WO2009129947A1

WO2009129947A1 - Device comprising a multilayer board and light-emitting diodes

Info

Publication number: WO2009129947A1
Application number: PCT/EP2009/002711
Authority: WO
Inventors: Christoph Becher
Original assignee: Alcan Technology & Management Ltd.
Priority date: 2008-04-25
Filing date: 2009-04-14
Publication date: 2009-10-29
Also published as: JP2011519155A; DE102008021014A1; EP2272103A1; TW201009775A; KR20110038608A; CN102027605A

Abstract

The invention relates to a multilayer composite for power and/or signal supply comprising a multilayer board (21) and light-emitting diodes (30) that are arranged thereon and connected to a power conductor. Said multilayer board (21) comprises a plurality of layers (22) which are produced of metal, preferably aluminum or an aluminum alloy, and which are arranged at both sides of a plastic center layer (24) and that are covered by a cover layer (26) which is produced o corresponding material. The diodes (30) are arranged in respective recesses (28) of the board (21) are connected to the electroconductive metal layers (22) of the board via a plurality of metal layers (32) and plastic layers (36) that extend between them. The multilayer composite has at least three, preferably four, electroconductive layers (22, 32) that are insulated from each other by respective plastic layers (24, 36).

Description

Device with a multilayer plate and light-emitting diodes

The invention relates to a multi-layer composite for power and / or signal supply with a plate and arranged at her, connected to a power supply, light emitting diodes, wherein the plate has a plurality of layers, according to the preamble of claim 1.

EP 1 423 891 B1 discloses a multilayer composite with an adapter to be mounted in an opening of a sandwich panel. This opening passes through the sandwich panel, which contains a middle insulating layer, an upper conductive layer and a lower conductive layer under the insulating layer. The adapter includes a housing having upper and lower housing parts, guide holes in one of the parts, guide pins in the other of the parts that fit into the guide holes, and a conductive washer between the upper part and the lower part. The conductive disk also has guide holes which allow the passage of the guide pins and hold the conductive disk in a correct position between the upper and lower parts; the conductive disk provides a plurality of outwardly extending first pins for establishing a stable electrical connection with the upper conductive layer and a second pin mounted in the lower portion and extending outwardly for electrical connection to the lower layer , The adapter may include a light emitting diode.

WO 2006/128 447 A1 discloses a metal mesh with luminaires and an arrangement of such a fabric on a building. A Leuchtenträgeraufnähme is integrated into the tissue and makes it possible to remove a light carrier without Disintegrierung the light carrier recording from the tissue and reinsert. Alternatively, a Leuchtenträgeraufnähme attached to the fabric or other curtain; at this then the light carrier can be determined. Preferably, clips are used.

From DE 40 39 034 Al it is known that conventional large-scale displays cost-related limits of their size and thus their conspicuousness are set. For this purpose, a large display to remedy the situation by using at least a portion of a building with regularly arranged windows or window groups, which are used as pixels, and mounted in or on the building, each window or window group associated light sources selectively by means of a remote control device be switched.

In recognition of these circumstances, the inventor set himself the goal of creating a new display unit, which can be used in particular in buildings, as a multilayer composite product for use as a lighting and / or information-switching or sensor system.

To achieve this object, the teaching of the independent claim; the dependent claims indicate favorable developments. In addition, all combinations of at least two of the features disclosed in the description, the drawings and / or the claims fall within the scope of the invention. For given designation ranges, values lying within the specified limits should also be disclosed as limit values and used as desired.

According to the invention, the multilayer plate comprises a plurality of layers of metal, in particular of aluminum or an aluminum alloy, arranged on both sides of a middle layer of a plastic, for example a thermosetting, in particular a thermoplastic, material, and on the other side correspondingly insulating from a further middle layer or a cover layer Material are covered. According to the invention, the multilayer plate should contain at least one - preferably several - recesses, wherein in each case a diode is arranged in the recesses of the plate. These diodes are connected to the current-conducting metal layers-of aluminum or an aluminum alloy-by means of a layer of metal, and layers extending therebetween, for example, of thermoplastic-containing diode body.

Alternatively, the diodes may be disposed on or above a surface of the multilayer board, and the control functions as well as power and voltage supply may be tapped by at least one conductive layer and correspondingly dissipated through at least one other layer.

By a multilayer sandwich construction - consisting of at least three, ideally four electrically conductive layers (such as metal, especially light metal such as aluminum) and intervening electrically insulating layers - such as the mentioned plastics - plates can be produced which as Carrier for electronic components - z. As integrated circuits (ICs), LEDs (light emitting diodes), connectors or sensors - serve to be used assets.

Typical thicknesses of the electrically conductive layers range from 20 nanometers for chemically or physically deposited layers to 200 microns for metal foils. As electrically conductive layers and electrically conductive plastic layers can be inserted. Electrically insulating layers such as polyolefin sheets or films - for example, polyethylene or polypropylene, polyvinylchloride, polyamide, etc. - may have a thickness of, for example, 7 to 300 μm and more (up to 1000 μm). The conductive layers of the plate serve as bus system and / or power supply. As a result, arbitrarily designable large-area monitors or illuminated surfaces can be produced.

In a particular embodiment, conductive film webs for connecting components such as diodes are provided on a free surface of a cover layer of a plate; the latter are placed on those layers.

If the diodes are each arranged within a recess, in order to ensure the desired contact within the plate, the layers of metal of the diode body used with the layers of metal of the plate must be aligned cross-sectionally according to the invention. In addition, the lower edge of the diode body used is to sit on a continuous layer of metal of the plate. For this purpose, it has proved to be advantageous if the diode body is covered by a lens canopy whose lens edge projects laterally beyond the diode body and thereby rests in the installed position of the adjacent cover layer of the plate. Also, it is advantageous that for better handling of the lens cap outside a support rod is added, which preferably extends in the central axis of the diode or the diode body, and for connecting to the latter / latter contains a fixing plate for resting on the lens canopy.

In a further embodiment of the subject invention sits in the rest of the lower edge of the diode body used a continuous translucent layer of the plate on; This allows the diode to shine through the bottom layer of the plate.

In the context of the invention is also a panel plate, in the panel surface a plurality of recesses are arranged for / with light emitting diodes. It is up to the respective designer to select a particular pattern for the arrangement of the recesses. In a box-like shaped panel whose box wall contains several recesses for / with light emitting diodes. Another inventive variation of a panel plate includes a plurality of groups of patterns each of a larger number of recesses for / with light-emitting diodes. Also within the scope of the invention is a panel plate with wave-like longitudinal section.

Of particular importance is the use of the table panels according to the invention on wall surfaces; here, too, different patterns are recorded.

Furthermore, a coupling by means of connectors and the inclusion of sensors is possible. The positioning and connection technology (hermetic sealing) of the components on / with the plate can be done, for example, by friction welding, thermoplastic or duroplastic injection molding or other joining technologies. Possible applications are in the field of architecture (eg media facades, interior and exterior lighting), transport (such as traffic control systems, road and tunnel lighting, train and ferry lighting), industry (including machine lighting, light barrier systems, curing systems), security technology (3D Light barrier systems) and display applications (signs, interactive signs, advertising space od. Like.).

Further advantages, features and details of the invention will become apparent from the following description of preferred embodiments and from the drawing; this shows in

Fig. 1: the top view of three after the

Prior art arranged in a line LEDs;

FIG. 2 shows the side view of a device according to FIG. 1 with this underrunning support plate; FIG.

3 shows a section through a multilayer printed circuit board with layer elements for light-emitting diodes arranged on its surface;

4 shows the sectional side view of a multilayer plate with recess for receiving a light-emitting diode;

Fig. 5 is a side view of a portion of another multilayer panel;

6 shows a sectional side view of a light-emitting diode as an insert element;

Fig. 7: one of FIG. 6 corresponding

Side view of a light emitting diode with associated plate; Fig. 8, 9: two different positions of the sketched in Figure 7 LED after its use in the plate.

FIG. 10: the top view of the detail of FIG. 9; FIG.

11 shows one of the illustrations in Fig. 8,

9 corresponding reproduction of a different shaped plate;

Fig. 12: an oblique view of a plate almost square plan as a blank;

Fig. 13: four oblique views on production forms of light-emitting diodes equipped plates from the blank of Fig. 12;

Fig. 14: an oblique view of a three-dimensional plate box-like configuration;

FIGS. 15 and 16 show two oblique views of two-dimensional plates of different shapes;

17 shows a sketch of the process of producing a plate in five steps;

Fig. 18 is an oblique view of a building with installed plates, which are created in accordance with FIG. 17; FIG. Fig. 19: the front view of a building with a comparison with FIG 18 differently shaped plate;

Fig. 20: an enlarged section of

Fig. 19.

The sketches of Fig. 1, 2, the position of three light-emitting diodes 10 at center distances n of about 350 mm from each other on a strand 12 with two lines 14, 15 can be seen, the latter ends at both ends in connecting elements 16, lβ _a . These are located from the center of the nearest light-emitting diode 10 at a distance ni of 250 mm here. The length a of the LEDs 10 is here 15.5 mm, their height i 7.5 mm.

The strand 12 is shown in Fig. 2 on a commercial support plate 17 of thickness h from two on both sides of a plastic plate 18 fixed light metal plates 19 launched.

A clarified in Fig. 3 PCB 20 of a thickness h of here, for example, 10 mm has two mutually parallel layers of light metal plates 22 made of aluminum or aluminum alloys each having a thickness hi of about 0.5 mm here, between which they a separating center layer 24 a Thickness h ₂ from here about 0.2 mm from PE (polyethylene) is arranged. Each of the aluminum plates 22 formed here from Al 99 is covered to the outside with another polymer layer as cover layer 26, the thickness h _{3 of which} measures approximately 4.4 mm in each case. The length and the width of the circuit board 20, which are not designated in Fig. 3, amount to, for example, about 300 mm and 400 mm.

On the free surface 27 of the cover layer 26 can be seen at 29 conductive layer webs for connecting components such as light emitting diodes, ie LED (light-emitting diodes). These are connected to the current-carrying aluminum layers 22 by lines (not visible in FIG. 3).

The advantages of such a printed circuit board 20 over a two-layer printed circuit board are above all:

• low emission through signal lines (loop surface return conductor);

• low radiation through the supply system;

• low common-mode currents.

The disadvantages of a four-layer circuit board 20 compared to six layers or more are:

• higher radiation through signal lines (thick dielectric);

• higher coupling between signal lines (thick dielectric);

• higher coupling between signal lines and VCC in X-Y design.

The plate 21 partly shown in FIG. 4 of four aluminum layers 22 and these each on both sides covering PE layers 24 or PE cover layers 26 serves, for example, for receiving the units of FIG. 3 and has for their LEDs 30 recesses 28 whose width di the diameter d of the LEDs 30 corresponds. For this purpose, FIG. 7 shows that the depth ii of the recess 28 corresponds to a height i of the diode body 31 of the light-emitting diode 30 to be lowered into it and to be fixed in it.

The plate 21 of FIG. 5 offers three PE layers 24 and two PE cover layers 26, between which four aluminum layers 22 are stored isolated from each other. Not shown here are the blind hole-like recesses 28 for the diode body 31; For this purpose, reference is made in particular to FIGS. 7 to 9. The diode body 31 of the light-emitting diode 30 of FIG. 6 is composed of four current-carrying aluminum layers 32 of thickness hi and four insulating PE layers 36 of thickness h ₃ . Its lower edge 34 is determined by an aluminum layer 32 and its upper edge 35 by a PE layer 36. The latter sits a diffusing, UV-resistant lens 40 with querschnittlieh to its edge 42 toward curved surface 39; whose diameter d ₂ is greater than the length or the diameter d of the diode body 31, so that between this and that lens edge 42, a protruding Kragmaß k is present. In addition, in Fig. 6 in the interior 33 of the diode body 31 oblique views of the lens 40 with six RGB LED 37 and a four-wire bus / driver IC 38 symbolically outlined.

In Fig. 7, the lens canopy 40 of the light emitting diode 30 is attached to a fixing plate 44 of a running in its central axis M support rod 46, thanks to which they can be easily inserted into the recess 28 of the plate 21 as shown in FIG. In Fig. 9, the support rod 46 is already released from the light emitting diode 30, and the latter is surrounded in the region of the recess 28 by a sealing layer 48, which according to Fig. 9, 10 and between the surface 27 of the plate 21 and the projecting lower surface of the lens canopy 40 is provided. 8, 9 also make it clear that in the installed position, the layers 22 and 24, 26 of the plates 21 are aligned with the respective material corresponding layers 32 and 36 of the diode body 31.

In Fig. 11, a plate 21 _{a is} sketched with a lower translucent cover layer 23, the latter being connected to the lower edge 34 of a diode body 31 _{a of} a diode 30 _a inserted into the corresponding recess 28 of the plate 21 _a . The latter shines through that cover layer 23.

FIG. 12 shows a tabular plate 50 of approximately square outline of length z, which, according to FIG. 13, has different patterns with light-emitting diodes 30b is fitted, for example in the form of an "F" or with four or seven parallel rows of light-emitting diodes 30 _b . The right in Fig. 13 plate 50 _a is transformed into a U-shaped base plate in plan view, ie at her is a median strip partially It is provided with thirty four LEDs 30b.

Fig. 14 illustrates a designed as a box plate 52 with the inside of the box walls 54 arranged light-emitting diodes 30 _b . In addition to this box 52, a plate 50 _{b is} shown in Fig. 15, the longitudinal section S-shaped bent and equipped with fifty-four LEDs 30 _b .

The plate 50 _c rectangular plan view of FIG. 16 offers three fields 56, each with thirty-seven LEDs 30 _b .

Fig. 17 illustrates a rectangular plate 50a with side lengths y, z. In a first step A twelve recesses 28a are introduced during a manufacturing process, in which then - step B - LEDs 30 _{b are} inserted and so a mounting plate 50 _e is formed. In a step C, a drainage string 58 is attached to the latter. Then - step D - the plate 50 _e according to the specifications of FIG. 15 longitudinally deformed S-shaped.

In Fig. 18, a building 60 is symbolized on the facade 62 below the roof 64 plates 50 _e are arranged; For the sake of clarity, only three of the printed circuit boards 50 _{e are} sketched in this FIG. 18.

On the facade 62 of the building 60 _a of FIG. 19, a plate 51 of a length e of 1150 mm and a width f of 850 mm is attached, the three hundred receiving apertures 70 square outline here about 15 mm side length for each one LED 30 _c square Outline offers. These are - as especially the Fig. 20 to take - arranged in a grid-like pattern in each case a distance c of 50 mm from each other. In addition, the pattern field is provided at a distance q of 75 mm to the longitudinal edge 51 _{3 of} the plate 51 and at a distance qi of 100 mm to its transverse edge 51 _b .

Claims

1. multilayer composite for power and / or signal supply with a plate and arranged thereon, connected to a power supply light-emitting diodes, wherein the plate has a plurality of layers,

characterized,

that the multilayer plate (21, 21 _a , 50, 50 _a to

50 _e , 51, 52) comprises a plurality of layers (22) of metal, preferably aluminum or an aluminum alloy, each on both sides of a middle layer

(24) arranged from a plastic and on the other hand by a further middle layer or a cover layer

(26) are covered by appropriate material.

2. Apparatus according to claim 1, characterized in that each in a recess (28, 28 _a ) of the plate (21, 21 a, 50, 50 _a to 50 _e , 51, 52) arranged diodes (30, 30 _a , 30 _b , 30 _c ) via a plurality of layers (32) of metal and between these extending layers (36) of plastic-containing diode body (31, 31 _a ) are connected to the current-conducting layers (22) made of metal of the plate.

3. Apparatus according to claim 1 or 2, characterized in that at least three, preferably four, each by a layer (24, 36) made of plastic against each other insulated electrically conductive layers (22, 32) are provided.

4. Apparatus according to claim 3, characterized in that the layer (24, 36) is formed from thermoplastic material.

5. Apparatus according to claim 3 or 4, characterized in that on a free surface (27) of a cover layer (26) conductive layer webs (29) for connection of components such as diodes (30) are provided (Fig. 3).

6. Device according to one of claims 1 to 5, characterized in that the layers (32) of metal of the inserted diode body (31, 31 _a ) with the layers (22) made of metal of the plate (21, 21 _a , 50, 50 _a to 50 _e , 51, 52) are aligned.

7. Device according to one of claims 1 to 6, characterized in that the lower edge (34) of the inserted diode body (31) of a continuous layer (22) of metal of the plate (21, 50, 50 _a to 50 _e , 51) is seated (Fig. 8).

8. Device according to one of claims 1 to 6, characterized in that the lower edge (34) of the inserted diode body (31 _a ) of a continuous translucent layer (23) of the plate (21 a) is seated (Fig. 12).

9. Device according to one of claims 1 to 8, characterized in that the diode body (31, 31 _a ) is spanned by a lens canopy (40) whose lens edge (42) projects laterally beyond the diode body.

10. The device according to claim 9, characterized in that the lens edge (42) of the adjacent cover layer (26) rests.

11. The device according to claim 9 or 10, characterized in that on the lens canopy (40) on the outside, a support rod (46) is added.

12. The device according to claim 11, characterized in that the support rod (46) in the central axis (M) of the diode (30) and the diode body (31).

13. The apparatus of claim 11 or 12, characterized in that the support rod (46) includes a fixing plate (44) for resting on the lens canopy (40).

14. The device according to at least one of claims 1 to

13, characterized by a panel plate (50, 50 _a to 50 _e , 51, 52), in the panel surface a plurality of recesses (28, 28 _a ) for / with light-emitting diodes (30, 30 _a to 30 _c ) are arranged.

15. The apparatus according to claim 14, characterized in that the panel plate (52) is shaped like a box and its box wall (54) a plurality of recesses (28, 28 _a ) for / with light-emitting diodes (30 _b ) contains (Fig. 14).

16. The apparatus according to claim 14, characterized in that the panel plate (50 _c ) a plurality of groups (56) of patterns from a plurality of recesses (28, 28 _a ) for / with light-emitting diodes (30 _b ) contains (Fig. 16).

17. The apparatus according to claim 16, characterized by a wave-like longitudinal section of the panel plate (50 _b , 50 _e ).

18. Device according to at least one of claims 1 to

14, characterized in that the panel plate (50 _e , 51) is fixed to a wall surface (62).

19. The device according to at least one of claims 1 to 18, characterized by at least one further description and / or the drawing removable feature.