WO2010034873A1

WO2010034873A1 - Arrangement and method in connection with a lighting apparatus

Info

Publication number: WO2010034873A1
Application number: PCT/FI2009/000084
Authority: WO
Inventors: Pekka Jahkonen
Original assignee: Kone Corporation
Priority date: 2008-09-26
Filing date: 2009-09-15
Publication date: 2010-04-01
Also published as: FI20080541A; FI122908B; FI20080541A0

Abstract

The invention relates to the cooling of a light-emitting diode (LED) light source (1). The LED light source (1) is fitted to a circuit card (2); which circuit card is fitted to be fixed via a mechanical fixing interface (3) to a support structure (4). The circuit card comprises at least one conductive layer (5,6) made of thermally conductive material. The aforementioned conductive layer (5,6) is formed to expand from the LED light source towards the edge part (7) of the circuit card, for cooling the LED light source.

Description

ARRANGEMENT AND METHOD IN CONNECTION WITH A LIGHTING APPARATUS

Field of the invention

The object of the invention is an arrangement for cooling a light-emitting diode (LED) light source as defined in the preamble of claim 1 , a lighting arrangement of a conveying system as defined in the preamble of claim 7, a method for cooling a LED light source as defined in the preamble of 13, and also a LED luminaire as defined in the preamble of claim 17.

Description of prior art

LEDs (light-emitting diodes) are semiconductors to which substances, such as gallium, arsenide, indium or nitride, are added to cause the LEDs to radiate light. When a forward voltage is placed over the dosed P and N semiconductor parts of a LED, the electrons and the holes start to join in the proximity of the joint of the semiconductor parts, current starts to flow and the LED starts to radiate light. The wavelength of the radiation, and thus the color of the light radiated by the LED, depends on which substance is added to the semiconductor.

The luminous efficiency achieved with LEDs has increased over the last few years. At the same time the scope of application of LEDs has broadened from status indicators of an electrical signal to lighting applications.

The current passing in a LED causes power losses and at the same time heating of the LED. Overheating, among other things, shortens the service life of a LED.

Publication EP 1795951 A1 presents a lighting arrangement of a liquid crystal display (LCD), wherein a number of consecutive LEDs are fitted onto a circuit card. Through-holes that conduct heat are drilled in the immediate proximity of the LEDs, via which through-holes the heat generated by the LEDs is transferred to the other side of the circuit card. Purpose of the invention

The object of this invention is to solve the problems referred to above in the description of prior art as well as the problems disclosed in the description of the invention below. A further object of the invention is to disclose a cooling solution of a LED light source that is simpler than prior art.

Summary of the invention

In relation to the characteristic attributes of the invention, reference is made to the claims.

The inventive content of the application can also be defined differently than in the claims presented below. The inventive content may also consist of several separate inventions, especially if the invention is considered in the light of expressions or implicit sub-tasks or from the point of view of advantages or categories of advantages achieved. In this case, some of the attributes contained in the claims below may be superfluous from the point of view of separate inventive concepts.

In the arrangement for cooling a LED light source according to the invention, a LED light source is fitted to a circuit card; which circuit card is fitted to be fixed via a mechanical fixing interface to a support structure; and which circuit card comprises at least one conductive layer made of thermally conductive material; and which LED light source is connected in a thermally conductive manner to the aforementioned conductive layer; and which conductive layer is formed to expand from the LED light source towards the edge part of the circuit card, for cooling the LED light source.

In the lighting arrangement of a conveying system according to the invention a LED light source is fitted to a circuit card; which circuit card is fitted to be fixed via a mechanical fixing interface to some support structure of the conveying system; and which circuit card comprises at least one conductive layer made of thermally conductive material; and which LED light source is connected in a thermally conductive manner to the aforementioned conductive layer; and which conductive layer is formed to expand from the LED light source towards the edge part of the circuit card, for cooling the LED light source.

In the method according to the invention for cooling a LED light source: at least one conductive layer of a thermally conductive material is made in the circuit card; a LED light source is fitted to the circuit card; the circuit card is fixed via a mechanical fixing interface to support structure; the aforementioned LED light source is connected in a thermally conductive manner to the aforementioned conductive layer; and also the aforementioned conductive layer is formed to expand from the LED light source towards the edge part of the circuit card, for cooling the LED light source.

The LED luminaire according to the invention comprises a LED light source fitted to a circuit card. The aforementioned LED light source (1) is connected in a thermally conductive manner to a conductive layer made in the circuit card. The aforementioned conductive layer is formed to expand from the LED light source towards the edge part of the circuit card, for cooling the LED light source. The aforementioned luminaire comprises a fixing interface for fixing the luminaire in a thermally conductive manner to a support structure at the point of, or in the proximity of, the conductive layer of the circuit card

The conveying system referred to in the invention can be e.g. an elevator system, such as a passenger elevator or a freight elevator. The conveying system referred to in the invention can also be, for instance, an escalator system, a travelator system, a crane system, or a belt conveyor system for conveying goods or raw materials.

In the invention, LED light source refers to a component that can comprise one or more LED units fitted in parallel or fitted in series.

In one embodiment of the invention at least one resistor is fitted to the circuit card, in addition to the LED light source, for limiting the current of the LED light source. In one embodiment of the invention at least one capacitor and/or choke is fitted to the circuit card, in addition to the LED light source, for filtering the interference of the electricity supply of the LED light source.

In one embodiment of the invention a connector is fitted to the circuit card, for the electricity supply of the LED light source.

In one embodiment of the invention the circuit card is fitted to be fixed via a mechanical fixing interface in a thermally conductive manner to the ceiling panel of an elevator car.

In one embodiment of the invention the circuit card is fitted to be fixed via a mechanical fixing interface in a thermally conductive manner to the wall panel of an elevator car.

In one embodiment of the invention the circuit card is fitted to be fixed via a mechanical fixing interface in a thermally conductive manner to the handrail structure of an escalator.

In one embodiment of the invention the circuit card is fitted to be fixed via a mechanical fixing interface in a thermally conductive manner to the handrail structure of a travelator.

In one embodiment of the invention the circuit card is fitted to be fixed via a mechanical fixing interface in a thermally conductive manner to the end structure of an escalator.

In one embodiment of the invention the circuit card is fitted to be fixed via a mechanical fixing interface in a thermally conductive manner to the end structure of a travelator.

In one embodiment of the invention the total width of at least one conductive layer is fitted to increase towards the edge part of the circuit card. The total width of the conductive layer refers in this context to the total width of the conductive layer measured at a right angle to the direction of the flow of heat flowing in the conductive layer.

In one embodiment of the invention at least a part of the support structure is made of thermally conductive material, and the circuit card is fitted in a thermally conductive manner in connection with the aforementioned thermally conductive part of the support structure.

In one embodiment of the invention a conductive layer made of thermally conductive material is disposed on the surface plane of the circuit card on the same side of the circuit card as the LED light source, and the circuit card is fixed in connection with a thermally conductive part of the support structure at the point of the thermally conducting conductive layer.

The LED light source can contain organic compounds (OLED technology). The LED light source can also contain polymer material, onto which the aforementioned organic compound is steamed.

The thermally conductive materials referred to in the invention are e.g. various metals and metal compounds, such as steel, aluminium, copper, silver, gold, lead and tin. Thermal conductors can also be manufactured from, among other things, silicon and from different structures of carbon, such as from diamonds and nanotubes. Also thermally conductive plastics are known in the art. In this case a thermally conductive structure can be achieved either by using a thermally conductive material as a manufacturing material, or by adding a thermally conductive material to the manufacturing material, to improve the thermal conductivity.

Advantages of the invention

With the invention at least one of the following advantages, among others, is achieved:

When the LED light source is connected in a thermally conductive manner to a conductive layer, which is made of thermally conductive material, on the circuit card and when the conductive layer is formed to expand from the LED light source towards the edge part of the circuit card, the heat generated by the LED light source is transferred both by being conducted towards the edge part of the circuit card and by convection into the environment of the conductive layer, in which case cooling of the LED light source becomes more efficient.

The electricity supply poles of a LED light source are generally connected in an electrically conductive and thermally conductive manner to LED semiconductor units. When conductive layers made of a thermally conductive material are connected to the electricity supply poles in the manner presented in the invention, the cooling of the LED light source improves. Thermally conductive material can also be added to the LED light source for improving the transfer of heat between the LED semiconductor units and the electricity supply poles.

If a hole drilled in the area of the conductive layer of the circuit card is filled at least partly with a type of thermally conductive material that is in connection with the conductive layer, the heat processing capability of the conductive layer improves. In this case the heat transfer capability improves; on the other hand, the aforementioned thermally conductive material also increases the thermal capacity of the conductive layer, i.e. the transient heat storage ability. Furthermore, heat can be transferred via the hole to the other side of the circuit card or to another conductive layer possibly formed on an intermediate plane, in which case cooling of the LED light source improves compared to before.

If at least a part of the support structure of the circuit card is made of thermally conductive material, and if the circuit card is fitted in a thermally conductive manner in connection with the aforementioned thermally conductive part of the support structure, heat is transferred from the LED light source via the conductive layers of the circuit card onwards to the support structure, and the cooling of the LED light source becomes more efficient. In this case the LED light source can also if necessary be more easily fitted inside a closed enclosure, because the heat rise inside the enclosure decreases. If at least a part of the luminaire enclosure is made of thermally conductive material, and if the circuit card inside the luminaire enclosure is fitted in a thermally conductive manner in connection with a support structure via a thermally conductive part of the luminaire enclosure, the heat rise inside the enclosure can be reduced. In this case the thermally conducting conductive layer of the circuit card can be connected to a thermally conductive part of the luminaire enclosure, e.g. by compression, by gluing or by soldering, in which case heat is transferred out from inside the luminaire enclosure. The aforementioned thermally conductive part of the luminaire enclosure can further be connected to a thermally conductive part of a support structure, in which case cooling becomes more efficient.

If the thermally conducting conductive layer of the circuit card is connected to the electricity .supply circuit of the LED light source, if necessary e.g. a silicone mat can be fitted between the conductive layer and the luminaire enclosure and/or the thermally conductive part of a support structure. Thus a thermally conductive but electrically insulating effect is achieved between the connected parts.

The use of LED light sources for illumination reduces the power consumption caused by lighting, because the efficiency ratio of LED light sources is better than conventional luminaires; in addition, with LEDS the light can be directed at the target more effectively than with conventional luminaires.

Brief explanation of the figures

In the following, the invention will be described in more detail by the aid of some examples of its embodiments, which in themselves do not limit the scope of application of the invention, with reference to the attached drawings, wherein

Fig. 1 presents one cooling arrangement of a LED light source according to the invention

Fig. 2 presents a fixing of a luminaire enclosure according to the invention Fig. 3 presents a detail of one fixing of a luminaire enclosure according to the invention

Fig. 4 presents one circuit card according to the invention

Fig. 5 presents a second circuit card according to the invention

Fig. 6 presents a detail of one LED luminaire according to the invention

Fig. 7 presents an explosion drawing of one LED luminaire according to the invention

Fig. 8 presents on a general level the circuit diagram and parts layout of a possible circuit card of the LED luminaire of Fig. 7

More detailed description of preferred embodiments of the invention

Fig. 1 presents one cooling arrangement of a LED light source according to the invention. The LED light source is soldered to a metallic conductive layer 5, which is disposed on the surface plane of the circuit card. The conductive layer 5 is formed to expand from the LED light source towards the edge part 7 of the circuit card. The circuit card 2 is fitted to a sheet-metal support structure 4 at the point of the expansion of the metallic conductive layer 5 with thermally conductive glue 3. In this case the surface plane of the circuit card 2, on which plane the conductive layer 5 is disposed, comes into contact with the glue 3. The thermally conductive glue layer 3 at the same time functions as electrical insulation between the metallic conductive layer 5 and the sheet-metal support structure 4. Since the thermal power generated by the LED light source is transmitted through the metallic conductive layer 5 via the thermally conductive glue layer 3 to the sheet-metal support structure 4, the LED light source cools effectively. Instead of the aforementioned thermally conductive glue layer 3, it is also possible to use e.g. a silicone mat or thermally conductive tape.

In the embodiment of Fig. 2 the circuit card 2 is fixed to the luminaire enclosure 3, and the luminaire enclosure is fixed to the sheet-metal support structure 4 with fixing brackets. The LED light source 1 is fitted to the circuit card 2. The LED light source is connected in a thermally conductive manner to a conductive layer 5 of the circuit card by soldering. The conductive layer 5 is made of thermally conductive material. The conductive layer 5 is formed on a surface plane of the circuit card, to expand from the LED light source 1 towards the edge part 7 of the circuit card. A part 12 of the luminaire enclosure 3 is made of thermally conductive plastic. The circuit card 2 is fixed to the luminaire enclosure 3 such that the conductive layer 5 on the surface of the circuit card 2 presses against the thermally conductive plastic part 12 of the luminaire enclosure 3 from the area of the expansion of the conductive layer 5 of the circuit card. In this case heat can be transferred from the LED light source via the thermally conducting conductive layer 5 of the circuit card 2 to the thermally conductive plastic part 12 of the luminaire enclosure, and from there onwards via the sheet-metal support structure 4 into the environment.

Fig. 3 presents a detail of one fixing of a luminaire enclosure according to the invention. In this embodiment of the invention the part 12 of the luminaire enclosure 3 is made of metal. The circuit card 2 is fitted to the luminaire enclosure such that the thermally conductive expansion of the conductive layer 5 on the surface of the circuit card 2 presses against the metallic part 12 of the luminaire enclosure. The electricity supply pole of the LED light source 1 fitted to the circuit card 2 is soldered to the conductive layer 5 so that the conductive layer 5 is connected to the electricity supply circuit of the LED light source. For this reason a thin thermally conductive, but electrically insulting, silicone mat 19 is fitted between the circuit card 2 and the metallic part 12 of the luminaire enclosure.

Fig. 4 presents one circuit card according to the invention. A LED light source 1 is fitted to the circuit card. The power supply to the LED light source occurs via a circuit card connector 14 with an electricity supply apparatus 15. The anode pole 8 of the LED light source is soldered to the first conductive layer 5, and the cathode pole 9 is soldered to the second conductive layer 6 on the circuit card. The aforementioned conductive layers are disposed on the surface plane of the circuit card 2 according to Fig. 4. The first conductive layer 5 is formed to expand towards the first edge part 7 of the circuit card, and the second conductive layer 6 is formed to expand towards the second edge part T of the circuit card. The transfer of heat from the LED light source into the environment occurs via the first 5 and the second 6 conductive layer.

Fig. 5 presents a second circuit card 2 according to the invention, to which a LED light source 1 is fitted. Also in this embodiment of the invention the anode pole (8) and the cathode pole (9) of the LED light source are soldered to the conductive layers 5,6 of the circuit card. In this embodiment of the invention the conductive layers are disposed, however, on different sides of the circuit card 2. The first conductive layer 5 is disposed on the surface plane of the circuit card 2 on the same side as the LED light source. The second conductive layer 6 is disposed on the opposite side of the circuit card 2. The cathode pole 9 of the LED light source is soldered to the conductive layer in the immediate proximity of the cathode pole, in which conductive layer through-holes 10 have been drilled. Also the through-holes 10 are soldered, so that they are filled with a material that conducts heat and electricity. The through-holes 10 are disposed in the area of the second conductive layer 6, and the second conductive layer 6 is connected via the aforementioned through-holes in an electrically and thermally conductive manner to the cathode pole of the LED light source on the other side of the circuit card 2. The first 5 and the second 6 conductive layer are formed to expand from the LED light source 1 towards the edge part of the circuit card, for cooling the LED light source.

Fig. 6 presents a circuit card to be fitted inside the luminaire enclosure 3 of a LED luminaire. The anode pole 8 and the cathode pole 9 of the LED light source 1 are soldered to the circuit card. A controller circuit 15' of the LED light source is also soldered to the circuit card. The power supply to the anode pole and cathode pole of the LED light source occurs via the power supply poles 16,

16' of the controller circuit 15'. The conductive layers 5, 6 soldered to the anode and the cathode poles of the LED light source are formed to expand from the

LED light source 1 towards the edge part 7 of the circuit card such that the expansion also passes via the power supply poles of the controller circuit 15'. In this case both the LED light source 1 and the controller circuit 15' are cooled via the conductive layers 5,6.

The power supply 17 to the LED light source 1 occurs in the embodiment of Fig. 6 from the electricity supply apparatus 15 via the circuit card connector 14. In this embodiment of the invention also the control signal 18 for regulating the power supply of the controller circuit 15' is taken to the controller circuit by a signal conductor 18, but the control signal can be transferred to the controller circuit 15' also e.g. wirelessly as electromagnetic radiation.

In one embodiment of the invention the LED luminaire comprises means for forming a control signal 18 for the controller circuit 15'. These means can comprise e.g. a rotatable switch or a pushable button, which is fixed to the luminaire enclosure 3.

In one embodiment of the invention the luminaire enclosure 3 comprises a diffusor 13, for diffusing the light radiated by the LED light source.

Fig. 7 presents an explosion drawing of one LED luminaire according to the invention viewed obliquely from the space to be illuminated. The luminaire enclosure incorporated in the luminaire is of two parts, and the parts 19A, 19B of the luminaire enclosure are disposed on opposite sides of a metallic support structure 4. The parts 19A, 19B of the luminaire enclosure are fixed with fixing means 21 , 22, 23 to the holes 21', 22', 23' made in the support structure at the locations of the parts. The LED light sources 1 are fitted to a circuit card 2. The circuit card 2 remains between the second part 19B of the luminaire enclosure and the support structure 4, when the second part 19B of the luminaire enclosure is tightened onto the support structure 4 with tightening means 22. For this reason, holes 23" are also made in the circuit card 2 for the through- hole of the fixing means 23 of the second part 19B of the luminaire enclosure.

A number of LED light sources 1 are fitted to the circuit card 2. The circuit diagram and parts layout of the circuit card 2 are described in more detail in Fig. 8. Metallic conductive layers 6 are made on the circuit card 2, which metallic conductive layers are disposed on the surface plane of the circuit card on the same side of the circuit card as the LED light source 1. The conductive layers 6 are formed to expand from the LED light sources 1 towards the edge part of the circuit card. The LED light sources 1 on the circuit card 2 are fitted in series with each other. A current control 14 of the LED light sources is also integrated into the circuit card 2, which current control comprises a controllable switch and also an inductance, for regulating the current of the LED light sources 1.

The circuit card 2 presses against the support structure 4 at the point of the conductive layers 6, when the second part 19B of the luminaire enclosure is tightened onto the support structure 4. A thin silicone mat is in this case fitted between the conductive layers 6 and the support structure 4, which mat functions as electrical insulation between the conductive layers 6 and the support structure 4, enabling however the transfer of heat from the conductive layers 6 to the support structure 4. In this case the heat generated by the LED light sources 1 can be effectively transferred from the luminaire to the support structure 4, and a separate heat sink is not necessarily needed. For example, the sheet-steel ceiling panel of an elevator car can function as a support structure 4.

Holes 20 are made in the support structure 4 at the point of the LED light sources 1 , through which holes the light produced by the LED light sources 1 passes to the first part 19A and from the first part 19A through the diffusor 13 to the space to be illuminated. Thus the LED light sources 1 are disposed on the opposite side of the support structure 4 with respect to the space to be illuminated, and the circuit card 2 preferably remains behind the protection of the support structure 4.

The invention is not limited solely to the embodiments described above, but instead many variations are possible within the scope of the inventive concept defined by the claims below. The mechanical fixing interface can comprise some prior-art fixing means, such as a screw, a POP rivet, a circuit board pillar, a centering pin or a compression spring.

Claims

1. Arrangement for cooling a LED light source (1 ), wherein the LED light source is fitted to a circuit card (2); which circuit card is fitted to be fixed via a mechanical fixing interface (3) to a support structure (4); and which circuit card (2) comprises at least one conductive layer (5, 6) made of thermally conductive material; characterized in that the aforementioned LED light source (1 ) is connected to the aforementioned conductive layer (5, 6) in a thermally conductive manner; and in that the aforementioned conductive layer (5, 6) is formed to expand from the LED light source towards the edge part (7) of the circuit card, for cooling the LED light source.

2. Arrangement according to claim 1 , characterized in that the aforementioned LED light source (1 ) comprises two electricity supply poles, an anode pole (8) and a cathode pole (9); the circuit card (2) comprises at least two conductive layers (5, 6) made of thermally conductive material; of which the first conductive layer (5) is connected in a thermally conductive manner to the first electricity supply pole (8) of the LED light source; and of which the second conductive layer (6) is connected in a thermally conductive manner to the second electricity supply pole (9) of the LED light source; and in that the aforementioned first conductive layer (5) is formed expand from the LED light source (1 ) towards the edge part (7) of the circuit card; and in that the aforementioned second conductive layer (6) is formed expand from the LED light source (1 ) towards the edge part (7) of the circuit card; for cooling the LED light source.

3. Arrangement according to any of the claims above, characterized in that at least one hole (10) is drilled into the circuit card (2) in the area of the conductive layer (5, 6); and in that the hole (10) is at least partly filled with thermally conductive material, for improving the heat processing capability of the conductive layer.

4. Arrangement according to any of the preceding claims, characterized in that at least a part (11 ) of the aforementioned support structure (4) is made of thermally conductive material; and in that the circuit card (2) is fitted in a thermally conductive manner in connection with the aforementioned thermally conductive part (11 ) of the support structure.

5. Arrangement according to claim 4 characterized in that the conductive layer (5, 6) made of thermally conductive material is disposed on the surface plane of the circuit card on the same side of the circuit card as the LED light source (1 ); and in that the circuit card (2) is fitted in connection with the thermally conductive part (11 ) of the support structure at the point of the thermally conducting conductive layer (5, 6);

6. Arrangement according to any of the preceding claims, characterized in that the aforementioned mechanical fixing interface (3) comprises a luminaire enclosure; of which luminaire enclosure (3) at least a part (12) is made of thermally conductive material; and in that the circuit card (2) is fitted to be fixed via the aforementioned luminaire enclosure (3) to the aforementioned support structure (4, 11 ); and in that when fixing the circuit card (2) to the support structure (4, 11 ) via the luminaire enclosure (3), the circuit card is fitted via the thermally conductive part (12) of the luminaire enclosure in a thermally conductive manner in connection with the support structure (4, 11), for cooling the LED light source.

7. Lighting arrangement of a conveying system, in which lighting arrangement a LED light source (1 ) is fitted to a circuit card (2); which circuit card (2) is fitted to be fixed via a mechanical fixing interface

(3) to some support structure (4) of the conveying system; and which circuit card (2) comprises at least one conductive layer (5, 6) made of thermally conductive material; characterized in that the aforementioned LED light source (1 ) is connected to the aforementioned conductive layer (5, 6) in a thermally conductive manner; and in that the aforementioned conductive layer (5, 6) is formed to expand from the LED light source (1 ) towards the edge part (7) of the circuit card, for cooling the LED light source.

8. Lighting arrangement according to claim 7, characterized in that at least a part (11 ) of the aforementioned structure (4) of the conveying system is made of thermally conductive material; and in that the circuit card (2) is fitted in a thermally conductive manner in connection with the aforementioned thermally conductive part (11 ) of the structure of the conveying system.

9. Lighting arrangement according to claim 8, characterized in that a conductive layer (5, 6) made of thermally conductive material is disposed on the surface plane of the circuit card on the same side of the circuit card as the LED light source (1 ); and in that the circuit card (2) is fitted in connection with the aforementioned thermally conductive part (11 ) of the structure (4) of the conveying system at the point of the thermally conducting conductive layer (5, 6);

10. Lighting arrangement according to any of claims 7 -9, characterized in that the aforementioned mechanical fixing interface (3) comprises a luminaire enclosure; of which luminaire enclosure (3) at least a part (12) is made of thermally conductive material; and in that the circuit card (2) is fitted to be fixed via the aforementioned luminaire enclosure (3) to the aforementioned structure (4, 1 1 ) of the conveying system; and in that when fixing the circuit card (2) to the structure (4, 11 ) of the conveying system via the luminaire enclosure (3), the circuit card is fitted via a thermally conductive part (12) of the luminaire enclosure (3) in a thermally conductive manner in connection with the structure (4, 1 1 ) of the conveying system, for cooling the LED light source.

11. Lighting arrangement according to claim 10, characterized in that the luminaire enclosure (3) comprises a diffusor (13), for diffusing the light radiated by the LED light source.

12. Lighting arrangement according to any of claims 7 -11 , characterized in that the aforementioned structure (4) of the conveying system is a ceiling panel of an elevator car and/or a wall panel of an elevator car.

13. Method for cooling a LED light source, in which method: - at least one conductive layer (5, 6) of thermally conductive material is made in the circuit card (2) a LED light source (1 ) is fitted to the circuit card the circuit card (2) is fixed via a mechanical fixing interface (3) to a support structure (4) characterized in that: the aforementioned LED light source (1 ) is connected to the aforementioned conductive layer (5, 6) in a thermally conductive manner - the aforementioned conductive layer (5, 6) is formed to expand from the LED light source (1 ) towards the edge part (7) of the circuit card, for cooling the LED light source

14. Method according to claim 13, characterized in that: at least two conductive layers (5, 6) of thermally conductive material are made in the circuit card (2) the aforementioned first conductive layer (5) is connected in a thermally conductive manner to the first electricity supply pole (8) of the LED light source the aforementioned second conductive layer (6) is connected in a thermally conductive manner to the second electricity supply pole (9) of the LED light source the aforementioned first conductive layer (5) is formed to expand from the LED light source (1 ) towards the edge part (7) of the circuit card - the aforementioned second conductive layer (6) is formed to expand from the LED light source (1 ) towards the edge part (7) of the circuit card

15. Method according to claim 13 or 14, characterized in that: at least a part (1 1 ) of the aforementioned support structure (4) is made of thermally conductive material the aforementioned circuit card (2) is fitted in a thermally conductive manner in connection with the aforementioned thermally conductive part (11 ) of the support structure

16. Method according to any of claims 13 - 15, characterized in that: at least a part (12) of the luminaire enclosure (3) is made of thermally conductive material the circuit card (2) is fixed via the aforementioned luminaire enclosure (3) to the aforementioned support structure (4, 1 1 ) - the circuit card (2) is fitted via the thermally conductive part

(12) of the luminaire enclosure in a thermally conductive manner in connection with the support structure (4, 11 ), for cooling the LED light source

17. Light-emitting diode (LED) luminaire, comprising a LED light source (1 ) fitted to a circuit card, characterized in that the aforementioned LED light source (1 ) is connected in a thermally conductive manner to a conductive layer (5, 6) made in the circuit card; and in that the aforementioned conductive layer (5, 6) is formed to expand from the LED light source (1 ) towards the edge part (7) of the circuit card, for cooling the LED light source; and in that the aforementioned luminaire comprises a fixing interface for fixing the luminaire in a thermally conductive manner to a support structure at the point of, or in the proximity of, the conductive layer (5, 6) of the circuit card 18. Light-emitting diode (LED) luminaire according to claim 17, characterized in that a control (15') is arranged on the circuit card, for supplying power to the LED light source.