WO2009009380A3 - Normally-off integrated jfet power switches in wide bandgap semiconductors and methods of making - Google Patents
Normally-off integrated jfet power switches in wide bandgap semiconductors and methods of making Download PDFInfo
- Publication number
- WO2009009380A3 WO2009009380A3 PCT/US2008/069043 US2008069043W WO2009009380A3 WO 2009009380 A3 WO2009009380 A3 WO 2009009380A3 US 2008069043 W US2008069043 W US 2008069043W WO 2009009380 A3 WO2009009380 A3 WO 2009009380A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- wide bandgap
- power switches
- making
- methods
- normally
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 3
- 230000005855 radiation Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/80—Field effect transistors with field effect produced by a PN or other rectifying junction gate, i.e. potential-jump barrier
- H01L29/808—Field effect transistors with field effect produced by a PN or other rectifying junction gate, i.e. potential-jump barrier with a PN junction gate, e.g. PN homojunction gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
- H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind
- H01L27/085—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only
- H01L27/098—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being PN junction gate field-effect transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
- H01L29/0607—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration
- H01L29/0611—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices
- H01L29/0615—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE]
- H01L29/0619—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE] with a supplementary region doped oppositely to or in rectifying contact with the semiconductor containing or contacting region, e.g. guard rings with PN or Schottky junction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/80—Field effect transistors with field effect produced by a PN or other rectifying junction gate, i.e. potential-jump barrier
- H01L29/808—Field effect transistors with field effect produced by a PN or other rectifying junction gate, i.e. potential-jump barrier with a PN junction gate, e.g. PN homojunction gate
- H01L29/8083—Vertical transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/80—Field effect transistors with field effect produced by a PN or other rectifying junction gate, i.e. potential-jump barrier
- H01L29/812—Field effect transistors with field effect produced by a PN or other rectifying junction gate, i.e. potential-jump barrier with a Schottky gate
- H01L29/8122—Vertical transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/80—Field effect transistors with field effect produced by a PN or other rectifying junction gate, i.e. potential-jump barrier
- H01L29/812—Field effect transistors with field effect produced by a PN or other rectifying junction gate, i.e. potential-jump barrier with a Schottky gate
- H01L29/8124—Field effect transistors with field effect produced by a PN or other rectifying junction gate, i.e. potential-jump barrier with a Schottky gate with multiple gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/861—Diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/861—Diodes
- H01L29/868—PIN diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/861—Diodes
- H01L29/872—Schottky diodes
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/08—Modifications for protecting switching circuit against overcurrent or overvoltage
- H03K17/081—Modifications for protecting switching circuit against overcurrent or overvoltage without feedback from the output circuit to the control circuit
- H03K17/0814—Modifications for protecting switching circuit against overcurrent or overvoltage without feedback from the output circuit to the control circuit by measures taken in the output circuit
- H03K17/08142—Modifications for protecting switching circuit against overcurrent or overvoltage without feedback from the output circuit to the control circuit by measures taken in the output circuit in field-effect transistor switches
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/08—Modifications for protecting switching circuit against overcurrent or overvoltage
- H03K17/081—Modifications for protecting switching circuit against overcurrent or overvoltage without feedback from the output circuit to the control circuit
- H03K17/0814—Modifications for protecting switching circuit against overcurrent or overvoltage without feedback from the output circuit to the control circuit by measures taken in the output circuit
- H03K17/08148—Modifications for protecting switching circuit against overcurrent or overvoltage without feedback from the output circuit to the control circuit by measures taken in the output circuit in composite switches
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/51—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used
- H03K17/56—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices
- H03K17/567—Circuits characterised by the use of more than one type of semiconductor device, e.g. BIMOS, composite devices such as IGBT
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/51—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used
- H03K17/56—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices
- H03K17/687—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices the devices being field-effect transistors
- H03K17/6871—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices the devices being field-effect transistors the output circuit comprising more than one controlled field-effect transistor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic System
- H01L29/1608—Silicon carbide
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/20—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
- H01L29/2003—Nitride compounds
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/51—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used
- H03K17/56—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices
- H03K17/687—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices the devices being field-effect transistors
- H03K2017/6875—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices the devices being field-effect transistors using self-conductive, depletion FETs
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP08781291A EP2171757A2 (en) | 2007-07-06 | 2008-07-02 | Normally-off integrated jfet power switches in wide bandgap semiconductors and methods of making |
JP2010515256A JP2010532920A (en) | 2007-07-06 | 2008-07-02 | Always-off integrated JFET power switch in wide band gap semiconductor and fabrication method |
CA2729299A CA2729299A1 (en) | 2007-07-06 | 2008-07-02 | Normally-off integrated jfet power switches in wide bandgap semiconductors and methods of making |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/822,568 US7820511B2 (en) | 2004-07-08 | 2007-07-06 | Normally-off integrated JFET power switches in wide bandgap semiconductors and methods of making |
US11/822,568 | 2007-07-06 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2009009380A2 WO2009009380A2 (en) | 2009-01-15 |
WO2009009380A3 true WO2009009380A3 (en) | 2009-03-05 |
Family
ID=39816697
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2008/069043 WO2009009380A2 (en) | 2007-07-06 | 2008-07-02 | Normally-off integrated jfet power switches in wide bandgap semiconductors and methods of making |
Country Status (7)
Country | Link |
---|---|
US (3) | US7820511B2 (en) |
EP (1) | EP2171757A2 (en) |
JP (1) | JP2010532920A (en) |
KR (1) | KR20100054787A (en) |
CA (1) | CA2729299A1 (en) |
TW (1) | TWI371800B (en) |
WO (1) | WO2009009380A2 (en) |
Families Citing this family (58)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7820511B2 (en) | 2004-07-08 | 2010-10-26 | Semisouth Laboratories, Inc. | Normally-off integrated JFET power switches in wide bandgap semiconductors and methods of making |
US7863877B2 (en) * | 2006-12-11 | 2011-01-04 | International Rectifier Corporation | Monolithically integrated III-nitride power converter |
US7977713B2 (en) * | 2008-05-08 | 2011-07-12 | Semisouth Laboratories, Inc. | Semiconductor devices with non-punch-through semiconductor channels having enhanced conduction and methods of making |
US20130288489A1 (en) * | 2009-05-15 | 2013-10-31 | Translith Systems, Llc | Method and Apparatus to Fabricate Vias in Substrates for Gallium Nitride MMICs |
US8338255B2 (en) * | 2009-06-19 | 2012-12-25 | Ss Sc Ip, Llc | Methods of making vertical junction field effect transistors and bipolar junction transistors without ion implantation |
FR2949630B1 (en) * | 2009-08-31 | 2019-04-05 | Safran Electrical & Power | ELECTRONIC CONTROL MODULE FOR TRANSISTOR JFET |
WO2011100304A1 (en) | 2010-02-09 | 2011-08-18 | Massachusetts Institute Of Technology | Dual-gate normally-off nitride transistors |
JP5611684B2 (en) * | 2010-06-22 | 2014-10-22 | 株式会社東芝 | Power converter |
US8492247B2 (en) | 2010-08-17 | 2013-07-23 | International Business Machines Corporation | Programmable FETs using Vt-shift effect and methods of manufacture |
US20120262220A1 (en) * | 2011-04-13 | 2012-10-18 | Semisouth Laboratories, Inc. | Cascode switches including normally-off and normally-on devices and circuits comprising the switches |
US9214538B2 (en) * | 2011-05-16 | 2015-12-15 | Eta Semiconductor Inc. | High performance multigate transistor |
US8482029B2 (en) * | 2011-05-27 | 2013-07-09 | Infineon Technologies Austria Ag | Semiconductor device and integrated circuit including the semiconductor device |
US9467047B2 (en) | 2011-05-31 | 2016-10-11 | Semiconductor Energy Laboratory Co., Ltd. | DC-DC converter, power source circuit, and semiconductor device |
FR2980039B1 (en) * | 2011-09-12 | 2013-09-27 | Commissariat Energie Atomique | Z2FET FIELD EFFECT TRANSISTOR WITH SLOPE UNDER THE VERTICAL THRESHOLD AND WITHOUT IMPACT IONIZATION |
US8502234B2 (en) | 2011-11-04 | 2013-08-06 | Agovy, Inc. | Monolithically integrated vertical JFET and Schottky diode |
CN103946978B (en) * | 2011-11-24 | 2017-03-01 | 夏普株式会社 | Semiconductor device and electronic equipment |
US9093420B2 (en) | 2012-04-18 | 2015-07-28 | Rf Micro Devices, Inc. | Methods for fabricating high voltage field effect transistor finger terminations |
US9163090B2 (en) | 2012-05-07 | 2015-10-20 | Cellerant Therapeutics, Inc. | Antibodies specific for CLL-1 |
DE102013010188A1 (en) * | 2012-06-21 | 2013-12-24 | Fairchild Semiconductor Corp. | Switching circuit and control circuit |
US9124221B2 (en) | 2012-07-16 | 2015-09-01 | Rf Micro Devices, Inc. | Wide bandwidth radio frequency amplier having dual gate transistors |
US9147632B2 (en) | 2012-08-24 | 2015-09-29 | Rf Micro Devices, Inc. | Semiconductor device having improved heat dissipation |
US9202874B2 (en) | 2012-08-24 | 2015-12-01 | Rf Micro Devices, Inc. | Gallium nitride (GaN) device with leakage current-based over-voltage protection |
US9917080B2 (en) | 2012-08-24 | 2018-03-13 | Qorvo US. Inc. | Semiconductor device with electrical overstress (EOS) protection |
US9142620B2 (en) | 2012-08-24 | 2015-09-22 | Rf Micro Devices, Inc. | Power device packaging having backmetals couple the plurality of bond pads to the die backside |
US8988097B2 (en) | 2012-08-24 | 2015-03-24 | Rf Micro Devices, Inc. | Method for on-wafer high voltage testing of semiconductor devices |
US20140055192A1 (en) * | 2012-08-24 | 2014-02-27 | Rf Micro Devices, Inc. | Saturation current limiting circuit topology for power transistors |
WO2014035794A1 (en) | 2012-08-27 | 2014-03-06 | Rf Micro Devices, Inc | Lateral semiconductor device with vertical breakdown region |
US9070761B2 (en) | 2012-08-27 | 2015-06-30 | Rf Micro Devices, Inc. | Field effect transistor (FET) having fingers with rippled edges |
US9325281B2 (en) | 2012-10-30 | 2016-04-26 | Rf Micro Devices, Inc. | Power amplifier controller |
US20150108958A1 (en) | 2012-12-28 | 2015-04-23 | Eaton Corporation | Hybrid three-level t-type converter for power applications |
US9209318B2 (en) | 2013-02-20 | 2015-12-08 | Infineon Technologies Austria Ag | Vertical JFET with body diode and device regions disposed in a single compound epitaxial layer |
US9093301B2 (en) * | 2013-03-08 | 2015-07-28 | Texas Instruments Incorporated | Driver for normally on III-nitride transistors to get normally-off functionality |
JP6201422B2 (en) * | 2013-05-22 | 2017-09-27 | 富士電機株式会社 | Semiconductor device |
JP2014229823A (en) * | 2013-05-24 | 2014-12-08 | 古河電気工業株式会社 | Semiconductor device and semiconductor module |
US9455327B2 (en) | 2014-06-06 | 2016-09-27 | Qorvo Us, Inc. | Schottky gated transistor with interfacial layer |
US9397657B1 (en) | 2014-07-24 | 2016-07-19 | Eaton Corporation | Methods and systems for operating hybrid power devices using multiple current-dependent switching patterns |
US9722581B2 (en) | 2014-07-24 | 2017-08-01 | Eaton Corporation | Methods and systems for operating hybrid power devices using driver circuits that perform indirect instantaneous load current sensing |
US9536803B2 (en) | 2014-09-05 | 2017-01-03 | Qorvo Us, Inc. | Integrated power module with improved isolation and thermal conductivity |
CN104409335B (en) * | 2014-11-18 | 2017-11-21 | 中国电子科技集团公司第五十五研究所 | A kind of preparation method of the carborundum JFET grid structures with rectification |
US10062684B2 (en) | 2015-02-04 | 2018-08-28 | Qorvo Us, Inc. | Transition frequency multiplier semiconductor device |
US10615158B2 (en) | 2015-02-04 | 2020-04-07 | Qorvo Us, Inc. | Transition frequency multiplier semiconductor device |
US10050620B2 (en) | 2015-02-27 | 2018-08-14 | Renesas Electronics America Inc. | Cascode connected SiC-JFET with SiC-SBD and enhancement device |
CN106300929B (en) * | 2015-05-21 | 2019-03-15 | 台达电子工业股份有限公司 | Switching circuit |
WO2017071635A1 (en) | 2015-10-30 | 2017-05-04 | The Hong Kong University Of Science And Technology | Semiconductor device with iii-nitride channel region and silicon carbide drift region |
US9871510B1 (en) | 2016-08-24 | 2018-01-16 | Power Integrations, Inc. | Clamp for a hybrid switch |
US10147785B2 (en) | 2017-01-26 | 2018-12-04 | Semiconductor Components Industries, Llc | High-voltage superjunction field effect transistor |
JP2019054170A (en) * | 2017-09-15 | 2019-04-04 | 株式会社東芝 | Semiconductor device |
FR3082076B1 (en) * | 2018-06-01 | 2020-05-08 | Exagan | SELF-POWERED SWITCHING DEVICE AND METHOD FOR OPERATING SUCH A DEVICE |
CN109671707B (en) * | 2018-12-25 | 2023-03-28 | 电子科技大学 | JCD integrated device integrated with VDMOS and preparation method thereof |
US20200346939A1 (en) | 2019-04-30 | 2020-11-05 | Shell Oil Company | Devices containing conductive magnesium oxides |
WO2020223464A1 (en) | 2019-04-30 | 2020-11-05 | Shell Oil Company | Crystalline magnesium oxide carbon composites |
WO2020223443A1 (en) | 2019-04-30 | 2020-11-05 | Shell Oil Company | Crystalline ionic oxides with modified electronic structure |
CN110739349A (en) * | 2019-10-22 | 2020-01-31 | 深圳第三代半导体研究院 | silicon carbide transverse JFET (junction field Effect transistor) device and preparation method thereof |
US11239238B2 (en) | 2019-10-29 | 2022-02-01 | Intel Corporation | Thin film transistor based memory cells on both sides of a layer of logic devices |
US11335686B2 (en) | 2019-10-31 | 2022-05-17 | Intel Corporation | Transistors with back-side contacts to create three dimensional memory and logic |
US11257822B2 (en) | 2019-11-21 | 2022-02-22 | Intel Corporation | Three-dimensional nanoribbon-based dynamic random-access memory |
US11056492B1 (en) | 2019-12-23 | 2021-07-06 | Intel Corporation | Dense memory arrays utilizing access transistors with back-side contacts |
US11087832B1 (en) | 2020-03-02 | 2021-08-10 | Intel Corporation | Three-dimensional nanoribbon-based static random-access memory |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006060337A2 (en) * | 2004-12-01 | 2006-06-08 | Semisouth Laboratories, Inc. | Normally-off integrated jfet power switches in wide bandgap semiconductors and methods of making |
JP2006202987A (en) * | 2005-01-20 | 2006-08-03 | Matsushita Electric Ind Co Ltd | Manufacturing method of semiconductor device |
US20070085147A1 (en) * | 2001-01-23 | 2007-04-19 | Tsutomu Imoto | Semiconductor Device and Manufacturing Method Thereof |
Family Cites Families (45)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3767946A (en) * | 1972-07-17 | 1973-10-23 | Western Electric Co | Junction field effect transistor device for replacing a pentode |
US4107725A (en) * | 1974-08-02 | 1978-08-15 | Nippon Gakki Seizo Kabushiki Kaisha | Compound field effect transistor |
US4663547A (en) * | 1981-04-24 | 1987-05-05 | General Electric Company | Composite circuit for power semiconductor switching |
US4587712A (en) * | 1981-11-23 | 1986-05-13 | General Electric Company | Method for making vertical channel field controlled device employing a recessed gate structure |
JPS59147467A (en) | 1983-02-12 | 1984-08-23 | New Japan Radio Co Ltd | Static induction transistor |
US4945394A (en) * | 1987-10-26 | 1990-07-31 | North Carolina State University | Bipolar junction transistor on silicon carbide |
US5264713A (en) * | 1991-06-14 | 1993-11-23 | Cree Research, Inc. | Junction field-effect transistor formed in silicon carbide |
JPH05243256A (en) * | 1992-03-02 | 1993-09-21 | Matsushita Electric Ind Co Ltd | Heterojunction bipolar transistor and manufacture thereof |
US6344663B1 (en) * | 1992-06-05 | 2002-02-05 | Cree, Inc. | Silicon carbide CMOS devices |
FR2693314B1 (en) | 1992-07-02 | 1994-10-07 | Alain Chantre | Vertical JFET transistor with optimized bipolar operating mode and corresponding manufacturing process. |
US5391895A (en) * | 1992-09-21 | 1995-02-21 | Kobe Steel Usa, Inc. | Double diamond mesa vertical field effect transistor |
ATE167669T1 (en) * | 1992-10-30 | 1998-07-15 | Searle & Co | HYDROXYETHYLAMINOSULFAMIC ACID DERIVATIVES USABLE AS INHIBITORS OF RETROVIRAL PROTEASES |
US5798539A (en) * | 1992-12-10 | 1998-08-25 | Daimler Benz Ag | Bipolar transistor for very high frequencies |
US5406096A (en) | 1993-02-22 | 1995-04-11 | Texas Instruments Incorporated | Device and method for high performance high voltage operation |
US5610085A (en) * | 1993-11-29 | 1997-03-11 | Texas Instruments Incorporated | Method of making a vertical FET using epitaxial overgrowth |
KR950015809A (en) | 1993-11-29 | 1995-06-17 | 윌리엄 이. 힐러 | Epitaxial Overgrowth Methods and Devices |
US5396085A (en) | 1993-12-28 | 1995-03-07 | North Carolina State University | Silicon carbide switching device with rectifying-gate |
US5543637A (en) * | 1994-11-14 | 1996-08-06 | North Carolina State University | Silicon carbide semiconductor devices having buried silicon carbide conduction barrier layers therein |
US5710455A (en) * | 1996-07-29 | 1998-01-20 | Motorola | Lateral MOSFET with modified field plates and damage areas |
US5945701A (en) * | 1997-12-19 | 1999-08-31 | Northrop Grumman Corporation | Static induction transistor |
US6545297B1 (en) * | 1998-05-13 | 2003-04-08 | Micron Technology, Inc. | High density vertical SRAM cell using bipolar latchup induced by gated diode breakdown |
US6156611A (en) * | 1998-07-20 | 2000-12-05 | Motorola, Inc. | Method of fabricating vertical FET with sidewall gate electrode |
JP4552055B2 (en) | 1998-10-01 | 2010-09-29 | 独立行政法人情報通信研究機構 | Semiconductor device, electronic device, and operation method thereof |
EP1128443B1 (en) * | 1998-10-09 | 2009-12-30 | The Kansai Electric Power Co., Inc. | Field-effect semiconductor device and fabrication method thereof |
JP2001308102A (en) | 2000-04-19 | 2001-11-02 | Nippon Telegr & Teleph Corp <Ntt> | Three-terminal electronic device |
DE10036208B4 (en) * | 2000-07-25 | 2007-04-19 | Siced Electronics Development Gmbh & Co. Kg | Semiconductor structure with buried island area and contact area |
JP2002076020A (en) | 2000-08-31 | 2002-03-15 | Sumitomo Electric Ind Ltd | Semiconductor device |
EP1334413A1 (en) | 2000-10-31 | 2003-08-13 | Koninklijke Philips Electronics N.V. | Voltage supply circuit |
WO2002054449A2 (en) * | 2001-01-03 | 2002-07-11 | Mississippi State University | Silicon carbide and related wide-bandgap transistors on semi-insulating epitaxy for high-speed, high-power applications |
US6503782B2 (en) * | 2001-03-02 | 2003-01-07 | Mississippi State University Research And Technology Corporation (Rtc) | Complementary accumulation-mode JFET integrated circuit topology using wide (>2eV) bandgap semiconductors |
US6861324B2 (en) * | 2001-06-15 | 2005-03-01 | Maxim Integrated Products, Inc. | Method of forming a super self-aligned hetero-junction bipolar transistor |
EP1428248B1 (en) * | 2001-07-12 | 2011-11-23 | Mississippi State University | Method of making transistor topologies in silicon carbide through the use of selective epitaxy |
US6855981B2 (en) | 2001-08-29 | 2005-02-15 | Denso Corporation | Silicon carbide power device having protective diode |
US6841812B2 (en) * | 2001-11-09 | 2005-01-11 | United Silicon Carbide, Inc. | Double-gated vertical junction field effect power transistor |
JP4060580B2 (en) * | 2001-11-29 | 2008-03-12 | 株式会社ルネサステクノロジ | Heterojunction bipolar transistor |
JP2003209263A (en) | 2002-01-11 | 2003-07-25 | Sumitomo Electric Ind Ltd | Vertical junction field effect transistor and its manufacturing method |
JP4110875B2 (en) * | 2002-08-09 | 2008-07-02 | 株式会社デンソー | Silicon carbide semiconductor device |
US6958275B2 (en) * | 2003-03-11 | 2005-10-25 | Integrated Discrete Devices, Llc | MOSFET power transistors and methods |
US6943407B2 (en) * | 2003-06-17 | 2005-09-13 | International Business Machines Corporation | Low leakage heterojunction vertical transistors and high performance devices thereof |
US20050067630A1 (en) * | 2003-09-25 | 2005-03-31 | Zhao Jian H. | Vertical junction field effect power transistor |
JP4770115B2 (en) * | 2003-12-24 | 2011-09-14 | 住友電気工業株式会社 | Semiconductor device and manufacturing method of semiconductor device |
SE527205C2 (en) * | 2004-04-14 | 2006-01-17 | Denso Corp | Process for manufacturing semiconductor device with channel in silicon carbide semiconductor substrate |
US7820511B2 (en) | 2004-07-08 | 2010-10-26 | Semisouth Laboratories, Inc. | Normally-off integrated JFET power switches in wide bandgap semiconductors and methods of making |
US7119380B2 (en) * | 2004-12-01 | 2006-10-10 | Semisouth Laboratories, Inc. | Lateral trench field-effect transistors in wide bandgap semiconductor materials, methods of making, and integrated circuits incorporating the transistors |
US7633101B2 (en) | 2006-07-11 | 2009-12-15 | Dsm Solutions, Inc. | Oxide isolated metal silicon-gate JFET |
-
2007
- 2007-07-06 US US11/822,568 patent/US7820511B2/en not_active Expired - Fee Related
-
2008
- 2008-07-02 EP EP08781291A patent/EP2171757A2/en not_active Withdrawn
- 2008-07-02 JP JP2010515256A patent/JP2010532920A/en active Pending
- 2008-07-02 KR KR1020107002369A patent/KR20100054787A/en not_active Application Discontinuation
- 2008-07-02 CA CA2729299A patent/CA2729299A1/en not_active Abandoned
- 2008-07-02 WO PCT/US2008/069043 patent/WO2009009380A2/en active Application Filing
- 2008-07-04 TW TW097125303A patent/TWI371800B/en not_active IP Right Cessation
-
2010
- 2010-06-29 US US12/826,033 patent/US8017981B2/en not_active Expired - Fee Related
-
2011
- 2011-08-11 US US13/207,623 patent/US8502282B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070085147A1 (en) * | 2001-01-23 | 2007-04-19 | Tsutomu Imoto | Semiconductor Device and Manufacturing Method Thereof |
US20070243668A1 (en) * | 2004-07-08 | 2007-10-18 | Igor Sankin | Normally-off integrated JFET power switches in wide bandgap semiconductors and methods of making |
WO2006060337A2 (en) * | 2004-12-01 | 2006-06-08 | Semisouth Laboratories, Inc. | Normally-off integrated jfet power switches in wide bandgap semiconductors and methods of making |
JP2006202987A (en) * | 2005-01-20 | 2006-08-03 | Matsushita Electric Ind Co Ltd | Manufacturing method of semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
US8502282B2 (en) | 2013-08-06 |
TW200910464A (en) | 2009-03-01 |
US20110291112A1 (en) | 2011-12-01 |
JP2010532920A (en) | 2010-10-14 |
CA2729299A1 (en) | 2010-01-15 |
WO2009009380A2 (en) | 2009-01-15 |
US8017981B2 (en) | 2011-09-13 |
US20080258184A1 (en) | 2008-10-23 |
US7820511B2 (en) | 2010-10-26 |
EP2171757A2 (en) | 2010-04-07 |
TWI371800B (en) | 2012-09-01 |
US20100295102A1 (en) | 2010-11-25 |
KR20100054787A (en) | 2010-05-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2009009380A3 (en) | Normally-off integrated jfet power switches in wide bandgap semiconductors and methods of making | |
WO2006060337A3 (en) | Normally-off integrated jfet power switches in wide bandgap semiconductors and methods of making | |
TW200742019A (en) | IC with on-die power-gating circuit | |
MY139190A (en) | Integrated radio front-end module with embedded circuit elements | |
TW200620657A (en) | Recessed semiconductor device | |
SG134334A1 (en) | Semiconductor package with passive device integration | |
WO2009036266A3 (en) | Iii-nitride bidirectional switches | |
WO2012141859A3 (en) | Cascode switches including normally-off and normally-on devices and circuits comprising the switches | |
WO2008147801A3 (en) | Half-bridge circuits employing normally on switches and methods of preventing unintended current flow therein | |
TW200723499A (en) | Semiconductor devices | |
WO2007095468A3 (en) | Multi-chip module for battery power control | |
WO2003069015A3 (en) | Aperture masks for circuit fabrication | |
TW200631064A (en) | Semiconductor device | |
WO2007014294A3 (en) | Solutions integrated circuit integration of alternative active area materials | |
TW200802782A (en) | Chip module for complete power train | |
ATE459131T1 (en) | SWITCHING CELL AND CONVERTER CIRCUIT FOR SWITCHING A VARIETY OF VOLTAGE LEVELS | |
WO2010080444A3 (en) | Methods and systems for power consumption management of a pattern-recognition processor | |
TW200717728A (en) | Semiconductor package | |
WO2009078148A1 (en) | Power conversion circuit | |
ATE486395T1 (en) | CIRCUIT BREAKER SYSTEM | |
AU2002255651A1 (en) | Complementary accumulation-mode jfet integrated circuit topology using wide (greater than 2ev) bandgap semiconductors | |
WO2013011289A3 (en) | Switching circuits | |
WO2003050934A3 (en) | Efficient buck topology dc-dc power stage utilizing monolithic n-channel upper fet and pilot current | |
TW200721493A (en) | Power semiconductor device with integrated passive component | |
DE112005003653A5 (en) | Power semiconductor module with load connection elements applied to the circuit carrier |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 08781291 Country of ref document: EP Kind code of ref document: A2 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2010515256 Country of ref document: JP |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
ENP | Entry into the national phase |
Ref document number: 20107002369 Country of ref document: KR Kind code of ref document: A |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2008781291 Country of ref document: EP |
|
ENP | Entry into the national phase |
Ref document number: 2729299 Country of ref document: CA |