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Publication numberWO2008088552 A3
Publication typeApplication
Application numberPCT/US2007/060603
Publication date4 Dec 2008
Filing date17 Jan 2007
Priority date17 Jan 2007
Also published asCN101589004A, WO2008088552A2
Publication numberPCT/2007/60603, PCT/US/2007/060603, PCT/US/2007/60603, PCT/US/7/060603, PCT/US/7/60603, PCT/US2007/060603, PCT/US2007/60603, PCT/US2007060603, PCT/US200760603, PCT/US7/060603, PCT/US7/60603, PCT/US7060603, PCT/US760603, WO 2008/088552 A3, WO 2008088552 A3, WO 2008088552A3, WO-A3-2008088552, WO2008/088552A3, WO2008088552 A3, WO2008088552A3
InventorsGerhardus W Koebrugge, Knuth Albertsen, Willibrordus J L M J Coppens
ApplicantFerro Corp, Gerhardus W Koebrugge, Knuth Albertsen, Willibrordus J L M J Coppens
Export CitationBiBTeX, EndNote, RefMan
External Links: Patentscope, Espacenet
X8r dielectric composition for use with nickel electrodes
WO 2008088552 A3
Multilayer ceramic chip capacitors which satisfy X8R requirements and which are compatible with reducing atmosphere sintering conditions so that non-noble metals such as nickel and nickel alloys thereof may be used for internal and external electrodes are made in accordance with the invention. The capacitors exhibit desirable dielectric properties (high capacitance, low dissipation factor, high insulation resistance), excellent performance on highly accelerated life testing, and very good resistance to dielectric breakdown. The dielectric layers comprise a barium titanate base material doped with other metal oxides such as BaO, Y2O3, ZrO2, SiO2, MgO, MnO, MoO3, CaO, Lu2O3, Yb2O3, or WO3 in various combinations.
Patent Citations
Cited PatentFiling datePublication dateApplicantTitle
US5137776 *27 Sep 199011 Aug 1992The United States Of America As Represented By The Secretary Of The NavyMetal-coated, ordered void piezoelectric ceramic material
US5187638 *27 Jul 199216 Feb 1993Micron Technology, Inc.Barrier layers for ferroelectric and pzt dielectric on silicon
US5361187 *11 Mar 19931 Nov 1994Ferro CorporationCeramic dielectric compositions and capacitors produced therefrom
US5422190 *22 Jan 19936 Jun 1995Ferro CorporationVia fill paste and method of using the same containing specific amounts of silver, gold and refractory oxides
US6185087 *8 Apr 19996 Feb 2001Kemet Electronics Corp.Multilayer ceramic chip capacitor with high reliability compatible with nickel electrodes
International ClassificationC04B35/00
Cooperative ClassificationC04B35/462
European ClassificationC04B35/462
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