
GB2411307B (en) | Image sensor module and camera module package including the same | |
WO2003021667A3 (en) | Package with integrated inductor and/or capacitor | |
EP2060533A3 (en) | Semiconductor device and method of manufacturing the same | |
TW200715282A (en) | Passive elements in mram embedded integrated circuits | |
WO2008079887A3 (en) | Stacked mems device | |
WO2007081883A3 (en) | Three-dimensional force input control device and fabrication | |
GB0607934D0 (en) | Semiconductor device package utilizing proud interconnect material | |
HK1122906A1 (en) | Antenna structure of an integrated circuit | |
TW200802782A (en) | Chip module for complete power train | |
WO2004034428A3 (en) | Semiconductor device package | |
WO2006107507A3 (en) | Wafer level package including a device wafer integrated with a passive component | |
TW200802790A (en) | Electronic substrate, semiconductor device, and electronic device | |
WO2010039453A3 (en) | Inertial sensor with dual cavity package and method of fabrication | |
WO2007034374A3 (en) | A micro-fluidic device based upon active matrix principles | |
EP1840941A3 (en) | Semiconductor device and manufacturing method thereof | |
WO2010048102A3 (en) | Integrated sensor including sensing and processing die mounted on opposite sides of package substrate | |
WO2008127269A3 (en) | A method and apparatus for attaching a fluid cell to a planar substrate | |
WO2008008581A3 (en) | An electronics package with an integrated circuit device having post wafer fabrication integrated passive components | |
EP1336858A3 (en) | Two-dimensional magnetic sensor | |
EP4152376A4 (en) | Chip encapsulation structure and electronic device | |
WO2008155522A3 (en) | Improvements relating to semiconductor packages |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 200980155487.8 Country of ref document: CN |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 09835730 Country of ref document: EP Kind code of ref document: A2 |
|
ENP | Entry into the national phase |
Ref document number: 2011542555 Country of ref document: JP Kind code of ref document: A |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
WWE | Wipo information: entry into national phase |
Ref document number: 1120090037631 Country of ref document: DE Ref document number: 112009003763 Country of ref document: DE |
|
WWE | Wipo information: entry into national phase |
Ref document number: 5216/CHENP/2011 Country of ref document: IN |
|
ENP | Entry into the national phase |
Ref document number: 20117017296 Country of ref document: KR Kind code of ref document: A |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 09835730 Country of ref document: EP Kind code of ref document: A2 |