WO2008130537A3 - Micromechanical device with gold alloy contacts and method of manufacture - Google Patents

Micromechanical device with gold alloy contacts and method of manufacture Download PDF

Info

Publication number
WO2008130537A3
WO2008130537A3 PCT/US2008/004844 US2008004844W WO2008130537A3 WO 2008130537 A3 WO2008130537 A3 WO 2008130537A3 US 2008004844 W US2008004844 W US 2008004844W WO 2008130537 A3 WO2008130537 A3 WO 2008130537A3
Authority
WO
WIPO (PCT)
Prior art keywords
gold alloy
switch
gold
manufacture
contact
Prior art date
Application number
PCT/US2008/004844
Other languages
French (fr)
Other versions
WO2008130537A2 (en
Inventor
Gregory A. Carlson
Patrick E. Feierabend
John S. Foster
Daryl W. Grummit
Alok Paranjpye
Paul J. Rubel
Jeffery F. Summers
Douglas L. Thompson
Original Assignee
Innovative Micro Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Innovative Micro Technology filed Critical Innovative Micro Technology
Publication of WO2008130537A2 publication Critical patent/WO2008130537A2/en
Publication of WO2008130537A3 publication Critical patent/WO2008130537A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/0036—Switches making use of microelectromechanical systems [MEMS]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/02—Contacts characterised by the material thereof
    • H01H1/021—Composite material
    • H01H1/023—Composite material having a noble metal as the basic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/02—Contacts characterised by the material thereof
    • H01H1/04—Co-operating contacts of different material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/0036—Switches making use of microelectromechanical systems [MEMS]
    • H01H2001/0052—Special contact materials used for MEMS
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/0036—Switches making use of microelectromechanical systems [MEMS]
    • H01H2001/0078—Switches making use of microelectromechanical systems [MEMS] with parallel movement of the movable contact relative to the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H61/00—Electrothermal relays
    • H01H2061/006—Micromechanical thermal relay
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H61/00—Electrothermal relays
    • H01H2061/006—Micromechanical thermal relay
    • H01H2061/008—Micromechanical actuator with a cold and a hot arm, coupled together at one end

Abstract

A MEMS switch device is made using a gold alloy as the switch contact material. The increased mechanical hardness of the alloy compared to the pure gold prevents the contacts of the switch from welding together. A scrubbing action which occurs when the switch closes may allow the contact surfaces to come to rest where their surfaces are complementary, thus resulting in higher contact area and low contact resistance, despite the higher sheet resistance of the gold alloy material relative to the pure gold material.
PCT/US2008/004844 2007-04-16 2008-04-15 Micromechanical device with gold alloy contacts and method of manufacture WO2008130537A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/785,119 US20080250785A1 (en) 2007-04-16 2007-04-16 Micromechanical device with gold alloy contacts and method of manufacture
US11/785,119 2007-04-16

Publications (2)

Publication Number Publication Date
WO2008130537A2 WO2008130537A2 (en) 2008-10-30
WO2008130537A3 true WO2008130537A3 (en) 2009-12-30

Family

ID=39852475

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2008/004844 WO2008130537A2 (en) 2007-04-16 2008-04-15 Micromechanical device with gold alloy contacts and method of manufacture

Country Status (2)

Country Link
US (1) US20080250785A1 (en)
WO (1) WO2008130537A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120174572A1 (en) * 2011-01-10 2012-07-12 Donato Clausi Method for mechanical and electrical integration of sma wires to microsystems
ES2555828B1 (en) * 2014-07-04 2016-10-24 Bsh Electrodomésticos España, S.A. Disposition of gas burners, cooking point, and kitchen

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020011758A1 (en) * 1999-02-26 2002-01-31 Vivek Agrawal MEMS microactuators located in interior regions of frames having openings therein and methods of operating same
US20050236935A1 (en) * 2004-04-22 2005-10-27 Ngk Insulators, Ltd. Microswitch and method for manufacturing the same
US7086918B2 (en) * 2002-12-11 2006-08-08 Applied Materials, Inc. Low temperature process for passivation applications

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7235750B1 (en) * 2005-01-31 2007-06-26 United States Of America As Represented By The Secretary Of The Air Force Radio frequency MEMS switch contact metal selection
US20080197964A1 (en) * 2007-02-21 2008-08-21 Simpler Networks Inc. Mems actuators and switches

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020011758A1 (en) * 1999-02-26 2002-01-31 Vivek Agrawal MEMS microactuators located in interior regions of frames having openings therein and methods of operating same
US7086918B2 (en) * 2002-12-11 2006-08-08 Applied Materials, Inc. Low temperature process for passivation applications
US20050236935A1 (en) * 2004-04-22 2005-10-27 Ngk Insulators, Ltd. Microswitch and method for manufacturing the same

Also Published As

Publication number Publication date
US20080250785A1 (en) 2008-10-16
WO2008130537A2 (en) 2008-10-30

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