WO2009155907A3 - Heat dissipation system for a conversion element and corresponding lighting device - Google Patents

Heat dissipation system for a conversion element and corresponding lighting device Download PDF

Info

Publication number
WO2009155907A3
WO2009155907A3 PCT/DE2009/000883 DE2009000883W WO2009155907A3 WO 2009155907 A3 WO2009155907 A3 WO 2009155907A3 DE 2009000883 W DE2009000883 W DE 2009000883W WO 2009155907 A3 WO2009155907 A3 WO 2009155907A3
Authority
WO
WIPO (PCT)
Prior art keywords
conversion element
heat
conversion
heat dissipation
lighting device
Prior art date
Application number
PCT/DE2009/000883
Other languages
German (de)
French (fr)
Other versions
WO2009155907A2 (en
Inventor
Frank Baumann
Kirstin Petersen
Sönke TAUTZ
Alfred Lell
Uwe Strauss
Original Assignee
Osram Opto Semiconductors Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors Gmbh filed Critical Osram Opto Semiconductors Gmbh
Publication of WO2009155907A2 publication Critical patent/WO2009155907A2/en
Publication of WO2009155907A3 publication Critical patent/WO2009155907A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/641—Heat extraction or cooling elements characterized by the materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/644—Heat extraction or cooling elements in intimate contact or integrated with parts of the device other than the semiconductor body

Abstract

In at least one embodiment of the conversion element (1) the latter comprises a light-permeable matrix material (2) into which heat-conducting particles (4) and at least one conversion means (3) are embedded, said conversion means (3) being designed to at least partially convert light of a certain wavelength to light of a different wavelength. The conversion means (3) and/or the heat-conducting particles (4) form heat-conducting paths P in the conversion element (1). Heat can be efficiently carried off from the conversion element (1) via the heat-conducting paths P formed by the heat-conducting particles (4) and the conversion means (3), thereby increasing the conversion efficiency of the conversion element.
PCT/DE2009/000883 2008-06-25 2009-06-25 Conversion element and lighting device WO2009155907A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102008030253.8A DE102008030253B4 (en) 2008-06-25 2008-06-25 Conversion element and illuminant
DE102008030253.8 2008-06-25

Publications (2)

Publication Number Publication Date
WO2009155907A2 WO2009155907A2 (en) 2009-12-30
WO2009155907A3 true WO2009155907A3 (en) 2010-03-18

Family

ID=41210474

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2009/000883 WO2009155907A2 (en) 2008-06-25 2009-06-25 Conversion element and lighting device

Country Status (2)

Country Link
DE (1) DE102008030253B4 (en)
WO (1) WO2009155907A2 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8203161B2 (en) * 2009-11-23 2012-06-19 Koninklijke Philips Electronics N.V. Wavelength converted semiconductor light emitting device
DE102010034915A1 (en) * 2010-08-20 2012-02-23 Osram Opto Semiconductors Gmbh Optoelectronic semiconductor component and scattering body
DE102010034913B4 (en) * 2010-08-20 2023-03-30 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Radiation-emitting component and method for producing the radiation-emitting component
DE102010061848B4 (en) * 2010-11-24 2022-11-03 Lumitech Patentverwertung Gmbh LED module with prefabricated element
DE102011009369A1 (en) * 2011-01-25 2012-07-26 Osram Opto Semiconductors Gmbh Optoelectronic semiconductor chip and method for its production
DE102011017633A1 (en) * 2011-04-27 2012-10-31 Osram Ag A method of forming a phosphor array and associated phosphor array
DE102011100710A1 (en) * 2011-05-06 2012-11-08 Osram Opto Semiconductors Gmbh Conversion element for light-emitting diodes and manufacturing method
DE102012101663B4 (en) 2012-02-29 2019-12-24 Osram Opto Semiconductors Gmbh Conversion element, illuminant and method for producing a conversion element
DE102012005658B4 (en) * 2012-03-22 2013-10-24 Schott Ag White light generation
DE102012108828A1 (en) 2012-09-19 2014-03-20 Osram Opto Semiconductors Gmbh Optoelectronic component, optical element and their manufacturing method
DE102013103416A1 (en) * 2013-04-05 2014-10-23 Osram Opto Semiconductors Gmbh Electromagnetic radiation emitting assembly and method of manufacturing an electromagnetic radiation emitting assembly
KR102071463B1 (en) 2013-04-08 2020-01-30 루미리즈 홀딩 비.브이. Led with high thermal conductivity particles in phosphor conversion layer and the method of fabricating the same
DE102016119739A1 (en) * 2016-10-17 2018-04-19 Osram Opto Semiconductors Gmbh Optoelectronic component
DE102021130998A1 (en) * 2021-11-25 2023-05-25 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung OPTOELECTRONIC LIGHTING DEVICE

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040150818A1 (en) * 1999-05-17 2004-08-05 Armstrong Robert L. Optical devices and methods employing nanoparticles, microcavities, and semicontinuous metal films
US6867542B1 (en) * 2000-03-29 2005-03-15 General Electric Company Floating chip photonic device and method of manufacture
EP1605028A1 (en) * 2003-03-13 2005-12-14 Nichia Corporation Light emitting film, luminescent device, method for manufacturing light emitting film and method for manufacturing luminescent device
WO2006041178A2 (en) * 2004-10-13 2006-04-20 Matsushita Electric Industrial Co., Ltd. Luminescent light source, method for manufacturing the same, and light-emitting apparatus
US7196354B1 (en) * 2005-09-29 2007-03-27 Luminus Devices, Inc. Wavelength-converting light-emitting devices
WO2007073393A2 (en) * 2005-02-16 2007-06-28 Georgia Tech Research Corporation Composite materials having low filler percolation thresholds and methods of controlling filler interconnectivity
US20070194709A1 (en) * 2003-01-10 2007-08-23 Toyoda Gosei Co., Ltd. Light emitting device
US20080054280A1 (en) * 2006-09-06 2008-03-06 Gelcore Llc Light emitting packages and methods of making same

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004140185A (en) * 2002-10-17 2004-05-13 Matsushita Electric Ind Co Ltd Light emitting device
JP4931628B2 (en) * 2006-03-09 2012-05-16 セイコーインスツル株式会社 Illumination device and display device including the same

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040150818A1 (en) * 1999-05-17 2004-08-05 Armstrong Robert L. Optical devices and methods employing nanoparticles, microcavities, and semicontinuous metal films
US6867542B1 (en) * 2000-03-29 2005-03-15 General Electric Company Floating chip photonic device and method of manufacture
US20070194709A1 (en) * 2003-01-10 2007-08-23 Toyoda Gosei Co., Ltd. Light emitting device
EP1605028A1 (en) * 2003-03-13 2005-12-14 Nichia Corporation Light emitting film, luminescent device, method for manufacturing light emitting film and method for manufacturing luminescent device
WO2006041178A2 (en) * 2004-10-13 2006-04-20 Matsushita Electric Industrial Co., Ltd. Luminescent light source, method for manufacturing the same, and light-emitting apparatus
WO2007073393A2 (en) * 2005-02-16 2007-06-28 Georgia Tech Research Corporation Composite materials having low filler percolation thresholds and methods of controlling filler interconnectivity
US7196354B1 (en) * 2005-09-29 2007-03-27 Luminus Devices, Inc. Wavelength-converting light-emitting devices
US20080054280A1 (en) * 2006-09-06 2008-03-06 Gelcore Llc Light emitting packages and methods of making same

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
SELLA C ET AL: "R.F.-sputtered luminescent rare earth and yttrium oxysulphide films", THIN SOLID FILMS, ELSEVIER-SEQUOIA S.A. LAUSANNE, CH, vol. 90, no. 2, 16 April 1982 (1982-04-16), pages 181 - 185, XP025731221, ISSN: 0040-6090, [retrieved on 19820416] *

Also Published As

Publication number Publication date
DE102008030253A1 (en) 2009-12-31
WO2009155907A2 (en) 2009-12-30
DE102008030253B4 (en) 2020-02-20

Similar Documents

Publication Publication Date Title
WO2009155907A3 (en) Heat dissipation system for a conversion element and corresponding lighting device
WO2010065663A3 (en) Led replacement lamp
WO2011109086A3 (en) Solid state lamp with thermal spreading elements and light directing optics
EP2321862A4 (en) Organic semiconductor material and light-emitting element, light-emitting device, lighting system, and electronic device using the same
NL1031328A1 (en) Backlight unit of the rim light type with a heat dissipation system.
EP1969647A4 (en) High efficiency light emitting diode (led)
EP2012370A4 (en) Method for manufacturing semiconductor light emitting element, semiconductor light emitting element and lamp provided with the semiconductor light emitting element
EP1898464A4 (en) Heat sink for power module
DE602007005054D1 (en) High power LED lamp with increased heat dissipation
EP2043167A4 (en) Nitride semiconductor light emitting device and process for producing the same
BRPI0820090A2 (en) LED lamp, and, LED lamp power management method and system
EP1949463A4 (en) High light extraction efficiency light emitting diode (led)
DK1880459T3 (en) Power control system for wind farms
WO2010035171A3 (en) Lighting device with thermally variable reflecting element
WO2008011723A3 (en) Illumination module with similar heat and light propagation directions
WO2010051985A3 (en) Led luminaire
EP1869293A4 (en) Cascaded organic rankine cycles for waste heat utilization
ZA200609298B (en) High efficiency thermal engine
GB0513958D0 (en) Optoelectronic assembly with heat sink
ITNA20080011A1 (en) LED POWER LAMP FOR LIGHTS LANTERNS.
TW200745522A (en) Light sensor with integrated temperature sensor functionality
GB2449595B (en) Group III nitride semiconductor light emitting device and method for producing the same
NL1034762A1 (en) Light diffusion plate.
FR2896029B1 (en) LIGHTING MODULE COMPRISING LIGHT EMITTING DIODES.
GB2439745B (en) Street light with heat dissipating device

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 09768831

Country of ref document: EP

Kind code of ref document: A2

122 Ep: pct application non-entry in european phase

Ref document number: 09768831

Country of ref document: EP

Kind code of ref document: A2