WO2008127186A1 - Silicon carbide semiconductor device - Google Patents

Silicon carbide semiconductor device Download PDF

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Publication number
WO2008127186A1
WO2008127186A1 PCT/SE2008/050408 SE2008050408W WO2008127186A1 WO 2008127186 A1 WO2008127186 A1 WO 2008127186A1 SE 2008050408 W SE2008050408 W SE 2008050408W WO 2008127186 A1 WO2008127186 A1 WO 2008127186A1
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Prior art keywords
region
drift region
doping
additional layer
sic
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PCT/SE2008/050408
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French (fr)
Inventor
Martin Domeij
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Transic Ab
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Application filed by Transic Ab filed Critical Transic Ab
Priority to EP08741898A priority Critical patent/EP2135284A4/en
Priority to US12/450,708 priority patent/US8829533B2/en
Publication of WO2008127186A1 publication Critical patent/WO2008127186A1/en

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    • H01L29/66068—Multistep manufacturing processes of devices having a semiconductor body comprising crystalline silicon carbide the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
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    • H01L29/1608—Silicon carbide

Definitions

  • the present invention relates to a semiconductor device in silicon carbide, with a highly doped substrate region and a drift region.
  • SiO tsUiGon carbide
  • SiC has excel! semiconductor devices.
  • SiC has due to its wide bandgap nearly ten times higher critical field strength than silicon and the wide bandgap also provides the possibility for devices that can operate at high temperatures.
  • the thermal conductivity of SiC is also 2-3 times higher than for Si and this improved heat transport means that SiC devices can operate at higher power densities without
  • Power switching transistors and diodes are used in a wide variety of power electronic systems such as power supplies, motor drives, welding, electric vehicles, trains and transmission and distribution of electric power on the grid
  • the fundamental material properties of Si are a barrier to substantial reductions of the power losses, that become more and more limiting for the continuous downsca ⁇ ng of power electronic systems.
  • Another more promising way to reduce the power losses is to develop power devices in a new material with wider bandgap.
  • SiC Silicon carbide
  • SiC is the most mature of the wide bandgap semiconductors, High-quality wafers in SiC are available, and thermal SiO 2 can be grown to fabricate SiC MOSFET transistors and high-quality surface passivation.
  • SiC has about ten times higher critical field strength than Si and this means that the drift layer can be made much thinner and with a higher doping concentration.
  • SiC devices have therefore a much tower on-state resistance than Si devices which means lower conduction power Josses, and SiC devices have less stored charge which means reduced switching power losses compared to Si bipolar devices like !GBTs.
  • SiC p ⁇ diodes have the disadvantage that a forward voltage of close to 3 V has to be applied to give forward conduction and this means reiatively high conduction power losses for pn diodes with moderate breakdown voltages, SiC pn diodes are therefore competitive mainly in applications where breakdown voltages exceeding about 2 kV are required,
  • SiC bipoiar junction transistors are attractive aiso for iower breakdown voltages because the base-emitter voltage and the base- collector voltage nearly cancel each other, and due to this junction cancellation, the forward voltage and the conduction power losses can become very low. Since the voltage blocking enabling drift region (the collector) of SiC BJTs is much thinner than for a Si bipolar device, there is also much less stored charge and the switching is faster resulting in lower switching power losses,
  • BJTs Bipolar junction transistors
  • npn bipolar junction transistor has emitter and collector regions with n-type doping and a base region with p-type doping.
  • the emitter, base and collector have separate metal contacts that can be biased with respect to each other, if the base-emitter voltage is less than the built- in potential of the base-emitter junction, then the BJT is in its off-state. In the off- state, the BJT can block a high positive voltage applied between the collector and the emitter.
  • the blocking capability is limited by avalanche breakdown of the base- collector junction if the base is designed with a doping dose high enough to avoid punch-through at voltages below the avalanche breakdown voltage, The avalanche breakdown voltage is limited by the doping and thickness of the collector region which constitutes the drift region in the BJT.
  • the BJT is in its on-state, in the on-state, electrons are injected from the emitter to the base and, provided that the base is thin enough and the carrier lifetime is sufficiently high, most electrons diffuse through the base without recombini ⁇ g and reach the collector, thus causing a collector current.
  • the emitter is doped with a higher concentration of n-type dopants than the concentration of p-type dopants in the base, in order to achieve high emitter injection efficiency, which means that the current at the base-emitter Junction is dominated by ⁇ i ⁇ ctrons.
  • the collector current ic in the BJT, in the on-state, consists mainly of eiectro ⁇ s that are injected from the emitter and diffuse through the base, Ic is therefore controlied by the base current IB and I 0 is equal to the current gain ⁇ times IB.
  • a high current gain is desired for a power BJT to be able to keep the BJT in its on-state with as low base current as possible, to simplify the drive circuit requirements,
  • Power switching BjTs have typically a verticai topology as shown schematically in figure 1.
  • the n ⁇ type doped drift region (often referred to as coiiector), which has a doping and thickness chosen to achieve the desired breakdown voltage, is placed on top of a substrate which has a high n-type doping to minimize the series resistance and to simplify fabrication of the collector ohmic contact,
  • a base layer with p ⁇ type doping is located on top of the collector and an n- doped emitter region on top of the base region.
  • the base and coiiector regions can be iaterally confined after fabrication by local diffusion or ion implantation (see figure 1a), or the base and emitter regions can be placed vertically on top of the collector region with junction termination by local etching of the semiconductor (see figure 1 b).
  • SiC bipolar junction transistors BJTs
  • BJTs SiC bipolar junction transistors
  • the vertical BJT structure shown in figure 1 b is most commonly used for SiC BJTs since diffusion of dopants cannot be used, and ion implantation has been found to create current gain degrading defects if it is performed in the active region of the bipolar Junction transistor.
  • the highly doped p-type region can be formed in two ways: 1 ⁇ By ion implantation of p-type dopants as described in U.S. Patent No. 4,945,394. ion implantation of p-type dopants, such as aluminum is wei! known for forming p ⁇ doped regions in SiC pn diodes, see for example: Vodakov et al., "Electrical properties of p-n- ⁇ + structure formed in silicon carbide by implantation of aluminum ions", Soviet Physics - Semiconductors, VoI 21 , No. 9, p. 1017, (1987)
  • SiC BJTs have been experimentally shown to have very low on-state voltages and therefore conduction power loss that are significantly tower than Si IGBTs and Si MOSFETs for a transistor with a breakdown voltage of 1000 V [Krishnaswami et al., "1 QQO-V 30-A 4H-SiC BJTs with high current gain", iEEE Eiectron Device Letters, Vol. 26, No, 3, p. 175, (2005)]. SiC BJTs have also been shown to have a forward voltage with a positive temperature coefficient and a current gain with a negative temperature coefficient.
  • SiC pn diodes are known, and high voltage blocking capability has been shown experimentally [Lendenrnann et al,, "Long term operation of 4.5 kV PIN arsd 2.5 kV JBS diodes 11 , Materials Science Forum, VoIs. 353-356, p. 727, (2001 )].
  • SiC pn diodes have a lowly n-doped region called drift layer on top of the ⁇ -doped substrate. The drift layer is designed with sufficiently low doping and sufficient
  • a p doped region can either be placed on lop of the drift layer or be laterally confined after fabrication by focal diffusion or ion implantation. Both types of SiC p ⁇ diodes are shown in figure 2, Metal is deposited, patterned and etched to form an anode contact to the p-type region and a cathode contact to the n-
  • a silicon carbide diode can have a traditional buffer iayer with a doping concentration in the range of one to two orders of magnitude higher than the doping concentration of the drift region. We assume the lowest buffer layer doping, i.e. ten times higher than the doping of the drift region. If the diode is made with a conventional punch-through design that minimizes its unipolar series resistance, then the electric field distribution at the limit of avalanche breakdown will look as shown in figure 3. The electric field at the right border of the drift region is now 1/3 of the maximum eiectric field Emax which is reached at the pn junction.
  • the buffer layer has ten times higher doping concentration than the drift region and the ten times higher space charge concentration causes the gradient of the electric field to increase by a factor of ten compared to the drift region.
  • the buffer iayer in the silicon carbide diode is designed to reduce the electric field to zero before it reaches the highly doped n 4 substrate and figure 3 shows that the buffer layer thickness (W n ) only has to exceed 5 % of the thickness of the drift region (W n .) to reduce the electric field to zero before il reaches the highly doped n ⁇ substrate.
  • the buffer layer can be made even thinner without a high electric field reaching the n* substrate.
  • Publication EP 1893898 A1 shows another use of buffer layers, which is to prevent free carriers in a silicon carbide device from reaching and recombining in the heavily doped substrate where they can cause formation of stacking faults and a thereby associated device degradation.
  • This type of buffer layer can be made thicker than conventional buffer iayers, In order to work efficiently, the doping concentration in the buffer layer must then, however, be considerably higher than tion of i
  • the drift velocities of eiectrons and holes are limited to the carrier saturation velocity, and at high current densities, the carrier concentrations therefore increase and their concentrations depend on the local current densities.
  • the free carrier concentrations can exceed the doping concentration in the lowly doped drift layer and the space charge of the free carriers will then influence the local electric field significantly.
  • the current controlled space charge will induce a negative differential resistance for the device, and this negative differentiaf resistance leads to the formation of high current density filaments, which in most cases cause local overheating and destruction of the device.
  • the occurrence of the negative differential resistance is associated with the appearance of impact ionization leading to the injection of free carriers into the drift region from both sides.
  • this negative differential resistance can occur either as the diode is driven deep into avalanche breakdown [Egawa, "Avalanche characteristics and failure mechanism of high voltage diodes", IEEE Transactions on Electron Devices, Voi ED-13, No. 11 , p, 754, ⁇ 1988 ⁇ ] or as an effect of dynamic avalanche that occurs during fast turn-off of the diode to a high voltage [Domeij above].
  • the negative differential resistance is in both cases caused by the appearance of impact ionization at both sides of the drift region.
  • the negative differential resistance can occur during avalanche breakdown or as a result of dynamic avaianche during turn-off or during short- circuit conditions.
  • the present invention is of particular interest for the SiC BJT.
  • Il is also a problem to modify the electric field distribution in the border region between the drift region and the n-doped substrate in order to achieve the desired suppression of the occurrence of a negative differential resistance and the pushing of the onset of negative resistance to higher current densities.
  • the present invention teaches that the safe operating area of SiC semiconductor devices is improved by the use of an n-doped additional layer, with optimized doping and thickness, between the n-doped substrate and the n-doped drift region, i.e. the region which has a doping and thickness designed for ensuring sufficient voltage blocking capability.
  • the present invention extends the prior art of so-cail ⁇ d buffer layers, which has traditionally been used to prevent the eiectric field from reaching the p layer in a so-called punch-through IGBT and at the same time
  • n + substrate can be of lower material quality than the drift region which has been grown epitaxially.
  • the additional layer of the present invention differs from the traditional buffer layer not only in the purpose and technical effect of the extra layer but also in physical design by being substantially thicker than the traditional buffer layer, where the thickness of a traditional buffer layer only has to exceed 5 % of the thickness of the drift region as shown in relation to figure 3 in the previous description of prior art, and where the traditional buffer layer can be even thinner if a higher doping concentration is used.
  • Publication EP 1893898 AI 1 as described in prior art teaches a use of buffer layers that can be made thicker than conventional buffer layers, but then also with a doping concentration in the buffer layer that is considerably higher than the doping concentration of conventional buffer layers and most certainly higher than the doping concentration of the additional layer according to the present invention.
  • the critical location, inside the device, that determines the onset of the negative resistance is the border between the drift region and the n-doped substrate.
  • the present invention teaches that the electric field distribution in the border region between the drift region and the n-doped substrate is modified by the introduction of an additional n-doped layer between the drift layer and the n-doped substrate.
  • the doping and the thickness of the additional layer are optimized to suppress the occurrence of a negative differential resistance and thus push the onset of negative resistance to higher current
  • Buffer layers between the drift layer and the ⁇ -doped substrate are known and can be used for improving the material quality of the epitaxiaily grown drift layers. These known buffer layers have, however, much smaller thickness and clearly higher doping concentrations than the additional layer according to the
  • the additional iayer of the present invention has a thickness that exceeds at least 10 % the thickness of the drift region and a doping concentration below 1 -1G 1 ? crrf 3 . It is thus dear that the thickness (W n ) of the traditional buffer layer is smaller than the width of an additional layer according to the present innovation.
  • Such layers can consist of several thinner layers with different doping concentrations or a graded doping profile in the
  • the advantages of a semiconductor device according to the present invention are a wider safe operating area under the following conditions: reverse recovery to high voltages with high dl/dt for SiC pn diodes, avalanche breakdown with high currents for SiC pn diodes and BJTs, inductive load switching to high voltages for SiC BJTs, and short-circuit operation (turn-on to a high collector current with a high collector-emitter voltage and very small series resistance) for SsC BJTs.
  • Figure 1 shows schematically a cross-section of vertical power bipolar junction transistors according to prior art; a) showing laterally confined emitter and base regions, and b) showing a vertical emitter structure with etched terminations of base-emitter and base-collector junctions
  • Figure 2 shows schematically a cross-section of vertical pn diodes according to prior art; a) showing a laterally confined p-anode region, and b) showing a vertical p-anode structure with etched terminations of the p ⁇ junction
  • Figure 3 is a graph showing design of a traditional buffer layer according to prior art
  • Figure 4 is a schematic and simplified cross-section of the doping in the
  • i is a schematic and simplified cross-section of the doping in the vertical p ⁇ diode with different types of additional layers according to the present invention
  • Figure 8 is a graph with a simulated current density vs. caravanage applied between the n cathode contact and the p anode contact, where a diode with an additional iayer is shown with a solid iine and a diode without an additional iayer is shown with a dashed iine, is a graph with a simulated eiectric field distribution in cross- section of the pn diodes at a current density of 20 000 A/cm 2
  • i is a schematic cross-section of a proposed inventive SiC BJT.
  • Figure 4 shows schematically a semiconductor device 1 in silicon carbide, with a highiy doped substrate region 11 and a drift region 12.
  • An additional layer 13 is positioned between the highly doped substrate region 11 and the drift region 12, the additional layer 13 providing a wider safe operating area at high voltages with subsequently high current densities.
  • the additional layer 13 has the same type of doping as the substrate region 11 and the drift region 12, and the doping concentration in the additional layer 13 is higher than the doping concentration in the drift region 12 and tower than the doping concentration in the substrate region 11.
  • the presentment invention teaches that doping concentration of the additional layer 13 can be smaller than 1 -10 17 cm '3 and that the additional layer 13 can have a thickness of at least 10 % of the thickness of the drift region 12.
  • the additional layer can be doped in different ways, figure 4 showing a constant doping concentration in the additional layer 13. it Is also possible to have a non-constant doping concentration in the additional iayer,
  • Figure 5a shows an embodiment where the non-constant doping concentration of the additional layer 13 ! has a gradient with higher concentration on the border to the substrate region 11 than on the border to the drift region 12.
  • Figure 5b shows an embodiment where the additional iayer 13" consist of several internal layers, each internal layer being thinner than 10 % of the width of the drift region 12.
  • the internal iayers closer to the substrate region 11 have a higher doping concentrations than the internal layers cioser to the drift region 12,
  • a diode with an additionai layer is shown with a solid line and a diode without an additional layer is shown with a dashed line.
  • the drift iayer (12) has a n-type doping with a doping concentration of 4'1O 1S cm "3 and a thickness of 15 ⁇ m. Highly doped p and n regions are present on both sides as shown in the Rg. 3.
  • the structure to be analyzed is a one- dimensional pn diode and this pn diode constitutes aiso the base-collector junction of a SiC BJT,
  • device simulation results will be presented to illustrate the efficiency of the additional layer (13) for suppressing the occurrence of a negative differential resistance.
  • the device simulation soives locally Poisson's equation and the continuity equations for electrons and holes including impact
  • the pn diode is an adequate model for simulating also the safe operating area (SOA) limit of a bipolar transistor qualitatively since the space charge effects that limit the SOA in BJTs and pn diodes are similar.
  • SOA safe operating area
  • Some quantitative difference can, however, be expected because the current distribution in a BJT is more inhomogeneous than in a pn diode and therefore higher current densities are likely to occur in BJTs than in pn diodes, thus making the BJT more sensitive to the appearance of negative differentia! resistance and destruction.
  • Fig. 3 shows the doping profiles with and without the additional layer (13).
  • the doping concentration in the additional layer is carefully chosen to compensate for the charge of free carriers at high current densities and thereby suppress the appearance of a high electric field and impact ionization at the border of the substrate.
  • Figure 6 shows the simuiated current density vs. voltage appiied positive from the n-doped side of the diode with reference to the p-doped side of the pn diode, Le. the pn diode is reverse biased.
  • Avalanche breakdown starts between 2600 V and 2800 V for both diodes and the current increases by orders of magnitude with very small further increases of the voltage, as is typical for avalanche breakdown with moderate current densities.
  • Figure 8 shows a cross-section of one cell of the active region of the NPN SiC BJT of the preferred embodiment of the present invention, Six layers with different doping concentrations are present in the B JT of the present invention as shown in Table 1 ,
  • the layers are designed with thicknesses and doping concentrations that are determined by the following requirements;
  • a high current gain is important to control the B JT with a small base current, The current gain is enhanced by using a narrow base ⁇ a small W 8 ) to reduce the base recombination. It is also important that the emitter doping (NE) is significantly higher than the base doping (NB) to improve the emitter efficiency and the current gain. In addition, a high material quality with a high carrier lifetime ⁇ in the base layer is important to reduce the recombination in the base and a low surface recombination velocity S at the side-wall of the base-emitter junction. A tow surface recombination is obtained using a high quality passivation of the etched surface that terminates the base-emitter junction. This passivation can consist of silicon dioxide or other insulator materials that can be fabricated with low
  • Designing the SiC BJT for high voltage blocking imposes a requirement of a maximum allowed collector doping Nc and a minimum required width of the collector region W 0 .
  • the maximum blocking voltage aiso imposes a requirement of a minimum doping concentration N 8 in the base and a minimum thickness of the base region W 8 to avoid punch-through of the eiectric field from collector to emitter.
  • the minimum required value of WB is calculated for a given Ns by determining the sum of the expansions of the depletion regions of the base- collector and base-emitter junctions into the base at the maximum blocking voltage.
  • the emitter doping IM E is chosen in the range of 1 -10 19 cm “3 and the emitter thickness W E is about 1 ⁇ m to obtain an optimum emitter injection ;ic
  • a thin emitter contact region with very high doping concentration NEC ⁇ -I O 19 cm “3 is used on top of the emitter layer to improve the ohmic contact to the emitter.
  • the additional layer, the drift region (also referred to as collector), the base region, the emitter region and the emitter contact region are fabricated by epitaxial growth, pref ⁇ rabiy in one continuous epitaxial growth run to minimize the creation of defects during growth.
  • ICP Inductively Coupled Plasma
  • One alternative to the ion impiantat ⁇ on step above is to use epitaxial regrowth of a highly doped p region followed by local etching as described in U.S.
  • Patent Nos. 8,815,304 and 6,982,440 and in Danieisson et al. "Extrinsic base design of SiC bipolar transistors", Materials Science Forurn, VoIs. 457-460, p.
  • a second step of ion impiantatio ⁇ of aluminum is used with an energy above 100 keV and with a dose on the order of 1 -10 13 cm “2 to create a junction termination extension (JTE) to achieve sufficiently high blockingiserage capability of the base-collector Junction.
  • JTE junction termination extension
  • the JTE region is located outside the etched termination of the bas ⁇ -coiiector junction, and it is defined by a photolithographic
  • High temperature annealing is performed at temperatures between 1500 and 1800 0 C in an epitaxy reactor or using flash-lamp annealing.
  • Thermal oxidation of silicon carbide is performed to passivate the surfaces in the device and to create an isolation oxide.
  • Contact windows are defined using photolithographic steps, using different masks for the emitter and base contacts.
  • Metal is deposited, by sputtering or evaporation, and patterned using lift-off of the photoresist to form metal contacts to the emitter and base regions and metai is also deposited on the backside of the wafer to form the collector contact.
  • Separate metals are used for the n-type and ⁇ type doped regions.
  • Nickel is preferred for ⁇ -type and an alloy of Nickel, Titanium and Aluminum is suitable for the p-type contact,
  • a thick silicon dioxide isolation layer is deposited using Plasma Enhanced
  • Via holes are defined by a photoiithographic step and etched in the silicon dioxide using oxide dry etching.
  • Metal preferably aluminium or gold is deposited to fill the via holes.
  • a last photolithographic step defines the metal pads that cover the device active region and serve as contact areas for wire bonding, Wet or dry etching of metal is used to define the metal pads for the base and emitter regions.
  • a backside metallization that Is suitable for soldering, is deposited and the
  • BJT chips are cut out and prepared for soldering and wire bonding in a discrete package or in a power module. It will be understood that the invention is not restricted to the aforede- scribed and illustrated exemplifying embodiments thereof and that modifications can be made within the scope of the inventive concept as illustrated in the accompanying Claims.

Abstract

The present invention relates to a semiconductor device (1) in silicon carbide, with a highly doped substrate region (11) and a drift region (12). The present invention specifically teaches that an additional layer (13) is positioned between the highly doped substrate region (11) and the drift region (12), the additional layer (13) thus providing a wide safe operating area at subsequently high voltages and current densities.

Description

The present invention relates to a semiconductor device in silicon carbide, with a highly doped substrate region and a drift region.
tsUiGon carbide (SiO) has excel! semiconductor devices. SiC has due to its wide bandgap nearly ten times higher critical field strength than silicon and the wide bandgap also provides the possibility for devices that can operate at high temperatures. The thermal conductivity of SiC is also 2-3 times higher than for Si and this improved heat transport means that SiC devices can operate at higher power densities without
Power switching transistors and diodes are used in a wide variety of power electronic systems such as power supplies, motor drives, welding, electric vehicles, trains and transmission and distribution of electric power on the grid
It is important to reduce power losses in power transistors and diodes as much as possible, since the power losses are wasted energy and because they limit the minimum size of the power electronic system. Today, power transistors in silicon (Si) such as MOSFETs and Insulated Gate Bipolar Transistors (IGBTs) are dominant in power electronics. The minimum power losses of these Si devices are, however, limited by the thick lowly doped drift region that is necessary to ensure high voltage blocking capability. The thick drift region adds to the on-state resistance of the devices thus increasing the power losses during conduction and in bipolar Si devices there is a significant stored charge that causes slower switching and increased switching power losses. The fundamental material properties of Si are a barrier to substantial reductions of the power losses, that become more and more limiting for the continuous downscaϋng of power electronic systems. Another more promising way to reduce the power losses is to develop power devices in a new material with wider bandgap.
Silicon carbide (SiC) is the most mature of the wide bandgap semiconductors, High-quality wafers in SiC are available, and thermal SiO2 can be grown to fabricate SiC MOSFET transistors and high-quality surface passivation. SiC has about ten times higher critical field strength than Si and this means that the drift layer can be made much thinner and with a higher doping concentration. SiC devices have therefore a much tower on-state resistance than Si devices which means lower conduction power Josses, and SiC devices have less stored charge which means reduced switching power losses compared to Si bipolar devices like !GBTs.
SiC pπ diodes have the disadvantage that a forward voltage of close to 3 V has to be applied to give forward conduction and this means reiatively high conduction power losses for pn diodes with moderate breakdown voltages, SiC pn diodes are therefore competitive mainly in applications where breakdown voltages exceeding about 2 kV are required,
SiC bipoiar junction transistors (BJTs), ore the other hand, are attractive aiso for iower breakdown voltages because the base-emitter voltage and the base- collector voltage nearly cancel each other, and due to this junction cancellation, the forward voltage and the conduction power losses can become very low. Since the voltage blocking enabling drift region (the collector) of SiC BJTs is much thinner than for a Si bipolar device, there is also much less stored charge and the switching is faster resulting in lower switching power losses,
Bipolar junction transistors (BJTs) are well known and they are used in high frequency and in power electronics applications. BJTs have two pn junctions in close proximity to each other. A region called the collector has a junction to a region called the base and the base has a junction to a region called the emitter. The collector and emitter regions have dopings of the same type, either n-type or p-type. The base region has a doping of the opposite type as the collector and emitter. The most commonly used bipolar transistor, referred to as npn bipolar junction transistor, has emitter and collector regions with n-type doping and a base region with p-type doping.
The emitter, base and collector have separate metal contacts that can be biased with respect to each other, if the base-emitter voltage is less than the built- in potential of the base-emitter junction, then the BJT is in its off-state. In the off- state, the BJT can block a high positive voltage applied between the collector and the emitter. The blocking capability is limited by avalanche breakdown of the base- collector junction if the base is designed with a doping dose high enough to avoid punch-through at voltages below the avalanche breakdown voltage, The avalanche breakdown voltage is limited by the doping and thickness of the collector region which constitutes the drift region in the BJT. if the base-emitter voltage is about equai to, or larger than, the built-in potentiai of the base-emitter junction then the BJT is in its on-state, in the on-state, electrons are injected from the emitter to the base and, provided that the base is thin enough and the carrier lifetime is sufficiently high, most electrons diffuse through the base without recombiniπg and reach the collector, thus causing a collector current. The emitter is doped with a higher concentration of n-type dopants than the concentration of p-type dopants in the base, in order to achieve high emitter injection efficiency, which means that the current at the base-emitter Junction is dominated by βiβctrons.
The collector current ic in the BJT, in the on-state, consists mainly of eiectroπs that are injected from the emitter and diffuse through the base, Ic is therefore controlied by the base current IB and I0 is equal to the current gain β times IB. A high current gain is desired for a power BJT to be able to keep the BJT in its on-state with as low base current as possible, to simplify the drive circuit requirements,
Power switching BjTs have typically a verticai topology as shown schematically in figure 1. The n~type doped drift region (often referred to as coiiector), which has a doping and thickness chosen to achieve the desired breakdown voltage, is placed on top of a substrate which has a high n-type doping to minimize the series resistance and to simplify fabrication of the collector ohmic contact,
A base layer with p~type doping is located on top of the collector and an n- doped emitter region on top of the base region. The base and coiiector regions can be iaterally confined after fabrication by local diffusion or ion implantation (see figure 1a), or the base and emitter regions can be placed vertically on top of the collector region with junction termination by local etching of the semiconductor (see figure 1 b). SiC bipolar junction transistors (BJTs) are well known. See for example: yϋnch et al.< "Silicon Carbide Bipolar Transistor", Solid-State Eiectronics, Voi. 21 , pp. 479-480, (1978)
Luo et al., "Demonstration of 4H-SiC Power Bipolar Junction Transistors", Eiectronic Letters, Vol. 36, No. 17, (2000) Ryu et al., "1800 V1 3.8 A bipolar junction transistors in 4H-SiC", Proceedings of the 58th Device Research Conference (DRC), p. 133, (2000)
The vertical BJT structure shown in figure 1 b is most commonly used for SiC BJTs since diffusion of dopants cannot be used, and ion implantation has been found to create current gain degrading defects if it is performed in the active region of the bipolar Junction transistor.
One crucial aspect in fabrication of SiC BJTs is the need to form a highly doped p-typβ region locally under the base contact. The highly doped p-type region can be formed in two ways: 1 } By ion implantation of p-type dopants as described in U.S. Patent No. 4,945,394. ion implantation of p-type dopants, such as aluminum is wei! known for forming p~doped regions in SiC pn diodes, see for example: Vodakov et al., "Electrical properties of p-n-π+ structure formed in silicon carbide by implantation of aluminum ions", Soviet Physics - Semiconductors, VoI 21 , No. 9, p. 1017, (1987)
2) By epitaxial regrøwth of a highly doped p-type region and subsequent etching as described in U.S. Patent Nos. 6,815,304 and 8,982,440 and in Danielsson et al., "Extrinsic base design of SiC bipoiar transistors", Materials Science Forum, VoIs. 457-460, p. 1117, (2004) SiC BJTs have been experimentally shown to have very low on-state voltages and therefore conduction power loss that are significantly tower than Si IGBTs and Si MOSFETs for a transistor with a breakdown voltage of 1000 V [Krishnaswami et al., "1 QQO-V 30-A 4H-SiC BJTs with high current gain", iEEE Eiectron Device Letters, Vol. 26, No, 3, p. 175, (2005)]. SiC BJTs have also been shown to have a forward voltage with a positive temperature coefficient and a current gain with a negative temperature coefficient. Both temperature dependencies are important to facilitate a safe parallel connection of SiC B JTs and thereby successful application in power moduies that consist of several transistor chips connected in parallel . For successfui application of power switching SiC BJTs, a relatively high current gain exceeding 50 is probably required, and a wide safe operating area must be proved.
SiC pn diodes are known, and high voltage blocking capability has been shown experimentally [Lendenrnann et al,, "Long term operation of 4.5 kV PIN arsd 2.5 kV JBS diodes11, Materials Science Forum, VoIs. 353-356, p. 727, (2001 )]. SiC pn diodes have a lowly n-doped region called drift layer on top of the π-doped substrate. The drift layer is designed with sufficiently low doping and sufficient
A p doped region can either be placed on lop of the drift layer or be laterally confined after fabrication by focal diffusion or ion implantation. Both types of SiC pπ diodes are shown in figure 2, Metal is deposited, patterned and etched to form an anode contact to the p-type region and a cathode contact to the n-
Both for the SiC BJT and for the SiC pn diode a wide safe operating area is required, in the following sections, it is described how the present invention provides a wider safe operating area for SiC semiconductor devices. The above described SiC BJTs and SiC pn diodes are two preferred embodiments of the invention, in which the benefits of the invention are substantial, The so-cailed buffer iayers according to prior art has traditionaily been used to prevent the electric field from reaching the p iayer in a so-called punch- through IGBT and at the same time reduce the injection of holes from the p layer [Nakagawa et al., 600- and 1200-V Bipoiar-Mode MGSFETs with High Current Capability", IEEE Electron Device Letters, Vol. EDI-6, No. 1, p. 378, (1985)]. A silicon carbide diode can have a traditional buffer iayer with a doping concentration in the range of one to two orders of magnitude higher than the doping concentration of the drift region. We assume the lowest buffer layer doping, i.e. ten times higher than the doping of the drift region. If the diode is made with a conventional punch-through design that minimizes its unipolar series resistance, then the electric field distribution at the limit of avalanche breakdown will look as shown in figure 3. The electric field at the right border of the drift region is now 1/3 of the maximum eiectric field Emax which is reached at the pn junction. The buffer layer has ten times higher doping concentration than the drift region and the ten times higher space charge concentration causes the gradient of the electric field to increase by a factor of ten compared to the drift region. The buffer iayer in the silicon carbide diode is designed to reduce the electric field to zero before it reaches the highly doped n4 substrate and figure 3 shows that the buffer layer thickness (Wn) only has to exceed 5 % of the thickness of the drift region (Wn.) to reduce the electric field to zero before il reaches the highly doped n÷ substrate. If the doping concentration of the buffer layer (H) is higher than the doping concentration of the drift region (N-) by more than one order of magnitude (as is typical) then the buffer layer can be made even thinner without a high electric field reaching the n* substrate. Publication EP 1893898 A1 shows another use of buffer layers, which is to prevent free carriers in a silicon carbide device from reaching and recombining in the heavily doped substrate where they can cause formation of stacking faults and a thereby associated device degradation. This type of buffer layer can be made thicker than conventional buffer iayers, In order to work efficiently, the doping concentration in the buffer layer must then, however, be considerably higher than tion of i
it is known that the safe operating area of bipolar junction transistors in Si is limited by second breakdown [Hower et al., "Avaianche injection and second breakdown in transistors", IEEE Transactions on Electron Devices, Vol. ED-17, No. 4, p. 320, (1970)], and that this effect is caused by the space effects that are induced by high current densities in combination with high voltages, The limits of second breakdown are important for BJTs during turn-off to high voltages and during short-circuit conditions. it is further known that the safe operating area of pn diodes in Si during fast turn-off to high voltages is limited by dynamic avaianche [M. Domeij et ai., On the destruction limit of Si power diodes during reverse recovery with dynamic avalanche", IEEE Transactions on Electron Devices, Vol. 50, No. 2, p. 486,
(2003)], and that a simiiar type of space charge effects limit the safe operating of Si pn diodes and in the Si BJTs. The space charge effects can, in a condensed manner, be described as follows:
At high electric fields, the drift velocities of eiectrons and holes are limited to the carrier saturation velocity, and at high current densities, the carrier concentrations therefore increase and their concentrations depend on the local current densities. In a high voltage device at high current densities, the free carrier concentrations can exceed the doping concentration in the lowly doped drift layer and the space charge of the free carriers will then influence the local electric field significantly. At some critical combination of applied voltage and current density, the current controlled space charge will induce a negative differential resistance for the device, and this negative differentiaf resistance leads to the formation of high current density filaments, which in most cases cause local overheating and destruction of the device. The occurrence of the negative differential resistance is associated with the appearance of impact ionization leading to the injection of free carriers into the drift region from both sides.
In a pn diode this negative differential resistance can occur either as the diode is driven deep into avalanche breakdown [Egawa, "Avalanche characteristics and failure mechanism of high voltage diodes", IEEE Transactions on Electron Devices, Voi ED-13, No. 11 , p, 754, {1988}] or as an effect of dynamic avalanche that occurs during fast turn-off of the diode to a high voltage [Domeij above]. The negative differential resistance is in both cases caused by the appearance of impact ionization at both sides of the drift region. In a BJT, the negative differential resistance can occur during avalanche breakdown or as a result of dynamic avaianche during turn-off or during short- circuit conditions. One important difference between the pπ diode and the BJT is that higher current densities can appear locally in the BJT during turn-off and lead to dynamic avalanche at lower total device currents than for the diode which has a more homogeneous current distribution.
Due to the snhomogenous current distribution, the present invention is of particular interest for the SiC BJT.
It is a problem to improve the safe operating area of SiC semiconductor
it is a problem to suppress the occurrence of a negative differential resistance and thus push the onset of negative resistance to higher current densities, thereby widening the safe operating area.
Il is also a problem to modify the electric field distribution in the border region between the drift region and the n-doped substrate in order to achieve the desired suppression of the occurrence of a negative differential resistance and the pushing of the onset of negative resistance to higher current densities.
Solution With the purpose of solving the above mentioned technical problems the present invention teaches that the safe operating area of SiC semiconductor devices is improved by the use of an n-doped additional layer, with optimized doping and thickness, between the n-doped substrate and the n-doped drift region, i.e. the region which has a doping and thickness designed for ensuring sufficient voltage blocking capability. The present invention extends the prior art of so-cailβd buffer layers, which has traditionally been used to prevent the eiectric field from reaching the p layer in a so-called punch-through IGBT and at the same time
layer can be used in a silicon carbide diode to prevent a high electric field from reaching the heavily doped n+ substrate which can be of lower material quality than the drift region which has been grown epitaxially.
The additional layer of the present invention differs from the traditional buffer layer not only in the purpose and technical effect of the extra layer but also in physical design by being substantially thicker than the traditional buffer layer, where the thickness of a traditional buffer layer only has to exceed 5 % of the thickness of the drift region as shown in relation to figure 3 in the previous description of prior art, and where the traditional buffer layer can be even thinner if a higher doping concentration is used. Publication EP 1893898 AI 1 as described in prior art, teaches a use of buffer layers that can be made thicker than conventional buffer layers, but then also with a doping concentration in the buffer layer that is considerably higher than the doping concentration of conventional buffer layers and most certainly higher than the doping concentration of the additional layer according to the present invention.
In BJTs and pn diodes the critical location, inside the device, that determines the onset of the negative resistance is the border between the drift region and the n-doped substrate. The present invention teaches that the electric field distribution in the border region between the drift region and the n-doped substrate is modified by the introduction of an additional n-doped layer between the drift layer and the n-doped substrate. The doping and the thickness of the additional layer are optimized to suppress the occurrence of a negative differential resistance and thus push the onset of negative resistance to higher current Buffer layers between the drift layer and the π-doped substrate are known and can be used for improving the material quality of the epitaxiaily grown drift layers. These known buffer layers have, however, much smaller thickness and clearly higher doping concentrations than the additional layer according to the
The additional iayer of the present invention has a thickness that exceeds at least 10 % the thickness of the drift region and a doping concentration below 1 -1G1 ? crrf3. It is thus dear that the thickness (Wn) of the traditional buffer layer is smaller than the width of an additional layer according to the present innovation.
The desired effects of the present invention can also be obtained using different types of additional iayers, Such layers can consist of several thinner layers with different doping concentrations or a graded doping profile in the
The advantages of a semiconductor device according to the present invention are a wider safe operating area under the following conditions: reverse recovery to high voltages with high dl/dt for SiC pn diodes, avalanche breakdown with high currents for SiC pn diodes and BJTs, inductive load switching to high voltages for SiC BJTs, and short-circuit operation (turn-on to a high collector current with a high collector-emitter voltage and very small series resistance) for SsC BJTs.
A method, a system, various computer program products and a single computing unit according to the present invention will now be described in detail with reference to the accompanying drawings, in which;
Figure 1 shows schematically a cross-section of vertical power bipolar junction transistors according to prior art; a) showing laterally confined emitter and base regions, and b) showing a vertical emitter structure with etched terminations of base-emitter and base-collector junctions, Figure 2 shows schematically a cross-section of vertical pn diodes according to prior art; a) showing a laterally confined p-anode region, and b) showing a vertical p-anode structure with etched terminations of the pπ junction, Figure 3 is a graph showing design of a traditional buffer layer according to prior art, Figure 4 is a schematic and simplified cross-section of the doping in the
i is a schematic and simplified cross-section of the doping in the vertical pπ diode with different types of additional layers according to the present invention,
Figure 8 is a graph with a simulated current density vs. voitage applied between the n cathode contact and the p anode contact, where a diode with an additional iayer is shown with a solid iine and a diode without an additional iayer is shown with a dashed iine, is a graph with a simulated eiectric field distribution in cross- section of the pn diodes at a current density of 20 000 A/cm2
contact and the p anode contact, where a diode with an additional layer is shown in soiid line and diode without an additional layer is shown in dashed iine, and i is a schematic cross-section of a proposed inventive SiC BJT.
The present invention wili now be described with reference to figure 4, where a silicon carbide bipolar junction transistor for power electronics applications, is described as an exemplifying embodiment of the invention.
Figure 4 shows schematically a semiconductor device 1 in silicon carbide, with a highiy doped substrate region 11 and a drift region 12. An additional layer 13 is positioned between the highly doped substrate region 11 and the drift region 12, the additional layer 13 providing a wider safe operating area at high voltages with subsequently high current densities.
The additional layer 13 has the same type of doping as the substrate region 11 and the drift region 12, and the doping concentration in the additional layer 13 is higher than the doping concentration in the drift region 12 and tower than the doping concentration in the substrate region 11.
The presentment invention teaches that doping concentration of the additional layer 13 can be smaller than 1 -1017 cm'3 and that the additional layer 13 can have a thickness of at least 10 % of the thickness of the drift region 12.
The additional layer can be doped in different ways, figure 4 showing a constant doping concentration in the additional layer 13. it Is also possible to have a non-constant doping concentration in the additional iayer,
Figure 5a shows an embodiment where the non-constant doping concentration of the additional layer 13! has a gradient with higher concentration on the border to the substrate region 11 than on the border to the drift region 12.
Figure 5b shows an embodiment where the additional iayer 13" consist of several internal layers, each internal layer being thinner than 10 % of the width of the drift region 12. The internal iayers closer to the substrate region 11 have a higher doping concentrations than the internal layers cioser to the drift region 12,
The embodiment illustrated in figure 4 shows a SiC pn diode designed for about 1200 V, The p anode contact is to the left (at deρth-0) and the n cathode contact to the right (at depth=20 μm). A diode with an additionai layer is shown with a solid line and a diode without an additional layer is shown with a dashed line.
The drift iayer (12) has a n-type doping with a doping concentration of 4'1O1S cm"3 and a thickness of 15 μm. Highly doped p and n regions are present on both sides as shown in the Rg. 3. The structure to be analyzed is a one- dimensional pn diode and this pn diode constitutes aiso the base-collector junction of a SiC BJT, In the following, device simulation results will be presented to illustrate the efficiency of the additional layer (13) for suppressing the occurrence of a negative differential resistance. The device simulation soives locally Poisson's equation and the continuity equations for electrons and holes including impact
The pn diode is an adequate model for simulating also the safe operating area (SOA) limit of a bipolar transistor qualitatively since the space charge effects that limit the SOA in BJTs and pn diodes are similar. Some quantitative difference can, however, be expected because the current distribution in a BJT is more inhomogeneous than in a pn diode and therefore higher current densities are likely to occur in BJTs than in pn diodes, thus making the BJT more sensitive to the appearance of negative differentia! resistance and destruction.
Fig. 3 shows the doping profiles with and without the additional layer (13). The doping concentration in the additional layer is carefully chosen to compensate for the charge of free carriers at high current densities and thereby suppress the appearance of a high electric field and impact ionization at the border of the substrate. Figure 6 shows the simuiated current density vs. voltage appiied positive from the n-doped side of the diode with reference to the p-doped side of the pn diode, Le. the pn diode is reverse biased. Avalanche breakdown starts between 2600 V and 2800 V for both diodes and the current increases by orders of magnitude with very small further increases of the voltage, as is typical for avalanche breakdown with moderate current densities. In the range of hundreds of A/cm2 8 the voitage increases as the carrier saturation velocity causes increasing free carrier concentrations with a space charge that affects the electric field distribution. At 5900 A/cm2, the onset of a negative differential resistance occurs for the pn diode without the additional layer.
The negative differential resistance appears simultaneously with the onset of impact ionization at the border between the drift layer and the substrate layer leading to a hammock-shaped electric field distribution as shown in figure 7, which shows the electric field distributions at a simulated current density of 20 000 A/cm2 (from figure 8), Experimental experience and stability considerations indicate that this negative resistance causes device destruction and represents the boundary of the safe operating area. This conclusion is also supported by [Egawa, "Avalanche characteristics and failure mechanism of high voltage diodes", IEEE Transactions on Electron Devices, VoI ED-13, No. 11 , p. 754, (1966) and Hower et a!.,
"Avalanche injection and second breakdown in transistors", IEEE Transactions on Electron Devices, Vol. ED-17, No. 4, p. 320, (1970)].
The doping concentration in the additional layer is carefully controlled to create a positive charge that compensates for the negative charge of free electrons at high current densities. Figure 7 illustrates that even with impact ionization occurring, now at the border between the drift region and the additional layer, the electric field decays sfowiy m the additional layer thus increasing the voitage (which is the integral of the electric field) with increasing current density and thereby suppressing the occurrence of a negative differential resistance. As a result of the additional layer, the negative differentia! resistance occurs instead at 48 000 A/cm2 p Le. at eight times higher current density than without the additional layer. This eightfold improvement represents no fundamentai limit for the improvement of the safe operating area that is possible when using an additional layer, Thicker additional layers will increase the critical current density even more. The additionai layer can be designed according to the device requirements, The penalty that is paid for the additionai layer is a limited extra cost for a little bit ionger epitaxial growth time, and a small increase of the on-state resistance. This increase is, however, modest since the additional layers are doped significantly higher than the drift layer and suitable additional layers are also substantialiy thinner than the drift region.
The simuiation results show that the critical current density for the onset of negative resistance increases significantly by application of the present invention. The invention becomes more important for devices with higher breakdown voltage, because lower doping concentrations in the drift region tead to space charge effects and negative differentia! resistances at lower current densities. it should be pointed out that the presented simulation shows the stability of a pn diode in avalanche breakdown at high current densities. Similar distributions of the electric field in the border region between the drift region and the n-doped substrate appear, however, also in BJTs and pn diodes well below the breakdown voltage also during fast turn-off to high voltages and for the BJT also during short- circuit conditions. The analysis of these phenomena by device simulations is more complex but the same principles apply to the increase of the critical current density, and the associated improvement of the safe operating area, using the additional iayer of the present invention.
Figure 8 shows a cross-section of one cell of the active region of the NPN SiC BJT of the preferred embodiment of the present invention, Six layers with different doping concentrations are present in the B JT of the present invention as shown in Table 1 ,
Region Doping concentration Thickness
Emitter NE (high) WE WB
W c mm)
N8 W5
Table 1 The layers of the SiC BJT of the present invention
The layers are designed with thicknesses and doping concentrations that are determined by the following requirements;
A high current gain is important to control the B JT with a small base current, The current gain is enhanced by using a narrow base {a small W8) to reduce the base recombination. It is also important that the emitter doping (NE) is significantly higher than the base doping (NB) to improve the emitter efficiency and the current gain. In addition, a high material quality with a high carrier lifetime τ in the base layer is important to reduce the recombination in the base and a low surface recombination velocity S at the side-wall of the base-emitter junction. A tow surface recombination is obtained using a high quality passivation of the etched surface that terminates the base-emitter junction. This passivation can consist of silicon dioxide or other insulator materials that can be fabricated with low
Designing the SiC BJT for high voltage blocking imposes a requirement of a maximum allowed collector doping Nc and a minimum required width of the collector region W0. In addition, the maximum blocking voltage aiso imposes a requirement of a minimum doping concentration N8 in the base and a minimum thickness of the base region W8 to avoid punch-through of the eiectric field from collector to emitter. The minimum required value of WB is calculated for a given Ns by determining the sum of the expansions of the depletion regions of the base- collector and base-emitter junctions into the base at the maximum blocking voltage.
The emitter doping IME is chosen in the range of 1 -1019 cm"3 and the emitter thickness WE is about 1 μm to obtain an optimum emitter injection ;ic A thin emitter contact region with very high doping concentration NEC^-I O19 cm"3 is used on top of the emitter layer to improve the ohmic contact to the emitter.
The additional layer, the drift region (also referred to as collector), the base region, the emitter region and the emitter contact region are fabricated by epitaxial growth, prefβrabiy in one continuous epitaxial growth run to minimize the creation of defects during growth.
deposited silicon dioxide. Two photolithographic steps are used before SiC etching to define the base-emitter junctions and the base-collector junctions, respectively.
Inductively Coupled Plasma (ICP) etching of SiC is performed using deposited and patterned silicon dioxide as mask for etching, ion implantation of aiuminum is preferably used for creating a highly doped region where the base contact will be fabricated. Deposited oxide can be used as mask for the ion implantation after a photolithographic step, ion implantation of p-type dopants for fabricating a contact to p-type SiC
BJTs is described in U.S. Patent No. 4,945,394. ton implantation of p-type dopants, such as aluminum is weil known for forming heavily p-doped regions in pn diodes, see for exampie: Vodakov et al., "Electrical properties of p-π-n+ structure formed in silicon carbide by implantation of aluminum ions", Soviet
Physics ~ Semiconductors, VoI 21 , No. 9, p. 1017, (1987)
One alternative to the ion impiantatϊon step above is to use epitaxial regrowth of a highly doped p region followed by local etching as described in U.S.
Patent Nos. 8,815,304 and 6,982,440 and in Danieisson et al., "Extrinsic base design of SiC bipolar transistors", Materials Science Forurn, VoIs. 457-460, p.
1117, (2004).
A second step of ion impiantatioπ of aluminum is used with an energy above 100 keV and with a dose on the order of 1 -1013 cm"2 to create a junction termination extension (JTE) to achieve sufficiently high blocking voitage capability of the base-collector Junction. The JTE region is located outside the etched termination of the basβ-coiiector junction, and it is defined by a photolithographic
High temperature annealing is performed at temperatures between 1500 and 1800 0C in an epitaxy reactor or using flash-lamp annealing. Thermal oxidation of silicon carbide is performed to passivate the surfaces in the device and to create an isolation oxide.
Contact windows are defined using photolithographic steps, using different masks for the emitter and base contacts. Metal is deposited, by sputtering or evaporation, and patterned using lift-off of the photoresist to form metal contacts to the emitter and base regions and metai is also deposited on the backside of the wafer to form the collector contact. Separate metals are used for the n-type and ρ~ type doped regions. Nickel is preferred for π-type and an alloy of Nickel, Titanium and Aluminum is suitable for the p-type contact, A thick silicon dioxide isolation layer is deposited using Plasma Enhanced
Chemical Vapour Deposition (PECVD). Via holes are defined by a photoiithographic step and etched in the silicon dioxide using oxide dry etching.
Metal, preferably aluminium or gold is deposited to fill the via holes. Finally, a last photolithographic step defines the metal pads that cover the device active region and serve as contact areas for wire bonding, Wet or dry etching of metal is used to define the metal pads for the base and emitter regions.
A backside metallization, that Is suitable for soldering, is deposited and the
BJT chips are cut out and prepared for soldering and wire bonding in a discrete package or in a power module. It will be understood that the invention is not restricted to the aforede- scribed and illustrated exemplifying embodiments thereof and that modifications can be made within the scope of the inventive concept as illustrated in the accompanying Claims.

Claims

1. Semiconductor device (1 } in silicon carbide, with a highly doped substrate region (11 ) and a drift region (12), characterized in that an additional iayer (13) is positioned between said highly doped substrate region (11 ) and said drift region (12), that said additional layer (13) has the same type of doping as said substrate region (11 ) and said drift region (12), that the doping concentration in said additional layer (13) is higher than the doping concentration in said drift region (12) and lower than the doping concentration in said substrate region (11 ), that the doping concentration of said additional layer (13) is smaller than 1 -1017 cm"3, and that said additionai iayer (13) has a thickness of at least 10 % of the thickness of said drift region (12), where said additional layer (13) providing a wide safe operating area at subsequently high voltages and current densities.
2. Semiconductor device according to claim 1 , characterised in that said additional layer (13) has a non-constant doping concentration.
3. Semiconductor device according to claim 2, characterised in that said non-constant doping concentration of said additional layer (131) has a gradient with higher concentration on the border to said substrate region (11 ) than on the border to said drift region (12).
4. Semiconductor device according to claim 2, characterised in that said additional iayer (13") consist of several internai layers, that each internal layer is thinner than 10 % of the width of said drift region (12), and that the internal layers closer to said substrate region (11 ) have a higher doping concentrations than the internal layers closer to said drift region (12).
PCT/SE2008/050408 2007-04-11 2008-04-10 Silicon carbide semiconductor device WO2008127186A1 (en)

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SE0700896A SE532625C2 (en) 2007-04-11 2007-04-11 Semiconductor component in silicon carbide
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SE0700896L (en) 2008-10-12
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SE532625C2 (en) 2010-03-09
US20100117097A1 (en) 2010-05-13
US8829533B2 (en) 2014-09-09

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