WO2009017111A1 - 露光装置の調整方法、露光装置、及びデバイス製造方法 - Google Patents

露光装置の調整方法、露光装置、及びデバイス製造方法 Download PDF

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Publication number
WO2009017111A1
WO2009017111A1 PCT/JP2008/063569 JP2008063569W WO2009017111A1 WO 2009017111 A1 WO2009017111 A1 WO 2009017111A1 JP 2008063569 W JP2008063569 W JP 2008063569W WO 2009017111 A1 WO2009017111 A1 WO 2009017111A1
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WO
WIPO (PCT)
Prior art keywords
holder
exposure apparatus
adjusting
holding
device manufacturing
Prior art date
Application number
PCT/JP2008/063569
Other languages
English (en)
French (fr)
Inventor
Yosuke Shirata
Yoshiki Kida
Original Assignee
Nikon Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corporation filed Critical Nikon Corporation
Priority to JP2009525403A priority Critical patent/JP5633148B2/ja
Publication of WO2009017111A1 publication Critical patent/WO2009017111A1/ja

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring

Abstract

　調整方法は、基板（Ｐ）を保持するホルダ（２Ｈ）と、ホルダ（２Ｈ）で基板（Ｐ）を保持する前に基板（Ｐ）を保持するホルダ（８Ｈ）とを有し、ホルダ（２Ｈ）に保持された基板（Ｐ）を液体（ＬＱ）を介して露光する液浸露光装置（ＥＸ）を調整する。調整方法は、ホルダ（２Ｈ）で温度計（３０）を保持することと、ホルダ（８Ｈ）で温度計（３０）を保持することと、ホルダ（２Ｈ）に保持された温度計（３０）の検出結果と、ホルダ（８Ｈ）に保持された温度計（３０）の検出結果に基づいて、ホルダ（２Ｈ）及びホルダ（８Ｈ）の少なくとも一方の温度を調整することと、を含む。
PCT/JP2008/063569 2007-07-31 2008-07-29 露光装置の調整方法、露光装置、及びデバイス製造方法 WO2009017111A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009525403A JP5633148B2 (ja) 2007-07-31 2008-07-29 露光装置の調整方法、露光方法、露光装置、及びデバイス製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007198675 2007-07-31
JP2007-198675 2007-07-31

Publications (1)

Publication Number Publication Date
WO2009017111A1 true WO2009017111A1 (ja) 2009-02-05

Family

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PCT/JP2008/063569 WO2009017111A1 (ja) 2007-07-31 2008-07-29 露光装置の調整方法、露光装置、及びデバイス製造方法

Country Status (5)

Country Link
US (1) US9025126B2 (ja)
JP (2) JP5633148B2 (ja)
KR (1) KR101560007B1 (ja)
TW (1) TWI465855B (ja)
WO (1) WO2009017111A1 (ja)

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JP2013201463A (ja) * 2007-07-31 2013-10-03 Nikon Corp 露光装置の調整方法、露光装置、及びデバイス製造方法
JP2014056990A (ja) * 2012-09-13 2014-03-27 Nikon Corp 露光装置及び露光方法並びにデバイス製造方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013201463A (ja) * 2007-07-31 2013-10-03 Nikon Corp 露光装置の調整方法、露光装置、及びデバイス製造方法
JP2014056990A (ja) * 2012-09-13 2014-03-27 Nikon Corp 露光装置及び露光方法並びにデバイス製造方法

Also Published As

Publication number Publication date
JP2013201463A (ja) 2013-10-03
JP5655903B2 (ja) 2015-01-21
JPWO2009017111A1 (ja) 2010-10-21
KR20100047189A (ko) 2010-05-07
TWI465855B (zh) 2014-12-21
KR101560007B1 (ko) 2015-10-15
TW200919109A (en) 2009-05-01
JP5633148B2 (ja) 2014-12-03
US9025126B2 (en) 2015-05-05
US20090279059A1 (en) 2009-11-12

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