WO2009056127A3 - Inspection device - Google Patents

Inspection device Download PDF

Info

Publication number
WO2009056127A3
WO2009056127A3 PCT/DE2008/001790 DE2008001790W WO2009056127A3 WO 2009056127 A3 WO2009056127 A3 WO 2009056127A3 DE 2008001790 W DE2008001790 W DE 2008001790W WO 2009056127 A3 WO2009056127 A3 WO 2009056127A3
Authority
WO
WIPO (PCT)
Prior art keywords
support element
optical sensor
inspection device
contact
sensitive
Prior art date
Application number
PCT/DE2008/001790
Other languages
German (de)
French (fr)
Other versions
WO2009056127A2 (en
Inventor
Michael Schilp
Josef Zimmermann
Adolf Zitzmann
Original Assignee
Zimmermann & Schilp Handhabungtechnik Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zimmermann & Schilp Handhabungtechnik Gmbh filed Critical Zimmermann & Schilp Handhabungtechnik Gmbh
Priority to CN2008801143147A priority Critical patent/CN102239403A/en
Priority to JP2010531413A priority patent/JP5502740B2/en
Priority to US12/741,110 priority patent/US20120327402A1/en
Priority to EP08846098.5A priority patent/EP2269041B1/en
Publication of WO2009056127A2 publication Critical patent/WO2009056127A2/en
Publication of WO2009056127A3 publication Critical patent/WO2009056127A3/en
Priority to US13/898,122 priority patent/US8836933B2/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/01—Arrangements or apparatus for facilitating the optical investigation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/94—Investigating contamination, e.g. dust
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/01—Arrangements or apparatus for facilitating the optical investigation
    • G01N21/03—Cuvette constructions
    • G01N2021/0339—Holders for solids, powders

Abstract

The invention relates to a device for inspecting contact-sensitive planar materials or workpieces, e.g. wafers for the semiconductor industry, solar cells, glasses, FPD substrates, or biologically active substrates for biosensors, as well as materials having contact-sensitive curved surfaces. Said inspection device comprises a support element (1) for supporting a material (3) on the top face of the support element (1), at least one oscillator which is connected to the support element (1) and the oscillation frequency and amplitude of which are selected in such a way as to keep the material (3) hovering on the support element (1), and at least one optical sensor (4). The support element is made of a light-permeable material, and the optical sensor (4) is arranged below the support element (1).
PCT/DE2008/001790 2007-11-01 2008-10-31 Inspection device WO2009056127A2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CN2008801143147A CN102239403A (en) 2007-11-01 2008-10-31 Inspection device
JP2010531413A JP5502740B2 (en) 2007-11-01 2008-10-31 Inspection device
US12/741,110 US20120327402A1 (en) 2007-11-01 2008-10-31 Inspection device
EP08846098.5A EP2269041B1 (en) 2007-11-01 2008-10-31 Inspection device
US13/898,122 US8836933B2 (en) 2007-11-01 2013-05-20 Inspection device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007052530A DE102007052530A1 (en) 2007-11-01 2007-11-01 Devices for inspection and irradiation of sheet materials
DE102007052530.5 2007-11-01

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US12/741,110 A-371-Of-International US20120327402A1 (en) 2007-11-01 2008-10-31 Inspection device
US13/898,122 Continuation US8836933B2 (en) 2007-11-01 2013-05-20 Inspection device

Publications (2)

Publication Number Publication Date
WO2009056127A2 WO2009056127A2 (en) 2009-05-07
WO2009056127A3 true WO2009056127A3 (en) 2010-07-29

Family

ID=40530440

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2008/001790 WO2009056127A2 (en) 2007-11-01 2008-10-31 Inspection device

Country Status (7)

Country Link
US (2) US20120327402A1 (en)
EP (1) EP2269041B1 (en)
JP (1) JP5502740B2 (en)
KR (1) KR101545761B1 (en)
CN (1) CN102239403A (en)
DE (2) DE202007019013U1 (en)
WO (1) WO2009056127A2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008053684B4 (en) * 2008-10-29 2010-10-14 Graphikon Gesellschaft für Bildverarbeitung und Computergraphik mbH Backlight device for semiconductor products
KR101888280B1 (en) * 2013-07-22 2018-08-13 제트에스-핸들링 게엠베하 Device for treating or machining a surface
EP3025145B1 (en) 2013-07-22 2017-06-28 ZS-Handling GmbH Device for inspecting workpiece surfaces and strip materials
DE102023103520B3 (en) 2023-02-14 2024-03-21 Isra Vision Gmbh Device and method for inspecting a plate-shaped or web-shaped object

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004059695A2 (en) * 2002-12-23 2004-07-15 Mattson Thermal Products Gmbh Ultrasonic levitation in a rapid thermal processing plant for wafers
US20040174518A1 (en) * 2001-09-21 2004-09-09 Olympus Corporation Defect inspection apparatus
WO2004076320A1 (en) * 2003-02-25 2004-09-10 Technische Universität München Device for contactlessly conveying and positioning components
US6810297B2 (en) * 2001-12-27 2004-10-26 Orbotech Ltd. System and methods for imaging employing a levitating conveyor

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0634679Y2 (en) * 1989-02-14 1994-09-07 日本アルミニウム工業株式会社 Powder sample inspection device
US5061679A (en) * 1989-03-17 1991-10-29 The University Of Arkansas Drive system employing frictionless bearings including superconducting matter
US5890580A (en) * 1993-07-12 1999-04-06 Kaijo Corporation Object levitating apparatus, object transporting apparatus, and object levitating bearing along with an object levitating process and object transporting process
JP2001027610A (en) * 1999-07-13 2001-01-30 Mitsui Chemicals Inc Method and apparatus for inspecting resin pellets
DE10039482B4 (en) * 2000-08-08 2016-03-24 Zs-Handling Gmbh Handler for transporting flat substrates used in the semiconductor industry
US6802220B2 (en) * 2000-10-26 2004-10-12 Kabushiki Kaisha Toyota Jidoshokki Apparatus for transporting levitated objects
US6781684B1 (en) * 2000-11-07 2004-08-24 Donald L. Ekhoff Workpiece levitation using alternating positive and negative pressure flows
WO2002040970A1 (en) * 2000-11-15 2002-05-23 Real Time Metrology, Inc. Optical method and apparatus for inspecting large area planar objects
JP2005239392A (en) * 2004-02-27 2005-09-08 Toyota Industries Corp Object levitation carrying device
JP4554397B2 (en) * 2005-02-23 2010-09-29 東京エレクトロン株式会社 Stage device and coating treatment device
US7391510B2 (en) * 2006-01-26 2008-06-24 Orbotech Ltd System and method for inspecting patterned devices having microscopic conductors
US7529338B2 (en) * 2006-02-22 2009-05-05 Focalspot, Inc. Method and apparatus for inspecting circuit boards
US8461022B2 (en) * 2009-04-20 2013-06-11 Applied Materials, Inc. Methods and apparatus for aligning a substrate in a process chamber

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040174518A1 (en) * 2001-09-21 2004-09-09 Olympus Corporation Defect inspection apparatus
US6810297B2 (en) * 2001-12-27 2004-10-26 Orbotech Ltd. System and methods for imaging employing a levitating conveyor
WO2004059695A2 (en) * 2002-12-23 2004-07-15 Mattson Thermal Products Gmbh Ultrasonic levitation in a rapid thermal processing plant for wafers
WO2004076320A1 (en) * 2003-02-25 2004-09-10 Technische Universität München Device for contactlessly conveying and positioning components

Also Published As

Publication number Publication date
JP5502740B2 (en) 2014-05-28
DE202007019013U1 (en) 2010-04-29
JP2011502257A (en) 2011-01-20
US20120327402A1 (en) 2012-12-27
KR101545761B1 (en) 2015-08-19
EP2269041A2 (en) 2011-01-05
EP2269041B1 (en) 2017-08-23
WO2009056127A2 (en) 2009-05-07
US20130321796A1 (en) 2013-12-05
US8836933B2 (en) 2014-09-16
CN102239403A (en) 2011-11-09
KR20100105566A (en) 2010-09-29
DE102007052530A1 (en) 2009-05-14

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