WO2010035998A3 - 반도체용 슬러리 공급장치 및 슬러리 공급방법 - Google Patents

반도체용 슬러리 공급장치 및 슬러리 공급방법 Download PDF

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Publication number
WO2010035998A3
WO2010035998A3 PCT/KR2009/005373 KR2009005373W WO2010035998A3 WO 2010035998 A3 WO2010035998 A3 WO 2010035998A3 KR 2009005373 W KR2009005373 W KR 2009005373W WO 2010035998 A3 WO2010035998 A3 WO 2010035998A3
Authority
WO
WIPO (PCT)
Prior art keywords
slurry
filter
semiconductor
supplying slurry
recovery tank
Prior art date
Application number
PCT/KR2009/005373
Other languages
English (en)
French (fr)
Other versions
WO2010035998A2 (ko
Inventor
김형일
홍사문
고세종
Original Assignee
씨앤지하이테크 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 씨앤지하이테크 주식회사 filed Critical 씨앤지하이테크 주식회사
Priority to JP2011528925A priority Critical patent/JP5303649B2/ja
Priority to US13/120,149 priority patent/US20110174745A1/en
Publication of WO2010035998A2 publication Critical patent/WO2010035998A2/ko
Publication of WO2010035998A3 publication Critical patent/WO2010035998A3/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents

Abstract

본 발명은 공급되는 상기 슬러리 중 소정치 이상의 입자를 제거하기 위한 여과기; 상기 여과기에 연결되어 주입되는 압축공기를 통해 상기 여과기의 역세척을 실시하는 공기 주입기; 상기 여과기에 연결되어 여과되지 않은 슬러리가 저장되는 슬러리 회수탱크; 및 상기 슬러리 회수 탱크에 설치되어 여과되지 않은 슬러리를 파쇄하기 위한 파쇄기를 포함하여 이루어진데 특징이 있다.
PCT/KR2009/005373 2008-09-24 2009-09-22 반도체용 슬러리 공급장치 및 슬러리 공급방법 WO2010035998A2 (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2011528925A JP5303649B2 (ja) 2008-09-24 2009-09-22 半導体用スラリー供給装置及びスラリー供給方法
US13/120,149 US20110174745A1 (en) 2008-09-24 2009-09-22 Apparatus and method for supplying slurry for a semiconductor

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020080093708A KR100985861B1 (ko) 2008-09-24 2008-09-24 반도체용 슬러리 공급장치 및 슬러리 공급방법
KR10-2008-0093708 2008-09-24

Publications (2)

Publication Number Publication Date
WO2010035998A2 WO2010035998A2 (ko) 2010-04-01
WO2010035998A3 true WO2010035998A3 (ko) 2010-07-08

Family

ID=42060252

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2009/005373 WO2010035998A2 (ko) 2008-09-24 2009-09-22 반도체용 슬러리 공급장치 및 슬러리 공급방법

Country Status (4)

Country Link
US (1) US20110174745A1 (ko)
JP (1) JP5303649B2 (ko)
KR (1) KR100985861B1 (ko)
WO (1) WO2010035998A2 (ko)

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JP5038378B2 (ja) * 2009-11-11 2012-10-03 株式会社コガネイ 薬液供給装置および薬液供給方法
KR101138403B1 (ko) * 2010-09-02 2012-04-26 씨앤지하이테크 주식회사 배관 막힘 방지 수단이 마련된 반도체용 슬러리 공급장치
JP6140051B2 (ja) 2013-10-23 2017-05-31 株式会社荏原製作所 研磨方法および研磨装置
KR101907830B1 (ko) 2018-05-15 2018-12-07 한동권 평면형 tv 프레임 측 헤어라인 가공을 위한 헤어라인 형성방법
DE102020131637A1 (de) * 2020-05-22 2021-11-25 Taiwan Semiconductor Manufacturing Co., Ltd. Filtervorrichtung für prozess zur herstellung von halbleitervorrichtungen
KR102351236B1 (ko) * 2021-01-28 2022-01-14 플러스이엔지 주식회사 직병렬 모드 변경 가능한 필터 시스템 및 이를 구비한 슬러리 공급 장치

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Also Published As

Publication number Publication date
KR100985861B1 (ko) 2010-10-08
KR20100034521A (ko) 2010-04-01
WO2010035998A2 (ko) 2010-04-01
US20110174745A1 (en) 2011-07-21
JP5303649B2 (ja) 2013-10-02
JP2012503557A (ja) 2012-02-09

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