WO2009055116A3 - Electroplating cell with hydrodynamics facilitating more uniform deposition on a workpiece with through holes during plating - Google Patents

Electroplating cell with hydrodynamics facilitating more uniform deposition on a workpiece with through holes during plating Download PDF

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Publication number
WO2009055116A3
WO2009055116A3 PCT/US2008/072287 US2008072287W WO2009055116A3 WO 2009055116 A3 WO2009055116 A3 WO 2009055116A3 US 2008072287 W US2008072287 W US 2008072287W WO 2009055116 A3 WO2009055116 A3 WO 2009055116A3
Authority
WO
WIPO (PCT)
Prior art keywords
workpiece
hydrodynamics
facilitating
uniform deposition
during plating
Prior art date
Application number
PCT/US2008/072287
Other languages
French (fr)
Other versions
WO2009055116A2 (en
Inventor
Lawrence E. Gebhart
E. Jennings Taylor
Original Assignee
Faraday Technology, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Faraday Technology, Inc. filed Critical Faraday Technology, Inc.
Publication of WO2009055116A2 publication Critical patent/WO2009055116A2/en
Publication of WO2009055116A3 publication Critical patent/WO2009055116A3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008—Current shielding devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S205/00—Electrolysis: processes, compositions used therein, and methods of preparing the compositions
    • Y10S205/92—Electrolytic coating of circuit board or printed circuit, other than selected area coating

Abstract

A method and apparatus for establishing more uniform deposition across one or more faces of a workpiece in an electroplating process. The apparatus employs eductors in conjunction with a flow dampener member and other measures to provide a more uniform current distribution and a more uniform metal deposit distribution as reflected in a coefficient of variability that is lower than conventional processes.
PCT/US2008/072287 2007-08-10 2008-08-06 Electroplating cell with hydrodynamics facilitating more uniform deposition on a workpiece with through holes during plating WO2009055116A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/836,903 US7947161B2 (en) 2004-03-19 2007-08-10 Method of operating an electroplating cell with hydrodynamics facilitating more uniform deposition on a workpiece with through holes
US11/836,903 2007-08-10

Publications (2)

Publication Number Publication Date
WO2009055116A2 WO2009055116A2 (en) 2009-04-30
WO2009055116A3 true WO2009055116A3 (en) 2010-01-07

Family

ID=40580976

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2008/072287 WO2009055116A2 (en) 2007-08-10 2008-08-06 Electroplating cell with hydrodynamics facilitating more uniform deposition on a workpiece with through holes during plating

Country Status (2)

Country Link
US (2) US7947161B2 (en)
WO (1) WO2009055116A2 (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7494925B2 (en) * 2004-02-23 2009-02-24 Micron Technology, Inc. Method for making through-hole conductors for semiconductor substrates
JP4992428B2 (en) * 2004-09-24 2012-08-08 イビデン株式会社 Plating method and plating apparatus
US8076244B2 (en) 2006-02-10 2011-12-13 Micron Technology, Inc. Methods for causing fluid to flow through or into via holes, vents and other openings or recesses that communicate with surfaces of substrates of semiconductor device components
US9822461B2 (en) * 2006-08-16 2017-11-21 Novellus Systems, Inc. Dynamic current distribution control apparatus and method for wafer electroplating
US8858774B2 (en) 2008-11-07 2014-10-14 Novellus Systems, Inc. Electroplating apparatus for tailored uniformity profile
US8985049B2 (en) 2011-12-29 2015-03-24 General Electric Company Pressure maskers and pressure masking systems
US20130220819A1 (en) 2012-02-27 2013-08-29 Faraday Technology, Inc. Electrodeposition of chromium from trivalent chromium using modulated electric fields
MY172195A (en) 2012-08-31 2019-11-15 Shinetsu Chemical Co Production method for rare earth permanent magnet
EP2892064B1 (en) 2012-08-31 2017-09-27 Shin-Etsu Chemical Co., Ltd. Production method for rare earth permanent magnet
US10179955B2 (en) 2012-08-31 2019-01-15 Shin-Etsu Chemical Co., Ltd. Production method for rare earth permanent magnet
JP6090589B2 (en) 2014-02-19 2017-03-08 信越化学工業株式会社 Rare earth permanent magnet manufacturing method
JP6191497B2 (en) * 2014-02-19 2017-09-06 信越化学工業株式会社 Electrodeposition apparatus and method for producing rare earth permanent magnet
CN105040035B (en) * 2015-09-17 2017-05-31 阳谷祥光铜业有限公司 A kind of parallel jet electrolysis process and device
CN112941582B (en) * 2021-02-09 2023-08-29 苏州晶洲装备科技有限公司 Electrochemical deposition device
JP7098220B1 (en) 2022-04-14 2022-07-11 株式会社日立パワーソリューションズ Plating equipment and plating method

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060151328A1 (en) * 2003-03-10 2006-07-13 Bert Reents Method of electroplating a workpiece having high-aspect ratio holes
US7223690B2 (en) * 2000-12-04 2007-05-29 Ebara Corporation Substrate processing method

Family Cites Families (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4696729A (en) * 1986-02-28 1987-09-29 International Business Machines Electroplating cell
US5443727A (en) * 1990-10-30 1995-08-22 Minnesota Mining And Manufacturing Company Articles having a polymeric shell and method for preparing same
US5599437A (en) * 1995-06-20 1997-02-04 Faraday Technology, Inc. Electrolysis of electroactive species using pulsed current
US5865971A (en) * 1996-03-22 1999-02-02 Faraday Technology, Inc. Sealing ring with electrochemical sensing electrode
US5804057A (en) * 1996-06-07 1998-09-08 Faraday Technology, Inc. Method of removing metal salts from solution by electrolysis an electrode closely associated with an ion exchange resin
US5776327A (en) * 1996-10-16 1998-07-07 Mitsubishi Semiconuctor Americe, Inc. Method and apparatus using an anode basket for electroplating a workpiece
US6113769A (en) * 1997-11-21 2000-09-05 International Business Machines Corporation Apparatus to monitor and add plating solution of plating baths and controlling quality of deposited metal
US6048584A (en) * 1998-05-13 2000-04-11 Tyco Printed Circuit Group, Inc. Apparatus and method for coating multilayer article
US6402931B1 (en) * 1998-05-18 2002-06-11 Faraday Technology Marketing Group, Llc Electrochemical machining using modulated reverse electric fields
US6319384B1 (en) * 1998-10-14 2001-11-20 Faraday Technology Marketing Group, Llc Pulse reverse electrodeposition for metallization and planarization of semiconductor substrates
EP1070159A4 (en) * 1998-10-14 2004-06-09 Faraday Technology Inc Electrodeposition of metals in small recesses using modulated electric fields
US6210555B1 (en) * 1999-01-29 2001-04-03 Faraday Technology Marketing Group, Llc Electrodeposition of metals in small recesses for manufacture of high density interconnects using reverse pulse plating
US6203684B1 (en) * 1998-10-14 2001-03-20 Faraday Technology Marketing Group, Llc Pulse reverse electrodeposition for metallization and planarization of a semiconductor substrates
US6524461B2 (en) * 1998-10-14 2003-02-25 Faraday Technology Marketing Group, Llc Electrodeposition of metals in small recesses using modulated electric fields
US6878259B2 (en) * 1998-10-14 2005-04-12 Faraday Technology Marketing Group, Llc Pulse reverse electrodeposition for metallization and planarization of semiconductor substrates
US6080504A (en) * 1998-11-02 2000-06-27 Faraday Technology, Inc. Electrodeposition of catalytic metals using pulsed electric fields
US6221235B1 (en) * 1998-11-30 2001-04-24 Faraday Technology Marketing Group Llc Removal of sacrificial cores by electrochemical machining
US6258220B1 (en) * 1998-11-30 2001-07-10 Applied Materials, Inc. Electro-chemical deposition system
US20030038035A1 (en) * 2001-05-30 2003-02-27 Wilson Gregory J. Methods and systems for controlling current in electrochemical processing of microelectronic workpieces
US6120658A (en) * 1999-04-23 2000-09-19 Hatch Africa (Pty) Limited Electrode cover for preventing the generation of electrolyte mist
US6309528B1 (en) * 1999-10-15 2001-10-30 Faraday Technology Marketing Group, Llc Sequential electrodeposition of metals using modulated electric fields for manufacture of circuit boards having features of different sizes
US6652727B2 (en) * 1999-10-15 2003-11-25 Faraday Technology Marketing Group, Llc Sequential electrodeposition of metals using modulated electric fields for manufacture of circuit boards having features of different sizes
US6527920B1 (en) * 2000-05-10 2003-03-04 Novellus Systems, Inc. Copper electroplating apparatus
US6558231B1 (en) * 2000-10-17 2003-05-06 Faraday Technology Marketing Goup, Llc Sequential electromachining and electropolishing of metals and the like using modulated electric fields
US6551485B1 (en) * 2000-10-17 2003-04-22 Faraday Technology Marketing Group, Llc Electrodeposition of metals for forming three-dimensional microstructures
US6610189B2 (en) * 2001-01-03 2003-08-26 Applied Materials, Inc. Method and associated apparatus to mechanically enhance the deposition of a metal film within a feature
US6827833B2 (en) * 2001-10-15 2004-12-07 Faraday Technology Marketing Group, Llc Electrodeposition of metals in high-aspect ratio cavities using modulated reverse electric fields
US6818115B2 (en) * 2001-10-19 2004-11-16 Viasystems Group, Inc. System and method for electrolytic plating
US6750144B2 (en) * 2002-02-15 2004-06-15 Faraday Technology Marketing Group, Llc Method for electrochemical metallization and planarization of semiconductor substrates having features of different sizes
WO2003106090A1 (en) * 2002-06-12 2003-12-24 Faraday Technology, Inc. Electrolytic etching of metal layers
DE10229001B4 (en) * 2002-06-28 2007-02-15 Advanced Micro Devices, Inc., Sunnyvale Method and system for controlling ion distribution during electrodeposition of a metal onto a workpiece surface
US6863796B2 (en) * 2002-07-02 2005-03-08 Taiwan Semiconductor Manufacturing Co., Ltd Method for reducing cu surface defects following cu ECP
JP4330380B2 (en) * 2003-05-29 2009-09-16 株式会社荏原製作所 Plating apparatus and plating method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7223690B2 (en) * 2000-12-04 2007-05-29 Ebara Corporation Substrate processing method
US20060151328A1 (en) * 2003-03-10 2006-07-13 Bert Reents Method of electroplating a workpiece having high-aspect ratio holes

Also Published As

Publication number Publication date
US20080035475A1 (en) 2008-02-14
US7947161B2 (en) 2011-05-24
US8226804B2 (en) 2012-07-24
WO2009055116A2 (en) 2009-04-30
US20110209991A1 (en) 2011-09-01

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