WO2010036575A3 - Methods and systems for preventing feature collapse during microelectronic topography fabrication - Google Patents
Methods and systems for preventing feature collapse during microelectronic topography fabrication Download PDFInfo
- Publication number
- WO2010036575A3 WO2010036575A3 PCT/US2009/057490 US2009057490W WO2010036575A3 WO 2010036575 A3 WO2010036575 A3 WO 2010036575A3 US 2009057490 W US2009057490 W US 2009057490W WO 2010036575 A3 WO2010036575 A3 WO 2010036575A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- methods
- systems
- fabrication
- topography
- collapse during
- Prior art date
Links
- 238000012876 topography Methods 0.000 title abstract 4
- 238000000034 method Methods 0.000 title abstract 3
- 238000004377 microelectronic Methods 0.000 title abstract 2
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000007788 liquid Substances 0.000 abstract 4
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 238000005530 etching Methods 0.000 abstract 1
- 239000012530 fluid Substances 0.000 abstract 1
- 238000011010 flushing procedure Methods 0.000 abstract 1
- 238000013022 venting Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31105—Etching inorganic layers
- H01L21/31111—Etching inorganic layers by chemical means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
- H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02101—Cleaning only involving supercritical fluids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31105—Etching inorganic layers
- H01L21/31111—Etching inorganic layers by chemical means
- H01L21/31116—Etching inorganic layers by chemical means by dry-etching
Abstract
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011529128A JP5680539B2 (en) | 2008-09-24 | 2009-09-18 | Method and system for preventing feature collapse during microelectronic topography manufacturing |
KR1020117006728A KR101663843B1 (en) | 2008-09-24 | 2009-09-18 | Methods and systems for preventing feature collapse during microelectronic topography fabrication |
CN200980136973.5A CN102160149B (en) | 2008-09-24 | 2009-09-18 | Methods and systems for preventing feature collapse during microelectronic topography fabrication |
TW098131869A TWI496209B (en) | 2008-09-24 | 2009-09-22 | Methods and systems for preventing feature collapse during microelectronic topography fabrication |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/237,070 US8153533B2 (en) | 2008-09-24 | 2008-09-24 | Methods and systems for preventing feature collapse during microelectronic topography fabrication |
US12/237,070 | 2008-09-24 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2010036575A2 WO2010036575A2 (en) | 2010-04-01 |
WO2010036575A3 true WO2010036575A3 (en) | 2010-06-03 |
Family
ID=42036562
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2009/057490 WO2010036575A2 (en) | 2008-09-24 | 2009-09-18 | Methods and systems for preventing feature collapse during microelectronic topography fabrication |
Country Status (6)
Country | Link |
---|---|
US (1) | US8153533B2 (en) |
JP (1) | JP5680539B2 (en) |
KR (1) | KR101663843B1 (en) |
CN (1) | CN102160149B (en) |
TW (1) | TWI496209B (en) |
WO (1) | WO2010036575A2 (en) |
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JP5471740B2 (en) * | 2010-04-08 | 2014-04-16 | 東京エレクトロン株式会社 | Substrate processing equipment |
JP5647845B2 (en) * | 2010-09-29 | 2015-01-07 | 株式会社Screenホールディングス | Substrate drying apparatus and substrate drying method |
JP6006923B2 (en) * | 2010-09-30 | 2016-10-12 | Kisco株式会社 | Drying apparatus and drying method for ultrafine structure |
JP5450494B2 (en) * | 2011-03-25 | 2014-03-26 | 株式会社東芝 | Supercritical drying method for semiconductor substrates |
JP6085424B2 (en) * | 2011-05-30 | 2017-02-22 | 株式会社東芝 | Substrate processing method, substrate processing apparatus, and storage medium |
JP6085423B2 (en) * | 2011-05-30 | 2017-02-22 | 株式会社東芝 | Substrate processing method, substrate processing apparatus, and storage medium |
WO2012165377A1 (en) | 2011-05-30 | 2012-12-06 | 東京エレクトロン株式会社 | Method for treating substrate, device for treating substrate and storage medium |
JP5859888B2 (en) * | 2012-03-26 | 2016-02-16 | 株式会社Screenホールディングス | Substrate processing apparatus and substrate processing method |
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TWI689004B (en) * | 2012-11-26 | 2020-03-21 | 美商應用材料股份有限公司 | Stiction-free drying process with contaminant removal for high-aspect-ratio semiconductor device structures |
JP6400919B2 (en) * | 2013-03-07 | 2018-10-03 | 芝浦メカトロニクス株式会社 | Substrate processing apparatus and substrate processing method |
JP6199155B2 (en) * | 2013-10-30 | 2017-09-20 | 株式会社Screenホールディングス | Sacrificial film removal method and substrate processing apparatus |
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JP6521799B2 (en) | 2015-08-31 | 2019-05-29 | 東京エレクトロン株式会社 | Method of removing halogen and method of manufacturing semiconductor device |
KR102062873B1 (en) | 2015-10-04 | 2020-01-06 | 어플라이드 머티어리얼스, 인코포레이티드 | Small thermal mass pressurized chamber |
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US10446416B2 (en) * | 2016-08-09 | 2019-10-15 | Lam Research Ag | Method and apparatus for processing wafer-shaped articles |
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JP7038524B2 (en) | 2017-11-14 | 2022-03-18 | 東京エレクトロン株式会社 | Cleaning equipment and cleaning method for substrate processing equipment |
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-
2008
- 2008-09-24 US US12/237,070 patent/US8153533B2/en active Active
-
2009
- 2009-09-18 WO PCT/US2009/057490 patent/WO2010036575A2/en active Application Filing
- 2009-09-18 CN CN200980136973.5A patent/CN102160149B/en not_active Expired - Fee Related
- 2009-09-18 KR KR1020117006728A patent/KR101663843B1/en active IP Right Grant
- 2009-09-18 JP JP2011529128A patent/JP5680539B2/en not_active Expired - Fee Related
- 2009-09-22 TW TW098131869A patent/TWI496209B/en active
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Also Published As
Publication number | Publication date |
---|---|
CN102160149A (en) | 2011-08-17 |
US20100072169A1 (en) | 2010-03-25 |
US8153533B2 (en) | 2012-04-10 |
KR20110063774A (en) | 2011-06-14 |
CN102160149B (en) | 2014-09-17 |
WO2010036575A2 (en) | 2010-04-01 |
KR101663843B1 (en) | 2016-10-07 |
TWI496209B (en) | 2015-08-11 |
JP2012503883A (en) | 2012-02-09 |
JP5680539B2 (en) | 2015-03-04 |
TW201021115A (en) | 2010-06-01 |
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