WO2010004006A3 - Device and method for impressing structures in a substrate, in particular in optical data storage media, semiconductor structures and microstructures - Google Patents

Device and method for impressing structures in a substrate, in particular in optical data storage media, semiconductor structures and microstructures Download PDF

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Publication number
WO2010004006A3
WO2010004006A3 PCT/EP2009/058758 EP2009058758W WO2010004006A3 WO 2010004006 A3 WO2010004006 A3 WO 2010004006A3 EP 2009058758 W EP2009058758 W EP 2009058758W WO 2010004006 A3 WO2010004006 A3 WO 2010004006A3
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
structures
chamber
storage media
data storage
Prior art date
Application number
PCT/EP2009/058758
Other languages
German (de)
French (fr)
Other versions
WO2010004006A2 (en
WO2010004006A9 (en
Inventor
Michael Reising
Stefan Kempf
Original Assignee
Singulus Technologies Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE102008032559A external-priority patent/DE102008032559A1/en
Application filed by Singulus Technologies Ag filed Critical Singulus Technologies Ag
Publication of WO2010004006A2 publication Critical patent/WO2010004006A2/en
Publication of WO2010004006A3 publication Critical patent/WO2010004006A3/en
Publication of WO2010004006A9 publication Critical patent/WO2010004006A9/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/002—Component parts, details or accessories; Auxiliary operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/56—Compression moulding under special conditions, e.g. vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
    • G11B7/26—Apparatus or processes specially adapted for the manufacture of record carriers
    • G11B7/263—Preparing and using a stamper, e.g. pressing or injection molding substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
    • B29C2043/023—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface having a plurality of grooves
    • B29C2043/025—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface having a plurality of grooves forming a microstructure, i.e. fine patterning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B29C43/361—Moulds for making articles of definite length, i.e. discrete articles with pressing members independently movable of the parts for opening or closing the mould, e.g. movable pistons
    • B29C2043/3615—Forming elements, e.g. mandrels or rams or stampers or pistons or plungers or punching devices
    • B29C2043/3634—Forming elements, e.g. mandrels or rams or stampers or pistons or plungers or punching devices having specific surface shape, e.g. grooves, projections, corrugations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/56—Compression moulding under special conditions, e.g. vacuum
    • B29C2043/561—Compression moulding under special conditions, e.g. vacuum under vacuum conditions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B29C2059/023—Microembossing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2017/00—Carriers for sound or information
    • B29L2017/001—Carriers of records containing fine grooves or impressions, e.g. disc records for needle playback, cylinder records
    • B29L2017/003—Records or discs
    • B29L2017/005—CD''s, DVD''s

Abstract

In the manufacture of optical data storage media, data structures are impressed into the substrate (2) in a protective chamber under vacuum. The impression head (4) forms the chamber cover through a flexible seal (20, 21) between the impression head (4) and the support (1) holding the substrate (2) to be impressed. This enables the chamber volume to be reduced and thus low pumping and cycle times as well as good access by the impression head (4). In addition, a self-sealing coupling can be used in the supply canal (101 to 105) between the chamber and the working pressure generating device (100). This makes it possible to quickly exchange the stamper (3) attached to the impression head (4) as a result of the good accessibility of the chamber interior.
PCT/EP2009/058758 2008-07-10 2009-07-09 Device and method for impressing structures in a substrate, in particular in optical data storage media, semiconductor structures and microstructures WO2010004006A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102008032559.7 2008-07-10
DE102008032559A DE102008032559A1 (en) 2008-07-10 2008-07-10 Device for embossing structures, particularly optical data media, semiconductor structures and microstructures, in substrate in closed pressure chamber of pressure chamber arrangement, has carrier for supporting substrate

Publications (3)

Publication Number Publication Date
WO2010004006A2 WO2010004006A2 (en) 2010-01-14
WO2010004006A3 true WO2010004006A3 (en) 2010-04-15
WO2010004006A9 WO2010004006A9 (en) 2010-06-03

Family

ID=41110937

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2009/058758 WO2010004006A2 (en) 2008-07-10 2009-07-09 Device and method for impressing structures in a substrate, in particular in optical data storage media, semiconductor structures and microstructures

Country Status (1)

Country Link
WO (1) WO2010004006A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL1038117C2 (en) * 2010-07-21 2012-01-25 Edward Bok SEMICONDUCTOR MODULE CONTAINING AN ELECTRIC SWITCHING PATTERN DEVICE FOR THE PURPOSE OF FITTING THEM ELECTRIC SWITCHING PATTERNS ON A SEMICONDUCTOR SUBSTRATE ADDED THEREIN.

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH419873A (en) * 1964-04-10 1966-08-31 Motsch Alfons Transportable compressed air tank for filling vehicle tires
US4786244A (en) * 1986-11-04 1988-11-22 Battenfeld Gmbh Coupling device
DE10100426A1 (en) * 2001-01-08 2002-08-14 Steag Hamatech Ag Method and device for joining substrates
US20020132482A1 (en) * 2000-07-18 2002-09-19 Chou Stephen Y. Fluid pressure imprint lithography
JP2004074770A (en) * 2002-06-18 2004-03-11 Meiki Co Ltd Press molding apparatus and control method therefor
EP1764648A1 (en) * 2005-09-14 2007-03-21 Erich Dipl.-Ing. Thallner Stamp with nanostructures and device as well as process for its production
US20070063384A1 (en) * 2005-09-21 2007-03-22 Molecular Imprints, Inc. Method to control an atmostphere between a body and a substrate
WO2007105474A1 (en) * 2006-03-10 2007-09-20 Pioneer Corporation Imprinting method and imprinting apparatus
US20080029931A1 (en) * 2006-07-07 2008-02-07 Tada Yasuhiko Imprint device and imprint method

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH419873A (en) * 1964-04-10 1966-08-31 Motsch Alfons Transportable compressed air tank for filling vehicle tires
US4786244A (en) * 1986-11-04 1988-11-22 Battenfeld Gmbh Coupling device
US20020132482A1 (en) * 2000-07-18 2002-09-19 Chou Stephen Y. Fluid pressure imprint lithography
DE10100426A1 (en) * 2001-01-08 2002-08-14 Steag Hamatech Ag Method and device for joining substrates
JP2004074770A (en) * 2002-06-18 2004-03-11 Meiki Co Ltd Press molding apparatus and control method therefor
EP1764648A1 (en) * 2005-09-14 2007-03-21 Erich Dipl.-Ing. Thallner Stamp with nanostructures and device as well as process for its production
US20070063384A1 (en) * 2005-09-21 2007-03-22 Molecular Imprints, Inc. Method to control an atmostphere between a body and a substrate
WO2007105474A1 (en) * 2006-03-10 2007-09-20 Pioneer Corporation Imprinting method and imprinting apparatus
US20080029931A1 (en) * 2006-07-07 2008-02-07 Tada Yasuhiko Imprint device and imprint method

Also Published As

Publication number Publication date
WO2010004006A2 (en) 2010-01-14
WO2010004006A9 (en) 2010-06-03

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