WO2008130173A1

WO2008130173A1 - Suction pad for semiconductor package

Info

Publication number: WO2008130173A1
Application number: PCT/KR2008/002248
Authority: WO
Inventors: Kwang Yeol Lee; Young Min Yoon; Yong Koo Lee
Original assignee: Hanmisemiconductor Co., Ltd
Priority date: 2007-04-23
Filing date: 2008-04-21
Publication date: 2008-10-30
Also published as: KR20080095189A; TW200901366A; TWI449125B; KR101446724B1

Abstract

The present invention relates to a semiconductor package handling device, and more particularly, to a suction pad suitable (100) for sucking and holding a semiconductor package (1) more efficiently. The present invention includes a body (110) having an air suction hole (131) and at least one soft sealing member configured to be flexibly deformed according to a surface contour of a suction target, the at least one soft sealing member sealing a suction space (5) communicating with the air suction hole (131).

Description

SUCTION PAD FOR SEMICONDUCTOR PACKAGE

Technical Field

[1] The present invention relates to a semiconductor package handling device, and more particularly, to a suction pad. Although the present invention is suitable for a wide scope of applications, it is particularly suitable for sucking and holding a semiconductor package more efficiently. Background Art

[2] Generally, a semiconductor package includes a semiconductor chip on which a highly integrated circuit having transistors and capacitors is formed on a substrate. And, a lead frame connected to the semiconductor chip is provided to the semiconductor package.

[3] The above-configured semiconductor package is mounted and aligned on a chuck table and then transferred to a sawing device to undergo a singulating process for individual cutting and separation. The semiconductor package handling device checks processed states of a plurality of semiconductor packages and then sorts the semiconductor packages.

[4] The semiconductor package handling device transfers the semiconductor package to process, check or sort the corresponding semiconductor package. For this, a vacuum suction picker is mainly used as a device for transferring the semiconductor package.

[5] In particular, a pad is attached to an end portion of the vacuum suction picker to facilitate suction & holding of the semiconductor package.

[6] Recently, a surface, on which a contact terminal is formed to prevent a semiconductor package from being damaged in the course of transferring/accommodating the semiconductor package, is sucked. In this case, a fringe part of the semiconductor package except a face having the contact terminal formed there on in the surface is sucked and held. Disclosure of Invention

Technical Problem

[7] However, as a semiconductor package becomes more highly integrated with high density, a fringe tends to be removed. So, it gets difficult to suck and hold the semiconductor package.

[8] Moreover, the pad needs to be replaced by a new pad matching a shape of a semiconductor package each time a semiconductor package size or type is changed. So, a working process for sucking and holding a semiconductor package gets complicated.

[9] Besides, a related art suction pad is formed of hard rubber. In particular, a thickness of a fringe part for sealing a suction space corresponds to 0.3~0.5mm and it length corresponds to 0.5-0.8mm. The related art suction pad barely has flexibility and is relatively hard. Technical Solution

[10] Accordingly, the present invention is directed to an suction pad for a semiconductor package that substantially obviates one or more of the problems due to limitations and disadvantages of the related art.

[11] An object of the present invention is to provide a suction pad, by which a semiconductor package having a protruding surface can be efficiently sucked and held.

[12] Another object of the present invention is to provide a suction pad, which is available regardless of a pattern of a contact terminal of a semiconductor package.

[13] Additional features and advantages of the invention will be set forth in the description which follows, and in part will be apparent from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims thereof as well as the appended drawings.

[14] To achieve these and other advantages and in accordance with the purpose of the present invention, as embodied and broadly described, a suction pad in a semiconductor package handling device according to the present invention includes a body having an air suction hole and at least one soft sealing member configured to be flexibly deformed according to a surface contour of a suction target, the at least one soft sealing member sealing a suction space communicating with the air suction hole.

[15] Preferably, the sealing member includes a flange placed on a lower portion of the body.

[16] The flange forms the suction space by being flexibly deformed and then performs sealing. The flange is formed of a soft material to be flexibly deformed. Hence, it is able to secure the suction space sufficient for vacuum suction without being affected by the surface contour of the suction target.

[17] The flange can be formed of silicon. And, the silicon can provide sufficient flexibility.

[18] More preferably, the flange and the body are formed in one body to configure a single piece. Alternatively, the body and the flange can be formed of different materials, respectively or bonded together by an adhesive agent.

[19] The flange may be configured to gradually decrease in thickness from a root of the flange toward an end portion of the flange. Hence, it is able to secure sufficient flexibility at the end portion. If the end portion is sufficiently flexible, the flange can be flexibly deformed according to a package surface contour and deformed to enclose the suction space well. Hence, it is able to raise suction efficiency.

[20] More preferably, at least one portion of an inner side of the flange is configured to incline in an external direction of the flange. In particular, the inner side of the flange can be configured to incline in a manner that a cross-section area of the suction space gradually increases toward the end portion of the flange. By securing an appropriately wide suction space, it is able to raise suction efficiency. And, an upper end, to which bending weight is considerably applied due to deformation in suction, is configured relatively thick, whereby durability can be enhanced.

[21] More preferably, an outer side of the flange includes a vertical face and an incline face inclining in an external direction. The incline face provides flexibility in sucking the suction target to secure the suction space sufficiently. And, the vertical face provides a restoring force in unloading the suction target on a destination, thereby helping the suction target fall quickly.

[22] The cross-sectional shape of the flange can be provided in one of various patterns.

For instance, the flange has a circular or polygonal cross-section.

[23] More preferably, the flange includes at least two flanges overlapped with each other by being evenly spaced from each other. For instance, the at least two flanges can include an inner flange and an outer flange provided to an outer circumference of the inner flange.

[24] The multiple flanges can raise suction efficiency by sealing the suction space more air-tightly.

[25] In this case, the inner flange can be configured less flexible than the outer flange. For his, the inner flange can be configured thicker or shorter than the outer flange. And, an outer side of the inner flange can be configured vertical.

[26] The inner flange can be configured to secure sufficient flexibility at its end portion.

For this, the end portion of the inner flange can be configured equal or similar to that of the outer flange in thickness.

[27] A vacuum remaining pressure may remain between the inner flange and the outer flange. This remaining pressure may hinder a package from being freely separated from the suction pad. So, the remaining pressure prevents the quick separation of the package when the package is unloaded on a destination. When the package is dropped on the destination by releasing the vacuum state, the package is preferably dropped in a horizontal direction. Otherwise, a position of the package is distorted or the package may be turned upside down. Yet, the remaining pressure hinders the package from falling horizontally. In this case, the inner flange applies the restoring force to the package to help the package fall horizontally by being quickly and evenly separated from the suction pad.

[28] Meanwhile, a stopper can be further included. The stopper prevents a package from being excessively sucked and held by the suction pad. If the package excessively adheres closely to the suction pad, sticking may take place to interrupt a quick transfer work of package. Hence, the stopper prevents the sticking .

[29] To further achieve these and other advantages and in accordance with the purpose of the present invention, a suction pad in a semiconductor package handling device includes a body having a plurality of air suction holes, the body configured in a single piece and a plurality of soft sealing plates configured to be flexibly deformed according to a surface contour of a suction target, a plurality of the soft sealing plates configured to seal suction spaces communicating with a plurality of the air suction holes, respectively.

[30] The suction pad can be assembled to the semiconductor package handling device in one body, thereby facilitating and a quick work.

[31] The suction pad includes a sealing plate attached to the body as a sealing member. In this case, the body can include a protruding part touched to a surface of the suction target to prevent the suction target from being distorted in performing suction.

[32] And, the body can be provided with a recess to which the sealing plate is mounted and attached therein. And, a sidewall of the recess can be configured to lay a role as the protruding part.

[33] To further achieve these and other advantages and in accordance with the purpose of the present invention, a suction pad in a semiconductor package handling device includes a plurality of bodies having a plurality of air suction holes, respectively and a plurality of soft flanges provided to a plurality of the bodies, respectively, a plurality of the soft flanges configured to be flexibly deformed according to a surface contour of a suction target, a plurality of the soft flanges configured to seal a plurality of suction spaces communicating with a plurality of the air suction holes, respectively, wherein a plurality of the bodies and a plurality of the soft flanges are formed in one body.

[34] Therefore, a suction pad according to the present invention is applicable to various semiconductor package handling devices capable of sucking and holding a package such as off-loading pickers, unit pickers, turntable pickers, chuck tables, turntables (sawing process) and the like.

[35] Meanwhile, a suction pad according to the present invention, which breaks a related art fixed idea that a suction pad sucks and holds a semiconductor package in a manner of being contacted with a fringe part of a semiconductor package by avoiding a contact terminal thereon, is attributed to the fresh and remarkable concept and can be named Lee pad in accordance with the last name of the inventor.

[36] It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation of the invention as claimed. Advantageous Effects

[37] Accordingly, the present invention provides the following effects or advantages.

[38] First of all, a suction pad according to the present invention is freely deformed according to a surface contour of a semiconductor package to suck and hold, thereby facilitating an uneven surface of the semiconductor package such as a ball grid array package, a board-on-chip and the like.

[39] Secondly, even if a type of a semiconductor package to be sucked and held, a single suction pad is used without being replaced by a separate suction pad. Therefore, both a working time and a product cost can be reduced. Brief Description of the Drawings

[40] The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention.

[41] In the drawings:

[42] FIG. 1 is an exploded perspective diagram for major configuration of a semiconductor package handling device before being sucked and held using a suction pad according to one embodiment of the present invention;

[43] FIG. 2 is a perspective diagram for depicting a state right before a semiconductor package is sucked and held using a suction pad;

[44] FIG. 3 is a cross-sectional diagram corresponding to FIG. 2;

[45] FIG. 4 is a perspective diagram of a suction pad pressed on a semiconductor package to suck and hold;

[46] FIG. 5 is a cross-sectional diagram corresponding to FIG. 4;

[47] FIG. 6 is a cross-sectional diagram of a sucked and held semiconductor package before transfer;

[48] FIG. 7 is a perspective diagram of a suction pad according to another embodiment of the present invention;

[49] FIG. 8 is a cross-sectional diagram corresponding to FIG. 7;

[50] FIG. 9 is a perspective diagram of a suction pad according to another embodiment of the present invention;

[51] FIG. 10 is a cross-sectional diagram corresponding to FIG. 9;

[52] FIG. 11 is a perspective diagram of a suction pad according to another embodiment of the present invention;

[53] FIG. 12 is a cross-sectional diagram corresponding to FIG. 11;

[54] FIGs. 13 to 15 are perspective diagrams of suction pads according to other embodiments of the present invention; [55] FIG. 16 and FIG. 17 are perspective diagrams of suction pads according to other embodiments of the present invention;

[56] FIG. 18 is a cross-sectional diagram corresponding to FIG. 17;

[57] FIG. 19 and FIG. 20 are diagrams of a suction pad according to another embodiment of the present invention; [58] FIGs. 20 to 23 are diagrams of a suction pad according to another embodiment of the present invention; [59] FIGs. 23 to 26 are diagrams of a suction pad according to another embodiment of the present invention; [60] FIG. 27 is a diagram to depict a state in using a semiconductor package handling apparatus according to the present invention; [61] FIG. 28 is a perspective diagram to depict a state in sucking and holding a board- on-chip (BOC) package 5 using a suction pad; [62] FIG. 29 and FIG. 30 are diagrams of a suction pad according to another embodiment of the present invention; [63] FIG. 31 is a cross-sectional diagram to depict a state before a semiconductor package sucking apparatus according to the present invention sucks a semiconductor package mounted on a chuck table; [64] FIG. 32 is a cross-sectional diagram to depict a state that a semiconductor package sucking apparatus according to the present invention sucks and holds a semiconductor package; [65] FIG. 33 is a cross-sectional diagram to depict a state that a semiconductor package sucking apparatus according to the present invention carries a semiconductor package sucked and held; [66] FIG. 34 is a cross-sectional diagram to depict a state that a semiconductor package sucking apparatus according to the present invention places a semiconductor package in a drying block; [67] FIG. 35 is a cross-sectional diagram to depict a state that a semiconductor package sucking apparatus according to the present invention completes a transfer of a semiconductor package; [68] FIGs. 37 to 39 are cross-sectional diagrams to depict a state that a suction pad according to one embodiment of the present invention is being used; [69] FIG. 40 is a cross-sectional diagram of a semiconductor package sucking apparatus according to another embodiment of the present invention; [70] FIGs. 41 to 43 are cross-sectional diagrams of a suction pad and a semiconductor package handling apparatus according to another embodiment of the present invention; [71] FIG. 44 is a cross-sectional diagram of a suction pad and a semiconductor package handling apparatus according to a further embodiment of the present invention; and [72] FIG. 45 is a diagram of a semiconductor package handling apparatus according to another further embodiment of the present invention. Mode for the Invention

[73] Reference will now be made in detail to the preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings.

[74] A suction pad according to one embodiment of the present invention and a semiconductor package handling apparatus for sucking and holding a semiconductor package using the same are explained with reference to FIGs. 1 to 6 as follows.

[75] First of all, a semiconductor package handling apparatus includes a picker holder 10 connected to an external air suction device to suck and hold a semiconductor package 1 and a suction pad 100 provided to an end portion of the picker holder 10.

[76] In this case, the semiconductor package 1 includes a semiconductor package provided with a plurality of contact terminals projected from one side of the semiconductor package. For instance, the semiconductor package 1 includes a ball grid array (BGA) package belonging to a large-scale integrated circuit (LSI) package. In the ball grid array package, a plurality of semi- spherical contact terminals are arranged in 2-dimensional array on a printed circuit board (PCB) having a bare chip loaded thereon to replace leads.

[77] The suction pad 100 according to the present invention sucks and holds a surface of the ball grid array package on which ball-contact terminals formed. In this case, the reason why the surface, on which the ball-contact terminals are formed, is sucked and held is mainly to reduce damage caused by interference between the contact terminals and a tray accommodating the semiconductor package therein in a manner that the ball-contact terminals of the sucked semiconductor package is accommodated to face upward.

[78] The picker holder 10 is installed to be movable vertically or horizontally by a transfer device provided to the semiconductor package handling apparatus. A head part 11 of the picker holder 10, at which the suction pad 100 is installed, has a shape corresponding to the suction pad 100.

[79] The suction pad 100 includes a body 110 having a cavity formed therein and a flange

120 extending downward from the body 110 to communicate with the body 110.

[80] The body 110, as shown in FIG. 3, has a shape similar to that of a square pillar in which square cavity is formed. And, an interior of the body 110 corresponds to an exterior of the picker holder 10, i.e., an exterior of the picker head.

[81] In particular, a separation preventing part 150 is provided to the interior of the body

110 to prevent the suction pad 100 from being separated from the picker holder 10. Since the suction pad 100 is formed of a soft material, it may be easily come out of the picker holder 10. So, the separation preventing part 150 holds the exterior of the picker holder 10 to prevent the separation.

[82] The separation preventing part 150, as shown in the drawing, can have a projection shape corresponding to a recess provided to the head par 11 of the picker holder 10. Of course, the separation preventing part 150 can have nay shape, e.g., a recess shape, as long as corresponding to the exterior of the picker holder 10.

[83] The flange 120 adheres closely to a surface of the semiconductor package by being freely deformed according to a surface contour of the sucked semiconductor package. And, the body 110 can further include a partition part 130 having an air suction hole 131 formed therein.

[84] Moreover, the body 110 can further include an incline part 140 having a prescribed angle of inclination from its portion connected to the flange 120 in a direction of the flange 120.

[85] Meanwhile, in the partition part 130, a shock absorbing projection 133 is provided neighbor to the air suction hole 131 to absorb shock applied to the semiconductor package by the picker holder in sucking and holding a suction target object, i.e., the semiconductor package.

[86] Besides, a perforated hole 132, which becomes a moving path of a pressurizing member (not shown in the drawings) for applying a specific force to the semiconductor package in removing the sucked and held object, i.e., in placing the sucked and held semiconductor package on an accommodating tray, is provided to the partition part 130.

[87] Preferably, the perforated hole 132 is provided to a center of the partition part 130.

This is because the pressurizing member is able to evenly apply a force to the semiconductor package if possible in pressurizing the semiconductor package.

[88] When a semiconductor package is sucked and held by a suction pad, in order for the semiconductor package to be quickly and safely sucked and held, the air suction holes 131 can be arranged symmetric centering on the perforated hole 132.

[89] Meanwhile, the flange 120 forms a suction space (S) with the semiconductor package in-between and is freely deformed according to a surface contour of the sucked semiconductor package.

[90] In this case, if air is externally discharged via the air suction hole 131, the suction space S maintains a vacuum state. So, such an air pressure enables the semiconductor package 1 to be sucked and held by the suction pad 100.

[91] In sucking and holding the semiconductor package, the flange 120 is attached to the surface of the semiconductor package with an irregular deformation rate. For instance, the flange 120 may be irregularly deformed in a direction tangential to the surface as well as in a direction of a normal to the surface of the semiconductor package. [92] The flange 120 is able to adhere closely to the surface of the ball type contact terminal and the surface of the semiconductor package having the ball type contact terminal formed thereon in a manner of enclosing at least a portion of the ball type contact terminal projected from the semiconductor package surface.

[93] The flange 120, as shown in FIG. 1 and FIG. 3, can be formed to have thickness tending to decrease top to bottom. As the thickness of the flange 120 is reduced toward bottom from top, a lower part of the flange 120 can be freely deformed along the surface of the semiconductor package and durability of an upper portion of the flange having the most severe bending deformation can be enhanced.

[94] If the flange extends thick in a straight line, durability may be raised. Yet, the flange relatively has difficulty in being deformed along the surface of the semiconductor package. If the flange extends thin in a straight line, it is able to be freely deformed along the surface of the semiconductor package. Yet, durability thereof may be degraded.

[95] In this case, the thickness of the flange 120, and more particularly, a lower potion thickness of the flange 120 has a range between 0.1~0.5mm. Preferably, the lower potion thickness of the flange 120 may be about 0.2mm.

[96] The upper and lower portion thickness of the flange 120 may have a predetermined ratio in-between. For instance, if the lower portion thickness of the flange 120 is 0.2mm, it is able to design the upper portion thickness of the flange 120 to have 0.3~0.8mm. And, a length of the flange 120 may be 0.7- 1.0mm.

[97] If the thickness of the flange 120 is ultra-thin, the flange can be flexibly deformed by preventing air from leaking from the suction space in sucking the semiconductor package.

[98] The flange 120 is formed of the material containing silicon, carbon and hardening substance. And, configuration ratio between the silicon, carbon and hardening substance can be set to 7:5:1.

[99] Alternatively, the flange 120 can contain silicon and carbon mixed together by about

3:1 (abut 75%:25%) and may further contain about 1% hardening substance in addition thereto. In this case, the hardening substance may include hydroperoxide hardening substance.

[100] The flange 120 has 50~40Hs rigidity with reference to shore hardness. In this case, the shore hardness means the hardness resulting from a bounced height when a hammer is dropped at a predetermined height on a test material.

[101] The suction pad 100 is formed of electrically non-conductive material. And, the body and flange provided to the suction pad 100 are formed in one body by injection molding.

[102] Meanwhile, the flange 120, as shown in FIG. 6 for example, includes a vertical flange 121 vertically projected from an outer side of the flange and an incline flange 13 extending from the vertical flange 121 in a manner that the outer side of the flange inclines in an external direction of the flange. And, at least a portion of an inner side of the incline flange 123 is formed to incline in the external direction of the flange.

[103] In particular, an inner side of the vertical flange 121 is formed to incline toward an outside of the flange and an outer side of the vertical flange 121 is formed to extend vertically from the partition part 130. On the other hand, both of the inner and outer sides of the incline flange 123 are formed to incline toward outside of the flange.

[104] Consequently, the flange has a shape widened outwardly and the vertical flange 121 is relatively thicker than the incline flange 123.

[105] In this case, the incline flange 123 forming a tip of the flange 120 is freely deformed according to a shape of the contact terminal, i.e., a shape of ball. In particular, the incline flange 123 of the flange 120 comes into contact with at least one ball contact terminal and then sucks and holds a surface where the contact terminal is formed.

[106] FIG. 2 and FIG. 3 are diagrams for depicting a state right before a semiconductor package is sucked and held using a suction pad, FIG. 4 and FIG. 5 are diagrams of a suction pad pressed on a semiconductor package to suck and hold, and FIG. 6 is a diagram of a sucked and held semiconductor package right before transfer.

[107] A process for sucking and holding a semiconductor package in a semiconductor package handling apparatus according to the present invention is explained with reference to FIGs. 2 to 6 as follows.

[108] Referring to FIG. 2 and FIG. 3, no force is applied to the suction pad before a semiconductor package is sucked and held. In particular, the picker holder 10 and the suction pad 100 fitted into the head part of the picker holder 10 are placed over an area where a semiconductor package is located.

[109] In this case, a thickness of the shock absorbing projection 133 provided to the suction pad 100 is set to tl. And, the flange 120 provided to a lower body of the suction pad 100 maintains an original shape in injection molding.

[110] Referring to FIG. 4 and FIG. 5, if the picker holder 10 moves downward to suck and hold the semiconductor package, it temporarily presses the suction pad that is flexible. Simultaneously, the head part 11 of the picker holder 10 pressurizes the shock absorbing projection 133. The shock absorbing projection is then contracted by a pressing force applied by head part 11. When the picker holder 10 pressurizes the suction pad 100 to suck and hold the semiconductor package, a thickness of the shock absorbing projection 133 becomes t2.

[I l l] Consequently, the shock absorbing projection 133 is deformed by tl-t2 to instantly absorb the shock applied to the semiconductor package by the picker holder 10, thereby protecting the semiconductor package. [112] Thereafter, referring to FIG. 6, the thickness of the shock absorbing projection 133 returns to the original thickness tl and the incline flange 123 sucks and holds ball contact terminals or a surface of the semiconductor package having the ball contact terminals formed thereon.

[113] In doing so, of course, an air suctioning device sucks air between the suction pad and the semiconductor package via an air passage provided within the picker holder.

[114] A suction pad according to another embodiment of the present invention is explained with reference to FIG. 7 and FIG. 8 as follows.

[115] Referring to FIG. 7 and FIG. 8, a suction pad according to another embodiment of the present invention includes a body 210 and a flange 220 connected to the body 210, like the former embodiments. And, the body 210 includes a partition part 230. The partition part 230 is provided with an air suction hole 231, a perforated hole 232, and a shock absorbing projection 233. Their details are substantially identical to those of the former embodiment and omitted in the following description.

[116] Yet, unlike the former suction pad, the flange 220 is configured to vertically extend downward. In this case, the flange 220 extends to a lower portion of the partition part 230 with a predetermined thickness.

[117] Such features of the flange 200 as a material, a processing method and the like are substantially identical to those of the former embodiment and their descriptions are omitted in the following description.

[118] Unlike the former embodiments, in a suction pad shown in FIG. 9 and FIG. 10, a thickness of a flange 320 projected from a lower side of a body tends to decrease downward. In particular, an outer side of the flange 320 is configured to extend from a partition part 330 vertically and downwardly and an inner side of the flange 320 tends to incline downward in an external direction of the flange 320.

[119] Consequently, the flange 320 extends downward by gradually decreasing in thickness while a cross-section of a suction space S tends to gradually increase downward.

[120] An upper end of the flange 320, i.e., the flange extending from the partition part 330 is formed relatively thick. This is to enhance durability of the flange for a predetermined period even if a lower end of the flange is damaged by abrasion.

[121] Unlike the former embodiments, in a suction pad shown in FIG. 11 and FIG. 12, thickness of a flange 420 is irregular and an outer side of the flange 420 inclines in a direction of a suction space S formed by the flange 420 overall. In particular, the flange 420 is configured to shrink in the direction of the suction space S.

[122] The flange 420 includes a vertical flange 421 extending from a rim of a partition part 430 vertically and downwardly and an incline flange 423 having a prescribed angle of inclination against the vertical flange 421. [123] In particular, an inner side of the vertical flange 421 is configured to vertically extend in a direction of a lower part of the partition part 430 while an inner side of the incline flange 423 is configured to incline in the direction of the suction space S.

[124] Suction pads according to other embodiments of the present invention are explained with reference to FIGs. 13 to 15 as follows.

[125] A suction pad 500 shown in Fig. 13 includes a cylindrical body 510 having a cavity inside. And, the body 510 includes a partition part 530. Moreover, a flange 520 forms a suction space S with an object to suck and hold in-between and is configured to seal the suction space S.

[126] The flange 520 is configured to be projected from the partition part 530 vertically and downwardly and freely deformed according to a surface contour of the object.

[127] In particular, the flange 520 is able to adhere closely to a surface of a ball type contact terminal and a surface of a semiconductor package, on which the ball type contact terminal is formed, while enclosing at least one portion of the ball type contact terminal projected from the object, i.e., the surface of the semiconductor package.

[128] The partition part 530 is provided with an air suction hole 531. And, the partition part 530 is provided with a perforated hole 532 that plays a role as a moving path of a pressurizing member to removing a semiconductor package sucked and held by the suction pad 500.

[129] Moreover, the partition part 530 is provided with a sock absorbing projection 533 neighboring to the air suction hole 531 to absorb shock applied to a semiconductor package by a picker holder in sucking and holding the semiconductor package. Its details are identical to those of the former embodiments and omitted in the following description.

[130] Like the former suction pad shown in FIG. 13, a suction pad shown in FIG. 14/15 includes a cylindrical body 610/710 and a flange 620/720 configured to have a circular ring shape.

[131] Yet, the flange 620 of the suction pad shown in FIG. 14 is configured to incline in an external direction of the flange. And, the flange 720 shown in FIG. 15, is configured to incline a direction of a suction space S. Namely, the flange 620 of the suction pad shown in FIG. 14 is configured to be widened in the external direction of the flange, while the flange 720 of the suction pad shown in FIG. 15 is configured to shrink in the direction of the suction space S.

[132] In this case, the suction pad shown in FIG. 14 is configured to correspond to the former suction pad shown in FIG. 3 or FIG. 5, while the suction pad shown in FIG. 15 is configured to correspond to the former suction pad shown in FIG. 11 or FIG. 12. In particular, the suction pad shown in FIG. 14/15 has the flange configured to have the circular ring type flange, while each of the suction pad shown in FIG. 3/5 and the suction pad shown in FIG. 11/12 has the flange configured to have the square ring type flange.

[133] Alternatively, the present invention is not limited to the above-mentioned embodiments. Optionally, the flange can have one of various polygonal cross-sections including a square cross-section as well as a circular cross-section.

[134] FIG. 16 and FIG. 17 are perspective diagrams of suction pads according to other embodiments of the present invention.

[135] Referring to FIG. 16/17, like the former embodiments, a suction pad according to an embodiment of the present invention includes a body 810/910 having a partition part 830/930 and a flange 820/920 forming a suction space S with an object to be sucked and held in-between.

[136] The partition part 830, as shown in FIG. 16, is provided with an air suction hole 831, a perforated hole 832, and a shock absorbing projection 833. Their details are substantially identical to those of the former embodiments and omitted in the following description.

[137] Meanwhile, each of the suction pads according to the present embodiment has a plurality of flanges, which is different from the former embodiments. In particular, a plurality of the flanges, as shown in FIG. 16, are configured to be overlapped with each other by being evenly spaced apart from each other. A plurality of the flanges 821 and 825 shown in FIG. 16 are configured to extend from the partition part 830 vertically and downwardly. A pair of the overlapped flanges 921 and 925 shown in FIG. 17 are configured to incline in an external direction of the flanges by being projected from a rim of the partition part 930.

[138] Referring to FIG. 16/17, the first flange 821/921 and the second flange 825/925 form a first suction space Sl and a second suction space S2 with an object to be sucked and held, i.e., a semiconductor package in-between.

[139] The second suction space S2 is provided to be prepared for a case that the first suction space Sl fails to be completely sealed. In case that air leaks from the space failing to be completely sealed by the first flange, the second flange forms an airtight suction space to facilitate the semiconductor package to be sucked and held.

[140] The above-mentioned embodiment does not restrict various embodiments of the present invention. For instance, a plurality of the flanges, as shown in FIG. 18, can have projected lengths differing from each other. In particular, a length of the first flange 921 is designed to be set to 0.5~0.8mm and a length of the second flange 925 is designed to be set to 0.8- 1.0mm. In this case, a length difference between the first and second flanges 921 and 925 can be 0.2~0.5mm.

[141] If the length of the first flange 921 is equal to that of the second flange 921, a remaining vacuum pressure stays in the second suction space S2 to hinder a package from being unloaded. So, if there is a step difference between the lengths, it is able to reduce the influence of the remaining vacuum pressure.

[142] Alternatively, a plurality of the flanges are installed by being evenly spaced apart from each other, whereby each individual and independent suction space can be formed between the flanges and an object to be sucked and held.

[143] For instance, a first air suction hole 831 for sucking air of the first suction space Sl and a second air suction hole (not shown in the drawing) for sucking air of the second suction space S2 can be individually provided to the partition part.

[144] If a plurality of individual suction spaces are formed, they play a role in distributing an air suction force to the object overall. So, it is able to raise the suction force for the object.

[145] In particular, in case that a suction surface of the object to be sucked and held is not flat, e.g., if the suction surface is uneven, a plurality of the flanges differing from each other in height for independent suction spaces, respectively. Hence, the object is facilitated to be sucked and held.

[146] FIG. 19 and FIG. 20 are diagrams of a suction pad for a semiconductor package handling apparatus according to another embodiment of the present invention.

[147] Referring to FIG. 19 and FIG. 20, unlike the former embodiments, a suction pad according to the present embodiment includes a plate type sealing member configured separate from a body 1010. A suction pad 1000 according to the present embodiment includes a body 1010 having a cavity therein and a sealing plate 1020 attached to the body 1010.

[148] The body 1010 includes a partition part 1130 having a plurality holes. And, the sealing plate 1020 is attached to the bottom of the partition part 1130.

[149] In particular, the sealing plate 1020 is formed of a material different from that of the body 1010 and can be attached to the bottom of the partition part 1130. For instance, the body 1010 is formed of a hard material, whereas the sealing plate 1020 can be formed of one of ultra- fine cloth, cotton flannel, jelly type fabric, soft silicon, etc.

[150] Alternatively, the sealing plate 102 can be formed of a material such as an adhesive tape formed of polyurethane by the company "SK utis". In particular, the company sells the material in a form of roll type polyerethane foam and in a product name of "eSORBA SRP series".

[151] If the sealing plate 102 is formed of polyurethane foam, its durability can be enhanced much better than that of other material. If the sealing plate 1020 is repeatedly used, it may be broken due to the damage caused by fatigue. Yet, since the polyurethane sealing plate is resistant against the fatigue damage attributed to the repetitive use, its durability can be considerably extended.

[152] The sealing plate 1020 formed of one of the above materials is freely deformed according to a surface contour of a semiconductor package to be sucked and held.

[153] And, the body can be formed of the same material of the suction pad according to one of the above-explained embodiments.

[154] FIGs. 21 to 23 are diagrams of a suction pad according to another embodiment of the present invention, which is similar to the former suction pad shown in FIG. 19 and FIG. 20.

[155] Referring to FIGs. 21 to 23, a suction pad 1100 includes a body 1110 and a sealing pate 1120 attached to the body 1110. Like the former suction pad shown in Fig. 19, the sealing plate 1120 can be formed of such a material as polyurethame and the like. FIG. 23 shows that a semiconductor package is picked using the suction pad 1100. In picking up the semiconductor package, the sealing plate 1120, as shown in FIG. 23, achieves sealing for vacuum suction by covering contact terminals projected from a surface of a semiconductor package. The sealing plate 1120 can be formed of any kind of material capable of being freely deformed enough to achieve the sealing by covering the contact terminals as well as polyurethame foam or the like.

[156] FIGs. 24 to 26 are diagrams of a suction pad 1200 according to another embodiment of the present invention, which is similar to the embodiments shown in FIGs. 19 to 23. Yet, in the present embodiment, a protruding part 1211 is provided to a body 1210. The protruding part 1211 prevents a package 1 from being distorted by being touched to a surface of the package 1 in sucking and holding the package 1. In FIG. 26, the protruding part 1211 is formed to be touched to an edge potion of the semiconductor package 1. In this case, the protruding part 1211 can be configured higher than a contact terminal of ht e package 1. The protruding part 1211 plays a role as a stopper to inhibit a package from excessively adhering closely to the suction pad. If the package 1 excessively adheres closely to the suction pad, the contact terminal of the package may be pressed and damaged. And, the package may have difficulty in being quickly unloaded.

[157] A semiconductor package handling apparatus having a suction pad according to one embodiment of the present invention is explained with reference to FIG. 27 as follows.

[158] Referring to FIG. 27, a semiconductor package handling apparatus according to one embodiment of the present invention includes a picker holder 10 connected to an external air sucking device to suck and hold a semiconductor package, a suction pad 100 provided to an end portion of the picker holder 10, and a test device 30 for testing a processed state of the semiconductor package.

[159] The semiconductor package handling apparatus can include a reflective member 50 provided onto the suction pad 100 to enable the test device 30 to correctly recognize image information on the semiconductor package.

[160] In this case, the test device 30 includes a photographing device capable of photo- graphing an image of a bottom of the semiconductor package 1. And, the photographing device includes a general camera, a CCD camera or the like.

[161] The reflective member 50 plays a role in configuring a background image of the semiconductor package 1 in photographing image information on the bottom of the semiconductor package 1. So, in viewing from the test device, a cross-section of the reflective member 50 should be greater than that of the suction pad 100. And, the reflective member 50 can be formed of any material such as metal, plastic and the like.

[162] Color of the reflective member 50 is selected to be discriminated from that of the bottom of the semiconductor package. This is to discriminate the reflective member 50 from the semiconductor package on the image photographed by the test device.

[163] For instance, if the color of the bottom of the semiconductor package is black, the reflective member 50 can have the color different from the bottom color of the semiconductor package such a white, yellow and the like.

[164] FIG. 28 is a perspective diagram to depict a state in sucking and holding a board- on-chip (BOC) package 5 using a suction pad.

[165] Referring to FIG. 28, eve if a surface of a package such as a BOC package is irregularly uneven, a soft flange is deformed along a surface of the package and sucks and holds the surface.

[166] FIG. 29 and FIG. 30 are diagrams of a suction pad according to another embodiment of the present invention, in which a plurality of flanges are provided to the suction pad like the former suction pad shown in FIG. 16.

[167] Referring to FIG. 29, a suction pad includes a body 1510 having a partition part 1530 and a plurality of flanges 1521 and 1525.

[168] In this case, the flange has a dual flange structure. This dual flange includes an outer flange 1525 and an inner flange 1521 overlapped with the outer flange 1525 by being evenly spaced apart from the outer flange 1525.

[169] The inner flange 1521 differs from the outer flange 1525 in height. In the suction pad shown in FIG. 29, a height of the inner flange 1521 is smaller than that of the outer flange 1525.

[170] An inner side of the outer flange 1525, as shown in FIG. 30, can be configured to be gradually widened downward. Namely, it can be tapered. In the suction pad shown in FIG. 29, an outer side of the outer flange 1525 is tapered as well.

[171] The outer flange 1525 can have one of the same configurations of the flanges of the suction pads shown in FIGs. 1 to 15.

[172] Meanwhile, the inner flange 1521 is provided within the outer flange 1525 and formed smaller than the outer flange 1525 in height.

[173] An inner side 1521a of the inner flange 1521, as shown in FIG. 30, is configured to taper and an outer side 1521b thereof can be configured vertical. And, a root side of the outer flange 1525 can be formed thicker than the outer flange 1525 at least.

[174] If the flanges are equal to each other in height, a remaining vacuum pressure may remain between the inner flange 1521 and the outer flange 1525 to hinder a package from being unloaded. For this, if the inner flange 1521 is formed lower than the outer flange 1525, it is able to reduce the influence of the remaining vacuum pressure. And, the inner flange 1521 is effective in achieving a quick package transfer work by pushing a package with its restoring force in unloading the package. In this case, by configuring the outer side 1521b of the inner flange 1521 to be vertical and by forming the inner flange 1521 thicker than the outer flange 1525, it is able to secure the restoring force sufficiently.

[175] The package may not be evenly separated from the suction pad due to the remaining of the remaining vacuum pressure between the inner flange 1521 and the outer flange 1525. A package portion firstly separated from the suction pad is firstly dropped, whereby the package can incline to fall. So, the package may deviate from its position on the floor or unloaded upside down. Yet, the restoring force of the inner flange 1521 enables the package to be evenly separated from the suction pad and fall. Hence, the package can be unloaded without deviating from its position on the floor or being turned upside down.

[176] Thus, the inner flange 1521 enables the package to be quickly and evenly separated from the suction pad, thereby helping the package reach a destination without deviating from its position or being turned upside down.

[177] In this case, the flange can be configured to taper in a manner that its width is gradually reduced downward, to the contrary of FIG. 30.

[178] The thickness of each of the inner and outer flanges 1521 and 1525 is formed to be gradually reduced toward its end portion. Since the end portions of the inner and outer flanges 1521 and 1525 should secure sealing for vacuum suction in a manner of being easily deformed according to a surface contour of a package, they are preferably formed thin.

[179] The suction pad having the dual flanges is configured in a manner that the outer flange 1525 is deformed more flexible than the inner flange 1521. In the suction pad shown in FIG. 30, the inner flange 1521 is formed thicker and shorter than the outer flange 1525. Preferably, the inner flange 1521 is formed to enable a package to be quickly separated by providing an appropriate restoring force to the package. Preferably, the outer flange 1525 is configured to secure sealing sufficient for vacuum suction in a manner of being sufficiently and flexibly deformed to correspond to a contour of a package surface.

[180] Besides, a stopper 1540, as shown in FIG. 30, is provided within the inner flange

1521. The stopper 1540 prevents a package from being excessively sucked and held by the suction pad. If the package excessively adheres closely, sticking may take place. Hence, the stopper 1540 prevents the sticking .

[181] Vertical distance between an end portion of the stopper 1540 and an end portion of the outer flange 1525 is preferably formed greater than a normal height of a contact terminal provided to a package surface. In picking up a package, the stopper 1540 is touched to a package surface and then prevents the package from further adhering closer to the suction pad.

[182] FIGs. 31 to 35 show a unit picker for sucking and holding a plurality of semiconductor packages simultaneously. If a strip package is sawed into a plurality of individual semiconductor packages by a blade, the packages are simultaneously sucked and held by a single action and then transferred for a cleaning process. For this, the unit picker is available.

[183] Referring to FIG. 31, after completion of a sawing process, a semiconductor package is placed on a chuck table 9 and a semiconductor package suction device 101 is placed over the chuck table 9 to suck and hold the semiconductor package.

[184] The semiconductor package handling apparatus includes a frame having at least one or more air passages 161 and 171 communicating with an external air suction device, at least one suction pad 100 communicating with the air passage to suck and hold a semiconductor package, and a pad holder 111 detachably assembled to the suction pad 100. In this case, the suction pad 100 is substantially identical to that shown in FIG. 1 and its details are omitted in the following description.

[185] The frame includes a first frame 141 and a second frame 129 under the first frame 141. The air passage includes a main air passage 171 provided between the first and second frames 141 and 129 and an individual air passage 161 communicating with the main air passage 171 and the suction pad 100.

[186] The pad holder 111 is provided in one body beneath the second frame 129. In particular, the pad holder 111 and the second frame 129 can be formed in one body by injection molding.

[187] Alternatively, the pad holder 111 and the second frame 129 can be individually manufactured and then combined together. This will be explained with reference to FIG. 40 later.

[188] The suction pad can be directly attached to a bottom of the second frame 129 by bonding. In particular, to prevent air from leaking between the suction pad and the second frame 129, the suction pad is air-tightly bonded to the second frame 129. Yet, for the replacement of the suction pad, the suction pad can be attached/detached to/ from the bottom of the second frame 129 by a user s force.

[189] Alternatively, the suction pad is fitted into the pad holder 111 and attached to the bottom of the second frame 129. [190] Alternatively, a plurality of suction pads can be provided. And, a plurality of the suction pads can be manufactured in one body. In particular, the respective suction pads are provided to the bottom of the second frame in one body by being evenly spaced apart from each other. And, the respective suction pads are combined with one another to be formed into one by injection molding.

[191] As the suction pads are formed in one body by injection molding, management of the suction pads can be facilitated. In particular, in case of attempting to replace suction pads, a user is facilitated to replace the suction pads by attaching or detaching the suction pads in one body.

[192] The suction pad 100 can be projected from the bottom of the second frame 129 by a prescribed length. This enables the suction pad 100 to be elastically deformed in sucking and holding the semiconductor package. And, if the suction pad is projected, it is facilitated to come into contact with the semiconductor package.

[193] FIG. 32 is a cross-sectional diagram to depict a state that a semiconductor package sucking apparatus according to the present invention sucks and holds a semiconductor package mounted on a shuck table.

[194] Details relevant to the chuck table 9 are substantially identical to those of the related art and will be omitted in the following description. Of course, a suction pad can be provided to a top of the suck table as well.

[195] FIG. 33 is a cross-sectional diagram to depict a state that the semiconductor package sucking apparatus according to the present invention carries the semiconductor package sucked and held. The semiconductor package undergoes a cleaning process while sucked and held by the sucking apparatus.

[196] FIG. 34 is a cross-sectional diagram to depict a state that the semiconductor package sucking apparatus according to the present invention places the semiconductor package in a drying block, and FIG. 35 is a cross-sectional diagram to depict a state that the semiconductor package sucking apparatus according to the present invention completes a transfer of the semiconductor package.

[197] In the dry block, prescribed air passages 50 and 70 for sucking and holding the semiconductor package are formed. Of course, the air passages 50 and 70 are configured to communicate with an external air sucking device.

[198] The dry block, as shown in Fig. 34 and FIG. 35, includes a first block 40 and a second block 20 provided under the first block 40. Unlike the chuck table, the dry block is not provided with a soft pad for accommodating the semiconductor package.

[199] Once the semiconductor package is mounted on the first block 40, it is dried by a heating device provided to the dry block.

[200] FIGs. 37 to 39 show a unit picker having such a suction pad as shown in FIG. 16 and FIG. 17. [201] A process for sucking and holding a semiconductor package using this unit picker is explained as follows.

[202] Referring to FIG. 37, before a semiconductor package is sucked, no force is working on the sucking pad. In this case, the partition part 830 and the flanges 821 and 825 maintain their original shapes in injection molding as they are.

[203] Referring to FIG. 38, as soon as a semiconductor package is sucked by a suction pad, the suction pad is temporarily and compressively pressed. In this case, the partition part 830 is instantly deformed in thickness to absorb shock applied to the semiconductor package, thereby protecting the semiconductor package.

[204] Referring to FIG. 39, the partition part 830 returns to its original thickness and the flanges 821 and 825 suck and hold a ball contact terminal or a surface of the semiconductor package on which the ball contact terminal is formed.

[205] In doing so, each of the flanges encloses at least a portion of the ball type contact terminal to adhere closely to the surface of the semiconductor package. And, the air sucking device sucks air between the suction pad and the semiconductor package via the air passage provided to the upper frame.

[206] In this case, the flange is configured in a square ring shape to be projected from a pad body. Alternatively, the flange can be configured in a circular or polygonal ring shape.

[207] FIG. 40 shows a unit picker in a different type, in which a suction pad is substantially identical to that shown in FIG. 1. So, details of the suction pad are omitted in the following description.

[208] In a unit picker shown in FIG. 40, a pad holder 1800 is detachably assembled to the frame, and more particularly, to a second frame 1300.

[209] For the assembly between the pad holder 1800 and the second frame 1300, a first locking part 1310 in a prescribed shape is provided to a lower end portion of the second frame 1330 and a second locking part 1810 is provided to the pad holder 1800 to correspond to the first locking part 1310.

[210] The first locking part 1310 includes a first recess recessed into the second frame 1330 and a first screw thread provided to the recess.

[211] The second locking part 1810 is provided to an upper rim of the pad holder 1800 and includes a second screw thread corresponding to the first screw thread.

[212] After the pad holder 1800 is screw-locked to the second frame 1300, the suction pad is locked to the pad holder by being fitted thereto.

[213] Alternatively, after the suction pad has been locked to the pad holder 1800, the pad holder 1800 can be locked to the second frame 1300. Optionally, a sealing member can be provided between the pad holder 1800 and the second frame 1300 to prevent air leakage.

[214] Alternatively, the pad holder 1800 and the second frame 1300 can be implemented in various ways, aside from the above embodiment. For instance, the pad holder 1800 and the second frame 1300 can be locked together by snap-fitting or hook locking.

[215] FIGs. 41 to 43 show a unit picker according to another embodiment of the present invention.

[216] In FIGs. 41 to 43, wherever possible, the same reference numbers will be used throughout the drawings to refer to the same or like parts of the former unit picker. And, their details will be omitted in the following description.

[217] First of all, a suction pad 1150 is configured similar to a plurality of the suction pads formed in one body in FIGs. 23 to 26.

[218] A plurality of perforated holes are formed in the suction pad 1150 to correspond to a plurality of individual air passages 161, respectively. And, the suction pad 1150 is provided with a plurality of recesses 1131 to enable a plurality of flanges 1140 to be inserted and attached thereto by corresponding to a plurality of the perforated holes, respectively.

[219] A recess 1401 is provided to a second frame 1400 of the unit picker to enable the suction pad 1150 to be inserted and attached thereto. In the former unit picker, a plurality of the picker holders are provided. Yet, in the unit picker of the present embodiment, the former type picker holder is absent. In this case, the suction pad 1150 is assembled to the second frame 1400 by inserting and attaching the suction pad 1150 in one body to the second frame 1400. This assembly method facilitates the assembly work and also facilitates maintenance and repair of the suction pad 1150 and the second frame 1400.

[220] FIG. 44 shows a unit picker according to a further embodiment of the present invention. In FIG. 44, a unit picker differs from that of FIGs. 41 to 43 in its suction pad only but the rest are identical to those of FIGs. 41 to 43.

[221] Referring to FIG. 44, a suction pad 1180 used for a unit picker is not provided with a recess for inserting and attaching a flange 1170 thereto. And, the flange 1170 of the suction pad 1180 is built in one body.

[222] By aligning the flange 1170 with a corresponding position of a body 1160 of the suction pad 1180 and the bonding it thereto, the assembly of the suction pad 1180 is completed.

[223] The suction pad 1180 shown in FIG. 44 has the flange 1170 in one body. Hence, its assembly work is much simpler and the management of the flange 1170 is facilitated.

[224] Besides, FIG. 45 is a bottom diagram of the unit picker shown in FIG. 41 and FIG. 42.

[225] While the present invention has been described and illustrated herein with reference to the preferred embodiments thereof, it will be apparent to those skilled in the art that various modifications and variations can be made therein without departing from the spirit and scope of the invention. Thus, it is intended that the present invention covers the modifications and variations of this invention that come within the scope of the appended claims and their equivalents. For instance, the present invention is applicable to various structures capable of sucking and holding a package such as off-loading pickers, unit pickers, turntable pickers, chuck tables, turntables (sawing process) and the like.

Industrial Applicability The present invention relates to a semiconductor package handling device, and more particularly, to a suction pad suitable for sucking and holding a semiconductor package more efficiently. Accordingly, a suction pad according to the present invention is freely deformed according to a surface contour of a semiconductor package to suck and hold, thereby facilitating an uneven surface of the semiconductor package such as a ball grid array package, a board-on-chip and the like.

Claims

[I] A suction pad in a semiconductor package handling device, comprising: a body having an air suction hole; and at least one soft sealing member configured to be flexibly deformed according to a surface contour of a suction target, the at least one soft sealing member sealing a suction space communicating with the air suction hole. [2] The suction pad of claim 1, wherein the sealing member comprises a flange placed on a lower portion of the body. [3] The suction pad of claim 2, wherein the flange and the body are formed in one body to configure a single piece. [4] The suction pad of claim 3, wherein the flange is configured to gradually decrease in thickness from a root of the flange toward an end portion of the flange. [5] The suction pad of claim 4, wherein a lower thickness of the flange is

0.1~0.5mm. [6] The suction pad of claim 4, wherein an upper thickness of the flange is

0.3~0.8mm.

[7] The suction pad of claim 2, wherein a length of the flange is 0.7- 1.0mm.

[8] The suction pad of claim 2, wherein a mixed ratio of silicon to carbon in the flange is 3:1 and wherein the flange contains about 1% hydroperoxide hardening material. [9] The suction pad of claim 2, wherein at least one portion of an inner side of the flange is configured to incline in an external direction of the flange. [10] The suction pad of claim 2, wherein an outer side of the flange comprises a vertical face and an incline face inclining in an external direction.

[I I] The suction pad of claim 2, wherein the flange has a circular or polygonal cross- section.

[12] The suction pad of claim 2, wherein the flange includes at least two flanges overlapped with each other by being evenly spaced from each other. [13] The suction pad of claim 12, wherein an inner one of the at least two overlapped flanges is configured shorter than an outer one of the at least two overlapped flanges. [14] The suction pad of claim 13, wherein the inner flange and the outer flange differ from each other in a length difference of 0.2~0.5mm. [15] The suction pad of claim 12, wherein a length of the inner flange is 0.4~0.8mm and wherein a length of the outer flange is 0.7- 1.0mm. [16] The suction pad of claim 13, wherein the inner flange is configured thicker than the outer flange.

[17] The suction pad of claim 16, wherein the inner flange is configured to gradually decrease in thickness from a root connected to the body to an end portion.

[18] The suction pad of claim 17, wherein an inner side of the inner flange is configured to gradually incline toward the end portion in an external direction.

[19] The suction pad of claim 18, wherein an outer side of the inner flange is configured vertical.

[20] The suction pad of claim 3 or claim 12, further comprising a stopper restricting a close adherence of the suction target.

[21] The suction pad of claim 20, wherein the stopper is provided within the suction space.

[22] The suction pad of claim 3, further comprising a shock absorbing projection provided between a picker holder and a semiconductor package to absorb shock applied to the semiconductor package in sucking and holding the semiconductor package.

[23] The suction pad of claim 3, wherein in removing the sucked target, the body further comprises a perforated hole playing a role as a moving passage of a pressurizing member for applying a specific force to the sucked target.

[24] A suction pad in a semiconductor package handling device, comprising: a plurality of bodies having a plurality of air suction holes, respectively; and a plurality of soft flanges provided to a plurality of the bodies, respectively, a plurality of the soft flanges configured to be flexibly deformed according to a surface contour of a suction target, a plurality of the soft flanges configured to seal a plurality of suction spaces communicating with a plurality of the air suction holes, respectively, wherein a plurality of the bodies and a plurality of the soft flanges are formed in one body.