WO2010063023A3 - Electronic device including circuitry comprising open failure-susceptible components, and open failure-actuated anti-fuse pathway - Google Patents

Electronic device including circuitry comprising open failure-susceptible components, and open failure-actuated anti-fuse pathway Download PDF

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Publication number
WO2010063023A3
WO2010063023A3 PCT/US2009/066073 US2009066073W WO2010063023A3 WO 2010063023 A3 WO2010063023 A3 WO 2010063023A3 US 2009066073 W US2009066073 W US 2009066073W WO 2010063023 A3 WO2010063023 A3 WO 2010063023A3
Authority
WO
WIPO (PCT)
Prior art keywords
open failure
open
electronic device
ancillary
device including
Prior art date
Application number
PCT/US2009/066073
Other languages
French (fr)
Other versions
WO2010063023A2 (en
Inventor
George R. Brandes
Original Assignee
Cree, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cree, Inc. filed Critical Cree, Inc.
Priority to CN200980153547.2A priority Critical patent/CN102273324B/en
Priority to EP09829842.5A priority patent/EP2356886B1/en
Publication of WO2010063023A2 publication Critical patent/WO2010063023A2/en
Publication of WO2010063023A3 publication Critical patent/WO2010063023A3/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/40—Details of LED load circuits
    • H05B45/42—Antiparallel configurations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
    • H01L29/861—Diodes
    • H01L29/866—Zener diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

An electronic device including series-connected open failure-susceptible components and re-routing assemblies for directing current through an ancillary current path to maintain operability of the series array despite an open-failed component therein. The re-routing assembly can be constituted as an ancillary circuit containing a bypass control element arranged to maintain the ancillary circuit in a non-current flow condition when none of the open failure-susceptible components has experienced open failure, and to re-route current from a main circuit around an open-failed component therein and through the ancillary circuit and back to the main circuit, to bypass the open-failed component so that all non-failed series components of the main circuit remain operative when electrically energized.
PCT/US2009/066073 2008-11-30 2009-11-30 Electronic device including circuitry comprising open failure-susceptible components, and open failure-actuated anti-fuse pathway WO2010063023A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN200980153547.2A CN102273324B (en) 2008-11-30 2009-11-30 Electronic device including circuitry comprising open failure-susceptible components, and open failure-actuated anti-fuse pathway
EP09829842.5A EP2356886B1 (en) 2008-11-30 2009-11-30 Electronic device including circuitry comprising open failure-susceptible components, and open failure-actuated anti-fuse pathway

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/325,214 2008-11-30
US12/325,214 US8643283B2 (en) 2008-11-30 2008-11-30 Electronic device including circuitry comprising open failure-susceptible components, and open failure-actuated anti-fuse pathway

Publications (2)

Publication Number Publication Date
WO2010063023A2 WO2010063023A2 (en) 2010-06-03
WO2010063023A3 true WO2010063023A3 (en) 2010-09-16

Family

ID=42222244

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2009/066073 WO2010063023A2 (en) 2008-11-30 2009-11-30 Electronic device including circuitry comprising open failure-susceptible components, and open failure-actuated anti-fuse pathway

Country Status (4)

Country Link
US (1) US8643283B2 (en)
EP (1) EP2356886B1 (en)
CN (1) CN102273324B (en)
WO (1) WO2010063023A2 (en)

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CN102750920A (en) * 2012-07-02 2012-10-24 深圳市华星光电技术有限公司 LED (Light emitting diode) backlight driving circuit, backlight module and liquid crystal display device
US8680780B2 (en) 2012-07-02 2014-03-25 Shenzhen China Star Optoelectronics Technology Co., Ltd. LED backlight driving circuit, backlight module, and LCD device
JP2015126077A (en) * 2013-12-26 2015-07-06 豊田合成株式会社 Light emitting component, light emitting device, and their manufacturing methods
CN105334661B (en) * 2015-11-12 2019-08-27 青岛海信电器股份有限公司 A kind of LED, backlight module and display device
JP6481245B2 (en) * 2017-04-12 2019-03-13 Ｚｉｇｅｎライティングソリューション株式会社 Light emitting device

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Also Published As

Publication number Publication date
US8643283B2 (en) 2014-02-04
CN102273324B (en) 2014-10-15
EP2356886A4 (en) 2011-09-21
EP2356886B1 (en) 2014-03-26
US20100134176A1 (en) 2010-06-03
CN102273324A (en) 2011-12-07
EP2356886A2 (en) 2011-08-17
WO2010063023A2 (en) 2010-06-03

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