WO2009024761A3 - Stack of integrated circuits - Google Patents

Stack of integrated circuits Download PDF

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Publication number
WO2009024761A3
WO2009024761A3 PCT/GB2008/002770 GB2008002770W WO2009024761A3 WO 2009024761 A3 WO2009024761 A3 WO 2009024761A3 GB 2008002770 W GB2008002770 W GB 2008002770W WO 2009024761 A3 WO2009024761 A3 WO 2009024761A3
Authority
WO
WIPO (PCT)
Prior art keywords
circuit
stack
master clock
integrated circuits
circuits
Prior art date
Application number
PCT/GB2008/002770
Other languages
French (fr)
Other versions
WO2009024761A2 (en
Inventor
Timothy James Regan
Original Assignee
Timothy James Regan
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Timothy James Regan filed Critical Timothy James Regan
Publication of WO2009024761A2 publication Critical patent/WO2009024761A2/en
Publication of WO2009024761A3 publication Critical patent/WO2009024761A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0657—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06513—Bump or bump-like direct electrical connections between devices, e.g. flip-chip connection, solder bumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06541—Conductive via connections through the device, e.g. vertical interconnects, through silicon via [TSV]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A three-dimensional structure including a plurality of integrated circuits (101a-d) stacked substantially vertically one on top of another, said stack of circuits (101a-d) including first and second circuits (101a;113) located at different vertical levels in the stack, wherein the first circuit comprises a master clock circuit (113) that includes clock circuitry arranged to provide clock signals to a plurality of nodes (107) within the master clock circuit, and the structure includes at least one interconnect (115) that is arranged to connect one of the nodes (107) in the master clock circuit to a node (117) in the second circuit (101a), and the master clock circuit (113) is arranged to supply clock signals to the second circuit (101a) via the interconnect (115).
PCT/GB2008/002770 2007-08-17 2008-08-15 Stack of integrated circuits WO2009024761A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB0716055A GB0716055D0 (en) 2007-08-17 2007-08-17 Vertical distribution of planar signals in stacked integrated circuits
GB0716055.9 2007-08-17

Publications (2)

Publication Number Publication Date
WO2009024761A2 WO2009024761A2 (en) 2009-02-26
WO2009024761A3 true WO2009024761A3 (en) 2009-04-30

Family

ID=38566544

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/GB2008/002770 WO2009024761A2 (en) 2007-08-17 2008-08-15 Stack of integrated circuits

Country Status (2)

Country Link
GB (1) GB0716055D0 (en)
WO (1) WO2009024761A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9490787B1 (en) 2015-06-11 2016-11-08 Infineon Technologies Ag System and method for integrated circuit clock distribution

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5376825A (en) * 1990-10-22 1994-12-27 Seiko Epson Corporation Integrated circuit package for flexible computer system alternative architectures
EP0827203A2 (en) * 1996-08-20 1998-03-04 International Business Machines Corporation Clock skew minimisation system and method for integrated circuits
US5818107A (en) * 1997-01-17 1998-10-06 International Business Machines Corporation Chip stacking by edge metallization
EP1762943A1 (en) * 2005-09-09 2007-03-14 STMicroelectronics S.r.l. Chip-to-chip communication system

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5376825A (en) * 1990-10-22 1994-12-27 Seiko Epson Corporation Integrated circuit package for flexible computer system alternative architectures
EP0827203A2 (en) * 1996-08-20 1998-03-04 International Business Machines Corporation Clock skew minimisation system and method for integrated circuits
US5818107A (en) * 1997-01-17 1998-10-06 International Business Machines Corporation Chip stacking by edge metallization
EP1762943A1 (en) * 2005-09-09 2007-03-14 STMicroelectronics S.r.l. Chip-to-chip communication system

Also Published As

Publication number Publication date
GB0716055D0 (en) 2007-09-26
WO2009024761A2 (en) 2009-02-26

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