WO2010064506A1

WO2010064506A1 - Imaging device and endoscope

Info

Publication number: WO2010064506A1
Application number: PCT/JP2009/068420
Authority: WO
Inventors: 寛雲財; 裕之永水
Original assignee: オリンパスメディカルシステムズ株式会社
Priority date: 2008-12-04
Filing date: 2009-10-27
Publication date: 2010-06-10
Also published as: JPWO2010064506A1

Abstract

Provided is a double board type imaging device (51) having two solid-state imaging elements (35, 37). The imaging device is provided with: substrates (38, 39) on which electronic components (40, 41) required for driving the solid-state imaging elements (35, 37) are mounted, respectively; two cables (43, 45) electrically connected to the substrates (38, 39), respectively; and a heat dissipating member (60) arranged between the two substrates (38, 39).

Description

Imaging apparatus and endoscope

The present invention relates to an imaging apparatus having a plurality of solid-state imaging elements and an endoscope including the imaging apparatus, and more particularly to an imaging apparatus having a heat dissipation member and an endoscope including the imaging apparatus.

An imaging device having an objective optical system and a solid-state imaging device is desired to be downsized and to have high image quality. For example, when the imaging device is provided at the distal end portion of the insertion portion of the endoscope, the imaging device and the illumination optical system occupy most of the interior of the distal end portion. Therefore, reducing the size of the imaging device is effective for reducing the diameter of the distal end portion of the insertion portion and the entire insertion portion. On the other hand, as a method for improving the image quality, there is a method of increasing the number of pixels of the solid-state imaging device, but the size of the solid-state imaging device having a high number of pixels is large.

As a method for simultaneously realizing miniaturization and high image quality, there is known an image pickup apparatus having a multi-plate structure that achieves high image quality by using a plurality of solid-state image sensors. When the imaging apparatus is applied to an endoscope, an imaging apparatus having a two-plate solid-state imaging element structure using two solid-state imaging elements in order to make the diameter of the tip portion equal to that when a single-plate imaging apparatus is used. (Hereinafter referred to as “two-plate imaging device”) is suitable.

In the single-plate imaging device, color filters of three colors of red, green, and blue, or three colors of cyan, magenta, and yellow are provided in each pixel in the solid-state imaging device. A color is formed by two pixels.

On the other hand, in a two-plate image pickup device, a prism with a coating reflecting green and transmitting red and blue is installed, and red and blue colors are placed on one solid-state image pickup device arranged in a direction in which red and blue are transmitted. A filter is provided. Then, black and white and green color filters are provided on the other solid-state imaging device arranged in the direction in which green is reflected. By arranging two solid-state image sensors in this way, colors are formed using two pixels of each solid-state image sensor. That is, in the two-plate image pickup apparatus, it is possible to improve the image quality by using a solid-state image pickup device having a small number of pixels, that is, a small solid-state image pickup device.

Here, Japanese Patent Application Laid-Open No. 2004-258497 and Japanese Patent Application Laid-Open No. 2007-135951 disclose disposing a two-plate imaging device in the distal end portion of the endoscope.

An example of the configuration of a conventional two-plate imaging device used for an endoscope will be described with reference to FIG. The two-plate imaging device 101 includes a prism unit 102 and two solid-

state imaging elements

106 and 107.

The prism unit 102 includes a prism unit 103 including a first prism 104 and a second prism 105, a first solid-state image sensor 106 is provided on the first prism 104 side, and a second prism 105 side is provided. A second solid-state image sensor 107 is provided.

A first FPC (flexible printed circuit board) 108 on which an electronic component 110 is mounted is connected to the first solid-state imaging device 106, and a plurality of signal lines 116 of a communication cable 118 are electrically connected to the first FPC 108. It is connected to the. On the other hand, the second solid-state imaging device 107 is connected to the second FPC 109 on which the electronic component 111 is mounted, and the plurality of signal lines 117 of the communication cable 119 are electrically connected to the second FPC 109. Yes.

The tip of the prism unit 102 on the incident light side is fitted and fixed to the holding holder 112. A metal frame member 113 is provided on the outer peripheral surface of the base end of the holding holder 112 so as to enclose the two

FPCs

108 and 109. A heat shrinkable tube 114 is provided on the proximal end side of the holding holder 112. The heat-shrinkable tube 114 covers up to the outer peripheral portions of the two

communication cables

118 and 119. The heat shrinkable tube 114 is filled with a filler 115 that protects the imaging device 101.

As shown in FIG. 1, the two-plate imaging device 101 has a configuration in which the

electronic components

110 and 111 on the two

FPCs

108 and 109 necessary to drive the two solid-

state imaging devices

106 and 107 face each other. Therefore, it is excellent in terms of downsizing and assembly. However, since the second solid-state imaging device 107 and the

electronic components

110 and 111, which are heat generating components, are densely packed, the heat generated is transferred to the solid-

state imaging devices

106 and 107 via the filler 115, and the S / N is deteriorated. There was a risk.

The present invention has been made in view of the above problems, and an object thereof is to provide an imaging device suitable for downsizing and efficiently dissipating heat generated to prevent the influence of heat on a solid-state imaging device. And

An image pickup apparatus according to an embodiment of the present invention includes an objective lens unit, an optical unit that divides incident light that has passed through the objective lens unit into a plurality of optical paths, and outputs the optical unit, and the optical paths that the optical unit emits. A plurality of solid-state imaging devices that receive the respective light; a plurality of substrates that are provided in each of the plurality of solid-state imaging devices and on which electronic components necessary for driving the respective solid-state imaging devices are mounted; A plurality of cables that are electrically connected to a plurality of substrates and that supply power to the electronic components and transmit / receive signals to / from the solid-state imaging device via the substrates, and a heat dissipation member disposed between the plurality of substrates And.

An endoscope according to another embodiment of the present invention is an endoscope having an imaging device at a distal end portion of an insertion portion, and the imaging device passes through an objective lens unit and the objective lens unit. An optical unit that divides light into a plurality of optical paths and emits the light, a plurality of solid-state imaging devices that receive the light of the plurality of optical paths emitted by the optical unit, and the plurality of solid-state imaging devices, respectively. A plurality of substrates on which electronic components necessary for driving each of the solid-state imaging devices are mounted, and electrically connected to each of the plurality of substrates, supplying power to the electronic components via the substrates, and the solid A plurality of cables for transmitting and receiving signals to and from the image sensor; and a heat dissipating member disposed between the plurality of substrates.

It is a figure for demonstrating the structure of the conventional imaging device. It is a lineblock diagram showing the whole endoscope composition of a 1st embodiment. It is a figure for demonstrating the cross-section of the front-end | tip part of the endoscope of 1st Embodiment. It is a figure for demonstrating the structure of the imaging device of 1st Embodiment. It is a figure for demonstrating the structure of the imaging device of 2nd Embodiment. It is a figure for demonstrating the structure along the VI-VI line of FIG. 5 of the imaging device of 2nd Embodiment. It is a figure for demonstrating the structure of the imaging device of 3rd Embodiment. It is a figure for demonstrating the structure of the imaging device of 4th Embodiment. It is a figure for demonstrating the structure of the imaging device of 5th Embodiment. It is a figure for demonstrating the structure of the imaging device of 6th Embodiment. It is a figure for demonstrating the cross-sectional structure of the state by which the filler was uniformly provided in the imaging device.

Hereinafter, an imaging apparatus disposed in an endoscope that is a medical device that is inserted into a body cavity and observes a living tissue, for example, a rigid electronic endoscope provided with a rigid insertion portion will be described as an example.

(First embodiment)
A rigid electronic endoscope 1 (hereinafter simply referred to as “endoscope”) 1 shown in FIG. 2 has an imaging device 51 described later. The endoscope 1 includes an insertion portion 2 having a distal end portion 11, an operation portion 3 connected to the proximal end of the insertion portion 2, a universal cord 4 extending from the operation portion 3, and a proximal end of the universal cord 4 The scope connector 5 is disposed on the side of the scope connector 5, and the electrical connector 6 is provided at the end of the cable extending from the side of the scope connector 5.

Next, the structure of the distal end portion 11 of the endoscope 1 having the imaging device 51 of the present embodiment will be described with reference to FIG. As shown in FIG. 3, an observation lens 21 of the objective lens unit 20 and an illumination lens 22 that is an illumination optical component are disposed at the distal end of the distal end portion 11. In addition, the front-end | tip part 11 has the hard pipe | tube 27 which forms an external shape so that the substantially perimeter may be coat | covered. The hard tube 27 is fitted with the tip cover 25. The observation lens 21 is held by a lens holding frame 24 together with an objective lens group 23 including a plurality of objective lenses. That is, the objective lens unit 20 includes an observation lens 21, an objective lens group 23, and a lens holding frame 24. The objective lens unit 20 is fitted and fixed to a tip frame 26 that is a metallic tip hard member.

On the other hand, the illumination lens 22 is held by the tip cover 25. On the back side of the illumination lens 22, the tip surface of the light guide bundle 29 is disposed so as to face. The light guide bundle 29 is inserted into the insertion portion 2, the operation portion 3, and the universal cord 4 of the endoscope 1, is disposed up to the scope connector 5, and transmits illumination light from a light source device (not shown). A holding holder 28 that is inserted into the distal end frame 26 and is fitted and fixed to the lens holding frame 24 is disposed on the outer peripheral portion of the base end of the lens holding frame 24 of the objective lens unit 20.

The distal end portion of the prism unit 30 of the imaging device 51 (the distal end portion where the incident light from the objective lens unit 20 is incident) is fitted and fixed to the proximal end portion of the holding holder 28.

Next, the imaging device 51 of the present embodiment will be described with reference to FIGS. As shown in FIGS. 3 and 4, the imaging device 51 includes a prism unit 30 having a prism portion 31 constituting an optical unit, two solid-

state imaging devices

35 and 37, two

FPCs

38 and 39, and two This is a two-plate type imaging device 51 having

cables

43 and 45 and a heat radiating member 60.

The prism unit 30 is configured by joining a plurality of optical members, and divides the incident light that has passed through the objective lens unit 20 into two optical paths and emits them. That is, the prism unit 30 includes a prism portion 31 configured by bonding the first prism 32 and the second prism 33, a first cover glass 34 bonded to the emission surface side of the prism 32, and a prism And a second cover glass 36 joined to the light emitting surface 33 side. The prism unit 31 has a green reflective coating layer (also referred to as a dichroic coating layer) 30 A on a joint boundary surface where the first prism 32 and the second prism 33 are overlapped. The green reflective coating layer 30A is formed on the joining boundary surface where the first prism 32 and the second prism 33 are overlapped by applying a reflective film to the slope of the first prism 32, and the incident light green ( G) reflects light and transmits red (R) and blue (B) light.

A cover glass 34 and a first solid-state imaging device 35 for luminance signal or color signal (G signal) are provided on the exit surface side of the first prism 32 that is reflected substantially at right angles by the green reflective coating layer 30A. Arranged and fixed in order.

A cover glass 36 and two color signals (R, B) are provided behind the green prism coat layer 30A of the first prism 32 and the side that is transmitted through and emitted from the second prism 33 (outgoing surface side). Signal) second solid-state imaging device 37 is arranged and fixed in that order. The first solid-state imaging device 35, the second solid-state imaging device 37, the first prism 32, and the second prism 33 have the same optical path length.

The first solid-state imaging device 35 receives light emitted from the first prism 32 that is reflected by the green reflective coating layer 30 A and constitutes the prism portion 31. The second solid-state imaging device 37 receives light emitted from the second prism 33 through the first prism 32 and the second prism 33.

The second solid-state imaging device 37 has red (R) and blue (B) color filters (not shown) arranged in stripes on the light receiving surface. The solid-

state imaging devices

35 and 37 are CCDs or CMOSs, and the configuration other than the color filter is substantially the same. That is, the two solid-

state imaging devices

35 and 37 receive and photoelectrically convert the light in the two optical paths emitted from the prism unit 31 of the prism unit 30.

A first FPC (flexible printed circuit board) 38 on which electronic components 40 such as a capacitor and an IC are mounted is connected to the first solid-state imaging device 35. A second FPC 39 on which an electronic component 41 such as a capacitor and an IC is mounted is connected to the second solid-state imaging element 37. That is, the imaging device 51 is provided in each of the solid-

state imaging devices

35 and 37, and has

FPCs

38 and 39 on which

electronic components

40 and 41 necessary for driving the respective solid-state imaging devices are mounted. The

electronic components

40 and 41 are large-sized electronic components that generate the largest amount of heat among the plurality of electronic components mounted on the

FPCs

38 and 39. Further, the

FPCs

38 and 39 may have small electronic components mounted on the surface opposite to the surface on which the

electronic components

40 and 41 are mounted.

Further, the plurality of signal lines 42 of the first communication cable 43 are electrically connected to the first FPC 38. A plurality of signal lines 44 of the second communication cable 45 are electrically connected to the second FPC 39. The

communication cables

43 and 45 are cables for supplying power to the

electronic components

40 and 41 and transmitting and receiving signals to and from the solid-

state imaging devices

35 and 37 via the

FPCs

38 and 39. That is, the imaging device 51 is electrically connected to the

FPCs

38 and 39, and the

communication cables

43 and 45 that supply power to the

electronic components

40 and 41 and transmit and receive signals to and from the solid-

state imaging devices

35 and 37 through the

FPCs

38 and 39. Have.

The

FPCs

38 and 39 are arranged so that the arranged

electronic components

40 and 41 face each other across the extension line Oa of the optical axis O of the objective lens unit 20, that is, toward the optical axis extension direction. It is arrange | positioned in the opposing position. For this reason, there is a space (gap) between the FPC 38 and the FPC 39, in other words, between the electronic component 40 and the electronic component 41.

On the other hand, the front end of the prism unit 30 (the front end where the incident light from the objective lens unit 20 enters) is fitted and fixed to the prism unit joint 28A of the holding holder 28. A metal frame member 46 that includes two solid-

state imaging devices

35 and 37 and two

FPCs

35 and 38 is provided on the outer peripheral surface of the prism unit joint portion 28 A of the holding holder 28. Further, the heat shrinkable tube 47 is covered on the outer peripheral surface of the proximal end side of the holding holder 28. The heat-shrinkable tube 47 encloses the imaging device 51 including the metal frame member 46 and covers up to the outer peripheral portions of the two

communication cables

43 and 45. The heat shrinkable tube 47 is filled with a filler 48 for protecting the imaging device 51 and for releasing heat.

In the imaging device 51 of the present embodiment, the solid-

state imaging devices

35, 37 and the gap between the first FPC 38 and the second FPC 39 formed by disposing the

electronic components

40, 41 so as to face each other. A heat dissipating member 60 for dissipating heat generated by the

electronic components

40 and 41 is provided. In other words, in the gap formed by disposing the substrate surface on which the

electronic components

40 and 41 of the

FPCs

38 and 39 are disposed facing the optical axis extending direction of the objective lens unit 20, the heat dissipation member 60 is arranged.

The heat radiating member 60 is a heat sink, and is made of a metal material such as copper or aluminum having high thermal conductivity, for example. The heat radiating member 60 may be made of a material other than a metal material as long as it has a high thermal conductivity and a low heat storage property. The shape of the heat radiating member 60 is matched to the shape of the gap (space) between the two

FPCs

38 and 39 formed by disposing the

electronic components

40 and 41 so as to face each other.

For example, as shown in FIG. 4, the heat radiating member 60 has a cross section perpendicular to the optical axis O of the incident light of the objective lens unit 20, strictly the extension line Oa of the optical axis O, in the extending direction of the

FPCs

38 and 39. It is a trapezoidal shape that tapers towards. The shape of the heat radiating member 60 may be, for example, an arc (cone) shape in which a cross section perpendicular to the optical axis of incident light of the objective lens unit 20 tapers in the extending direction of the

FPCs

38 and 39. .

Between the heat dissipation member 60 and the electronic component 40 on the first FPC 38, between the heat dissipation member 60 and the electronic component 41 on the second FPC 39, and between the heat dissipation member 60 and the second solid-state imaging device 37. Is filled with a high thermal conductivity filler 48 made of a resin containing silicon particles or the like which are high thermal conductivity particles. A filler 48 is also filled between the periphery of the heat dissipating member 60 and the metal frame member 46 in the direction of the left and right side surfaces of the heat dissipating member 60.

Next, the operation of the imaging device 51 will be described with reference to FIG. When the surgeon drives the imaging device 51, the

electronic components

40 and 41 and the solid-

state imaging elements

35 and 37 generate heat. In the imaging device 51, the solid-

state imaging devices

35 and 37 and the

electronic components

40 and 41 are arranged in a region between the first FPC 38 and the second FPC 39 formed by arranging the

electronic components

40 and 41 so as to face each other. A heat dissipating member 60 is provided for dissipating the heat generated in step.

Therefore, the heat generated by the

electronic components

40 and 41 and the solid-

state imaging devices

35 and 37 is transferred to the heat radiating member 60 through the filler 48 and radiated.

That is, in the imaging device 51, the

electronic components

40 and 41 and the second solid-state imaging element 37 are densely arranged by the structure in which the

electronic components

40 and 41 face each other, but heat can be efficiently radiated by the heat radiating member 60. For this reason, the first solid-state imaging element 35 and the second solid-state imaging element 37 of the imaging device 51 are not easily affected by heat, and the operation is stable because the deterioration of S / N is prevented.

As described above, even if the imaging device 51 of the first embodiment is a small two-plate imaging device 51 having a structure in which the

electronic components

40 and 41 face each other, the heat generated can be efficiently radiated. Therefore, the solid-

state imaging elements

35 and 37 are not affected by heat. Note that in the imaging device 51, due to the heat dissipation effect of the heat dissipation member 60, the

electronic components

40 and 41 other than the solid-

state imaging elements

35 and 37 are not easily affected by heat. Further, the endoscope 1 having the imaging device 51 has the effect of the imaging device 51 and realizes the diameter reduction of the distal end portion 11 of the insertion portion 2 and the entire insertion portion.

(Second Embodiment)
Next, the imaging device 51A and the endoscope 1A according to the second embodiment will be described with reference to FIGS. Since the imaging device 51A is similar to the imaging device 51, the same components are denoted by the same reference numerals and description thereof is omitted.

As shown in FIG. 5, in the image pickup apparatus 51 A, a part of the heat radiating member 60 includes a first solid-state image pickup device 35, a second solid-state image pickup device 37, a first FPC 38, and a second FPC 39. It is in contact with the member 46. The metal frame member 46 is a thin metal tubular member.

That is, as shown in FIGS. 5 and 6, along the extending direction of the first FPC 38 and the second FPC 39 (the optical axis direction of the incident light of the objective lens unit 20), which is a part of the heat radiating member 60. The entire side region on one side of the left and right side portions is in surface contact with the metal frame member 46.

In the imaging device 51A of the present embodiment, the side surface portion of the heat radiating member 60 is in surface contact with the metal frame member 46 having high thermal conductivity, so that the heat of the heat radiating member 60 is transferred to the metal frame member 46, and the metal Heat is radiated from the frame member 46. Therefore, the imaging device 51A has a higher heat dissipation effect than the imaging device 51.

Even if a part of the heat radiating member 60 is disposed close to the metal frame member 46 or a part of the side surface portion of the metal frame member 46 is disposed so as to contact the metal frame member 46, the heat radiating member 60. If the heat is transferred to the metal frame member 46, a heat radiation effect higher than that of the imaging device 51 can be obtained. When the heat radiating member 60 is arranged so as to be close to the metal frame member 46, a filler 48 is interposed between the heat radiating member 60 and the metal frame member 46.

In addition, it is preferable that the metal frame member 46 is increased in thickness so that the diameter of the imaging device 51A does not increase, thereby improving the heat dissipation effect.

As described above, the imaging apparatus 51A includes a metal frame in which at least a part of the heat dissipation member 60 includes the first solid-state imaging element 35, the second solid-state imaging element 37, the first FPC 38, and the second FPC 39. It is close to or in contact with the member 46. For this reason, in addition to the effect which imaging device 51 and endoscope 1 have, imaging device 51A and endoscope 1A have the heat dissipation effect improved more.

(Third embodiment)
Next, an imaging device 51B and an endoscope 1B according to the third embodiment will be described with reference to FIG. Since the imaging device 51B is similar to the imaging device 51 and the like, the same components are denoted by the same reference numerals and description thereof is omitted.

As shown in FIG. 7, in the imaging device 51 B, the signal line 44 a that is a part of the signal lines 42, 44, 44 a included in the first and

second communication cables

43, 45 A is connected and fixed to the heat radiating member 60. . The signal line is made of a conductive material such as copper, and the conductive material is a high thermal conductivity material.

In the imaging device 51B, since the signal line 44a of the second communication cable 45A is connected to a part of the heat radiating member 60, the heat in the heat radiating member 60 is transferred to the signal line 44a, so that the heat radiating effect is effective. It is more improved.

That is, the second communication cable 45A is configured in the same manner as the first communication cable 43, but has a heat radiating signal line 44a other than the signal line 44 necessary for power feeding and signal transmission / reception. Yes. The signal line 44 a may be an excess signal line in the cable, or may be provided in the cable particularly for connecting the heat radiating member 60.

Further, the first communication cable 43 may be configured in the same manner as the second communication cable 45A, and the heat radiation signal line may be connected to the heat radiation member 60 together with the signal line 44a, or a plurality of heat radiation signal lines. The first and

second communication cables

43 and 45 A having 44 a may be prepared, and a plurality of heat radiating signal lines 44 a may be connected to the heat radiating member 60.

The two

communication cables

43 and 45A may be coaxial cables, and an external conductor having a ground potential wound around the central conductor of at least one coaxial cable may be connected to the heat radiating member 60 as a heat radiating signal line.

Further, the connection location of the signal line 44a to the heat radiating member 60 is not limited to the tapered lower portion of the heat radiating member 60 as shown in FIG. 7, and may be connected to other locations.

The signal line 44a connected to the heat radiating member 60 has been described with respect to the configuration using the signal line 44a of the second communication cable 45A. A heat dissipation cable having a dedicated signal line for heat dissipation may be provided. However, it is desirable that the heat radiating cable has a diameter that does not increase the diameter of the imaging device 51A and has a signal line with high thermal conductivity.

As described above, the imaging device 51B of the present embodiment has a configuration in which part of the signal lines 42, 44, and 44a included in the first and

second communication cables

43 and 45A are attached to the heat dissipation member 60. is there. For this reason, in addition to the effect which the imaging device 51 and the endoscope 1 have, the imaging device 51B and the endoscope 1B have a more improved heat dissipation effect.

(Fourth embodiment)
Next, an imaging device 51C and an endoscope 1C according to the fourth embodiment will be described with reference to FIG. Since the imaging device 51C is similar to the imaging device 51 and the like, the same components are denoted by the same reference numerals and description thereof is omitted.

As shown in FIG. 8, the heat dissipating member 60A of the image pickup apparatus 51C has cutouts 61 that are opened in the extending direction side and on both side surfaces of the two

FPCs

38 and 39. For this reason, the surface area of 60 A of heat radiating members is larger than the surface area of the heat radiating member 60 of 1st Embodiment. Since the cutout 61 of the heat dissipation member 60A shown in FIG. 8 is provided so that the extending direction side and both side portions on the base end side of the

FPCs

38 and 39 are opened, the heat dissipation member 60A does not have the cutout 61. The surface area is larger than that of the heat dissipation member 60.

The heat radiating member 60A may have two notches so that, for example, a part of both sides of the upper surface and the lower surface in the direction perpendicular to the optical axis O of the objective lens unit 20 is opened.

Furthermore, the shape or the like of the notch 61 is not limited to the shape shown in FIG. 8, and for example, the width and length of the opening may be appropriately changed.

The imaging device 51C of the present embodiment has a notch 61 in the heat radiating member 60A, and the surface area of the heat radiating member 60A is larger than that of the heat radiating member 60 of the imaging device 51 of the first embodiment. For this reason, in addition to the effect which the imaging device 51 and the endoscope 1 have, the imaging device 51C and the endoscope 1C have a further improved heat dissipation effect.

(Fifth embodiment)
Next, an imaging device 51D and an endoscope 1D according to the fifth embodiment will be described with reference to FIG. Since the imaging device 51D is similar to the imaging device 51 and the like, the same components are denoted by the same reference numerals and description thereof is omitted.

As shown in FIG. 9, the heat radiating member 60B of the imaging device 51D of the present embodiment includes a first heat radiating member 62 divided into two in the vertical direction on a surface perpendicular to the optical axis 0 of the objective lens unit 20. And a second heat radiating member 63. The vertical direction is the vertical direction in FIG. 9, that is, the direction in which the FPC 38 and the FPC 39 are arranged to face each other. In other words, the heat radiating member 60B is divided into two in the vertical direction on the surface perpendicular to the optical axis O of the objective lens unit 20, and thus has a large surface area. The two divided

heat dissipating members

62 and 63 are arranged at a predetermined interval.

Since the heat radiating member 60B of the imaging device 51D is divided into two parts as the

heat radiating members

62 and 63 and arranged so as to be separated at a predetermined interval, the entire surface area of the heat radiating member 60B is the same as that of the fourth embodiment. It is larger than the heat dissipation member 60A of the imaging device 51C. Therefore, the heat dissipation effect of the heat dissipation member 60B is further improved.
Note that the shapes of the

heat dissipation members

62 and 63 of the heat dissipation member 60B may be the same size and shape, or may be different sizes and shapes. Further, the heat dissipating member 60B is only required to be divided into at least two in the vertical direction. For example, the heat dissipating member is formed so that part of both sides of the upper surface and the lower surface in the direction perpendicular to the optical axis O of the objective lens unit 20 are opened. 60B may be divided into four.

In addition to the effects of the imaging device 51C and the endoscope 1C, the imaging device 51D and the endoscope 1D have a further improved heat dissipation effect.

(Sixth embodiment)
Next, an imaging device 51E and an endoscope 1E according to the sixth embodiment will be described with reference to FIG. Since the imaging device 51E is similar to the imaging device 51 and the like, the same components are denoted by the same reference numerals and description thereof is omitted.

As shown in FIG. 10, the imaging device 51 E includes a heat dissipation member 60 on at least a part of a portion of the

electronic components

40 and 41 that are mounted on the first and

second FPCs

38 and 39, respectively, in contact with the heat dissipation member 60. Insulating member 64 is provided to prevent contact with and insulate. The insulating member 64 is an insulating tape formed of, for example, an insulating material, and is attached to the entire region or a partial region of each of the

electronic components

40 and 41 facing the heat radiating member 60. The insulating member 64 is preferably formed of a material having high thermal conductivity.

The insulating member 64 is not limited to the insulating tape, and may be an insulating layer formed by applying an insulating material to the entire area of the

electronic components

40 and 41 or a part of the area.

Since the imaging device 51E does not cause contact between the

electronic components

40 and 41 and the heat dissipation member 60, that is, a short circuit, the operations of the

electronic components

40 and 41 and the solid-

state imaging elements

35 and 37 are stable.

The insulating member 64 may be provided in a region where the

electronic components

40 and 41 and the heat radiating member 60 are in contact with each other, or even if the

electronic components

40 and 41 and the heat radiating member 60 are not in contact with each other, You may provide in all the area | regions or a one part area | region. The insulating member 64 may be provided on one of the

electronic components

40 and 41. That is, the heat radiating member 60 of the imaging device may be provided with the insulating member 64, or may be configured with at least a part of the insulating member 64, or at least part of the

electronic components

40 and 41. An insulating member 64 may be provided to prevent contact with the heat radiating member 60 for insulation.

The imaging device 51E and the endoscope 1E have stable operations in addition to the effects of the imaging device 51 and the endoscope 1.

(Modification)
In the imaging devices 51 and the like of the first to sixth embodiments, the

heat dissipating members

60, 60A, 60B may themselves be constituted by insulating members, or may be constituted by conductive members, and the outer peripheral surface. The insulating member may be attached or applied to all or at least a part. As a result, the contact between the

electronic components

40 and 41 and the heat radiating member 60 can be prevented similarly to the imaging device 51D of the sixth embodiment, and the operation of the imaging device is stabilized.

As shown in FIG. 11, in the imaging device having the metal frame member 46, the region between the metal frame member 46 and the heat dissipation member 60, the metal frame member 46 and the first and

second FPCs

38 and 39, It is preferable to provide the fillers 48 in the regions between the layers in a substantially uniform thickness. Then, the heat dissipation effect of the heat radiating member 60 itself can be improved, and the heat radiating member 60 can be disposed near the center of the imaging device 51, so that the imaging device 51 is reduced in diameter.

Moreover, although the imaging apparatus 51 of the embodiment according to the present invention has been described by taking a two-plate imaging apparatus having two solid-

state imaging elements

35 and 37 as an example, the imaging apparatus 51 is not limited to this, and for example, a three-plate imaging Needless to say, the present invention can also be applied to a configuration in which an apparatus is provided and the photographing light is divided into three optical paths and emitted by the prism unit.

As described above, the endoscope of the present invention is an endoscope having an imaging device at the distal end portion of the insertion portion, and the imaging device has an objective lens unit and an incident light that has passed through the objective lens unit. An optical unit that divides light into two optical paths and emits the light; a first solid-state image sensor and a second solid-state image sensor that receive light in the two optical paths emitted from the optical unit; A first substrate and a second substrate on which electronic components necessary for driving each of the first solid-state imaging device and the second solid-state imaging device are mounted; and the first substrate and the second substrate. The heat dissipating member having a notch disposed between and the first substrate or the second substrate are electrically connected to each other, and the first substrate or the second substrate passes through the first substrate or the second substrate. Power supply to electronic components and Two cables having a signal line for transmitting and receiving signals to and from the first solid-state imaging device or the second solid-state imaging device, and a signal line connected to the heat dissipation member, and the first solid state An image sensor, the second solid-state image sensor, the first substrate and the second substrate are included, a metal frame member having a contact surface with a part of the heat dissipation member, and at least a part of the electronic component The insulating tape which prevents the contact with the said heat radiating member provided, and the filler with which the said metal frame member is filled are comprised.

The present invention is not limited to the above-described embodiments and modifications, and various changes and modifications can be made without departing from the scope of the present invention.

This application is filed on the basis of the priority claim of Japanese Patent Application No. 2008-310079 filed in Japan on Dec. 4, 2008, and the above disclosed contents are disclosed in the present specification, claims, It shall be cited in the drawing.

Claims

An objective lens unit;
An optical unit that divides and emits incident light that has passed through the objective lens unit into a plurality of optical paths;
A plurality of solid-state imaging devices that receive light of each of the plurality of optical paths emitted by the optical unit;
A plurality of substrates provided on each of the plurality of solid-state image sensors, on which electronic components necessary for driving the respective solid-state image sensors are mounted;
A plurality of cables that are electrically connected to each of the plurality of substrates and that supply power to the electronic component and transmit / receive signals to / from the solid-state imaging device via the substrate;
An image pickup apparatus comprising: a heat dissipating member disposed between the plurality of substrates.
The electronic components of the plurality of substrates are arranged in the direction of the optical axis extension of the objective lens unit;
The imaging apparatus according to claim 1, wherein the heat radiating member is disposed between the plurality of substrates.
The plurality of image sensors are composed of a first solid-state image sensor and a second solid-state image sensor,
The plurality of substrates comprises a first substrate and a second substrate;
The heat dissipating member is disposed between the first substrate and the second substrate;
The imaging apparatus according to claim 2, wherein the imaging apparatus is a two-plate imaging apparatus.
A metal frame member enclosing the plurality of solid-state imaging devices and the plurality of substrates;
The imaging apparatus according to claim 3, wherein a part of the heat radiating member is close to the metal frame member or a part of the heat radiating member is in contact with the metal frame member.
The plurality of cables have a plurality of signal lines;
The imaging apparatus according to claim 4, wherein some of the signal lines are attached to the heat radiating member.
6. The imaging apparatus according to claim 5, wherein the heat radiating member has a notch.
The imaging device according to claim 6, wherein the heat radiating member is divided into at least two parts.
8. The imaging apparatus according to claim 7, wherein an insulating member that prevents contact with the heat radiating member is provided on at least a part of the electronic component.
An endoscope having an imaging device at a distal end portion of an insertion portion,
The imaging device is
An objective lens unit;
An optical unit that divides and emits incident light that has passed through the objective lens unit into a plurality of optical paths;
A plurality of solid-state imaging devices that receive light of each of the plurality of optical paths emitted by the optical unit;
A plurality of substrates provided on each of the plurality of solid-state image sensors, on which electronic components necessary for driving the respective solid-state image sensors are mounted;
A plurality of cables that are electrically connected to each of the plurality of substrates and that supply power to the electronic component and transmit / receive signals to / from the solid-state imaging device via the substrate;
An endoscope comprising: a heat dissipating member disposed between the plurality of substrates.
The electronic components of the plurality of substrates are arranged in the direction of the optical axis extension of the objective lens unit;
The endoscope according to claim 9, wherein the heat radiating member is disposed in a gap between the plurality of substrates.
The plurality of image sensors are composed of a first solid-state image sensor and a second solid-state image sensor,
The plurality of substrates comprises a first substrate and a second substrate;
The heat dissipating member is disposed between the first substrate and the second substrate;
The endoscope according to claim 10, which is a two-plate imaging device.
A metal frame member enclosing the plurality of solid-state imaging devices and the plurality of substrates;
The endoscope according to claim 11, wherein a part of the heat radiating member is close to the metal frame member, or a part of the heat radiating member is in contact with the metal frame member.
The plurality of cables have a plurality of signal lines;
The endoscope according to claim 12, wherein some of the signal lines are attached to the heat dissipation member.
The endoscope according to claim 13, wherein the heat radiating member has a notch.
The endoscope according to claim 14, wherein the heat radiating member is divided into at least two in the vertical direction on a surface perpendicular to the optical axis of the objective lens unit, and has a large surface area. .