WO2009066918A3 - Laser processing equipment - Google Patents

Laser processing equipment Download PDF

Info

Publication number
WO2009066918A3
WO2009066918A3 PCT/KR2008/006783 KR2008006783W WO2009066918A3 WO 2009066918 A3 WO2009066918 A3 WO 2009066918A3 KR 2008006783 W KR2008006783 W KR 2008006783W WO 2009066918 A3 WO2009066918 A3 WO 2009066918A3
Authority
WO
WIPO (PCT)
Prior art keywords
laser beam
laser
reflector
chamber
resonator
Prior art date
Application number
PCT/KR2008/006783
Other languages
French (fr)
Other versions
WO2009066918A2 (en
Inventor
Hyun-Jung Kim
Dae-Jin Kim
Seung-Hwan Eom
Kwang-Jae Lee
Original Assignee
Kornic Systems Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kornic Systems Co., Ltd. filed Critical Kornic Systems Co., Ltd.
Priority to CN2008801167230A priority Critical patent/CN101868887B/en
Priority to JP2010533971A priority patent/JP5220121B2/en
Publication of WO2009066918A2 publication Critical patent/WO2009066918A2/en
Publication of WO2009066918A3 publication Critical patent/WO2009066918A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/042—Automatically aligning the laser beam

Abstract

Laser processing equipment is provided. The laser beam processing equipment includes a laser resonator, an optical system, a chamber, a reflector, and a laser beam aligning unit. The laser resonator resonates a laser beam. The optical system converts the laser beam resonated by the laser resonator to have an energy density of a beam profile with a predetermined beam width. The laser beam converted by the optical system is radiated onto a processing object disposed in the chamber. The reflector is disposed between the laser resonator and the chamber to reflect the laser beam. The laser beam aligning unit aligns the laser beam radiated into the chamber. The laser beam aligning unit includes an aligning member installed between the reflector and the processing object and disposed in a travel path of the laser beam. The aligning member defines a through-hole that is greater in area than a cross-section of the laser beam to enable the laser beam to pass therethrough. The driver drives the reflector to control the travel path of the laser beam reflected by the reflector. The controller controls the driver to control a distance between a center of the laser beam and a center of the through-hole, based on the laser beam detected as passing through the through-hole of the aligning member.
PCT/KR2008/006783 2007-11-19 2008-11-18 Laser processing equipment WO2009066918A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2008801167230A CN101868887B (en) 2007-11-19 2008-11-18 Laser processing equipment
JP2010533971A JP5220121B2 (en) 2007-11-19 2008-11-18 Laser processing equipment

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020070117781A KR100939043B1 (en) 2007-11-19 2007-11-19 Laser process equipment
KR10-2007-0117781 2007-11-19

Publications (2)

Publication Number Publication Date
WO2009066918A2 WO2009066918A2 (en) 2009-05-28
WO2009066918A3 true WO2009066918A3 (en) 2009-09-03

Family

ID=40667978

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2008/006783 WO2009066918A2 (en) 2007-11-19 2008-11-18 Laser processing equipment

Country Status (5)

Country Link
JP (1) JP5220121B2 (en)
KR (1) KR100939043B1 (en)
CN (1) CN101868887B (en)
TW (1) TWI352002B (en)
WO (1) WO2009066918A2 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2403172B1 (en) 2011-09-22 2014-12-12 Jeanología, S.L. METHOD AND SYSTEM OF ADJUSTMENT OF THE ALIGNMENT OF A PHOTONIC BEAM
JP6261844B2 (en) * 2012-02-20 2018-01-17 株式会社ディスコ Laser processing method and laser processing apparatus
CN104563976B (en) * 2013-10-11 2018-04-27 中国石油化工股份有限公司 Laser perforation system and laser perforating methods
WO2018233997A1 (en) * 2017-06-23 2018-12-27 Jenoptik Optical Systems Gmbh Method for supporting an adjustment of a beam expander, adjustment support device and beam expander
EP4056948A1 (en) * 2018-10-26 2022-09-14 Concept Laser GmbH Determination device for determining at least one parameter of an energy beam
KR20210014835A (en) 2019-07-30 2021-02-10 삼성디스플레이 주식회사 Laser annealing apparatus and method of manufacturing substrate having poly-Si layer using the same
WO2021145357A1 (en) * 2020-01-15 2021-07-22 パナソニックＩｐマネジメント株式会社 Laser apparatus and laser machining apparatus using same
CN114505578A (en) * 2020-11-17 2022-05-17 大族激光科技产业集团股份有限公司 Method and device for debugging flight light path

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4879448A (en) * 1988-10-24 1989-11-07 Storage Technology Corporation Apparatus for laser welding and annealing
US5103082A (en) * 1990-07-12 1992-04-07 Grumman Aerospace Corporation Automatic laser beam expander-pinhole alignment system
US6239406B1 (en) * 1998-04-01 2001-05-29 Nec Corporation Laser beam machining apparatus
US6943086B2 (en) * 2001-10-10 2005-09-13 Hitachi, Ltd. Laser annealing apparatus, TFT device and annealing method of the same
US7115503B2 (en) * 2000-10-10 2006-10-03 The Trustees Of Columbia University In The City Of New York Method and apparatus for processing thin metal layers

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5215107Y2 (en) * 1973-09-26 1977-04-05
JPS60130935A (en) * 1983-12-19 1985-07-12 Mitsubishi Electric Corp Laser beam transmitter
JPH0780671A (en) * 1993-09-16 1995-03-28 Sanyo Mach Works Ltd Method and device for detecting beam abnormality of laser beam machine
JPH09271971A (en) * 1996-04-02 1997-10-21 Shinozaki Seisakusho:Kk Laser beam machine
JP2001284281A (en) * 2000-03-30 2001-10-12 Sumitomo Heavy Ind Ltd Laser machining device and method
US7321114B2 (en) * 2005-03-10 2008-01-22 Hitachi Via Mechanics, Ltd. Apparatus and method for beam drift compensation

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4879448A (en) * 1988-10-24 1989-11-07 Storage Technology Corporation Apparatus for laser welding and annealing
US5103082A (en) * 1990-07-12 1992-04-07 Grumman Aerospace Corporation Automatic laser beam expander-pinhole alignment system
US6239406B1 (en) * 1998-04-01 2001-05-29 Nec Corporation Laser beam machining apparatus
US7115503B2 (en) * 2000-10-10 2006-10-03 The Trustees Of Columbia University In The City Of New York Method and apparatus for processing thin metal layers
US6943086B2 (en) * 2001-10-10 2005-09-13 Hitachi, Ltd. Laser annealing apparatus, TFT device and annealing method of the same

Also Published As

Publication number Publication date
WO2009066918A2 (en) 2009-05-28
KR100939043B1 (en) 2010-01-27
JP5220121B2 (en) 2013-06-26
JP2011505252A (en) 2011-02-24
TWI352002B (en) 2011-11-11
KR20090051405A (en) 2009-05-22
CN101868887B (en) 2012-10-10
CN101868887A (en) 2010-10-20
TW200930489A (en) 2009-07-16

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