WO2009072690A1

WO2009072690A1 - Apparatus for heating pattern frame

Info

Publication number: WO2009072690A1
Application number: PCT/KR2007/006377
Authority: WO
Inventors: Sang Hyun Lee
Original assignee: Top Engineering Co., Ltd.
Priority date: 2007-12-07
Filing date: 2007-12-07
Publication date: 2009-06-11
Also published as: CN101889241B; CN101889241A

Abstract

Disclosed is the apparatus for heating a pattern frame, including: a housing having an internal space and to which a pattern frame is mounted, a heat generating unit for supplying heat to the internal space, and a heat transfer unit filled in the internal space in a powdered form so as to transfer heat supplied by the heat generating unit to the pattern frame, thus to uniformly and quickly heat the pattern frame and to facilitate the manufacture thereof.

Description

APPARATUS FOR HEATING PATTERN FRAME

TECHNICAL FIELD

The present invention relates to a heating apparatus, and more particularly, to an apparatus for heating a pattern frame which is used to form a pattern on a glass plate in manufacturing processes of an LCD (Liquid Crystal Display), and the like.

BACKGROUND ART In general, an LCD device is a display device which uses a state change of a liquid crystal having a characteristic between a liquid and a solid, and a polarizing characteristic of a polarizer so as to adjust the amount of light penetrating a liquid crystal, thereby displaying information.

In more detail, an LCD includes a lower substrate having driving devices such as a TFT (Thin Film Transistor) on a plate-shaped glass, an upper substrate having a color filter layer, a liquid crystal filled between the upper and lower substrates, and a backlight unit serving as a light source.

In an LCD fabrication process, in order to form driving devices, a color filter layer, etc. on a substrate, there is a need to form a film with a certain material on a surface of the substrate.

Then, a specific pattern can be formed on the film formed on the substrate, in a "patterning" process. In the patterning process, after a photoresist is deposited on the substrate where the film was formed, a series of steps including exposure, developing, etching, resist removal, and the like is performed. Since it is complicated to perform such series of steps, a new method for simplicity, which presses a pattern frame having a pattern to mold onto a film of the substrate and then imprints it, is in the limelight.

In the imprinting method, heat is applied to a pattern frame having a pattern to mold, and the heated pattern frame contacts or presses the substrate on which the film is formed. After pressing, a film portion having been contacted by the heated pattern frame becomes hardened, thereby securely forming the pattern on the film and then the pattern frame is separated from the substrate.

A heating apparatus used to heat the pattern frame in such a patterning (imprinting) step is described with reference to Fig. 1.

Figure 1 is a schematic view illustrating a related art heating apparatus 10 which is used for a patterning process.

As shown in the drawing, the heating apparatus 10 is configured with a heat conduction unit 13 received inside a housing 11. A heating means 15 for supplying heat, e.g., a heating wire is arrayed in the heat conduction unit 13. Further, one side of the housing 11 is contacted by a pattern frame P, which has a shape corresponding to the pattern to be molded onto the glass substrate where a film is formed (not shown).

Heat generated by the heating means 15 is transferred to the pattern frame P through the heat conduction unit 13 under the control of an operator. The pattern frame P, having been transferred heat, becomes heated, and as the pattern frame P contacts the glass substrate, a desired pattern can be formed on the portion where the film was formed.

In the heating apparatus 10, the heat conduction unit 13 is shaped as a solid formed by sintering a heat conducting material. Since the heat conduction unit 13 is in a solid form, a hole must be made in the heat conduction unit 13 by a drilling and then the heating means 15 needs to be inserted into the hole.

During the process for manufacturing the heating apparatus 10, sintering and drilling processes of the heat conduction unit 13 require a long time and various work steps. Cracks may be generated in the heat conduction unit 13 due to the difference in the thermal expansion coefficients of the heat conduction unit 13 and the heating apparatus 15, and repetitive heating and cooling. The generation of cracks causes a deterioration of the durability of the heating apparatus 10 as well as the heat conduction unit 13, and of work efficiency.

Since the heat conduction unit 13 is formed in the solid form, the heat transfer from the heating means 15 to the pattern frame P can be performed only by the heat conduction method in the heat conduction unit 13. That is, it is difficult to expect heat convection and/or heat radiation by the heat conduction unit 13. With the heat conduction only, it is difficult to transfer heat to the heat conduction unit 13 in a rapid and uniform manner, thereby limiting to heat the pattern frame P quickly and uniformly.

Considering the glass plate requiring the patterning process becomes lager, if the heating apparatus 10 needs to be larger, the heat conduction unit 13 having a large size should be integrally sintered, thereby causing a difficulty in the sintering process.

Also, the heating means 15 is formed as a heating wire, thereby generating almost only conduction heat. Further, the heating wire has just 20 - 30% energy conversion efficiency and is limited for a rapid heating. Further, the heating apparatus 10 is not provided with a specific cooling means, and cools the pattern frame P by just natural convection after patterning. Accordingly, rapid and uniform cooling becomes difficult.

DISCLOSURE OF THE INVENTION TECHNICAL PROBLEM

Therefore, it is an object of the present invention to manufacture an apparatus for heating a pattern frame, and to facilitate the manufacture of the apparatus for heating a pattern frame in a large size.

It is another object of the present invention to avoid the apparatus for heating a pattern frame being damaged by a thermal deformation as well as to enable a rapid and uniform heat transfer to the pattern frame.

TECHNICAL SOLUTION

To achieve these and other advantages and in accordance with the purpose of the present invention, as embodied and broadly described herein, there is provided an apparatus for heating a pattern frame, including: a housing having an internal(interior) space and to which a pattern frame is mounted; a heat generating unit for supplying heat to the internal space of the housing; and a heat transfer unit filled in the internal space of the housing in a powdered form for transferring heat supplied by the heat generating unit to the pattern frame.

An apparatus for heating a pattern frame according to another aspect of the present invention includes a housing having an internal space and at which a pattern frame is mounted; and a liquid control unit communicated with the internal space of the housing, for injecting or collecting a heated liquid into or from the internal space so as to perform heat exchange with the pattern frame.

ADVANTAGEOUS EFFECTS

The apparatus for heating a pattern frame according to the present invention can facilitate the manufacture of a heat transfer unit for transferring heat to the pattern frame and a liquid control unit, without limiting the size to be manufactured. Accordingly, the heat transfer unit and the like do not affect the manufacture of the entire apparatus for heating a pattern frame of a large size.

The heat transfer unit can perform all of the three heat transfer methods. The liquid control unit and the cooling unit can simultaneously supply a heated liquid and cooling water, thereby enabling uniform and rapid heating and cooling for the pattern frame. Such uniform and rapid heating and cooling can facilitate a patterning process in a precise scale, such as a nano-scale, using the apparatus for heating the pattern frame. A halogen lamp as a heat emitting lamp has a quick temperature increase rate and energy conversion efficiency. Besides, the halogen lamp emits light and heat at the same time, thus to highly contribute to a rapid heating of the pattern frame.

In addition, the apparatus for heating the pattern frame according to the present invention is provided with a cooing unit, thereby actively performing a cooling of the pattern frame beyond a cooling by the natural convection. Such cooling can be more rapidly performed by having a heat transfer unit, or by quickly supplying cooling water in the cooling unit.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other objects, features, and advantages of the present invention will be made apparent from the following description of the preferred embodiments, given as nonlimiting examples, with reference to the accompanying drawings in which: Figure 1 is a schematic view illustrating a related art heating apparatus used for a patterning process;

Figure 2 is a perspective view schematically illustrating an apparatus for heating a pattern frame according to a first embodiment of the present invention;

Figure 3 is a cross-sectional view taken along line ¹Et-III' in Fig. 2; Figure 4 is a schematic view illustrating an operational method for the apparatus for heating a pattern frame shown in Figs. 2 and 3;

Figure 5 is a perspective view schematically illustrating the apparatus for heating a pattern frame according to a second embodiment of the present invention;

Figure 6 is a cross-sectional view taken along line 'VI-VI' in Fig. 5; and Figure 7 is a schematic view illustrating an operational method for the apparatus for heating a pattern frame shown in Figs. 5 and 6.

MODES FOR CARRYING OUT THE INVENTION Description will now be given in detail of the apparatus for heating a pattern frame according to the preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings.

Figure 2 is a perspective view illustrating an apparatus for heating a pattern frame 100 according to a first embodiment of the present invention.

Referring to Fig. 2, the apparatus for heating a pattern frame 100 includes a cover 160 having a pattern frame P mounted at one surface thereof and enclosing internal components, a heat generating unit 120 electrically connected to the internal components inside the cover 160, and a cooling unit 140 communicated with the internal components inside the cover 160.

The pattern frame P is heated by the internal components of the cover 160 and the heat generating unit 120, and then contacts a glass plate G (Fig. 4) on which a film was formed. In order to make the pattern frame P contact the glass plate G, the cover 160 may be mounted at a moving means (not shown) configured to make the cover 160 (and the internal components therein) contact the glass plate G or make the cover 160 be separated from the glass plate G.

As a part of the heat generating unit 120, a power supply unit 123 and a power controller 125 are schematically illustrated in the drawing. The power supply unit 123 is electrically connected to the power controller 125, and simultaneously, is electrically connected to the internal components inside the cover 160, i.e., a heat emitting lamp 121 (Fig. 3). The power supply means 123 and the heat emitting lamp 121 are connected through wires 123a.

The cooling unit 140 serves to cool the pattern frame P after the pattern frame P contacts the glass plate G. For this, the cooling unit 140, as schematically shown in the drawing, includes a refrigerant supply unit 143 and a refrigerant controller 145 for controlling the refrigerant supply unit 143. The refrigerant supply unit 143 is communicated with a cooling pipe 141 (referring to Fig. 3) through refrigerant supply lines 143a.

Next, descriptions of the cover 160 and internal components thereof will be given in detail with reference to Fig. 3 which is a cross-sectional view taken along line (HI-III) in Fig. 2.

Referring to Fig. 3, a housing 110 is disposed inside the cover 160. A vacuum portion 170 is maintained in a vacuum state between the housing 110 and the cover 160 for insulation. A heat conduction plate 150 of a high conductivity is mounted between the housing 110 and the pattern frame P. Since the heat conduction plate 150 is mounted on one surface of the housing 110, the heat conduction plate 150 may be considered as a part of the housing 110. That is, that the pattern frame P is mounted at the housing 110 may also include a case that the pattern frame P is mounted at the heat conduction plate 150 coupled to the housing 110.

A heating element serving as a component of the heat generating unit 120 is disposed in an internal space 110a in the housing 110. For instance, a heat emitting lamp 121 can be adopted as the heating element. The heat emitting lamp

121 is, as described above, electrically connected to the power supply means 123 through the wires 123a.

Preferably, a halogen lamp is implemented as the heat emitting lamp 121. The halogen lamp simultaneously generates light and heat, and is considered as a heating element of high efficiency which is capable of having a 70% energy conversion efficiency. Also, the halogen lamp can achieve a rate of temperature increase up to 70 ^°C per second, thereby enabling a rapid temperature increase.

The cooling pipe 141 , which is a component of the cooling unit 140, is disposed in the internal space 110a in the housing 110. The cooling pipe 141 is, as mentioned above, communicated with the refrigerant supply unit 143 through the refrigerant supply lines 143a. The cooling pipe 141 is disposed to surround the heat emitting lamp 121. With this arrangement, when cooling is needed, cooling can be effectively started from a periphery of the heat emitting lamp 121 , which is at a relatively high temperature.

A heat transfer unit 130 is disposed in the internal space 110a in the housing 110 so as to transfer heat and cooling air respectively generated by the heat emitting lamp 121 and the cooling pipe 141. The heat transfer unit 130 is filled with materials in a powdered form having heat conductivity. The materials filled in a powdered form can be Au, Ag, SiC, CNT (Carbon nanotube), and the like. Such materials are of good heat conductivity, and can form the heat transfer unit 130 by a single type having only one material or by a mixed type having various materials.

The heat transfer unit 130 simply requires the heat conductive material in a powdered form to be filled in the internal space 110a in the housing 110, thereby facilitating to manufacture the housing 110 (and further, the apparatus for heating the pattern frame 100) in a large size. That is because it does not encounter any difficulty in manufacture as caused by sintering the heat transfer unit 13 (Fig. 1 ) in a large size. Also, no sintering process is required, thereby quickening and simplifying the manufacture of the heat transfer unit 130.

Description of the operational method of the apparatus for heating the pattern frame 100 will now be given in detail with reference to Fig. 4, which is a schematic view showing the operational method thereof.

Referring to Fig. 4 (and Figs. 2 and 3), to heat the pattern frame P, the power controller 125 issues an operational command to the power supply unit 123. The power supply unit 123 operated by the operational command supplies power to the heat emitting lamp 121 through the wires 123a. The heat emitting lamp 121 , to which power is applied, radiates light and heat.

The heat transfer unit 130 in a powdered form is configured to transfer heat generated by the heat emitting lamp 121 to the heat conduction plate 150. The heat conduction plate 150, to which heat is transferred, transfers heat to the pattern frame P, and the heated pattern frame P contacts the glass plate G.

Accordingly, the portion where the film was formed on the glass plate G can be patterned with a certain pattern.

The heat emitting lamp 121 simultaneously generates heat and light, thereby having excellent heat-emitting efficiency. If the heat emitting lamp 121 is a halogen lamp, as described above, the pattern frame P can be rapidly heated and the temperature thereof can be up to 1000⁰C .

Since the heat transfer unit 130 is in a powdered form, heat generated by the heat emitting lamp 121 is conducted by powder particles contacting each other. The heat is radiated through gaps between the particles. Although it is insignificant when compared to conduction or radiation, convection also occurs between the gaps. Three aspects of conduction, convection and radiation in the heat transfer are simultaneously performed by the heat transfer unit 130.

As a result, the heat generated by the heat emitting lamp 121 is uniformly and quickly transferred to the entire area of the heat conduction plate 150, thereby heating the entire area of the pattern frame P uniformly and quickly. The heating of the pattern frame P in a uniform and rapid manner is a very important factor to achieve precision and quickness of the patterning process. The importance of such two factors can be more emphasized in a precise nano-scale patterning process.

If the pattern frame P needs to be returned to its original position from the state that the pattern frame P is heated and is contacted onto the glass plate G, the pattern frame P should be cooled for stable separation of the pattern frame P from the glass plate G. The refrigerant controller 145 issues an operational command to the refrigerant supply unit 143 for cooling. The refrigerant supply unit

143 having received the operational command, supplies refrigerant to the cooling pipe 141 through the refrigerant supply lines 143a.

Since the temperature at the periphery of the cooling pipe 141 is changed to be relatively low, heat at the area having a relatively high temperature, such as at the periphery of the heat emitting lamp 121 , the heat conduction plate 150, etc. is transferred to the periphery of the cooling pipe 141 by the heat transfer unit 130. Through the heat transfer, the inside of the housing 110 and also the pattern frame P are cooled, thereby completing the patterning process.

The heat transfer unit 130 enables the rapid and uniform cooling, similarly to the heating, thereby contributing to the precision and quickness of the patterning process. Since the heat transfer unit 130 is formed as a powder, unlike the related art sintered solid 13 (Fig. 1 ), cracking does not occur in the heat transfer unit 130 in spite of repetitive heating and cooling. That can be a factor to enhance the overall durability of the heat transfer unit 130 and the apparatus for heating the pattern frame 100.

Referring to Figs. 5 through 7, an apparatus for heating a pattern frame 200 according to a second embodiment of the present invention will be described in detail.

Figure 5 is a perspective view schematically illustrating the apparatus for heating a pattern frame 200 according to the second embodiment of the present invention.

Referring to the drawing, the apparatus for heating the pattern frame 200 includes a cover 260 having a pattern frame P mounted at one side thereof and covering internal components thereof, and a liquid control unit 220 and a cooling unit 230 communicated with the internal components in the cover 260.

Here, the liquid control unit 220 includes a connection line 221 , a liquid supply/collection portion 223, and a liquid controller 225. The connection line 221 is configured to communicate the liquid supply/collection portion 223 and the housing 210 (referring to Fig. 6) with each other. The connection line 221 is formed to have a hollow pipe shape, and is extended to the inside of the cover 260. The connection line 221 may be divided into a supply line 221-1 for supplying a heated liquid L (referring to Fig. 6) from the liquid supply/collection portion 223 to the housing 210, and a collection line 221-2 for collecting the liquid L in the housing 210 to the liquid supply/collection portion 223.

The liquid supply/recollection portion 223 is provided with a liquid tank

223a for storing the liquid L. A pump 223b is further provided to pump the liquid L in the liquid tank 223a and the housing 210. The pump 223b may be divided into a supply pump 223b-1 installed at the supply line 221-1 , and a collection pump 223b-2 installed at the collection line 221-2.

A heater 223c is disposed at the supply line 221-1 so as to heat the liquid L supplied to the housing 210. The heater 223c may be integrally installed inside the liquid tank 223a.

A supply valve 223d-1 and the collection valve 223d-2 are respectively installed at the supply line 221-1 and the collection line 221-2, and open/close the lines 221-1 and 221-2.

The liquid controller 225 is electrically connected to each of the components 223a, 223b, 223c, 223d-1 and 223d-2 of the liquid supply/collection portion 223 so as to control the operations thereof. That the liquid controller 225 controls the liquid tank 223a may indicate that the operation of the heater 223c is controlled in the case that the heater 223c is mounted within the liquid tank 223a, or the like.

The cooling unit 230 includes a connection line 231 , a cooling water supply/collection portion 233 and a cooling water controller 235.

The connection line 231 is configured to connect a cooling tank 233a of the cooling water supply/collection portion 233 and the housing 210 so as to be communicated with each other. The connection line 231 is formed to have a hollow pipe shape, and is provided with two lines of a supply line 231-1 and a collection line 231-2.

The cooling water supply/collection portion 233 includes the cooling tank 233a and a pump 233b installed at the connection line 231. The cooling tank 233a serves to store cooling water. A cooling device (not shown) is installed at the cooling tank 233a, thereby enabling the cooling water to be maintained at a temperature required for cooling. The pump 233b is categorized into a supply pump 233b-1 disposed to be communicated with the supply line 231-1 , and a collection pump 233b-2 disposed to be communicated with the collection line 231- 2. The supply valve 233c-1 and the collection valve 233c-2 are respectively installed so as to be communicated with the supply line 231-1 and the collection line 231-2, and open/close the lines 231-1 and 231-2.

The cooling water controller 235 is electrically connected to each of the components 233a, 233b, 233c-1 and 233c-2 of the cooling water supply collection portion 233 so as to control the operations thereof. Here, that the cooling water controller 235 controls the cooling tank 233a indicates the control of the above- mentioned cooling device. In the apparatus for heating the pattern frame 200, in order to heat and cool the pattern frame P, a heated liquid L or cooling water is rapidly supplied to the internal space of the housing 210 by the liquid control unit 220 or the cooling unit 230. To make the heated liquid L and cooling water flow more quickly and smoothly, the supply line 221 and the connection line 231 may be formed in more than one pair, that is, as a plurality of pairs each connected to a portion of the housing 210. The quick flow of the heated liquid L and cooling water can enable the housing 210 and the pattern frame P to be heated or cooled rapidly and uniformly. Description of the internal components of the cover 260 will now be given in detail with reference to Fig. 6 which is a cross-sectional view taken along line (VI-VI) in Fig. 5.

Referring to Fig. 6, a housing 210 is disposed inside the hollow cover 260. A vacuum portion 270 in a vacuum state is formed between the housing 210 and the cover 260. A heat conduction plate 250 is mounted on one surface of the housing 210 as a part of the housing 210. The heat conduction plate 250 serves to conduct heat finally to the pattern frame P.

The supply line 221-1 and the collection line 221-2 of the connection line 221 penetrate the cover 260 and extend to be communicated with the internal space 210a in the housing 210.

The heated liquid L stored in the liquid tank 223a may be introduced into the internal space 210a in the housing 210 via the connection line 221 , or be collected from the internal space 210a into the liquid tank 223a. Even if the housing 210 becomes larger, the liquid L and the cooling water need only to be supplied according to its size, thereby reducing the limitation in manufacturing the housing 210 and the apparatus for heating the pattern frame 200 in a larger size. In order to increase the heated temperature of the liquid L, materials 280 with good heat conductivity are distributed in the liquid L in a powdered form (Raoult's law). The conductive materials 280 may be formed of the same kinds of materials as the heat transfer unit 130 in the first embodiment. In order to prevent the powdered materials 280 from being precipitated, a mixer for mixing the liquid L may be installed in the storage space of the liquid L, such as the housing 210, the liquid tank 223a, and the like.

For additional heating of the liquid L, a heat emitting lamp 241 may be additionally disposed in the internal space 210a in the housing 210. The power supply unit 243 and the power controller 245 (hereinafter, referring to Fig. 7) should also be provided to drive the heat emitting lamp 241. Such components are the same as those corresponding to the heat generating unit 120 in the first embodiment, and detailed explanations therefor are omitted.

Description of the operational method of the apparatus for heating the pattern frame 200 will be given in detail with reference to Fig. 7 which is a schematic view illustrating the operational method thereof.

Referring to Fig. 7 (and Figs. 5 and 6), the liquid controller 225 issues an operational command to the liquid supply/collection portion 223 to heat the pattern frame P. According to the operational command, the supply pump 223b-1 pumps the liquid L stored in the liquid tank 223a into the housing 210 through the supply line 221-1. The liquid L being pumped is supplied, heated by the heater 223c. Once a certain amount of the liquid L is supplied to the housing 210, the liquid controller 225 closes the valves 223d-1 and 223d-2 such that the liquid L can remain in the internal space 110a. The powdered materials 280 having conductivity in the liquid L serve to increase the heating temperature of the mixed liquid L, compared to a pure liquid L.

When the heated liquid L is supplied into the internal space 110a, the heat generating unit 240 makes the heat emitting lamp 241 radiate and therefore supplies additional heat to the liquid L₁ thereby heating the heated liquid L at a higher temperature.

The heat generated by the above process within a preset temperature range is conducted to the pattern frame P through the heat conduction plate 250. Here, the pattern frame P can be heated up to 500⁰C . Accordingly, the pattern frame P contacts a portion where the film was formed on the glass plate G, thereby forming a certain pattern on the portion where the film was formed.

As a finishing step of the patterning process, operation of the heat generating unit 240 is stopped to cool the pattern frame P. Further, collecting the liquid L in the housing 210 to the liquid tank 223a can help the cooling of the pattern frame P. Here, in a state that the collection valve 223d-2 is opened, as the collection pump 223b-2 is operated, the liquid L inside the housing 210 is returned to the liquid tank 223a, thereby collecting the liquid L.

The cooling unit 230 may be operated for quicker cooling. The cooling unit 230 is operated as follows: the cooling water controller 235 issues a command to the cooling water supply/collection unit 233 to supply the cooling water in the cooling tank 233a to the inside the housing 210. The cooling water is supplied by operating the supply pump 233b-1 connected to the supply line 233c-1. The cooling water supplied to the housing 210 may be circulated in the cooling tank 233a and the housing 210, or may be received in the housing as the valves 233c- 1 and 233c-2 are closed.

As the cooling water is supplied, the housing 210 is cooled more rapidly than when the heated liquid L is simply discharged. The cooling of the housing 210 causes the heat conduction plate 250 and the pattern frame P to be cooled. Accordingly, the pattern frame P is separated from the glass plate G, thus to complete the patterning process for the glass plate G.

For the patterning process for the glass plate G, the collection pump 233b- 2 is operated in a state that the collection valve 233c-2 is opened, thereby collecting the cooling water in the housing 210 into the cooling tank 233a. The collected cooling water is maintained below a certain temperature by the cooling system of the cooling tank 233a. As so far described, description of the apparatus for heating the pattern frame according to the present invention is given, examples of which are illustrated in the accompanying drawings. This description is intended to be illustrative, and not to limit the scope of the claims. Many alternatives, modifications, and variations will be apparent to those skilled in the art. For instance, the connection lines 221 , 231 are divided into the supply line and the collection line. However, there may be only one line for supplying and collecting the liquid, and the like.

The heat emitting lamp 121 , e.g., the halogen lamp, is used as the heating element; however, a thermoelement (thermoelectric element) can also be adopted.

INDUSTRIAL APPLICABILITY

The present invention is an apparatus for heating a pattern when a patterning process is to be performed on a glass plate in a manufacturing process of an LCD module, etc. and can be used in the industry.

Claims

What is claimed is:

1. An apparatus for heating a pattern frame, comprising: a housing having an internal space and to which a pattern frame is mounted; a heat generating unit for supplying heat to the internal space; and a heat transfer unit filled in the internal space in a powdered form so as to transfer heat supplied by the heat generating unit to the pattern frame.

2. The apparatus of claim 1 , wherein the heat generating unit comprises: a heat emitting lamp disposed inside the heat transfer unit; a power supply unit electrically connected to the heat emitting lamp, for supplying power for an operation of the heat emitting lamp; and a power controller electrically connected to the power supply unit for controlling an operation of the power supply unit.

3. The apparatus of claim 2, wherein the heat emitting lamp is a halogen lamp.

4. The apparatus of claim 1 , wherein the heat transfer unit is formed in a powdered form from at least one of Au₁ Ag, SiC and CNT.

5. The apparatus of claim 2, further comprising: a cooling unit disposed in the internal space of the housing for cooling the heat transfer unit.

6. The apparatus of claim 5, wherein the cooling unit comprises: a cooling pipe disposed inside the heat transfer unit and through which a refrigerant flows; a refrigerant supply unit communicated with the cooling pipe for supplying the refrigerant; and a refrigerant controller electrically connected to the refrigerant supply unit for controlling an operation of the refrigerant supply unit.

7. The apparatus of claim 6, wherein the cooling pipe is arranged to surround the heat emitting lamp.

8. An apparatus for heating a pattern frame, comprising: a housing having an intemal(interior) space and at which a pattern frame is mounted; and a liquid control unit communicated with the inner space, for injecting or collecting a heated liquid into or from the internal space so as to perform heat exchange with the pattern frame.

9. The apparatus of claim 8, wherein the liquid control unit comprises: a connection line communicated with the housing and through which the liquid flows; a liquid supply/collection portion communicated with the connection line for supplying or collecting the liquid; and a liquid controller for controlling an operation of the liquid supply/collection portion.

10. The apparatus of claim 9, wherein the liquid supply/collection portion comprises: a liquid tank communicated with the connection line for storing the liquid; a pump communicated with the liquid tank for pumping the liquid to the liquid tank or the housing; and a heater connected to the liquid tank for heating the liquid in the liquid tank.

11. The apparatus of claim 8, further comprising: a heat conductive powder mixed in the liquid.

12. The apparatus of claim 11 , wherein the heat conductive powder is at least one of Au, Ag, SiC and CNT powder.

13. The apparatus of claim 8, further comprising: a cooling unit communicated with the housing for supplying cooling water to the housing or for collecting cooling water from the housing.

14. The apparatus of claim 13, wherein the cooling unit comprises: a hollow connection line communicated with the housing and through which the cooling water flows; a cooling water supply/collection portion communicated with the connection line, for supplying or collecting the cooling water; and a cooling water controller electrically connected to the cooling water supply collection portion for controlling an operation of the cooling water supply/collection portion.

15. The apparatus of claim 14, wherein the cooling water supply/collection portion comprises: a cooling tank communicated with the connection line for storing the cooling water and maintained at a low temperature; and a pump communicated with the cooling tank for pumping the cooling water to the cooling tank or the housing.

16. The apparatus of claim 8, further comprising: a heat generating unit disposed in the internal space of the housing for generating heat for heating the liquid.

17. The apparatus of claim 16, wherein the heat generating unit comprises: a heat emitting lamp disposed in the internal space; a power supply unit for supplying power to the heat emitting lamp; and a power controller electrically connected to the power supply unit for controlling an operation of the power supply unit.

18. The apparatus of claim 17, wherein the heat emitting lamp is a halogen lamp.