WO2008088306A3 - Thermoenergy devices and methods for manufacturing same - Google Patents

Thermoenergy devices and methods for manufacturing same Download PDF

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Publication number
WO2008088306A3
WO2008088306A3 PCT/US2006/048749 US2006048749W WO2008088306A3 WO 2008088306 A3 WO2008088306 A3 WO 2008088306A3 US 2006048749 W US2006048749 W US 2006048749W WO 2008088306 A3 WO2008088306 A3 WO 2008088306A3
Authority
WO
WIPO (PCT)
Prior art keywords
devices
methods
thermoenergy
manufacturing same
manufacturing
Prior art date
Application number
PCT/US2006/048749
Other languages
French (fr)
Other versions
WO2008088306A2 (en
Inventor
Mark Logan
Frederick A Flitsch
Lloyd Wright
Lloyd Young
Original Assignee
Solid State Cooling Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Solid State Cooling Inc filed Critical Solid State Cooling Inc
Priority to PCT/US2006/048749 priority Critical patent/WO2008088306A2/en
Publication of WO2008088306A2 publication Critical patent/WO2008088306A2/en
Publication of WO2008088306A3 publication Critical patent/WO2008088306A3/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N19/00—Integrated devices, or assemblies of multiple devices, comprising at least one thermoelectric or thermomagnetic element covered by groups H10N10/00 - H10N15/00
    • H10N19/101—Multiple thermocouples connected in a cascade arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device

Abstract

The present invention provides thermoelectric or thermodiodic devices and methods for manufacturing such devices.
PCT/US2006/048749 2006-12-20 2006-12-20 Thermoenergy devices and methods for manufacturing same WO2008088306A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/US2006/048749 WO2008088306A2 (en) 2006-12-20 2006-12-20 Thermoenergy devices and methods for manufacturing same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2006/048749 WO2008088306A2 (en) 2006-12-20 2006-12-20 Thermoenergy devices and methods for manufacturing same

Publications (2)

Publication Number Publication Date
WO2008088306A2 WO2008088306A2 (en) 2008-07-24
WO2008088306A3 true WO2008088306A3 (en) 2009-04-09

Family

ID=39636490

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2006/048749 WO2008088306A2 (en) 2006-12-20 2006-12-20 Thermoenergy devices and methods for manufacturing same

Country Status (1)

Country Link
WO (1) WO2008088306A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11435766B2 (en) 2018-09-07 2022-09-06 Maxwell Labs Inc Fine-grain dynamic solid-state cooling system

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4855810A (en) * 1987-06-02 1989-08-08 Gelb Allan S Thermoelectric heat pump
US6396191B1 (en) * 1999-03-11 2002-05-28 Eneco, Inc. Thermal diode for energy conversion
US20020085601A1 (en) * 2000-12-29 2002-07-04 Arima Optoelectronics Corporation Light emitting diode with light conversion using scattering optical media
US6446441B1 (en) * 2001-08-28 2002-09-10 William G. Dean Magnetic refrigerator
US6492585B1 (en) * 2000-03-27 2002-12-10 Marlow Industries, Inc. Thermoelectric device assembly and method for fabrication of same
US6948322B1 (en) * 2001-09-10 2005-09-27 Percy Giblin Solid state heat pump appliance with carbon foam heat sink
US20050227382A1 (en) * 2004-04-02 2005-10-13 Hui Angela T In-situ surface treatment for memory cell formation
US20050242425A1 (en) * 2004-04-30 2005-11-03 Leal George R Semiconductor device with a protected active die region and method therefor

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4855810A (en) * 1987-06-02 1989-08-08 Gelb Allan S Thermoelectric heat pump
US6396191B1 (en) * 1999-03-11 2002-05-28 Eneco, Inc. Thermal diode for energy conversion
US6492585B1 (en) * 2000-03-27 2002-12-10 Marlow Industries, Inc. Thermoelectric device assembly and method for fabrication of same
US20020085601A1 (en) * 2000-12-29 2002-07-04 Arima Optoelectronics Corporation Light emitting diode with light conversion using scattering optical media
US6446441B1 (en) * 2001-08-28 2002-09-10 William G. Dean Magnetic refrigerator
US6948322B1 (en) * 2001-09-10 2005-09-27 Percy Giblin Solid state heat pump appliance with carbon foam heat sink
US20050227382A1 (en) * 2004-04-02 2005-10-13 Hui Angela T In-situ surface treatment for memory cell formation
US20050242425A1 (en) * 2004-04-30 2005-11-03 Leal George R Semiconductor device with a protected active die region and method therefor

Also Published As

Publication number Publication date
WO2008088306A2 (en) 2008-07-24

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