WO2008122347A3 - Sheet-shaped support comprising a printed conductor, and method for the production of said support - Google Patents

Sheet-shaped support comprising a printed conductor, and method for the production of said support Download PDF

Info

Publication number
WO2008122347A3
WO2008122347A3 PCT/EP2008/002202 EP2008002202W WO2008122347A3 WO 2008122347 A3 WO2008122347 A3 WO 2008122347A3 EP 2008002202 W EP2008002202 W EP 2008002202W WO 2008122347 A3 WO2008122347 A3 WO 2008122347A3
Authority
WO
WIPO (PCT)
Prior art keywords
support
printed conductor
sheet
production
contact point
Prior art date
Application number
PCT/EP2008/002202
Other languages
German (de)
French (fr)
Other versions
WO2008122347A2 (en
Inventor
Hans Layer
Original Assignee
Alcan Tech & Man Ltd
Hans Layer
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alcan Tech & Man Ltd, Hans Layer filed Critical Alcan Tech & Man Ltd
Priority to EP08734674A priority Critical patent/EP2145292A2/en
Publication of WO2008122347A2 publication Critical patent/WO2008122347A2/en
Publication of WO2008122347A3 publication Critical patent/WO2008122347A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/113—Via provided in pad; Pad over filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0329—Intrinsically conductive polymer [ICP]; Semiconductive polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates

Abstract

Disclosed is a sheet-shaped support (10) that is made of a flexible material and is provided with a printed conductor (10) which is arranged on one side (12) of the support (10) and has an electrically conducting connection to a contact point (22) located on the other side (14) of the support (10). The electrically conducting connection between the contact point (22) and a contact point (24) located on the printed conductor (16), opposite the contact point (22), is a breakthrough (20) in the support (10). Said breakthrough (20) is filled with an electrically conducting material (EL).
PCT/EP2008/002202 2007-04-10 2008-03-19 Sheet-shaped support comprising a printed conductor, and method for the production of said support WO2008122347A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP08734674A EP2145292A2 (en) 2007-04-10 2008-03-19 Sheet-shaped support comprising a printed conductor, and method for the production of said support

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH5862007 2007-04-10
CH0586/07 2007-04-10

Publications (2)

Publication Number Publication Date
WO2008122347A2 WO2008122347A2 (en) 2008-10-16
WO2008122347A3 true WO2008122347A3 (en) 2008-11-27

Family

ID=39769165

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2008/002202 WO2008122347A2 (en) 2007-04-10 2008-03-19 Sheet-shaped support comprising a printed conductor, and method for the production of said support

Country Status (2)

Country Link
EP (1) EP2145292A2 (en)
WO (1) WO2008122347A2 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0818752A2 (en) * 1996-07-08 1998-01-14 Fela Holding AG Inlet for chipcards
DE19811578A1 (en) * 1998-03-17 1999-10-14 Siemens Ag Multiple layer circuit board especially for chip card
US6421013B1 (en) * 1999-10-04 2002-07-16 Amerasia International Technology, Inc. Tamper-resistant wireless article including an antenna
US20050158456A1 (en) * 2001-08-03 2005-07-21 Seiko Epson Corporation Method and apparatus for making devices

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0818752A2 (en) * 1996-07-08 1998-01-14 Fela Holding AG Inlet for chipcards
DE19811578A1 (en) * 1998-03-17 1999-10-14 Siemens Ag Multiple layer circuit board especially for chip card
US6421013B1 (en) * 1999-10-04 2002-07-16 Amerasia International Technology, Inc. Tamper-resistant wireless article including an antenna
US20050158456A1 (en) * 2001-08-03 2005-07-21 Seiko Epson Corporation Method and apparatus for making devices

Also Published As

Publication number Publication date
WO2008122347A2 (en) 2008-10-16
EP2145292A2 (en) 2010-01-20

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