WO2009146432A1 - Plasma-based chemical source device and method of use thereof - Google Patents
Plasma-based chemical source device and method of use thereof Download PDFInfo
- Publication number
- WO2009146432A1 WO2009146432A1 PCT/US2009/045708 US2009045708W WO2009146432A1 WO 2009146432 A1 WO2009146432 A1 WO 2009146432A1 US 2009045708 W US2009045708 W US 2009045708W WO 2009146432 A1 WO2009146432 A1 WO 2009146432A1
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- Prior art keywords
- plasma
- precursor
- ionizable media
- source
- plasma device
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Classifications
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B18/00—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body
- A61B18/04—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body by heating
- A61B18/042—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body by heating using additional gas becoming plasma
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32348—Dielectric barrier discharge
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
- H01J37/3255—Material
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/2406—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/2406—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes
- H05H1/2418—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes the electrodes being embedded in the dielectric
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/2406—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes
- H05H1/2431—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes using cylindrical electrodes, e.g. rotary drums
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/513—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using plasma jets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/2406—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes
- H05H1/2443—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes the plasma fluid flowing through a dielectric tube
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/2406—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes
- H05H1/2443—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes the plasma fluid flowing through a dielectric tube
- H05H1/245—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes the plasma fluid flowing through a dielectric tube the plasma being activated using internal electrodes
Definitions
- the present disclosure relates to plasma devices and processes for surface processing and material removal or deposition. More particularly, the disclosure relates to an apparatus and method for generating and directing chemically reactive plasma-generated species in a plasma device along with excited-state species (e.g., energetic photons) that are specific to the selected ingredients.
- excited-state species e.g., energetic photons
- Plasmas have the unique ability to create large amounts of chemical species, such as ions, radicals, electrons, excited-state (e.g., metastable) species, molecular fragments, photons, and the like.
- the plasma species may be generated in a variety of internal energy states or external kinetic energy distributions by tailoring plasma electron temperature and electron density.
- adjusting spatial, temporal and temperature properties of the plasma allows for achieving specific changes to the material being irradiated by the plasma species and associated photon fluxes.
- Plasmas are also capable of generating photons including energetic ultraviolet photons that have sufficient energy to initiate photochemical and photocatalytic reaction paths in biological and other materials that are irradiated by the plasma photons.
- Plasma has broad applicability to provide alternative solutions to industrial, scientific and medical needs, especially workpiece surface processing at low temperature. Plasmas may be delivered to a workpiece, thereby affecting many changes in the properties of materials upon which they impinge.
- One suitable application of the unique chemical species that are produced is to drive non-equilibrium or selective chemical reactions at the workpiece. Such selective processes are especially sought in biological tissue processing, which allows for cutting and removal of tissue at low temperatures with differential selectivity to underlayers and adjacent tissues.
- the plasma may remove a distinct upper layer of a workpiece but have little or no effect on a separate underlayer of the workpiece or it may be used to selectively remove a particular tissue from a mixed tissue region or selectively remove a tissue with minimal effect to adjacent organs of different tissue type.
- the plasma species are capable of modifying the chemical nature of tissue surfaces by breaking chemical bonds, substituting or replacing surface-terminating species (e.g., surface functionalization) through volatilization, gasification or dissolution of surface materials (e.g., etching). By proper choices of conditions one can remove a tissue type entirely but not effect a nearby different tissue type at all when selectivity of the plasma chemistry is tailored to be high.
- the present disclosure provides for a plasma system including a plasma device coupled to a power source, an ionizable media source and a precursor source.
- the ionizable media source provides ionizable media suitable for plasma initiation and maintenance and the precursor source provides one or more chemical species having various reactive functional groups and/or components that are desired for surface treatment.
- the chemical species and the ionizable media are mixed upstream or at ignition point of the plasma device and, once mixed, are ignited under application of electrical energy from the power source.
- the ignited media forms a volume of active plasma in the region where electrical energy is delivered.
- the active plasma volume includes various species that flow therefrom as an effluent that is delivered to a workpiece.
- the species and the ionizable media may be excited separately (e.g., one excited upstream and another added midstream or downstream, which are then combined prior to delivery to a workpiece).
- a plasma system includes a plasma device having an active electrode and an ionizable media source configured to supply ionizable media to the plasma device.
- the ionizable media source is coupled to the plasma device at a first connection upstream of the active electrode.
- the system also includes a precursor source configured to supply at least one precursor feedstock to the plasma device.
- the precursor source is coupled to the plasma device at a second connection at the active electrode or upstream thereof.
- the system further includes a power source coupled to the active electrode and configured to ignite the ionizable media and the precursor feedstock at the plasma device to form a plasma volume.
- a method for generating plasma includes the steps of: supplying ionizable media to a plasma device, supplying at least one precursor feedstock to the plasma device at the active electrode or upstream thereof and igniting the ionizable media and the precursor feedstock at the plasma device to form a plasma effluent.
- a plasma system includes a plasma device having an active electrode and an ionizable media source configured to supply ionizable media to the plasma device.
- the ionizable media source is coupled to the plasma device at a first connection upstream of the active electrode.
- the system also includes a plurality of precursor sources, each of the precursor sources is configured to supply at least one precursor feedstock to the plasma device.
- Each of the precursor sources is also coupled to the plasma device at a second connection at the active electrode or upstream thereof.
- the system also includes a power source coupled to the active electrode and configured to ignite the ionizable media and the precursor feedstock at the plasma device to form a plasma volume.
- Fig. 1 is a schematic diagram of a plasma system according to the present disclosure
- Fig. 2 is a schematic diagram of a plasma system and a plasma handpiece according to one embodiment of the present disclosure
- Fig. 3 is a flow diagram of an illustrative method according to the present disclosure
- FIG. 4 is a schematic diagram of a plasma system and a plasma handpiece according to one embodiment of the present disclosure
- Fig. S is a schematic diagram of a plasma system and a plasma handpiece according to another illustrative embodiment the present disclosure.
- Fig. 6 is spectra graph of a plasma generated according to one illustrative embodiment of the present disclosure.
- Plasmas are commonly generated using electrical energy that is delivered as either direct current (DC) electricity or electricity that is alternating current (AC) at frequencies from about 0.1 hertz (Hz) to about 100 gigahertz (GHz), including radio frequency ("RF", from about 0.1 MHz to about 100 MHz) and microwave (“MW", from about 0.1 GHz to about 100 GHz) bands, using appropriate generators, electrodes, and antennas.
- DC direct current
- AC alternating current
- RF radio frequency
- MW microwave
- choices of electrical excitation and plasma device hardware also determine how a given plasma system responds dynamically to the introduction of new ingredients to the host plasma gas or liquid media and the corresponding dynamic adjustment of the electrical drive, such as via dynamic match networks or adjustments to voltage, current, or excitation frequency to maintain controlled power transfer from the electrical circuit to the plasma.
- a plasma system 10 includes a plasma device 12 that is coupled to a power source 14, an ionizable media source 16, and a precursor source 18.
- Power source 14 includes any required components for delivering power or matching impedance to plasma device 12. More particularly, the power source 14 may be any radio frequency generator or other suitable power source capable of producing power to ignite the ionizable media to generate plasma.
- the precursor source 18 may be a bubbler or a nebulizer, for aerosolizing precursor feedstocks prior to introduction thereof into the device 12.
- the precursor source 18 may also be a micro droplet or injector system capable of generating predetermined refined droplet volume of the precursor feedstock from about 1 femtoliter to about 1 nanoliter in volume.
- the precursor source 18 may also include a microfluidic device, a piezoelectric pump, or an ultrasonic vaporizer.
- the system 10 provides a flow of plasma through the device 12 to a workpiece "W" (e.g., tissue).
- Plasma feedstocks which include ionizable media and precursor feedstocks, are supplied by the ionizable media source 16 and the precursor source 18, respectively, to the plasma device 12.
- the precursor feedstock and the ionizable media are provided to the plasma device 12 where the plasma feedstocks are ignited to form plasma effluent containing ions, radicals, photons from the specific excited species and metastables that carry internal energy to drive desired chemical reactions in the workpiece "W" or at the surface thereof.
- the feedstocks may be mixed upstream from the ignition point or midstream thereof (e.g., at the ignition point) of the plasma effluent, as shown in Fig. 1 and described in more detail below.
- the ionizable media source 16 provides ionizable feedstock to the plasma device 12.
- the ionizable media source 16 may include a storage tank and a pump (not explicitly shown) and is coupled to the plasma device 12.
- the ionizable media may be a liquid or a gas such as argon, helium, neon, krypton, xenon, radon, carbon dioxide, nitrogen, hydrogen, oxygen, etc. and their mixtures, and the like, or a liquid. These and other gases may be initially in a liquid form that is gasified during application.
- the precursor source 18 provides precursor feedstock to the plasma device 12.
- the precursor feedstock may be either in solid, gaseous or liquid form and may be mixed with the ionizable media in any state, such as solid, liquid (e.g., particulates or droplets), gas, and the combination thereof.
- the precursor source 18 may include a heater, such that if the precursor feedstock is liquid, it may be heated into gaseous state prior to mixing with the ionizable media.
- the precursors may be any chemical species capable of forming reactive species such as ions, electrons, excited-state (e.g., metastable) species, molecular fragments (e.g., radicals) and the like, when ignited by electrical energy from the power source 14 or when undergoing collisions with particles (electrons, photons, or other energy-bearing species of limited and selective chemical reactivity) formed from ionizable media 16.
- reactive species such as ions, electrons, excited-state (e.g., metastable) species, molecular fragments (e.g., radicals) and the like, when ignited by electrical energy from the power source 14 or when undergoing collisions with particles (electrons, photons, or other energy-bearing species of limited and selective chemical reactivity) formed from ionizable media 16.
- the precursors may include various reactive functional groups, such as acyl halide, alcohol, aldehyde, alkane, alkene, amide, amine, butyl, carboxlic, cyanate, isocyanate, ester, ether, ethyl, halide, haloalkane, hydroxyl, ketone, methyl, nitrate, nitro, nitrile, nitrite, nitroso, peroxide, hydroperoxide, oxygen, hydrogen, nitrogen, and combination thereof.
- reactive functional groups such as acyl halide, alcohol, aldehyde, alkane, alkene, amide, amine, butyl, carboxlic, cyanate, isocyanate, ester, ether, ethyl, halide, haloalkane, hydroxyl, ketone, methyl, nitrate, nitro, nitrile, nitrite, nitroso, peroxide, hydroperoxide, oxygen
- the chemical precursors may be water, halogenoalkanes, such as dichloromethane, tricholoromethane, carbon tetrachloride, difluoromethane, trifluoromethane, carbon tetrafluoride, and the like; peroxides, such as hydrogen peroxide, acetone peroxide, benzoyl peroxide, and the like; alcohols, such as methanol, ethanol, isopropanol, ethylene glycol, propylene glycol, alkalines such as NaOH, KOH, amines, alkyls, alkenes, and the like.
- halogenoalkanes such as dichloromethane, tricholoromethane, carbon tetrachloride, difluoromethane, trifluoromethane, carbon tetrafluoride, and the like
- peroxides such as hydrogen peroxide, acetone peroxide, benzoyl peroxide, and the like
- the precursors and their functional groups may be delivered to a surface to react with the surface species (e.g., molecules) of the workpiece "W.”
- the functional groups may be used to modify or replace existing surface terminations of the workpiece "W.”
- the functional groups react readily with the surface species due to their high reactivity and the reactivity imparted thereto by the plasma.
- the functional groups are also reacted within the plasma volume prior to delivering the plasma volume to the workpiece.
- Some functional groups generated in the plasma can be reacted in situ to synthesize materials that subsequently form a deposition upon the surface.
- an illustrative embodiment of the plasma device 12 includes a housing 20 enclosing a dielectric inner tube 22 having a proximal end 25 and a distal end 27 configured for the passage of the plasma effluent in either liquid or gaseous form.
- the plasma device 12 may be utilized as an electrosurgical pencil for application of plasma to tissue and the power source 14 may be an electrosurgical generator that is adapted to supply the device 12 with electrical power at a frequency from about 0.1 MHz to about 1,000 MHz and in another embodiment from about 1 MHz to about 13.6 MHz.
- the precursor source 18 and the ionizable media source 16 are coupled to the plasma device 12 via tubing 13a and 13b, respectively, at a first connection 31.
- the tubing 13a and 13b may be combined into tubing 13c to deliver a mixture of the ionizable media and the precursor feedstock to the device 12. This allows for the plasma feedstocks, e.g., the precursor feedstock and the ionizable gas, to be delivered to the plasma device 12 simultaneously prior to ignition of the mixture therein.
- the ionizable media source 16 and the precursors source 18 may be coupled to the plasma device 12 via the tubing 13a and 13b at separate connections, e.g., the first connection 31 and a second connection 29, respectively, such that the mixing of the feedstocks occurs within the inner tube 22 upstream from ignition point.
- the plasma feedstocks are mixed proximally of the ignition point, which may be any point between the respective sources 16 and 18 and the plasma device 12, prior to ignition of the plasma feedstocks to create the desired mix of the plasma effluent species for each specific surface treatment on the workpiece.
- the plasma feedstocks may be mixed midstream, e.g., at the ignition point or downstream of the plasma effluent, directly into the plasma.
- the first and second connections 31, 29 may be coupled to the device 12 at the active electrode 23, such that the precursor feedstocks and the ionizable media are ignited concurrently as they are mixed (Fig. 1). It is also envisioned that the ionizable media may be supplied to the device 12 proximally of the active electrode 23, while the precursor feedstocks are mixed therewith at the ignition point.
- the second connection 29 is coupled to the device 12 at the active electrode to achieve mixing that is concurrent with ignition.
- the ionizable media may be ignited in an unimixed state and the precursors may be mixed directly into the ignited plasma.
- the plasma feedstocks Prior to mixing, the plasma feedstocks may be ignited individually.
- the plasma feedstock is supplied at a predetermined pressure to create a flow of the medium through the device 12, which aids in the reaction of the plasma feedstocks and produces a plasma effluent.
- the device 12 also includes an active electrode 23 that extends around or into tube 22.
- the device 12 may also include an optional return electrode 33 disposed on an outer surface of the tube 22.
- the electrodes 23 and 33 are capacitively coupled thereto and to the plasma formed within the tube 22.
- the electrodes 23 and 33 are formed from a conductive material that may be adapted to assist in the ignition of plasma.
- the electrode 23 may have a needle or other pointed shape conducive to maximizing local electric field and forming a predetermined ignition point.
- the electrodes 23 and 33 are coupled to the power source 14, such that the energy from the power source 14 may be used to ignite the plasma feedstocks flowing through the inner tube 22.
- electrode 23 is connected to a separate ignition circuit (not shown) that transfers energy to cause ignition of the plasma species.
- the inner tube 22 may also be formed from a conductive material.
- the inner tube 22 is coupled to the power source 14 and igniting electrical energy is transmitted directly through the inner tube 22, or between tube 22 and electrode 23.
- the inner tube 22 and the electrode 23 may be coupled to the power source 14 through a variety of coupling components, such as wires, cables, antennas and the like.
- the tube 22 and/or the electrode 23 may be fabricated from conductive materials upon which an insulating layer is formed over at least a portion thereof. In one illustrative embodiment, this may be achieved by forming a metal oxide on a conducting metal or by coating an insulating layer on a conductive material.
- the inner tube 22 may be coated by a non-reactive material to reduce plasma species loss through undesired surface reactions.
- the inner tube 22 may be coated by reactive material that may be removed from the inner tube to create plasma species through tailored plasma driven surface reactions including secondary electron emission or volatilized tube construction material(s).
- the inner tube 22 may also be coated by an optically reflective material that acts as a means to confine photons generated by the plasma.
- the inner tube 22 may have a substantially tubular structure (e.g., cylindrical, granular, etc.).
- the distal end 27 may have a high aspect ratio cross-section (e.g., oval, rectangular, etc.). This limits and confines the active plasma volume to provide a flattened plasma effluent.
- the geometrical confinement of the plasma effluent directs the flow of plasma into open air, imparting a directed hydrodynamic flow of effluent to the workpiece "W" to achieve a highly localized effect on the flow boundary layers.
- This design provides for enhanced control of the hydrodynamic boundary layers of the plasma effluent and thereby isolates the plasma from the user and minimizes the loss of plasma species (e.g., radicals) to open atmosphere due to an extended length of the boundary layer.
- plasma species e.g., radicals
- the housing 20 also includes a plasma ignition circuit 24, which includes input controls 26 having one or more buttons or switches 28 for activating the circuit 24.
- the input controls 26 are coupled to the power source 14 and is adapted to activate the energy flow from the power source 14 to the electrodes 23 and 33. More specifically, the input controls 26 signal the power source 14 to provide a minimum voltage and current suitable for igniting the plasma precursor feedstocks flowing through inner tube 22, such that the plasma precursor feedstocks are ignited and plasma effluent is ejected from the distal end 27 of the inner tube 22. This process can be improved upon by enhancing the "Q" factor of the AC power delivery circuit.
- the activation circuit 24 may be configured either as a toggle switch or a continuous operation switch. In a toggle mode, the plasma effluent is sustained until the switch is toggled. In a continuous mode, the plasma effluent is sustained for as long as the switch is pressed.
- the activation circuit 24 may also be coupled to the ionizable media source 16 and the precursors source 18 such that upon activation of the activation circuit 24, the power source 14 as well as the flow of plasma feedstocks is also activated simultaneously.
- simultaneous activation may include delaying plasma energy from the power source 14 until the plasma feedstocks reach the inner tube 22; this may be accomplished by including flow sensors into the tubing 13 and/or the proximal end 25 of the inner tube 22.
- optical sensors may be used to detect the presence or absence of plasma, or with appropriate optical filtering the presence or absence of one or more particular plasma species.
- a variety of other upstream and downstream mixing and plasma excitation allows tailoring of the relative concentrations of the various plasma species.
- Fig. 3 illustrates a method for operating the system 10 according to the present disclosure.
- the activation circuit 24 is activated to commence the flow of the plasma feedstocks from the precursors source 18 and the ionizable media source 16, respectively.
- the plasma feedstocks are fed to the plasma device 12, where they are mixed upstream prior to ignition thereof or midstream, e.g., in the ignition region.
- the plasma device 12 signals the power source 14 to supply sufficient energy to ignite the mixed plasma feedstocks.
- the plasma feedstocks are ignited and plasma effluent is sustained by electrical energy.
- the ignition induces a variety of physical and chemical reactions in the feedstocks, such as dissociation (e.g., breaking up of molecular components into smaller parts) of the feedstocks into highly reactive species (e.g., radicals, ions, etc.).
- This plasma environment induces chemical changes to the precursors via a multitude of reactions, including direct electron and photon irradiation directly from the ignited plasma.
- These chemical changes are contrasted to plasma systems that inject precursors downstream from the active plasma volume in that the present disclosure creates said species in much higher densities and at much higher rates.
- Fig. 4 illustrates another illustrative embodiment of a plasma system 110.
- the system 110 includes a controller 32, which may be a microcontroller, microprocessor or any other suitable logic circuit.
- the controller 32 may be incorporated into the power source 14.
- the controller 32 may be coupled to the input controls 26 for controlling the system 110. More specifically, the controller 32 is coupled to the power source 14, ionizable media source 16, and first and second regulator valves 34 and 36.
- the first regulator valve 34 is coupled to the ionizable media source 16 and controls the flow of the ionizable medium to the plasma device 12.
- the second regulator valve 36 is coupled to the precursor source 18 and controls the flow of the precursors to the plasma device 12.
- the device 12 includes an active electrode 43 and a return electrode 45 disposed about an outer surface of tube 22.
- the electrodes 43 are capacitively coupled to the ionizable media and precursor mix in the tube 22 the extent of their relative positions defining the active plasma volume.
- the operation of the system 110 may be controlled through the input controls 26.
- the user may initiate the flow of ionizable media source 16 via the input controls 26.
- the input signal is then processed by the controller 32, which opens the first and second regulator valves 34 and 36 to open the flow of ionizable media and the precursor feedstock.
- the first and second regulator valves 34 and 36 may be either opened consecutively or simultaneously.
- Fig. 5 shows another embodiment of a plasma system 120 having multiple precursor sources 40a, 40b and 40c, each including various types or combinations of precursors. Multiple precursors may be embodied using any of the above-illustrated containers and/or delivery devices.
- the input controls 26 may include multiple buttons or switches 41a, 41b and 41c for activating each of the precursor sources 40a, 40b and 40c, respectively.
- the input controls 26 may be located at any location in the system 120 where manual operation is desired or in the case of automated systems RF power, flow of ionizable media, and chemical precursors may be controlled automatically by the controller 32 based on a feedback algorithm.
- Argon gas was mixed with CCU and ignited within a plasma activation device.
- Spectra were obtained for the plasma inside outside device as illustrated by the dashed and solid graphs, respectively in Fig. 6.
- the graphs illustrate generation of various chemical species as s result of the plasma being produced from an ionizable media and a chemical precursor.
- the intensity of the various emissions correspond to relative concentrations of different chemical species and they show that as the plasma flows into open air, there is a decrease of the density of some species but an increase in the density in other species. This is due to the plasma mixing with nitrogen, oxygen, carbon dioxide and other constituent gases of air. This exemplar plasma was used to successfully to remove tissue material.
Abstract
The present disclosure provides for a plasma system including a plasma device coupled to a power source, an ionizable media source and a precursor source. During operation, the ionizable media source provides ionizable media and the precursor ionizable media source provides one or more chemical species, photons at specific wavelengths, as well as containing various reactive functional groups and/or components to treat the workpiece surface by working in concert for synergetic selective tissue effects. The chemical species and the ionizable gas are mixed either upstream or midstream from an ignition point of the plasma device and once mixed, are ignited therein under application of electrical energy from the power source. As a result, a plasma effluent and photon source is formed, which carries the ignited plasma feedstock and resulting mixture of reactive species to a workpiece surface to perform a predetermined reaction.
Description
PLASMA-BASED CHEMICAL SOURCE DEVICE AND METHOD OF USE THEREOF
CROSS-REFERENCE TO RELATED APPLICATION
[0001] The present application claims the benefit of and priority to U.S. Provisional Application Serial No. 61/057,667 entitled "PLASMA-BASED CHEMICAL SOURCE DEVICE AND METHOD OF USE THEREOF" filed by Moore et al. on May 30, 2008, the entire contents of which are incorporated by reference herein.
BACKGROUND
Technical Field
[0002] The present disclosure relates to plasma devices and processes for surface processing and material removal or deposition. More particularly, the disclosure relates to an apparatus and method for generating and directing chemically reactive plasma-generated species in a plasma device along with excited-state species (e.g., energetic photons) that are specific to the selected ingredients.
Background of Related Art
[0003] Electrical discharges in dense media, such as liquids and gases at or near atmospheric pressure, can, under appropriate conditions, result in plasma formation. Plasmas have the unique ability to create large amounts of chemical species, such as ions, radicals, electrons, excited-state (e.g., metastable) species, molecular fragments, photons, and the like. The plasma species may be generated in a variety of internal energy states or external kinetic energy distributions by tailoring plasma electron temperature and electron density. In addition, adjusting spatial, temporal and temperature properties of the plasma allows for achieving specific changes to the material being irradiated by the plasma species and associated photon fluxes. Plasmas are also
capable of generating photons including energetic ultraviolet photons that have sufficient energy to initiate photochemical and photocatalytic reaction paths in biological and other materials that are irradiated by the plasma photons.
SUMMARY
[0004] Plasma has broad applicability to provide alternative solutions to industrial, scientific and medical needs, especially workpiece surface processing at low temperature. Plasmas may be delivered to a workpiece, thereby affecting many changes in the properties of materials upon which they impinge. One suitable application of the unique chemical species that are produced is to drive non-equilibrium or selective chemical reactions at the workpiece. Such selective processes are especially sought in biological tissue processing, which allows for cutting and removal of tissue at low temperatures with differential selectivity to underlayers and adjacent tissues. That is, the plasma may remove a distinct upper layer of a workpiece but have little or no effect on a separate underlayer of the workpiece or it may be used to selectively remove a particular tissue from a mixed tissue region or selectively remove a tissue with minimal effect to adjacent organs of different tissue type. More specifically, the plasma species are capable of modifying the chemical nature of tissue surfaces by breaking chemical bonds, substituting or replacing surface-terminating species (e.g., surface functionalization) through volatilization, gasification or dissolution of surface materials (e.g., etching). By proper choices of conditions one can remove a tissue type entirely but not effect a nearby different tissue type at all when selectivity of the plasma chemistry is tailored to be high.
[0005] In one aspect, the present disclosure provides for a plasma system including a plasma device coupled to a power source, an ionizable media source and a precursor source. During operation, the ionizable media source provides ionizable media suitable for plasma initiation and maintenance and the precursor source provides one or more chemical species having various reactive functional groups and/or components that are desired for surface treatment. The chemical species and the ionizable media are mixed upstream or at ignition point of the plasma device and, once mixed, are ignited under application of electrical energy from the power source. The ignited media forms a volume of active plasma in the region where electrical energy is delivered. The active plasma volume includes various species that flow therefrom as an effluent that is delivered to a workpiece. Alternatively the species and the ionizable media may be excited separately (e.g., one excited upstream and another added midstream or downstream, which are then combined prior to delivery to a workpiece).
[0006] According to one embodiment of the present disclosure, a plasma system is disclosed. The system includes a plasma device having an active electrode and an ionizable media source configured to supply ionizable media to the plasma device. The ionizable media source is coupled to the plasma device at a first connection upstream of the active electrode. The system also includes a precursor source configured to supply at least one precursor feedstock to the plasma device. The precursor source is coupled to the plasma device at a second connection at the active electrode or upstream thereof. The system further includes a power source coupled to the active electrode and configured to ignite the ionizable media and the precursor feedstock at the plasma device to form a plasma volume.
[0007J A method for generating plasma is also contemplated by the present disclosure. The method includes the steps of: supplying ionizable media to a plasma device, supplying at least
one precursor feedstock to the plasma device at the active electrode or upstream thereof and igniting the ionizable media and the precursor feedstock at the plasma device to form a plasma effluent.
[0008] According to another embodiment of the present disclosure, a plasma system is disclosed. The system includes a plasma device having an active electrode and an ionizable media source configured to supply ionizable media to the plasma device. The ionizable media source is coupled to the plasma device at a first connection upstream of the active electrode. The system also includes a plurality of precursor sources, each of the precursor sources is configured to supply at least one precursor feedstock to the plasma device. Each of the precursor sources is also coupled to the plasma device at a second connection at the active electrode or upstream thereof. The system also includes a power source coupled to the active electrode and configured to ignite the ionizable media and the precursor feedstock at the plasma device to form a plasma volume.
BRIEF DESCRIPTION OF THE DRAWINGS
(0009) The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate exemplary embodiments of the disclosure and, together with a general description of the disclosure given above, and the detailed description of the embodiments given below, serve to explain the principles of the disclosure, wherein:
[0010] Fig. 1 is a schematic diagram of a plasma system according to the present disclosure; [0011] Fig. 2 is a schematic diagram of a plasma system and a plasma handpiece according to one embodiment of the present disclosure;
[0012] Fig. 3 is a flow diagram of an illustrative method according to the present disclosure;
[0013] Fig. 4 is a schematic diagram of a plasma system and a plasma handpiece according to one embodiment of the present disclosure;
[0014] Fig. S is a schematic diagram of a plasma system and a plasma handpiece according to another illustrative embodiment the present disclosure; and
[0015] Fig. 6 is spectra graph of a plasma generated according to one illustrative embodiment of the present disclosure.
DETAILED DESCRIPTION
[0016] Plasmas are commonly generated using electrical energy that is delivered as either direct current (DC) electricity or electricity that is alternating current (AC) at frequencies from about 0.1 hertz (Hz) to about 100 gigahertz (GHz), including radio frequency ("RF", from about 0.1 MHz to about 100 MHz) and microwave ("MW", from about 0.1 GHz to about 100 GHz) bands, using appropriate generators, electrodes, and antennas. Choice of excitation frequency determines many properties and requirements of the plasma, the workpiece, as well as the electrical circuit that is used to deliver electrical energy to the circuit. The performance of the plasma chemical generation and delivery system and the design of the electrical excitation circuitry are interrelated - as the choices of operating voltage, frequency and current levels as well as phase all effect the electron temperature and electron density. Furthermore, choices of electrical excitation and plasma device hardware also determine how a given plasma system responds dynamically to the introduction of new ingredients to the host plasma gas or liquid media and the corresponding dynamic adjustment of the electrical drive, such as via dynamic
match networks or adjustments to voltage, current, or excitation frequency to maintain controlled power transfer from the electrical circuit to the plasma.
[0017] Referring initially to Fig. 1, a plasma system 10 is disclosed. The system 10 includes a plasma device 12 that is coupled to a power source 14, an ionizable media source 16, and a precursor source 18. Power source 14 includes any required components for delivering power or matching impedance to plasma device 12. More particularly, the power source 14 may be any radio frequency generator or other suitable power source capable of producing power to ignite the ionizable media to generate plasma. The precursor source 18 may be a bubbler or a nebulizer, for aerosolizing precursor feedstocks prior to introduction thereof into the device 12. The precursor source 18 may also be a micro droplet or injector system capable of generating predetermined refined droplet volume of the precursor feedstock from about 1 femtoliter to about 1 nanoliter in volume. The precursor source 18 may also include a microfluidic device, a piezoelectric pump, or an ultrasonic vaporizer.
[0018] The system 10 provides a flow of plasma through the device 12 to a workpiece "W" (e.g., tissue). Plasma feedstocks, which include ionizable media and precursor feedstocks, are supplied by the ionizable media source 16 and the precursor source 18, respectively, to the plasma device 12. During operation, the precursor feedstock and the ionizable media are provided to the plasma device 12 where the plasma feedstocks are ignited to form plasma effluent containing ions, radicals, photons from the specific excited species and metastables that carry internal energy to drive desired chemical reactions in the workpiece "W" or at the surface thereof. The feedstocks may be mixed upstream from the ignition point or midstream thereof (e.g., at the ignition point) of the plasma effluent, as shown in Fig. 1 and described in more detail below.
[0019] The ionizable media source 16 provides ionizable feedstock to the plasma device 12. The ionizable media source 16 may include a storage tank and a pump (not explicitly shown) and is coupled to the plasma device 12. The ionizable media may be a liquid or a gas such as argon, helium, neon, krypton, xenon, radon, carbon dioxide, nitrogen, hydrogen, oxygen, etc. and their mixtures, and the like, or a liquid. These and other gases may be initially in a liquid form that is gasified during application.
[0020] The precursor source 18 provides precursor feedstock to the plasma device 12. The precursor feedstock may be either in solid, gaseous or liquid form and may be mixed with the ionizable media in any state, such as solid, liquid (e.g., particulates or droplets), gas, and the combination thereof. The precursor source 18 may include a heater, such that if the precursor feedstock is liquid, it may be heated into gaseous state prior to mixing with the ionizable media. In one embodiment, the precursors may be any chemical species capable of forming reactive species such as ions, electrons, excited-state (e.g., metastable) species, molecular fragments (e.g., radicals) and the like, when ignited by electrical energy from the power source 14 or when undergoing collisions with particles (electrons, photons, or other energy-bearing species of limited and selective chemical reactivity) formed from ionizable media 16. More specifically, the precursors may include various reactive functional groups, such as acyl halide, alcohol, aldehyde, alkane, alkene, amide, amine, butyl, carboxlic, cyanate, isocyanate, ester, ether, ethyl, halide, haloalkane, hydroxyl, ketone, methyl, nitrate, nitro, nitrile, nitrite, nitroso, peroxide, hydroperoxide, oxygen, hydrogen, nitrogen, and combination thereof. In embodiments, the chemical precursors may be water, halogenoalkanes, such as dichloromethane, tricholoromethane, carbon tetrachloride, difluoromethane, trifluoromethane, carbon tetrafluoride, and the like; peroxides, such as hydrogen peroxide, acetone peroxide, benzoyl peroxide, and the
like; alcohols, such as methanol, ethanol, isopropanol, ethylene glycol, propylene glycol, alkalines such as NaOH, KOH, amines, alkyls, alkenes, and the like. Such chemical precursors may be applied in substantially in pure, mixed, or soluble form.
[0021] The precursors and their functional groups may be delivered to a surface to react with the surface species (e.g., molecules) of the workpiece "W." In other words, the functional groups may be used to modify or replace existing surface terminations of the workpiece "W." The functional groups react readily with the surface species due to their high reactivity and the reactivity imparted thereto by the plasma. In addition, the functional groups are also reacted within the plasma volume prior to delivering the plasma volume to the workpiece. [0022] Some functional groups generated in the plasma can be reacted in situ to synthesize materials that subsequently form a deposition upon the surface. This deposition may be used for stimulating healing, killing bacteria, increasing hydration (e.g., adding hydroxyl groups to produce carboxyl group at the workpiece), and increasing hydrophilic or hydroscopic properties. In addition, deposition of certain function groups may also allow for encapsulation of the surface to achieve predetermined gas/liquid diffusion, e.g., allowing gas permeation but preventing liquid exchange, to bond or stimulate bonding of surfaces, or as a physically protective layer. [0023] With reference to Fig. 2, an illustrative embodiment of the plasma device 12 includes a housing 20 enclosing a dielectric inner tube 22 having a proximal end 25 and a distal end 27 configured for the passage of the plasma effluent in either liquid or gaseous form. The plasma device 12 may be utilized as an electrosurgical pencil for application of plasma to tissue and the power source 14 may be an electrosurgical generator that is adapted to supply the device 12 with electrical power at a frequency from about 0.1 MHz to about 1,000 MHz and in another embodiment from about 1 MHz to about 13.6 MHz.
[0024] The precursor source 18 and the ionizable media source 16 are coupled to the plasma device 12 via tubing 13a and 13b, respectively, at a first connection 31. The tubing 13a and 13b may be combined into tubing 13c to deliver a mixture of the ionizable media and the precursor feedstock to the device 12. This allows for the plasma feedstocks, e.g., the precursor feedstock and the ionizable gas, to be delivered to the plasma device 12 simultaneously prior to ignition of the mixture therein.
[0025] In another embodiment, the ionizable media source 16 and the precursors source 18 may be coupled to the plasma device 12 via the tubing 13a and 13b at separate connections, e.g., the first connection 31 and a second connection 29, respectively, such that the mixing of the feedstocks occurs within the inner tube 22 upstream from ignition point. In other words, the plasma feedstocks are mixed proximally of the ignition point, which may be any point between the respective sources 16 and 18 and the plasma device 12, prior to ignition of the plasma feedstocks to create the desired mix of the plasma effluent species for each specific surface treatment on the workpiece.
[0026] In a further embodiment, the plasma feedstocks may be mixed midstream, e.g., at the ignition point or downstream of the plasma effluent, directly into the plasma. More specifically, the first and second connections 31, 29 may be coupled to the device 12 at the active electrode 23, such that the precursor feedstocks and the ionizable media are ignited concurrently as they are mixed (Fig. 1). It is also envisioned that the ionizable media may be supplied to the device 12 proximally of the active electrode 23, while the precursor feedstocks are mixed therewith at the ignition point. In other words, the second connection 29 is coupled to the device 12 at the active electrode to achieve mixing that is concurrent with ignition.
[0027] In a further illustrative embodiment, the ionizable media may be ignited in an unimixed state and the precursors may be mixed directly into the ignited plasma. Prior to mixing, the plasma feedstocks may be ignited individually. The plasma feedstock is supplied at a predetermined pressure to create a flow of the medium through the device 12, which aids in the reaction of the plasma feedstocks and produces a plasma effluent.
[0028] The device 12 also includes an active electrode 23 that extends around or into tube 22. The device 12 may also include an optional return electrode 33 disposed on an outer surface of the tube 22. The electrodes 23 and 33 are capacitively coupled thereto and to the plasma formed within the tube 22. The electrodes 23 and 33 are formed from a conductive material that may be adapted to assist in the ignition of plasma. In particular, the electrode 23 may have a needle or other pointed shape conducive to maximizing local electric field and forming a predetermined ignition point. The electrodes 23 and 33 are coupled to the power source 14, such that the energy from the power source 14 may be used to ignite the plasma feedstocks flowing through the inner tube 22. In another embodiment electrode 23 is connected to a separate ignition circuit (not shown) that transfers energy to cause ignition of the plasma species.
[0029] In yet another illustrative embodiment, the inner tube 22 may also be formed from a conductive material. In this embodiment, the inner tube 22 is coupled to the power source 14 and igniting electrical energy is transmitted directly through the inner tube 22, or between tube 22 and electrode 23. The inner tube 22 and the electrode 23 may be coupled to the power source 14 through a variety of coupling components, such as wires, cables, antennas and the like. Alternatively, the tube 22 and/or the electrode 23 may be fabricated from conductive materials upon which an insulating layer is formed over at least a portion thereof. In one illustrative
embodiment, this may be achieved by forming a metal oxide on a conducting metal or by coating an insulating layer on a conductive material.
[0030] The inner tube 22 may be coated by a non-reactive material to reduce plasma species loss through undesired surface reactions. Alternatively, the inner tube 22 may be coated by reactive material that may be removed from the inner tube to create plasma species through tailored plasma driven surface reactions including secondary electron emission or volatilized tube construction material(s). The inner tube 22 may also be coated by an optically reflective material that acts as a means to confine photons generated by the plasma.
[0031] The inner tube 22 may have a substantially tubular structure (e.g., cylindrical, granular, etc.). In one embodiment, the distal end 27 may have a high aspect ratio cross-section (e.g., oval, rectangular, etc.). This limits and confines the active plasma volume to provide a flattened plasma effluent. The geometrical confinement of the plasma effluent directs the flow of plasma into open air, imparting a directed hydrodynamic flow of effluent to the workpiece "W" to achieve a highly localized effect on the flow boundary layers. This design provides for enhanced control of the hydrodynamic boundary layers of the plasma effluent and thereby isolates the plasma from the user and minimizes the loss of plasma species (e.g., radicals) to open atmosphere due to an extended length of the boundary layer.
[0032] The housing 20 also includes a plasma ignition circuit 24, which includes input controls 26 having one or more buttons or switches 28 for activating the circuit 24. The input controls 26 are coupled to the power source 14 and is adapted to activate the energy flow from the power source 14 to the electrodes 23 and 33. More specifically, the input controls 26 signal the power source 14 to provide a minimum voltage and current suitable for igniting the plasma precursor feedstocks flowing through inner tube 22, such that the plasma precursor feedstocks are ignited
and plasma effluent is ejected from the distal end 27 of the inner tube 22. This process can be improved upon by enhancing the "Q" factor of the AC power delivery circuit. The activation circuit 24 may be configured either as a toggle switch or a continuous operation switch. In a toggle mode, the plasma effluent is sustained until the switch is toggled. In a continuous mode, the plasma effluent is sustained for as long as the switch is pressed.
[0033] In one embodiment, the activation circuit 24 may also be coupled to the ionizable media source 16 and the precursors source 18 such that upon activation of the activation circuit 24, the power source 14 as well as the flow of plasma feedstocks is also activated simultaneously. Those skilled in the art will appreciate that simultaneous activation may include delaying plasma energy from the power source 14 until the plasma feedstocks reach the inner tube 22; this may be accomplished by including flow sensors into the tubing 13 and/or the proximal end 25 of the inner tube 22. Alternatively optical sensors may be used to detect the presence or absence of plasma, or with appropriate optical filtering the presence or absence of one or more particular plasma species. A variety of other upstream and downstream mixing and plasma excitation allows tailoring of the relative concentrations of the various plasma species. [0034] Fig. 3 illustrates a method for operating the system 10 according to the present disclosure. In step 100, once the plasma device 12 is brought in proximity with the workpiece "W," the activation circuit 24 is activated to commence the flow of the plasma feedstocks from the precursors source 18 and the ionizable media source 16, respectively. The plasma feedstocks are fed to the plasma device 12, where they are mixed upstream prior to ignition thereof or midstream, e.g., in the ignition region. In step 102, the plasma device 12 signals the power source 14 to supply sufficient energy to ignite the mixed plasma feedstocks. The plasma feedstocks are ignited and plasma effluent is sustained by electrical energy. The ignition induces
a variety of physical and chemical reactions in the feedstocks, such as dissociation (e.g., breaking up of molecular components into smaller parts) of the feedstocks into highly reactive species (e.g., radicals, ions, etc.). This plasma environment induces chemical changes to the precursors via a multitude of reactions, including direct electron and photon irradiation directly from the ignited plasma. These chemical changes are contrasted to plasma systems that inject precursors downstream from the active plasma volume in that the present disclosure creates said species in much higher densities and at much higher rates. In step 104, the plasma effluent flows out of the distal end 27 of the inner tube 22 to the workpiece "W." The delivered plasma volume includes various reactive species, such as the functional groups of the precursor feedstock, which are deposited unto the workpiece "W" to react with substitutents thereof (e.g., molecules). [0035] Fig. 4 illustrates another illustrative embodiment of a plasma system 110. The system 110 includes a controller 32, which may be a microcontroller, microprocessor or any other suitable logic circuit. The controller 32 may be incorporated into the power source 14. The controller 32 may be coupled to the input controls 26 for controlling the system 110. More specifically, the controller 32 is coupled to the power source 14, ionizable media source 16, and first and second regulator valves 34 and 36. The first regulator valve 34 is coupled to the ionizable media source 16 and controls the flow of the ionizable medium to the plasma device 12. The second regulator valve 36 is coupled to the precursor source 18 and controls the flow of the precursors to the plasma device 12.
(0036] As shown in Fig. 4, the device 12 includes an active electrode 43 and a return electrode 45 disposed about an outer surface of tube 22. The electrodes 43 are capacitively coupled to the ionizable media and precursor mix in the tube 22 the extent of their relative positions defining the active plasma volume. The operation of the system 110 may be controlled through the input
controls 26. The user may initiate the flow of ionizable media source 16 via the input controls 26. The input signal is then processed by the controller 32, which opens the first and second regulator valves 34 and 36 to open the flow of ionizable media and the precursor feedstock. The first and second regulator valves 34 and 36 may be either opened consecutively or simultaneously. The controller 50 then activates the power source 14 in unison with the flow from the first and second regulator valves 34 and 36 as needed to produce metastable plasma. [0037] Fig. 5 shows another embodiment of a plasma system 120 having multiple precursor sources 40a, 40b and 40c, each including various types or combinations of precursors. Multiple precursors may be embodied using any of the above-illustrated containers and/or delivery devices. The input controls 26 may include multiple buttons or switches 41a, 41b and 41c for activating each of the precursor sources 40a, 40b and 40c, respectively. In another embodiment, the input controls 26 may be located at any location in the system 120 where manual operation is desired or in the case of automated systems RF power, flow of ionizable media, and chemical precursors may be controlled automatically by the controller 32 based on a feedback algorithm.
Examples
[0038] Argon gas was mixed with CCU and ignited within a plasma activation device. Spectra were obtained for the plasma inside outside device as illustrated by the dashed and solid graphs, respectively in Fig. 6. The graphs illustrate generation of various chemical species as s result of the plasma being produced from an ionizable media and a chemical precursor. The intensity of the various emissions correspond to relative concentrations of different chemical species and they show that as the plasma flows into open air, there is a decrease of the density of some species but an increase in the density in other species. This is due to the plasma mixing with nitrogen, oxygen, carbon dioxide and other constituent gases of air. This exemplar plasma was used to successfully to remove tissue material.
[0039] Although the illustrative embodiments of the present disclosure have been described herein with reference to the accompanying drawings, it is to be understood that the disclosure is not limited to those precise embodiments, and that various other changes and modifications may be effected therein by one skilled in the art without departing from the scope or spirit of the disclosure. In particular, as discussed above this allows the tailoring of the relative populations of plasma species to meet needs for the specific process desired on the workpiece surface or in the volume of the reactive plasma.
Claims
1. A plasma system comprising: a plasma device including an active electrode; an ionizable media source configured to supply ionizable media to the plasma device, the ionizable media source coupled to the plasma device at a first connection upstream of the active electrode; a precursor source configured to supply at least one precursor feedstock to the plasma device, the precursor source coupled to the plasma device at the active electrode or upstream thereof; and a power source coupled to the active electrode and configured to ignite the ionizable media and the precursor feedstock at the plasma device to form a plasma volume.
2. The plasma system according to claim 1, wherein the ionizable media and the precursor feedstock are mixed prior to ignition of the mixture thereof.
3. The plasma system according to claim 1, further comprising a microcontroller for controlling a flow of the ionizable media and the precursor feedstock.
4. The plasma system according to claim 3, further comprising a first regulator valve coupled to the ionizable media source and a second regulator valve coupled to the precursor source, wherein the first and second regulator valves are coupled to the microcontroller.
5. The plasma system according to claim 1, wherein the ionizable media is selected from the group consisting of argon, helium, neon, krypton, xenon, radon; nitrogen, hydrogen, oxygen, carbon dioxide, nitrous oxide, and mixtures thereof.
6. The plasma system according to claim 1, wherein the precursor feedstock is a compound having a functional group selected from the group of acyl halide, alcohol, aldehyde, alkane, alkene, amide, amine, butyl, carboxlic, cyanate, isocyanate, ester, ether, ethyl, halide, haloalkane, hydroxyl, ketone, methyl, nitrate, nitro, nitrile, nitrite, nitroso, peroxide, hydroperoxide, oxygen, hydrogen, nitrogen, and combination thereof.
7. The plasma system according to claim 7, wherein the precursor feedstock is selected from the group consisting of water, halogenoalkanes, peroxides, alcohols, amines, alkyls, alkenes, alkalines, and combinations thereof.
8. The plasma system according to claim 1, wherein the precursor source includes at least one of a bubbler, a microfluidic device, a nebulizer, a micropump, a piezoelectric pump, and an ultrasonic vaporizer.
9. The plasma system according to claim 1 , wherein the plasma device includes a dielectric tube and a return electrode disposed on an outer surface thereof.
10. The plasma system according to claim 9, wherein the active and the return electrodes are capacitively coupled to the plasma volume.
11. The plasma system according to claim 10, wherein the precursor source is coupled to the plasma device upstream of at least one of the active electrode and the return electrode or proximally thereof.
12. A method for generating plasma comprising the steps of: supplying ionizable media to a plasma device upstream of an active electrode; supplying at least one precursor feedstock to the plasma device at the active electrode or upstream thereof; and igniting the ionizable media and the precursor feedstock at the plasma device to form a plasma volume.
13. The method according to claim 12, further comprising the step of mixing the ionizable media and precursor feedstock prior to ignition of the mixture thereof.
14. The method according to claim 12, further comprising the step of selecting the ionizable media from the group consisting of argon, helium, neon, krypton, xenon, radon; nitrogen, hydrogen, oxygen, carbon dioxide, nitrous oxide, and mixtures thereof.
15. The method according to claim 12, wherein the precursor feedstock is a compound having at least one functional group, the method further comprising the step of delivering the plasma volume to a workpiece to react at least one substituent of the workpiece with the at least one functional group.
16. The method according to claim 15, fturther comprising the step of reacting the at least one fiinctional group within the plasma volume prior to delivering the plasma volume to the workpiece.
17. The method according to claim 15, wherein the functional group is selected from the group of acyl halide, alcohol, aldehyde, alkane, alkene, amide, amine, butyl, carboxlic, cyanate, isocyanate, ester, ether, ethyl, halide, haloalkane, hydroxyl, ketone, methyl, nitrate, nitro, nitrile, nitrite, nitroso, peroxide, hydroperoxide, oxygen, hydrogen, nitrogen, and combination thereof, to a surface to modify or replace the surface species of the workpiece.
18. The method according to claim 15, further comprising the step of selecting the precursor feedstock is selected from the group consisting of water, halogenoalkanes, peroxides, alcohols, amines, alkyls, alkenes, alkalines, and combinations thereof.
19. A plasma system comprising: a plasma device including an active electrode; an ionizable media source configured to supply ionizable media to the plasma device, the ionizable media source coupled to the plasma device at a first connection upstream of the active electrode; a plurality of precursor sources, each of the precursor sources configured to supply at least one precursor feedstock to the plasma device, wherein each of the precursor sources is coupled to the plasma device at the active electrode or proximally thereof; and a power source coupled to the active electrode and configured to ignite the ionizable media and the precursor feedstock at the plasma device to form a plasma volume.
20. The plasma system according to claim 19, wherein the plasma device includes input controls to active each of the plurality of the precursor sources individually.
21. The plasma system according to claim 19, wherein the ionizable media and at least one of the precursor feedstock are mixed prior to ignition of the mixture thereof.
22. The plasma system according to claim 19, further comprising a microcontroller for controlling a flow of the ionizable media and at least one of the precursor feedstock.
Priority Applications (25)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/995,106 US9288886B2 (en) | 2008-05-30 | 2009-05-29 | Plasma-based chemical source device and method of use thereof |
EP09755793.8A EP2297377B1 (en) | 2008-05-30 | 2009-05-29 | Plasma-based chemical source device and method of use thereof |
JP2011511864A JP2011522381A (en) | 2008-05-30 | 2009-05-29 | Plasma-based chemical source apparatus and method of use thereof |
AU2009347179A AU2009347179B2 (en) | 2009-05-29 | 2009-09-30 | Systems and methods for plasma application |
CA2763866A CA2763866A1 (en) | 2009-05-29 | 2009-09-30 | Plasma electrode configuration for forming an electron sheath layer |
CA2763869A CA2763869A1 (en) | 2009-05-29 | 2009-09-30 | Systems and methods for plasma application |
PCT/US2009/005389 WO2010138103A1 (en) | 2008-05-30 | 2009-09-30 | Electrode surface materials and structures for plasma chemistry |
AU2009347178A AU2009347178B2 (en) | 2009-05-29 | 2009-09-30 | Electrode surface materials and structures for plasma chemistry |
AU2009347177A AU2009347177B2 (en) | 2009-05-29 | 2009-09-30 | Plasma electrode configuration for forming an electron sheath layer |
EP09845328.5A EP2435206B1 (en) | 2008-05-30 | 2009-09-30 | Electrode surface materials and structures for plasma chemistry |
PCT/US2009/005399 WO2010138105A1 (en) | 2008-05-30 | 2009-09-30 | Plasma device for wide area surface treatment of tissue |
EP09845330.1A EP2434975B1 (en) | 2008-05-30 | 2009-09-30 | Plasma device for wide area surface treatment of tissue |
EP09845329.3A EP2435607B1 (en) | 2008-05-30 | 2009-09-30 | Systems and methods for plasma application |
CA2763868A CA2763868A1 (en) | 2009-05-29 | 2009-09-30 | Electrode surface materials and structures for plasma chemistry |
CA2763870A CA2763870A1 (en) | 2009-05-29 | 2009-09-30 | Plasma device for wide area surface treatment of tissue |
PCT/US2009/005385 WO2010138102A1 (en) | 2008-05-30 | 2009-09-30 | Plasma electrode configuration for forming an electron sheath layer |
PCT/US2009/005398 WO2010138104A1 (en) | 2008-05-30 | 2009-09-30 | Systems and methods for plasma application |
JP2012513021A JP2012528452A (en) | 2008-05-30 | 2009-09-30 | Electrode surface materials and structures for plasma chemistry |
AU2009347180A AU2009347180B2 (en) | 2009-05-29 | 2009-09-30 | Plasma device for wide area surface treatment of tissue |
JP2012513023A JP2012528454A (en) | 2008-05-30 | 2009-09-30 | Plasma device for wide-area surface treatment of tissue |
JP2012513022A JP2012528453A (en) | 2008-05-30 | 2009-09-30 | System and method for plasma application |
US13/637,331 US9272359B2 (en) | 2008-05-30 | 2010-03-31 | Liquid-gas interface plasma device |
US13/637,340 US9028656B2 (en) | 2008-05-30 | 2010-03-31 | Liquid-gas interface plasma device |
US12/924,404 US8994270B2 (en) | 2008-05-30 | 2010-09-27 | System and methods for plasma application |
US14/669,028 US9287091B2 (en) | 2008-05-30 | 2015-03-26 | System and methods for plasma application |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US5766708P | 2008-05-30 | 2008-05-30 | |
US61/057,667 | 2008-05-30 |
Related Child Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/637,331 Continuation US9272359B2 (en) | 2008-05-30 | 2010-03-31 | Liquid-gas interface plasma device |
US13/637,340 Continuation US9028656B2 (en) | 2008-05-30 | 2010-03-31 | Liquid-gas interface plasma device |
US12/924,404 Continuation-In-Part US8994270B2 (en) | 2008-05-30 | 2010-09-27 | System and methods for plasma application |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009146432A1 true WO2009146432A1 (en) | 2009-12-03 |
Family
ID=41377615
Family Applications (5)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2009/045708 WO2009146432A1 (en) | 2008-05-30 | 2009-05-29 | Plasma-based chemical source device and method of use thereof |
PCT/US2009/005389 WO2010138103A1 (en) | 2008-05-30 | 2009-09-30 | Electrode surface materials and structures for plasma chemistry |
PCT/US2009/005399 WO2010138105A1 (en) | 2008-05-30 | 2009-09-30 | Plasma device for wide area surface treatment of tissue |
PCT/US2009/005398 WO2010138104A1 (en) | 2008-05-30 | 2009-09-30 | Systems and methods for plasma application |
PCT/US2009/005385 WO2010138102A1 (en) | 2008-05-30 | 2009-09-30 | Plasma electrode configuration for forming an electron sheath layer |
Family Applications After (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2009/005389 WO2010138103A1 (en) | 2008-05-30 | 2009-09-30 | Electrode surface materials and structures for plasma chemistry |
PCT/US2009/005399 WO2010138105A1 (en) | 2008-05-30 | 2009-09-30 | Plasma device for wide area surface treatment of tissue |
PCT/US2009/005398 WO2010138104A1 (en) | 2008-05-30 | 2009-09-30 | Systems and methods for plasma application |
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US (1) | US9288886B2 (en) |
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Also Published As
Publication number | Publication date |
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EP2435206B1 (en) | 2016-11-09 |
WO2010138102A1 (en) | 2010-12-02 |
EP2297377A4 (en) | 2014-08-20 |
WO2010138105A1 (en) | 2010-12-02 |
US20110139751A1 (en) | 2011-06-16 |
JP2015134167A (en) | 2015-07-27 |
US9288886B2 (en) | 2016-03-15 |
WO2010138103A1 (en) | 2010-12-02 |
EP2434975A4 (en) | 2014-12-24 |
EP2435206A1 (en) | 2012-04-04 |
EP2434975B1 (en) | 2018-07-11 |
JP2012528453A (en) | 2012-11-12 |
JP2011522381A (en) | 2011-07-28 |
EP2297377A1 (en) | 2011-03-23 |
EP2435607B1 (en) | 2016-07-20 |
JP2012528452A (en) | 2012-11-12 |
JP2012528454A (en) | 2012-11-12 |
WO2010138104A1 (en) | 2010-12-02 |
EP2435607A4 (en) | 2015-01-07 |
EP2434975A1 (en) | 2012-04-04 |
EP2297377B1 (en) | 2017-12-27 |
EP2435607A1 (en) | 2012-04-04 |
EP2435206A4 (en) | 2015-01-14 |
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